UPC2905AHB

DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC2933A, 2905A THREE-TERMINAL LOW DROPOUT VOLTAGE REGULATOR DESCRIPTION The µPC2933A, 2905A of low dropout voltage three terminal positive regulators is constructed with PNP output transistor. The µPC2933A, 2905A feature the ability to source 1 A of output current with a low dropout voltage of typically 0.7 V. The power dissipation of the µPC2933A, 2905A can be drastically reduced compared with the conventional three terminal positive voltage regulators that is constructed with NPN output transistor. Also, this series corresponds to the low voltage output (3 V, 3.3 V) which is not in the conventional low dropout regulators ( µPC2400A series). FEATURES • Output current in excess of 1.0 A • Low dropout voltage VDIF = 0.7 V TYP. (at IO = 1 A) • On-chip overcurrent and thermal protection circuit • On-chip output transistor safe area protection circuit PIN CONFIGURATION (Marking Side) PC2933AHF, 2905AHF : MP-45G PC2933AHB, 2905AHB : MP-3 PC2933AT, 2905AT : MP-3Z 4 1 2 3 1: INPUT 2: GND 3: OUTPUT 1 2 3 1: INPUT 2: GND 3: OUTPUT 4: GND (Fin) The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. G15374EJ2V0DS00 (2nd edition) Date Published September 2001 NS CP(K) Printed in Japan The mark 5 shows major revised points. © 2001 µPC2933A, 2905A BLOCK DIAGRAM INPUT Safe operating area protection Start-up circuit Reference voltage Error amp. Drive circuit Saturation protection OUTPUT Thermal shut down Over current protection GND 2 Data Sheet G15374EJ2V0DS µPC2933A, 2905A ORDERING INFORMATION Part Number Package MP-45G (Isolated TO-220) Output Voltage 3.3 V Marking 2933A Package Type • Packed in envelope µ PC2933AHF µ PC2933AHB µ PC2933AT µ PC2933AT-E1 MP-3 (SC-64) MP-3Z (SC-63) MP-3Z (SC-63) 3.3 V 3.3 V 3.3 V 2933A 2933A 2933A • Packed in envelope • Packed in envelope • 16 mm wide embossed taping • Pin 1 on drawout side • 2000 pcs/reel µ PC2933AT -E2 MP-3Z (SC-63) 3.3 V 2933A • 16 mm width embossed taping • Pin 1 at takeup side • 2000 pcs/reel µ PC2933AT -T1 MP-3Z (SC-63) 3.3 V 2933A • 32 mm wide adhesive taping • Pin 1 at drawout side • 1500 pcs/reel µ PC2933AT -T2 MP-3Z (SC-63) 3.3 V 2933A • 32 mm wide adhesive taping • Pin 1 at takeup side • 1500 pcs/reel µ PC2905AHF MP-45G (Isolated TO-220) 5.0 V 2905A • Packed in envelope µ PC2905AHB µ PC2905AT µ PC2905AT-E1 MP-3 (SC-64) MP-3Z (SC-63) MP-3Z (SC-63) 5.0 V 5.0 V 5.0 V 2905A 2905A 2905A • Packed in envelope • Packed in envelope • 16 mm wide embossed taping • Pin 1 at drawout side • 2000 pcs/reel µ PC2905AT-E2 MP-3Z (SC-63) 5.0 V 2905A • 16 mm wide embossed taping • Pin 1 at takeup side • 2000 pcs/reel µ PC2905AT-T1 MP-3Z (SC-63) 5.0 V 2905A • 32 mm wide adhesive taping • Pin 1 at drawout side • 1500 pcs/reel µ PC2905AT-T2 MP-3Z (SC-63) 5.0 V 2905A • 32 mm wide adhesive taping • Pin 1 at takeup side • 1500 pcs/reel Data Sheet G15374EJ2V0DS 3 µPC2933A, 2905A ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified) Rating Parameter Symbol µ PC2933AHF, 2905AHF µPC2933AHB, 2905AHB µPC2933AT, 2905AT Unit Input Voltage Internal Power Dissipation Note VIN (TC = 25°C) PT TA TJ Tstg Rth(J-C) Rth(J-A) 7 65 15 20 10 –30 to +85 –30 to +150 –55 to +150 12.5 125 V