UPC29L04

DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC29L00 Series THREE TERMINAL LOW DROPOUT VOLTAGE REGULATOR DESCRIPTION µPC29L00 Series are low dropout regulators which have 100 mA capable for the output current. The variation of output voltage is 3 V, 3.3 V, 4 V and 5 V. FEATURES • Low dropout voltage. VDIF ≤ 0.3 V • Built-in overcurrent protection circuit. • Built-in thermal shut-down circuit. CONNECTION DIAGRAM (TOP VIEW) µPC29L00J Series ORDERING INFORMATION Output Voltage 3V Type Number Package TO-92 SOT-89 TO-92 SOT-89 TO-92 SOT-89 TO-92 SOT-89 1 1 2 3 µPC29L03J µPC29L03T 3.3 V µPC29L33J µPC29L33T OUTPUT GND INPUT 4V µPC29L04J µPC29L04T µPC29L00T Series GND 5V µPC29L05J µPC29L05T 2 3 OUTPUT GND INPUT Document No. G10354EJ2V0DS00 (2nd edition) Date Published December 1995 P Printed in Japan © 1995 µPC29L00 Series BLOCK DIAGRAM INPUT Over-current protection Reference voltage Start-up circuit OUTPUT Drive circuit Error amplifier Thermal shut down GND 2 µPC29L00 Series ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C, Unless otherwise specified.) PARAMETER Input Voltage Internal Power Dissipation SYMBOL VIN PT J T RATING 16 700 Note 1 400 Note 1 2000 Note 1, 2 Operating Ambient Temperature Range Operating Junction Temperature Range Storage Temperature Range Thermal Resistance (Junction to Case) TA TJ Tstg Rth(J - C) J T Thermal Resistance (Junction to Ambient) Rth(J - A) J T –30 to +85 –30 to +150 –55 to +150 – 30 180 315 62.5 Note 2 ˚C/W ˚C ˚C ˚C ˚C/W UNIT V mW Notes 1. TA ≤ 25 ˚C 2. With the 16 cm2 × 0.7 mm ceramic substrate TYPICAL CONNECTION D1 INPUT CIN µ PC29L00 + COUT D2 OUTPUT CIN D1 D2 : 0.1 to 0.47 µF. : Need for VO > VIN. : Need for VO < GND. COUT : More than 10 µF. RECOMMENDED OPERATING CONDITIONS PARAMETER Input Voltage SYMBOL VIN TYPE NUMBER MIN. 3.5 3.8 4.5 5.5 0 –30 –30 TYP. MAX. 9 9 12 12 40 +85 +125 mA ˚C ˚C UNIT V µPC29L03 µPC29L33 µPC29L04 µPC29L05 Output Current Operating Ambient Temperature Range Operating Junction Temperature Range IO TA TJ All All All 3 µPC29L00 Series ELECTRICAL CHARACTERISTICS µPC29L03 (VIN = 4 V, IO = 40 mA, TJ = 25 ˚C, Unless otherwise specified) PARAMETER Output Voltage SYMBOL VO 3.5 V ≤ VIN ≤ 9 V, 1 mA ≤ IO ≤ 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 4.5 V ≤ VIN ≤ 5.5 V, 1 mA ≤ IO ≤ 100 mA, 0 ˚C ≤ TJ ≤ 125 ˚C Line Regulation REGIN 3.5 V ≤ VIN ≤ 12 V 3.5 V ≤ VIN ≤ 9 V Load Regulation REGL 1 mA ≤ IO ≤ 100 mA 1 mA ≤ IO ≤ 40 mA Quiescent Current IBIAS IO = 0 IO = 100 mA Start-up Current Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage Peak Output Current Short Circuit Current Temperature Coefficient of Output Voltage IBIAS(S) ∆IBIAS Vn R·R VDIF IOpeak IOshort ∆ VO/ ∆ T IO = 0 mA, before VO regulation 4 V ≤ VIN ≤ 12 V, 0 ˚C ≤ TJ ≤ 125 ˚C 10 Hz ≤ f ≤ 100 kHz f = 120 Hz, 4 V ≤ VIN ≤ 9 V IO = 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C VIN = 5 V VIN = 12 V IO = 5 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 48 25 66 0.15 190 100 –0.5 0.3 TEST CONDITIONS MIN. 2.88 2.85 TYP. 3.0 MAX. 3.12 3.15 UNIT V 2.85 3.15 4 2 37 15 1.5 10 6 50 20 50 20 2.0 20 20 1.0 mV mV mA mA mA mA µVrms dB V mA mA mV/˚C 4 µPC29L00 Series ELECTRICAL CHARACTERISTICS µPC29L33 (VIN = 5 V, IO = 40 mA, TJ = 25 ˚C, Unless otherwise specified) PARAMETER Output Voltage SYMBOL VO 3.8 V ≤ VIN ≤ 10 V, 1 mA ≤ IO ≤ 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 4.5 