UPC2792TB-E3

DATA SHEET µPC2791TB, µPC2792TB 5 V, SUPER MINIMOLD SILICON MMIC VHF-UHF WIDEBAND AMPLIFIER BIPOLAR ANALOG INTEGRATED CIRCUITS DESCRIPTION The µPC2791TB and µPC2792TB are silicon monolithic integrated circuits designed as 2nd IF buffer amplifier for DBS tuners. These ICs are packaged in super minimold package which is smaller than conventional minimold. So, in the case of reducing your system size, µPC2791TB and µPC2792TB are suitable. Among the 6-pin mini/superminimold amplifiers, µPC2791TB and µPC2792TB have unique pin locations taken over from conventional 4-pin minimold µPC1675G, µPC1676G and µPC1688G. These ICs are manufactured using NEC’s 10GHz fT NESAT™ II AL silicon bipolar process. This process uses silicon nitride passivation film. The material can protect chip surface from external pollution and prevent corrosion/migration. Thus, these IC have excellent performance, uniformity and reliability. FEATURES • • • • High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) Supply voltage Wideband response Power gain : VCC = 4.5 to 5.5 V : µPC2791TB; fu = 1.9 GHz TYP. @3 dB bandwidth µPC2792TB; fu = 1.2 GHz TYP. @3 dB bandwidth : µPC2791TB; GP = 12 dB TYP. @f = 500 MHz µPC2792TB; GP = 22 dB TYP. @f = 500 MHz APPLICATION • 400 MHz band 2nd IF buffer amplifiers in DBS tuners (2nd frequecy converter block), etc. ORDERING INFORMATION Part Number Package 6-pin super minimold Marking C2S C2T Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face to perforation side of the tape. Qty 3kpcs/reel. µPC2791TB-E3 µPC2792TB-E3 Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC2791TB, µPC2792TB) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P11863EJ2V0DS00 (2nd edition) Date Published February 2000 N CP(K) Printed in Japan The mark shows major revised points. © 1996, 2000 µPC2791TB, µPC2792TB PIN CONNECTIONS (Top View) (Bottom View) 4 5 6 4 5 6 3 2 1 4 5 VCC GND INPUT Pin No. 1 2 3 Pin Name GND GND OUTPUT 3 2 1 Marking is an example of µPC2791TB C2S 6 Caution µPC2791TB, µPC2792TB pin locations are different from the other 6-pin mini/super-minimold amplifiers. PRODUCT LINE-UP (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 Ω) fu (GHz) 1.9 Po(sat) (dBm) +4.0 GP (dB) 12 NF (dB) 5.5 ICC (mA) 17 Part Number Package 4-pin minimold 6-pin super minimold Marking C1A C2S C1C C1B C2T µPC1675G µPC2791TB µPC1688G µPC1676G µPC2792TB 1.1 1.2 +4.0 +5.0 21 22 20 4.0 4.5 3.5 19 19 4-pin minimold 4-pin minimold 6-pin super minimold Remarks Caution Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. This document is to specified for µPC2791TB and µPC2792TB. For the other part numbers mentioned in this document, the data sheet of each part number should be referred. SYSTEM APPLICATION EXAMPLE Example of DBS tuners (2nd frequecy converter block) 1st IF input from DBS converter BPF MIX SAW AGC Amp. FM Demo. Baseband output µPC2712TB µ PC2711TB µ PC2791TB µ PC2792TB OSC Prescaler PLL Synth. µPC2711TB LPF 2 Data Sheet P11863EJ2V0DS00 µPC2791TB, µPC2792TB PIN EXPLANATION Applied Voltage (V) 0 Pin Voltage Note (V)  Pin No. 1 2 5 Pin Name GND Function and Applications Internal Equivalent