UPC2926T

DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC2918,2925,2926 THREE-TERMINAL LOW DROPOUT VOLTAGE REGULATOR # DESCRIPTION The µPC2918, 2925 and 2926 are three-terminal low dropout voltage regulators with the 1-A output. The µPC2918 outputs 1.8 V, the µPC2925 outputs 2.5 V and the µPC2926 outputs 2.6 V. Since these regulators use a PNP transistor for the output stage, they achieve a low dropout voltage of 0.7 V TYP. at IO = 1 A and minimize the power dissipation of the IC. As a result, these regulators can be used to realize sets with lower voltage and power dissipation. FEATURES • Output current capacity: 1 A • Low dropout voltage (VDIF = 0.5 V MAX. (at IO = 0.5 A)) • Output voltage accuracy: ±2% • On-chip saturation protector rising edge of input voltage (at low input voltage) • On-chip overcurrent limiter and thermal protection • On-chip output transistor safe operation area protection PIN CONFIGURATION (Marking Side) 4 1: INPUT 2: GND 3: OUTPUT 4: GND (Fin) 1 2 3 BLOCK DIAGRAM INPUT Reference voltage circuit Startup circuit Thermal shut down Saturation protection Error Amp. Drive circuit Safe operation area protection OUTPUT Overcurrent protection GND The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. G14983EJ3V0DS00 (3rd edition) Date Published May 2001 NS CP(K) Printed in Japan The mark # shows major revised points. © 2000,2001 µPC2918, 2925, 2926 # ORDERING INFORMATION Part Number Package MP-3Z (SC-63) MP-3Z (SC-63) Marking 29xx 29xx • Bag stuffing • Embossed-type taping (16mm tape) • Pin 1 on drawout side • 2000 pcs/reel Packing Type µ PC29xxT µ PC29xxT-E1 µ PC29xxT-E2 MP-3Z (SC-63) 29xx • Embossed-type taping (16mm tape) • Pin 1 at takeup side • 2000 pcs/reel µ PC29xxT-T1 MP-3Z (SC-63) 29xx • Adhesive-type taping (32mm tape) • Pin 1 on drawout side • 1500 pcs/reel µ PC29xxT-T2 MP-3Z (SC-63) 29xx • Adhesive-type taping (32mm tape) • Pin 1 at takeup side • 1500 pcs/reel µ PC29xxHB MP-3 (SC-64) 29xx • Bag stuffing ”xx” mark of the part number and marking columns expresses output voltage. Example Output Voltage Part Number Marking 1.8V 2.5V 2.6V µ PC2918T µ PC2925T µ PC2926T 2918 2925 2926 2 Data Sheet G14983EJ3V0DS µPC2918, 2925, 2926 ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified) Parameter Input Voltage Internal Power Dissipation (TC = 25°C) Operating Ambient Temperature Operating Junction Temperature Storage Temperature Thermal Resistance (junction to case) Thermal Resistance (junction to ambient) Symbol VIN PT TA TJ Tstg Rth(J-C) Rth(J-A) Rating –0.3 to +20 10 Note Unit V W °C °C °C °C/W °C/W –30 to +85 –30 to +150 –55 to +150 12.5 125 Note Internally limited. When the operating junction temperature rises over 150°C, the internal circuit shuts down the output voltage. Caution If the absolute maximum rating of any of the above parameters is exceeded even momentarily, the quality of the product may be degraded. In other words, absolute maximum ratings specify the values exceeding which the product may be physically damaged. Be sure to use the product with these ratings never exceeded. # TYPICAL CONNECTION D1 INPUT CIN µ PC2918, 2925, 2926 + OUTPUT COUT D2 CIN: 0.1 µF or higher. Set this value according to the length of the line between the regulator and INPUT