V ≤ VIN ≤ 5.5 V, 1 mA ≤ IO ≤ 100 mA, 0 ˚C ≤ TJ ≤ 125 ˚C Line Regulation REGIN 3.8 V ≤ VIN ≤ 12 V 3.8 V ≤ VIN ≤ 9 V Load Regulation REGL 1 mA ≤ IO ≤ 100 mA 1 mA ≤ IO ≤ 40 mA Quiescent Current IBIAS IO = 0 IO = 100 mA Start-up Current Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage Peak Output Current Short Circuit Current Temperature Coefficient of Output Voltage IBIAS(S) ∆IBIAS Vn R·R VDIF IOpeak IOshort ∆ V O / ∆T IO = 0 mA, before VO regulation 4.3 V ≤ VIN ≤ 12 V, 0 ˚C ≤ TJ ≤ 125 ˚C 10 Hz ≤ f ≤ 100 kHz f = 120 Hz, 4.3 V ≤ VIN ≤ 9 V IO = 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C VIN = 5 V VIN = 12 V IO = 5 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 48 28 65 0.15 190 100 –0.6 0.3 TEST CONDITIONS MIN. 3.17 3.14 TYP. 3.3 MAX. 3.43 3.46 UNIT V 3.14 3.46 4 2 37 16 1.5 10 19 50 20 50 20 2.0 20 30 1.0 mV mV mA mA mA mA µVrms dB V mA mA mV/˚C 5 µPC29L00 Series ELECTRICAL CHARACTERISTICS µPC29L04 (VIN = 6 V, IO = 40 mA, TJ = 25 ˚C, Unless otherwise specified) PARAMETER Output Voltage SYMBOL VO 4.5 V ≤ VIN ≤ 12 V, 1 mA ≤ IO ≤ 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C VIN = 6 V, 1 mA ≤ IO ≤ 100 mA, 0 ˚C ≤ TJ ≤ 125 ˚C Line Regulation Load Regulation REGIN REGL 4.5 V ≤ VIN ≤ 12 V 1 mA ≤ IO ≤ 100 mA 1 mA ≤ IO ≤ 40 mA Quiescent Current IBIAS IO = 0 IO = 100 mA Start-up Current Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage Peak Output Current Short Circuit Current Temperature Coefficient of Output Voltage IBIAS(S) ∆IBIAS Vn R·R VDIF IOpeak IOshort ∆ V O / ∆T IO = 0 mA, before VO regulation 4.5 V ≤ VIN ≤ 12 V, 0 ˚C ≤ TJ ≤ 125 ˚C 10 Hz ≤ f ≤ 100 kHz f = 120 Hz, 5 V ≤ VIN ≤ 10 V IO = 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C VIN = 6 V VIN = 12 V IO = 5 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 47 35 65 0.15 220 100 0.2 0.3 TEST CONDITIONS MIN. 3.84 3.80 TYP. 4.0 MAX. 4.16 4.20 UNIT V 3.80 4.20 4 33 14 1.6 10 20 30 60 30 2.0 20 50 1.0 mV mV mA mA mA mA µVrms dB V mA mA mV/˚C 6 µPC29L00 Series ELECTRICAL CHARACTERISTICS µPC29L05 (VIN = 6 V, IO = 40 mA, TJ = 25 ˚C, Unless otherwise specified) PARAMETER Output Voltage SYMBOL VO 5.5 V ≤ VIN ≤ 12 V, 1 mA ≤ IO ≤ 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C VIN = 6 V, 1 mA ≤ IO ≤ 100 mA, 0 ˚C ≤ TJ ≤ 125 ˚C Line Regulation Load Regulation REGIN REGL 5.5 V ≤ VIN ≤ 12 V 1 mA ≤ IO ≤ 100 mA 1 mA ≤ IO ≤ 40 mA Quiescent Current IBIAS IO = 0 IO = 100 mA Start-up Current Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage Peak Output Current Short Circuit Current Temperature Coefficient of Output Voltage IBIAS(S) ∆IBIAS Vn R·R VDIF IOpeak IOshort ∆ V O / ∆T IO = 0 mA, before VO regulation 6 V ≤ VIN ≤ 12 V, 0 ˚C ≤ TJ ≤ 125 ˚C 10 Hz ≤ f ≤ 100 kHz f = 120 Hz, 6 V ≤ VIN ≤ 11 V IO = 40 mA, 0 ˚C ≤ TJ ≤ 125 ˚C VIN = 7 V VIN = 12 V IO = 5 mA, 0 ˚C ≤ TJ ≤ 125 ˚C 46 40 62 0.15 210 100 0.2 0.3 TEST CONDITIONS MIN. 4.8 4.75 TYP. 5.0 MAX. 5.2 5.25 UNIT V 4.75 5.25 4 35 15 1.6 10 50 30 80 30 2.0 20 90 1.0 mV mV mA mA mA mA µVrms dB V mA mA mV/˚C 7 µPC29L00 Series TYPICAL CHARACTERISTICS Pd - TA 2000 5 VO - VIN ( µPC29L03) TA = 25 ˚C Pd - Power Dissipation - mW 1500 VO - Output Voltage - V µ PC29L00T 62.5 ˚C/W (With the 16 cm2 × 0.7 mm ceramic substrate) 4 IO = 0 mA 3 40 mA 100 mA 1000 700 500 400 µPC29L00J 180 ˚C/W 85 ˚C 2 µPC29L00T 315 ˚C/W 0 50 100 150 1 0 0 0 2 4 6 8 10 12 14 16 TA - Ambient Temperature - ˚C VIN - Input Voltage - V