Circuit Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. Signal output pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wide band. This pin must be coupled to next stage with capacitor for DC cut. Power supply pin. This pin should be externally equipped with bypass capacity to minimize ground impedance. Signal input pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wide band. A multi-feedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to front stage with capacitor for DC cut. µPC2791TB 4 VCC 3 OUT 3 OUTPUT  IN 6 3.92 3.96 2 GND 5 1 GND 4 VCC 4.5 to 5.5  µPC2792TB 4 VCC 3 OUT 6 INPUT  1.11 IN 6 0.92 2 GND 5 1 GND Note Pin voltage is measured at VCC = 5.0 V. Above: µPC2791TB, Below: µPC2792TB Data Sheet P11863EJ2V0DS00 3 µPC2791TB, µPC2792TB ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Power Dissipation Symbol VCC PD TA = +25°C Mounted on doublesided copper clad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85°C) Conditions Ratings 6 200 −40 to +85 −55 to +150 TA = +25°C +10 Unit V mW °C °C dBm Operating Ambient Temperature Storage Temperature Input Power TA Tstg Pin RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Operating Ambient Temperature Symbol VCC TA MIN. 4.5 −40 TYP. 5.0 +25 MAX. 5.5 +85 Unit V °C ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50Ω) µPC2791TB Parameter Circuit Current Power Gain Noise Figure Upper Limit Operating Frequency Symbol ICC GP NF fu Test Conditions MIN. No signal f = 500 MHz f = 500 MHz 3 dB down from flat gain f = 500 MHz f = 500 MHz f = 500 MHz f = 500 MHz, Pin = 0 dBm 12 10  1.6 TYP. 17 12 5.5 1.9 MAX. 22 14 7.0      MIN. 14 17  1.0 TYP. 19 20 3.5 1.2 MAX. 24 22 6.0      mA dB dB GHz µPC2792TB Unit Isolation Input Return Loss Output Return Loss Saturated Output Power ISL RLin RLout PO(sat) 20 9 8 +2.0 24 12 11 +4.0 24 12 9 +3.0 28 15 12 +5.0 dB dB dB dBm 4 Data Sheet P11863EJ2V0DS00 µPC2791TB, µPC2792TB TEST CIRCUIT VCC 1 000 pF C3 4 50 Ω IN 1 000 pF C1 6 3 C2 1 000 pF 50 Ω OUT 1, 2, 5 EXAMPLE OF APPLICATION CIRCUIT VCC 1 000 pF C3 1 000 pF C6 4 50 Ω IN 1 000 pF C1 4 3 C4 1 000 pF C5 C2 6 6 1 000 pF R1 50 to 200 Ω 3 1 000 pF 50 Ω OUT 1, 2, 5  To stabilize operation,   please connect R1, C5  1, 2, 5 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS 1 000 pF capacitors are recommendable as bypass capacitor for VCC pin and coupling capacitors for input/output pins. Bypass capacitor for VCC pin is intended to minimize VCC pin’s ground impedance. Therefore, stable bias can be supplied against VCC fluctuation. Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC. To get flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 π fZs).] Data Sheet P11863EJ2V0DS00 5 µPC2791TB, µPC2792TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD AMP-3 Top View 1 2 3 S C2 IN C C OUT Mounting direction (Marking is an example for µ PC2791TB) C COMPONENT LIST Value C 1 000 pF For more information on the use of this IC, refer to the following application note: USAGE AND APPLICATIONS OF 6-PIN MINI-MOLD, 6-PIN SUPER MINI-MOLD SILICON HIGH-FREQUENCY WIDEBAND AMPLIFIER MMIC (P11976E). 6 5 4 VCC Notes 1. 30 × 30 × 0.4 mm double sided copper clad polyimide board. 