pin. Be sure to connect CIN to prevent parasitic oscillation. Use of a film capacitor or other capacitor with excellent voltage and temperature characteristics is recommended. If using a laminated ceramic capacitor, it is necessary to ensure that CIN is 0.1 µF or higher for the voltage and temperature range to be used. COUT: 10 µF or higher. Be sure to connect COUT to prevent oscillation and improve excessive load regulation. Place CIN and COUT as close as possible to the IC pins (within 2 cm). Also, use an electrolytic capacitor with low impedance characteristics if considering use at sub-zero temperatures. D1: If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode. D2: If the OUTPUT pin has a lower voltage than the GND pin, connect a Schottky barrier diode. Caution Make sure that no voltage is applied to the OUTPUT pin from external. Data Sheet G14983EJ3V0DS 3 µPC2918, 2925, 2926 RECOMMENDED OPERATING CONDITIONS Parameter Input Voltage Symbol VIN Type Number MIN. 2.8 3.5 3.6 0 − 30 − 30 TYP. MAX. 16 16 16 1 + 85 + 125 Unit V V V A °C °C µ PC2918 µ PC2925 # Output Current IO Operating Ambient Temperature TA Operating Junction Temperature TJ µ PC2926 All All All Caution Use of conditions other than the above-listed recommended operating conditions is not a problem as long as the absolute maximum ratings are not exceeded. However, since the use of such conditions diminishes the margin of safety, careful evaluation is required before such conditions are used. Moreover, using the MAX. value for all the recommended operating conditions is not guaranteed to be safe. ELECTRICAL CHARACTERISTICS µPC2918 (TJ = 25°C, VIN = 2.8 V, IO = 0.5 A, CIN = 0.1 µF, COUT = 10 µF, unless otherwise specified) Parameter Output Voltage Symbol VO 2.8 V ≤ VIN ≤ 5 V, 0 A ≤ IO ≤ 1 A, 0°C ≤ TJ ≤ 125°C Line Regulation Load Regulation Quiescent Current Startup Quiescent Current Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage Short Circuit Current Peak Output Current Temperature Coefficient of Output Voltage REGIN REGL IBIAS IBIAS (s) 2.8 V ≤ VIN ≤ 16 V 0 A ≤ IO ≤ 1 A IO = 0 A IO = 1 A VIN = 2.4 V, IO = 0 A VIN = 2.4 V, IO = 1 A 2.8 V ≤ VIN ≤ 16 V, 0°C ≤ TJ ≤ 125°C 10 Hz ≤ f ≤ 100 kHz f = 120 Hz, 2.8 V ≤ VIN ≤ 9 V IO = 0.5 A IO = 1 A, 0°C ≤ TJ ≤ 125°C IOshort IOpeak VIN = 2.8 V VIN = 16 V VIN = 2.8 V VIN = 16 V IO = 5 mA, 0°C ≤ TJ ≤ 125°C 1.0 1.2 45 Conditions MIN. 1.764 (1.71) 6 7 2 20 10 2.9 40 60 0.25 0.7 1.7 1.2 1.5 1.1 − 0.4 3.0 3.0 0.5 TYP. 1.8 MAX. 1.836 (1.854) 25 30 4 60 30 80 20 Unit V V mV mV mA mA mA mA mA ∆IBIAS Vn R•R VDIF µ Vr.m.s. dB V V A A A A mV/°C ∆VO /∆T Remark Values in parentheses have been measured during product design and are provided as reference values. 4 Data Sheet G14983EJ3V0DS µPC2918, 2925, 2926 µPC2925 (TJ = 25°C, VIN = 3.5 V, IO = 0.5 A, CIN = 0.1 µF, COUT = 10 µF, unless otherwise specified) Parameter Output Voltage Symbol VO 3.5 V ≤ VIN ≤ 5 V, 0 A ≤ IO ≤ 1 A, 0°C ≤ TJ ≤ 125°C Line Regulation Load Regulation Quiescent Current Startup Quiescent Current Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage Short Circuit Current Peak Output Current Temperature Coefficient of Output Voltage REGIN REGL IBIAS IBIAS (s) 3.5 V ≤ VIN ≤ 16 V 0 A ≤ IO ≤ 1 A IO = 0 A IO = 1 A VIN = 2.4 V, IO = 0 A