W °C °C °C °C/W °C/W Operating Ambient Temperature Operating Junction Temperature Storage Temperature Thermal Resistance (junction to case) Thermal Resistance (junction to ambient) Note Internally limited. When the operating junction temperature rises over 150°C, the internal circuit shuts down the output voltage. Caution If the absolute maximum rating of any of the above parameters is exceeded even momentarily, the quality of the product may be degraded. In other words, absolute maximum ratings specify the values exceeding which the product may be physically damaged. Be sure to use the product with these ratings never exceeded. STANDARD CONNECTION D1 INPUT CIN PC2933A, 2905A + COUT OUTPUT D2 CIN: 0.1 µF or higher. Set this value according to the length of the line between the regulator and INPUT pin. Be sure to connect CIN to prevent parasitic oscillation. Use of a film capacitor or other capacitor with excellent voltage and temperature characteristics is recommended. If using a laminated ceramic capacitor, it is necessary to ensure that CIN is 0.1 µF or higher for the voltage and temperature range to be used. 5 COUT: 47 µF or higher. Be sure to connect COUT to prevent oscillation and improve excessive load regulation. Place CIN and COUT as close as possible to the IC pins (within 2 cm). Also, use an electrolytic capacitor with low impedance characteristics if considering use at sub-zero temperatures. D1: If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode. D2: If the OUTPUT pin has a lower voltage than the GND pin, connect a Schottky barrier diode. Caution Make sure that no voltage is applied to the OUTPUT pin from external. 4 Data Sheet G15374EJ2V0DS µPC2933A, 2905A RECOMMENDED OPERATING CONDITIONS Parameter Input Voltage Symbol VIN Type Number MIN. 4.3 6 0 –30 –30 TYP. MAX. 16 16 1.0 +85 +125 A °C °C Unit V µ PC2933A µ PC2905A Output Current IO All All All Operating Ambient Temperature TA Operating Junction Temperature TJ ELECTRICAL CHARACTERISTICS µPC2933A (TJ = 25°C, VIN = 5 V, IO = 500 mA, CIN = 0.22 µF, COUT = 47 µF, unless otherwise specified) Parameter Output Voltage Symbol VO 0°C ≤ TJ ≤ 125°C, 4.3 V ≤ VIN ≤ 16 V, 0 A ≤ IO ≤ 500 mA 0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 1 A Line Regulation Load Regulation Quiescent Current REGIN REGL IBIAS 4.3 V ≤ VIN ≤ 16 V 0 A ≤ IO ≤ 1 A IO = 0 A IO = 1 A Startup Quiescent Current IBIAS (s) VIN = 3.1 V, IO = 0 A VIN = 3.1 V, IO = 1 A Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage Short Circuit Current 12 23 2.0 20 10 33 33 3.0 40 30 80 3.0 55 48 64 0.7 1.2 1.6 1.2 1.0 1.3 1.4 1.7 –0.4 3.0 2.8 mV/°C A 1.0 3.0 15 mA mA mA mV Conditions MIN. 3.18 3.14 TYP. 3.3 MAX. 3.42 3.46 Unit V ∆IBIAS Vn R•R VDIF IOpeak 0°C ≤ TJ ≤ 125°C, 4.3 V ≤ VIN ≤ 16 V 10 Hz ≤ f ≤ 100 kHz 4.3 V ≤ VIN ≤ 16 V, f = 120 Hz 0°C ≤ TJ ≤ 125°C, IO = 1 A VIN = 4.5 V VIN = 16 V µ Vr.m.s. dB V A Peak Output Current IOpeak VIN = 4.5 V VIN = 16 V Temperature Coefficient of Output Voltage ∆VO /∆T 0°C ≤ TJ ≤ 125°C, IO = 5 mA Data Sheet G15374EJ2V0DS 5 µPC2933A, 2905A µPC2905A (TJ = 25°C, VIN = 8 V, IO = 500 mA, CIN = 0.22 µF, COUT = 47 µF, unless otherwise specified) Parameter Output Voltage Symbol VO 0°C ≤ TJ ≤ 125°C, 6 V ≤ VIN ≤ 16 V, 0 A ≤ IO ≤ 500 mA 0°C ≤ TJ ≤ 125°C, 0 A ≤ IO ≤ 1 A Line Regulation Load Regulation Quiescent Current REGIN REGL IBIAS 6 V ≤ VIN ≤ 16 V 0 A ≤ IO ≤ 1 A IO = 0 A IO = 1 A Startup Quiescent Current IBIAS (s) VIN = 4.5 V, IO = 0 A VIN = 4.5 V, IO = 1 A Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage Short Circuit Current 23 28 2.2 28 10 50 50 3.5 50 30 50 2.9 90 46 61 0.7 1.15 1.8 1.1 1.1 1.4 1.5 2.0 0.6 3.0 2.8 mV/°C A 1.0 3.0 15 mA mA mV mV mA Conditions MIN. 4.83 4.75 TYP. 5.0 MAX. 5.18 5.25 Unit V ∆IBIAS Vn R•R VDIF IOpeak 0°C ≤ TJ ≤ 125°C, 6 V ≤ VIN ≤ 16 V 10 Hz ≤ f ≤ 100 kHz f = 120 Hz, 6 V ≤ VIN ≤ 16 V 0°C ≤ TJ ≤ 125°C, IO = 1 A VIN = 6.5 V VIN = 16 V µ Vr.m.s. dB V A Peak Output Current IOpeak VIN = 6.5 V VIN = 16 V Temperature Coefficient of Output Voltage ∆VO /∆T 0°C ≤ TJ ≤ 125°C, IO = 5 mA 6 Data Sheet G15374EJ2V0DS µPC2933A, 2905A TYPICAL CHARACTERISTICS (Reference Values) Pd vs.TA 20 Pd - Total Power Dissipation - W ∆ VO - Output Voltage Deviation - mV Solid line : PC2933AHF, 2905AHF Broken line : PC2933AHB, 2905AHB PC2933AT, 2905AT ∆ V O vs.TJ 300 200 100 0 -100 -200 -300 I O = 5 mA -400 -50 15 With infinite heatsink µ PC2905A 10 µ PC2933A 5 Without heatsink 1.92 1.0 0 0 50 85 100 150 TA - Operating Ambient Temperature - ˚C 0 50 100 150 TJ - Operating Junction Temperature - ˚C VO vs.VIN 4.0 3.5 O PC2933A VO vs. V IN 8 TJ = 25˚C PC2905A TJ = 25˚C I O = 1.0 A = 0.5 A 7 I O = 1.0 A VO - Output Voltage - V VO - Output Voltage - V 3.0 I O = 5 mA 2.5 2.0 1.5 1.0 0.5 0 0 1 2 3 4 5 6 7 8 VIN - Input Voltage - V 6 O = 0.5 A 5 I O = 5 mA 4 3 2 1 0 0 1 2 3 4 5 6 7 8 VIN - Input Voltage - V BIAS I BIAS(s) ) vs.VIN PC2933A T = 25˚C BIAS IBIAS(s)) vs.VIN PC2905A T = 25˚C 50 50 Quiescent Current - mA Quiescent Current - mA 40 40 30 30 20 IO= 1 A 10 O= 20 O= IO= 1 A 0.5 A BIAS BIAS 0.5 A IO= 0 A 10 IO= 0 A 0 0 2 4 6 8 10 12 14 16 18 20 0 2 4 6 8 10 12 14 16 18 20 VIN - Input Voltage - V VIN - Input Voltage - V Data Sheet G15374EJ2V0DS 7 µPC2933A, 2905A VDIF vs.TJ 1.0 PC2905A 3 IO peak vs. VDIF m PC2933A 0.8 IO peak - Peak Output Current - A V DIF - Dropout Voltage - V 0.6 PC2933A 2 TJ = 0˚C 0.4 TJ = 25˚C 1 TJ = 125˚C 0 0.2 I O = 1.0 A 0 -25 TJ 0 +25 +50 +75 +100 +125 +150 0 5 10 15 20 Operating Junction Temperature - ˚C VDIF - Dropout Voltage - V IO peak vs.V DIF 3 PC2905A 80 70 R R vs. f IO peak - Peak Output Current - A R - Ripple Rejection - dB PC2933A 60 50 PC2905A 40 30 20 TJ = 25˚C IO = 1 A 4.3 V VIN 16 V ( PC2933A) IN 6 V V 16 V ( PC2905A) 2 TJ = 0˚C 1 TJ = 25˚C TJ = 125˚C R 0 0 10 VDIF - Dropout Voltage - V 0 15 20 10 100 1k f - Frequency - Hz 10 k 100 k 80 R R vs. IO 1.0 VDIF vs. IO TJ = 25˚C R - Ripple Rejection - dB PC2933A 60 PC2905A 50 TJ = 25˚C f = 120 Hz 4.3 V VIN 16 V ( PC2933A) 6 V VIN 16 V ( PC2905A) V DIF - Dropout Voltage - V 70 0.8 0.6 PC2905A 0.4 PC2933A 0.2 40 R 30 0 0.2 0.4 0.6 0.8 1.0 I O - Output Current - A 0 0 0.2 0.4 0.6 0.8 1.0 IO - Output Current - A 8 Data Sheet G15374EJ2V0DS µPC2933A, 2905A VO vs.I O PC2933A 6 TJ = 25˚C 6 5 VO vs.I O PC2905A TJ = 25˚C 5 VO - Output Voltage - V V O - Output Voltage - V 4 3 VIN = 4.3 V VIN = 5 V 2 1 VIN = 16 V 4 3 2 1 VIN = 6 V VIN = 8 V VIN = 16 V 0 0.4 0.8 1.2 1.6 2.0 2.4 0 0.4 0.8 