2. Back side : GND pattern 3. Solder plated on pattern : Through holes 4. 6 Data Sheet P11863EJ2V0DS00 µPC2791TB, µPC2792TB TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°C) − µPC2791TB − CIRCUIT CURRENT vs. SUPPLY VOLTAGE 30 No Signal 25 CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 30 No Signal VCC = 5.0 V 25 Circuit Current ICC (mA) Circuit Current ICC (mA) 20 20 15 15 10 10 5 5 0 0 1 2 3 4 5 6 0 −60 −40 −20 0 +20 +40 +60 +80 +100 Supply Voltage VCC (V) NOISE FIGURE, INSERTION POWER GAIN vs. FREQUENCY 15 VCC = 5.0 V VCC = 5.5 V Operating Ambient Temperature TA (°C) INSERTION POWER GAIN vs. FREQUENCY 15 VCC = 5.0 V TA = +25 °C Insertion Power Gain GP (dB) GP 10 VCC = 4.5 V Insertion Power Gain GP (dB) 9 Noise Figure NF (dB) 8 10 TA = +85 °C TA = −40 °C 7 VCC = 5.5 V 5 NF VCC = 5.0 V VCC = 4.5 V 6 5 5 0 0.1 0 0.1 4 0.3 1.0 3.0 0.3 1.0 3.0 Frequency f (GHz) ISOLATION vs. FREQUENCY 0 VCC = 5.0 V Frequency f (GHz) INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY 0 RLin VCC = 5.0 V Input Return Loss RLin (dB) Output Return Loss RLout (dB) −10 −10 Isolation ISL (dB) −20 −20 RLout −30 −30 −40 −40 −50 0.1 0.3 1.0 3.0 −50 0.1 0.3 1.0 3.0 Frequency f (GHz) Frequency f (GHz) Data Sheet P11863EJ2V0DS00 7 µPC2791TB, µPC2792TB − µPC2791TB − OUTPUT POWER vs. INPUT POWER +10 f = 500 MHz +5 VCC = 5.0 V Output Power Pout (dBm) 0 VCC = 4.5 V −5 −10 −15 −20 −25 −35 −30 −25 −20 −15 −10 −5 Output Power Pout (dBm) 0 TA = −40 °C −5 −10 −15 −20 −25 −35 −30 −25 −20 −15 −10 −5 VCC = 5.5 V +10 f = 500 MHz +5 VCC = 5.0 V TA = +25 °C OUTPUT POWER vs. INPUT POWER TA = +85 °C 0 0 Input Power Pin (dBm) SATURATED OUTPUT POWER vs. FREQUENCY +8 VCC = 5.5 V f = 500 MHz Saturated Output Power PO (sat) (dBm) +6 +4 +2 0 VCC = 4.5 V −2 −4 −6 0.1 VCC = 5.0 V Input Power Pin (dBm) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE Third Order Intermodulation Distortion IM3 (dBc) −60 −50 −40 −30 VCC = 5.0 V −20 −10 VCC = 4.5 V f1 = 500 MHz f2 = 504 MHz VCC = 5.5 V 0.3 1.0 3.0 0 −14 −12 −10 −8 −6 −4 −2 0 +2 Frequency f (GHz) Output Power of Each Tone PO (each) (dBm) 8 Data Sheet P11863EJ2V0DS00 µPC2791TB, µPC2792TB S-PARAMETER (TA = +25°C, VCC = 5.0 V) − µPC2791TB − S11-FREQUENCY 1.0 G 0.1 G 3.0 G 2.0 G S22-FREQUENCY 0.1 G 1.0 G 2.0 G Data Sheet P11863EJ2V0DS00 9 µPC2791TB, µPC2792TB TYPICAL S-PARAMETER VALUES (TA = +25°C) − µPC2791TB − VCC = 5.0 V, ICC = 17.0 mA FREQUENCY MHz 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 MAG. 0.155 0.191 0.240 0.290 0.337 0.383 0.418 0.459 0.499 0.553 0.604 0.647 0.670 0.672 0.665 0.659 0.653 0.645 0.642 0.621 0.605 0.577 0.561 0.536 0.521 0.509 0.493 0.482 0.467 0.453 0.441 S11 ANG. 11.8 21.7 25.3 25.6 22.9 18.1 11.0 3.2 –4.9 –12.7 –19.5 –26.4 –33.9 –42.4 –50.1 –57.4 –65.1 –71.8 –77.8 –83.3 –89.3 –94.9 –101.0 –106.7 –111.7 –116.1 –120.9 –125.0 –128.6 –132.3 –137.2 MAG. 4.157 4.179 4.193 4.245 4.288 4.320 4.316 4.316 4.268 4.243 4.218 4.140 3.981 3.753 3.473 3.169 2.924 2.680 2.490 2.302 2.137 1.977 1.838 1.714 1.596 1.499 1.416 1.353 1.283 1.222 1.172 S21 ANG. –8.1 –16.4 –24.6 –33.2 –42.4 –51.7 –61.9 –72.0 –82.3 –91.9 –102.2 –113.2 –124.8 –136.1 –146.3 –155.5 –164.3 –172.6 –179.7 173.0 166.6 160.2 154.2 148.2 142.9 