VIN = 3.0 V, IO = 1 A 3.5 V ≤ VIN ≤ 16 V, 0°C ≤ TJ ≤ 125°C 10 Hz ≤ f ≤ 100 kHz f = 120 Hz, 3.5 V ≤ VIN ≤ 9 V IO = 0.5 A IO = 1 A, 0°C ≤ TJ ≤ 125°C IOshort IOpeak VIN = 3.5 V VIN = 16 V VIN = 3.5 V VIN = 16 V IO = 5 mA, 0°C ≤ TJ ≤ 125°C 1.0 1.2 45 Conditions MIN. 2.45 (2.375) 6 7 2 20 10 2.9 40 60 0.25 0.7 1.7 1.2 1.5 1.1 − 0.5 3.0 3.0 0.5 TYP. 2.5 MAX. 2.55 (2.575) 25 30 4 60 30 80 20 Unit V V mV mV mA mA mA mA mA ∆IBIAS Vn R•R VDIF µ Vr.m.s. dB V V A A A A mV/°C ∆VO /∆T Remark Values in parentheses have been measured during product design and are provided as reference values. # µPC2926 (TJ = 25°C, VIN = 3.6 V, IO = 0.5 A, CIN = 0.1 µF, COUT = 10 µF, unless otherwise specified) Parameter Output Voltage Symbol VO 3.6 V ≤ VIN ≤ 5 V, 0 A ≤ IO ≤ 1 A, 0°C ≤ TJ ≤ 125°C Line Regulation Load Regulation Quiescent Current Startup Quiescent Current Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage Short Circuit Current Peak Output Current Temperature Coefficient of Output Voltage REGIN REGL IBIAS IBIAS (s) 3.6 V ≤ VIN ≤ 16 V 0 A ≤ IO ≤ 1 A IO = 0 A IO = 1 A VIN = 2.4 V, IO = 0 A VIN = 3.0 V, IO = 1 A 3.6 V ≤ VIN ≤ 16 V, 0°C ≤ TJ ≤ 125°C 10 Hz ≤ f ≤ 100 kHz f = 120 Hz, 3.6 V ≤ VIN ≤ 9 V IO = 0.5 A IO = 1 A, 0°C ≤ TJ ≤ 125°C IOshort IOpeak VIN = 3.6 V VIN = 16 V VIN = 3. 6 V VIN = 16 V IO = 5 mA, 0°C ≤ TJ ≤ 125°C 1.0 1.2 45 Conditions MIN. 2.548 (2.470) 6 7 2 20 10 2.9 40 60 0.25 0.7 1.7 1.2 1.5 1.1 − 0.5 3.0 3.0 0.5 TYP. 2.6 MAX. 2.652 (2.678) 25 30 4 60 30 80 20 Unit V V mV mV mA mA mA mA mA ∆IBIAS Vn R•R VDIF µ Vr.m.s. dB V V A A A A mV/°C ∆VO /∆T Remark Values in parentheses have been measured during product design and are provided as reference values. Data Sheet G14983EJ3V0DS 5 µPC2918, 2925, 2926 TYPICAL CHARACTERISTICS (Reference Values) PD vs. TA ∆VO vs. TJ 12 PD - Total Power Dissipation - W 50 IO = 5 mA W ∆VO - Output Voltage Deviation - mV 10 8 6 4 2 1.0 0 0 ith in fin ite 25 he at sin k 0 µPC2918 µPC2925 Without –25 heatsink 50 100 150 –50 –50 0 50 100 150 TA - Operating Ambient Temperature - °C TJ - Operating Junction Temperature - °C VO vs. VIN (µPC2918) IBIAS (IBIAS(s)) vs. VIN (µPC2918) TJ = 25˚C IBIAS - Quiescent Current - mA 2.0 IO = 5 mA IO = 0.5 A 50 TJ = 25˚C 40 VO - Output Voltage - V 1.5 IO = 1 A 30 1.0 20 IO = 1 A 10 IO = 0.5 A IO = 0 A 0.5 0 0 1 2 3 4 5 6 7 8 VIN - Input Voltage - V VO vs. VIN (µPC2925) 0 0 5 10 VIN - Input Voltage - V IBIAS (IBIAS(s)) vs. VIN (µPC2925) TJ = 25˚C 15 20 3.0 50 TJ = 25˚C IBIAS - Quiescent Current - mA IO = 5 mA 40 VO - Output Voltage - V IO = 0.5 A 2.0 IO = 1 A 30 20 IO = 1 A 10 IO = 0.5 A IO = 0 A 1.0 0 0 1 2 3 4 5 6 7 8 VIN - Input Voltage - V 0 0 5 10 15 20 VIN - Input Voltage - V 6 Data Sheet G14983EJ3V0DS µPC2918, 2925, 2926 VDIF vs. TJ IOpeak vs. VDIF (µPC2918) 2.5 1 VDIF - Dropout Voltage - V 0.8 IOpeak - Peak Output Current - A 2 TJ = 0˚C TJ = 25˚C 0.6 1.5 TJ = 125˚C 1 0.4 0.2 IO = 1 A 0 –25 0 25 50 75 100 125 150 0.5 0 0 5 10 15 20 VDIF - Dropout Voltage - V TJ - Operating Junction Temperature - °C IOpeak vs. VDIF (µPC2925) 2.5 70 60 R R vs. f TJ = 25˚C IO = 1 A µPC2918 . IOpeak - Peak Output Current - A TJ = 0˚C TJ = 25˚C R R - Ripple Rejection - dB 2 50 40 30 20 10 µPC2925 1.5 TJ = 125˚C 1 . 