1.2 1.6 2.0 2.4 IO - Output Current - A IO - Output Current - A Data Sheet G15374EJ2V0DS 9 µPC2933A, 2905A PACKAGE DRAWINGS µPC2933AHF, 2905AHF 3PIN PLASTIC SIP (MP-45G) A E B P N I L D 1 2 3 M K Y H Z C F NOTE J V U G M ITEM A B C D E F G H I J K L M N P U V Y Z MILLIMETERS 10.0 ± 0.2 7.0 ± 0.2 1.50 ± 0.2 17.0 ± 0.3 φ 3.3 ± 0.2 0.75 ± 0.10 0.25 2.54 (T.P.) 5.0 ± 0.3 2.46 ± 0.2 5.0 ± 0.2 8.5 ± 0.2 8.5 ± 0.2 4.5 ± 0.2 2.8 ± 0.2 2.4 ± 0.5 0.65 ± 0.10 8.9 ± 0.7 1.30 ± 0.2 P3HF-254B-4 Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. 10 Data Sheet G15374EJ2V0DS µPC2933A, 2905A µPC2933AHB, 2905AHB MP-3 (SC-64) (Unit: mm) 5.0±0.2 4 0. 1.5 +0. 2 –1 6.5±0.2 2.3±0.2 0.5±0.1 1.6±0.2 1.1±0.1 0.2 0.5 +0.1 – 7.0 MIN. 13.7 MIN. 1 2 3 5.5±0.2 0.2 0.5 +0.1 – 2.3 2.3 µPC2933AT, 2905AT MP-3Z (SC-63) (Unit: mm ) 0.75 6.5±0.2 5.0±0.2 2.3±0.2 1.5 –0.1 +0.2 0.5±0.1 4 4.3 MAX. 10.0 MAX. 5.5±0.2 1 2 3 0.8 2.0 MIN. 1.1±0.2 2.3 2.3 0.9 MAX. 0.8 MAX. 0.8 0.5 1.0 MIN. 1.5 TYP. Data Sheet G15374EJ2V0DS 11 µPC2933A, 2905A RECOMMENDED SOLDERING CONDITIONS W hen soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is perfomed under different condition, please make sure to consult with our sales offices. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E). Surface Mount Device µPC2933AT, 2905AT: MP-3Z (SC-63) Process Infrared Ray Reflow Conditions Peak temperature: 235°C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 2 times or less. Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 2 times or less. Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each side of the device). – WS60-00-1 VP15-00-2 Symbol IR35-00-2 Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Through-hole devices µPC2933AHF, 2905AHF: MP-45G µPC2933AHB, 2905AHB: MP-3 Process Wave soldering (only to leads) Partial heating method Solder temperature: 260°C or below, Flow time: 10 seconds or less. Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each pin). Conditions Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. 12 Data Sheet G15374EJ2V0DS µPC2933A, 2905A NOTES ON USE W hen the µPC2933A, 2905A are used with an input voltage that is lower than the value indicated in the recommended operating conditions, a large quiescent current flows through the device due to saturation of the transistor of the output stage. (Refer to the IBIAS (IBIAS(S)) vs. VIN curves in TYPICAL CHARACTERISTICS). These products have saturation protector, but a current of up to 80 mA MAX. may flow through the device. Thus the power supply on the input side must have sufficient capacity to allow this quiescent current to pass when the device starts up. REFERENCE DOCUMENTS Document Name QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL VOLTAGE REGULATOR OF SMD SEMICONDUCTOR SELECTION GUIDE – PRODUCTS AND PACKAGES Document No. C11531E C10535E G11872E X13769E Data Sheet G15374EJ2V0DS 13 µPC2933A, 2905A [MEMO] 14 Data Sheet G15374EJ2V0DS µPC2933A, 2905A [MEMO] Data Sheet G15374EJ2V0DS 15 µPC2933A, 2905A • The information in this document is current as of September, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. 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(Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4