137.1 132.2 126.6 122.6 116.8 113.1 MAG. 0.085 0.081 0.079 0.075 0.068 0.064 0.059 0.054 0.049 0.045 0.045 0.041 0.045 0.049 0.054 0.058 0.063 0.067 0.071 0.071 0.072 0.074 0.076 0.075 0.078 0.078 0.080 0.080 0.082 0.085 0.087 S12 ANG. –4.4 –7.2 –11.0 –11.1 –13.2 –13.3 –13.2 –11.4 –8.3 –1.1 4.7 13.4 20.2 27.7 28.4 33.3 32.8 33.0 31.2 31.0 30.6 30.3 31.4 30.8 31.2 31.4 32.1 34.2 33.8 34.0 34.2 MAG. 0.211 0.203 0.192 0.179 0.161 0.140 0.115 0.087 0.067 0.069 0.097 0.133 0.175 0.214 0.251 0.279 0.302 0.320 0.328 0.336 0.340 0.344 0.343 0.345 0.343 0.342 0.340 0.336 0.341 0.341 0.341 S22 ANG. 174.9 168.6 163.1 156.8 152.3 149.8 149.8 156.4 175.9 –155.3 –138.9 –137.3 –140.2 –145.4 –152.7 –159.6 –166.3 –172.9 –178.8 175.6 170.4 165.3 161.7 158.1 154.9 151.7 149.4 146.9 144.6 142.5 140.4 1.53 1.56 1.56 1.59 1.65 1.69 1.74 1.81 1.90 1.88 1.72 1.71 1.53 1.50 1.47 1.53 1.55 1.60 1.63 1.84 1.98 2.19 2.35 2.62 2.77 2.98 3.12 3.33 3.45 3.55 3.68 K 10 Data Sheet P11863EJ2V0DS00 µPC2791TB, µPC2792TB TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°C) − µPC2792TB − CIRCUIT CURRENT vs. SUPPLY VOLTAGE 35 No Signal 30 Circuit Current ICC (mA) Circuit Current ICC (mA) CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 35 No Signal VCC = 5.0 V 30 25 20 15 10 5 0 −60 −40 −20 25 20 15 10 5 0 0 1 2 3 4 5 6 0 +20 +40 +60 +80 +100 Supply Voltage VCC (V) NOISE FIGURE, INSERTION POWER GAIN vs. FREQUENCY 25 VCC = 5.5 V VCC = 5.0 V GP Insertion Power Gain GP (dB) Insertion power Gain GP (dB) Operating Ambient Temperature TA (°C) INSERTION POWER GAIN vs. FREQUENCY 25 VCC = 5.0 V 20 TA = −40 °C 15 TA = +85 °C 10 TA = +25 °C 7 20 VCC = 4.5 V 15 Noise Figure NF (dB) 6 5 10 VCC = 5.5 V 5 NF VCC = 5.0 V VCC = 4.5 V 0.3 1.0 3.0 Frequency f (GHz) ISOLATION vs. FREQUENCY 0 VCC = 5.0 V 4 5 3 0 0.1 0 0.1 0.3 1.0 3.0 Frequency f (GHz) INPUT RETURN LOSS, OUTPUT RETURN LOSS vs. FREQUENCY 0 VCC = 5.0 V RLout Input Return Loss RLin (dB) Output Return Loss RLout (dB) −10 Isolation ISL (dB) −10 −20 −20 −30 −30 RLin −40 −40 −50 0.1 0.3 1.0 3.0 −50 0.1 0.3 1.0 3.0 Frequency f (GHz) Data Sheet P11863EJ2V0DS00 Frequency f (GHz) 11 µPC2791TB, µPC2792TB − µPC2792TB − OUTPUT POWER vs. INPUT POWER +10 f = 500 MHz +5 Output Power Pout (dBm) OUTPUT POWER vs. INPUT POWER +10 f = 500 MHz +5 VCC = 5.0 V Output Power Pout (dBm) VCC = 5.5 V TA = +85 °C 0 −5 −10 −15 −20 TA = +25 °C 0 VCC = 5.0 V −5 VCC = 4.5 V −10 −15 −20 −25 −40 −35 −30 −25 −20 −15 −10 −5 TA = −40 °C −25 −40 −35 −30 −25 −20 −15 −10 −5 Input Power Pin (dBm) SATURATED OUTPUT POWER vs. FREQUENCY +10 f = 500 MHz VCC = 5.5 V Saturated Output Power PO (sat) (dBm) Input Power Pin (dBm) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE −60 f1 = 500 MHz VCC = 5.5 V f2 = 504 MHz −50 VCC = 5.0 V −40 −30 VCC = 4.5 V −20 −10 +8 +6 +4 +2 VCC = 4.5 V 0 −2 −4 0.1 VCC = 5.0 V Third Order Intermodulation Distortion IM3 (dBc) 0.3 1.0 3.0 0 −16 −14 −12 −10 −8 −6 −4 −2 0 +2 +4 Frequency f (GHz) Output Power of Each Tone PO (each) (dBm) 12 Data Sheet P11863EJ2V0DS00 µPC2791TB, µPC2792TB S-PARAMETER (TA = +25°C, VCC = 5.0 V) − µPC2792TB − S11-FREQUENCY 0.1 G 1.0 G 2.0 G S22-FREQUENCY 0.1 G 1.0 G 2.0 G Data Sheet P11863EJ2V0DS00 