0.5 0 0 5 10 15 20 VDIF - Dropout Voltage - V 0 10 100 1000 10000 100000 f - Frequency - Hz R R vs. IO 80 . VDIF vs. IO 1 TJ = 25˚C R R - Ripple Rejection - dB 60 µPC2925 µPC2918 VDIF - Dropout Voltage - V 1 70 0.8 0.6 50 0.4 . 40 30 0 0.2 0.4 TJ = 25˚C, f = 120 Hz 2.8 V < VIN < 9 V (µPC2918) 3.5 V < VIN < 9 V (µPC2925) 0.6 0.8 IO - Output Current - A 0.2 0 0 0.2 0.4 0.6 0.8 1 IO - Output Current - A Data Sheet G14983EJ3V0DS 7 µPC2918, 2925, 2926 # 2 1.8 1.6 VO - Output Voltage - V VO vs. IO (µPC2918) 3 2.5 # VO vs. IO (µPC2925) VIN = 5 V 1.4 1.2 1 0.8 0.6 0.4 0.2 VIN = 16 V VIN = 5 V VIN = 2.8 V VO - Output Voltage - V 2 VIN = 16 V 1.5 1 0.5 VIN = 3.5 V TJ = 25˚C 0 0.5 1 1.5 2 IO - Output Current - A 2.5 TJ = 25˚C 0 0 0.5 1 1.5 IO - Output Current - A 2 2.5 0 8 Data Sheet G14983EJ3V0DS µPC2918, 2925, 2926 PACKAGE DRAWINGS MP-3Z (SC-63) (Unit: mm) 6.5± 0.2 5.0± 0.2 2.3 ±0.2 1.5+0.2 –0.1 0.5 ±0.1 4 4.3 MAX. 5.5±0.2 10.0 MAX. 1 2 3 0.8 2.0 MIN. 1.1± 0.2 2.3 2.3 0.9 MAX. 0.8 MAX. 0.8 # MP-3 (SC-64) (Unit: mm) 2.3±0.2 6.5± 0.2 5.0± 0.2 4 1.5 +0.2 −0.1 0.5±0.1 1.6±0.2 5.5±0.2 1 2 3 7.0 MIN. 1.1± 0.1 13.7 MIN. 0.5 +0.2 −0.1 0.5 +0.2 −0.1 2.3 2.3 ' Data Sheet G14983EJ3V0DS 0.75 0.5 1.0 MIN. 1.5 TYP. 9 µPC2918, 2925, 2926 # RECOMMENDED SOLDERING CONDITIONS The µPC2918, 2925 and 2926 should be soldered and mounted under the following recommended conditions. For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended below, contact our sales representative. Type of Surface Mount Device µPC2918T, µPC2925T, µPC2926T: MP-3Z(SC-63) Process Infrared Ray Reflow Conditions Peak temperature: 235°C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 3 times or less. Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 3 times or less. Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each side of the device). – WS60-00-1 VP15-00-3 Symbol IR35-00-3 Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Type of Through-hole Device µPC2918HB, µPC2925HB, µPC2926HB: MP-3(SC-64) Process Wave Soldering (only to leads) Partial Heating Method Solder temperature: 260°C or below, Flow time: 10 seconds or less Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each pin). Conditions Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. 10 Data Sheet G14983EJ3V0DS µPC2918, 2925, 2926 NOTES ON USE When the µPC2918, 2925, and 2926 are used with an input voltage that is lower than the value indicated in the recommended operating conditions, a large quiescent current flows through the device due to saturation of the transistor of the output stage. (Refer to the IBIAS (IBIAS(S)) vs. VIN curves in TYPICAL CHARACTERISTICS). These products have saturation protector, but a current of up to 80 mA MAX. may flow through the device. Thus the power supply on the input side must have sufficient capacity to allow this quiescent current to pass when the device starts up. REFERENCE DOCUMENTS Document Name Usage of Three-Terminal Regulators Voltage Regulator of SMD User’s Manual Document No. G12702E G11872E Information C10535E X13769X Information Semiconductor Device Mounting Technology Manual SEMICONDUCTOR SELECTION GUIDE - Products and Packages- Data Sheet G14983EJ3V0DS 11 µPC2918, 2925, 2926 • The information in this document is current as of May, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4