IBIAS (IBIAS(S)) - VIN ( µ PC29L03) 60 60 TJ = 25 ˚C 50 40 30 20 10 0 IO = 100 mA IO = 40 mA IO = 0 IBIAS (IBIAS(S)) - VIN ( µ PC29L05) TJ = 25 ˚C 50 40 30 20 IO = 100 mA 10 0 IO = 40 mA IO = 0 0 2 4 6 8 10 IBIAS - Quiescent Current - mA 0 2 4 6 8 10 VIN - Input Voltage - V IBIAS - Quiescent Current - mA VIN - Input Voltage - V VDIF - TJ 0.5 IO = 40 mA 0.5 VDIF - IO TJ = 25 ˚C VDIF - Dropout Voltage - V VDIF - Dropout Voltage - V 0.4 0.4 0.3 0.3 µ PC29L03 0.2 0.2 0.1 µ PC29L05 0 50 100 150 0.1 0 –20 0 0 20 40 60 80 100 TJ - Junction Temperature - ˚C IO - Output Current - mA 8 µPC29L00 Series TYPICAL CHARACTERISTICS R·R - f TJ = 25 ˚C ∆VIN = 5 V IO = 40 mA ∆ VO - TJ ( µ PC29L03) ∆ VO - Output Voltage Deviation - mV 100 50 VIN = 4 V IO = 5 mA R·R - Ripple Rejection - dB 80 µPC29L03 0 60 µPC29L05 40 –50 20 0 10 100 1k f - Frequency - Hz 10 k 100 k –100 0 50 100 150 TJ - Junction Temperature - ˚C ∆ VO - TJ ( µ PC29L33) ∆ VO - TJ ( µ PC29L04) VIN = 5 V IO = 5 mA ∆ VO - Output Voltage Deviation - mV ∆ VO - Output Voltage Deviation - mV 50 50 0 0 –50 –50 VIN = 6 V IO = 5 mA –100 0 50 100 150 TJ - Junction Temperature - ˚C –100 0 50 100 150 TJ - Junction Temperature - ˚C ∆ VO - TJ ( µPC29L05) ∆ VO - Output Voltage Deviation - mV 50 0 –50 VIN = 6 V IO = 5 mA –100 0 50 100 150 TJ - Junction Temperature - ˚C 9 µPC29L00 Series PACKAGE DIMENSIONS (Unit: mm) µPC29L00J Series 3PIN PLASTIC SIP (TO-92) 10 µPC29L00 Series µPC29L00T Series SOT-89 4.5±0.1 1.6±0.2 1.5±0.1 0.8 MIN. 0.42 ±0.06 0.47 1.5 ±0.06 3.0 0.42±0.06 0.41+0.03 –0.05 4.0±0.25 2.5±0.1 11 µPC29L00 Series RECOMMENDED SOLDERING CONDITIONS The following conditions (see table below) must be met when soldering this product. Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. TYPES OF THROUGH HOLE MOUNT DEVICE µPC29L00J Series Soldering Process Wave soldering Soldering Conditions Solder temperature: 260 ˚C or below. Flow Time: 10 seconds or below. Symbol TYPES OF SURFACE MOUNT DEVICE For more details, refer to our document “Semiconductor Device Mounting Manual” (IEI-1207). µPC29L00T Series Soldering Process Infrared ray reflow Soldering Conditions Peak package’s temperature: 235 ˚C or below. Reflow time: 30 seconds or below (210 ˚C or higher). Number of flow process: 2. Exposure limit Note: None. Peak package’s temperature: 215 ˚C or below. Reflow time: 40 seconds or below (200 ˚C or higher). Number of flow process: 2. Exposure limit Note: None. Solder temperature: 260 ˚C or below. Flow time: 10 seconds or below. Number of flow process: 1. Exposure limit Note: None. Symbol IR35-00-2 Vapor phase soldering VP15-00-2 Wave soldering WS60-00-1 Note Exposure limit before soldering after dry-pack package is opened. Remark Storage conditions: 25 ˚C and relative humidity at 65 % or less. Caution Do not apply more than a single process at once, except for “Partial heating method”. REFERENCE Document Name NEC semiconductor device reliability/quality control system. Quality grade on NEC semiconductor devices. Semiconductor device mounting technology manual. Semiconductor device package manual. Guide to quality assurance for semiconductor devices. Semiconductor selection guide. Document No. IEI-1212 IEI-1209 IEI-1207 IEI-1213 MEI-1202 MF-1134 12 µPC29L00 Series [MEMO] 13 µPC29L00 Series No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: “Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11