13 µPC2791TB, µPC2792TB TYPICAL S-PARAMETER VALUES (TA = +25°C) − µPC2792TB − VCC = 5.0 V, ICC = 19.0 mA FREQUENCY MHz 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 MAG. 0.029 0.040 0.056 0.076 0.090 0.103 0.122 0.148 0.181 0.219 0.248 0.271 0.277 0.286 0.298 0.311 0.328 0.338 0.347 0.345 0.349 0.353 0.365 0.371 0.377 0.378 0.380 0.382 0.381 0.380 0.390 S11 ANG. –8.4 12.5 16.9 17.9 10.7 0.3 –14.9 –28.8 –40.4 –48.0 –54.0 –60.3 –67.2 –77.3 –86.0 –93.2 –99.6 –105.2 –110.0 –115.4 –121.1 –126.8 –131.5 –136.3 –139.3 –142.3 –146.4 –150.0 –153.4 –157.0 –160.4 MAG. 11.334 11.414 11.459 11.525 11.506 11.394 11.159 10.840 10.239 9.577 8.783 7.883 6.929 6.074 5.338 4.709 4.206 3.793 3.474 3.179 2.926 2.704 2.513 2.345 2.192 2.059 1.931 1.827 1.727 1.633 1.557 S21 ANG. –11.1 –22.4 –34.1 –46.2 –58.9 –72.0 –85.6 –99.5 –113.7 –127.1 –140.5 –153.0 –164.4 –174.3 177.3 169.7 162.6 156.0 150.4 144.6 138.7 133.6 128.2 122.8 118.0 112.6 108.2 102.7 99.0 93.7 90.1 MAG. 0.038 0.038 0.036 0.036 0.035 0.034 0.034 0.034 0.032 0.031 0.031 0.032 0.034 0.035 0.038 0.040 0.046 0.048 0.053 0.055 0.059 0.063 0.069 0.072 0.077 0.082 0.083 0.091 0.094 0.098 0.102 S12 ANG. 0.4 1.8 2.7 3.7 5.3 8.9 11.6 13.9 19.9 22.9 27.1 32.3 39.4 44.0 49.1 54.9 56.5 58.3 60.5 60.4 60.3 60.5 61.7 60.7 60.6 61.3 59.9 59.9 59.4 57.4 58.2 MAG. 0.205 0.194 0.180 0.160 0.137 0.110 0.090 0.094 0.127 0.174 0.222 0.264 0.299 0.322 0.341 0.350 0.358 0.360 0.356 0.355 0.350 0.346 0.339 0.335 0.329 0.324 0.316 0.314 0.317 0.318 0.318 S22 ANG. 169.7 157.6 145.4 130.1 113.0 91.0 56.4 8.9 –26.9 –51.7 –71.0 –86.7 –101.0 –112.8 –123.3 –131.9 –139.2 –145.8 –151.1 –156.0 –160.4 –164.6 –166.9 –169.0 –170.9 –172.3 –173.1 –174.0 –174.5 –175.1 –175.2 1.34 1.34 1.37 1.39 1.42 1.47 1.48 1.50 1.58 1.68 1.71 1.76 1.87 1.99 2.04 2.20 2.11 2.24 2.22 2.33 2.37 2.42 2.37 2.42 2.42 2.44 2.56 2.48 2.52 2.56 2.54 K 14 Data Sheet P11863EJ2V0DS00 µPC2791TB, µPC2792TB PACKAGE DIMENSIONS 6 PIN SUPER MINIMOLD (UNIT: mm) 0.1 MIN. 0.2 –0.05 +0.1 0.15 +0.1 –0.05 1.25 ±0.1 2.1 ±0.1 0 to 0.1 0.65 1.3 0.65 0.7 0.9 ±0.1 2.0 ±0.2 Data Sheet P11863EJ2V0DS00 15 µPC2791TB, µPC2792TB NOTES ON CORRECT USE (1) Observe precautions for handiling because of electro-static sensitive devices. (2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The DC cut capacitor must be each attached to input and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Note Count: 3, Exposure limit: None Package peak temperature: 215°C or below Time: 40 seconds or less (at 200°C) Note Count: 3, Exposure limit: None Pin temperature: 300°C Time: 3 seconds or less (per side of device) Note Exposure limit: None Recommended Condition Symbol IR35-00-3 VPS VP15-00-3 Partial Heating – Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). 16 Data Sheet P11863EJ2V0DS00 µPC2791TB, µPC2792TB [MEMO] Data Sheet P11863EJ2V0DS00 17 µPC2791TB, µPC2792TB [MEMO] 18 Data Sheet P11863EJ2V0DS00 µPC2791TB, µPC2792TB [MEMO] Data Sheet P11863EJ2V0DS00 19 µPC2791TB, µPC2792TB ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • N o part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • D escriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8