UPC29S78TA

DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC29S00 Series LOW DROPOUT VOLTAGE REGULATOR WITH ON/OFF FUNCTION The µPC29S00 series is a low dropout regulator which has 100 mA capable for the output current. This series features ON/OFF function to control output voltage. The µPC29S00 series is suitable for NEC’s single chip microcontroller which have on-chip flash memory. The µPC29S00 series is use of erasing and writing data on its flash memory. FEATURES • ON/OFF control function (Active high) • Output current excess of 100 mA • Surface mount device package : 4-pin plastic SIP (TO-126 Gullwing) (7.8 V output) 8-pin plastic SOP (225mil) (7.8 V output, 10 V output) • High accuracy output voltage : ± 2% (7.8 V output) –2% to +1% (10 V output) • On-chip all kinds of protection circuit ORDERING INFORMATION Part Number Package 4-pin plastic SIP (TO-126) 4-pin plastic SIP (TO-126 Gullwing) 8-pin plastic SOP (225 mil) 8-pin plastic SOP (225 mil) Output Voltage 7.8 V 7.8 V 7.8 V 10 V µPC29S78H µPC29S78TA µPC29S78GR µPC29S10GR PIN CONFIGURATIONS (Marking Side) TO-126 • µPC29S78H TO-126 Gullwing • µPC29S78TA 8-pin plastic SOP (225mil) • µPC29S78GR • µPC29S10GR INPUT NC 1 2 3 4 1: INPUT 2: ON/OFF 3: GND 4: OUTPUT 1 2 3 4 8 7 6 5 OUTPUT NC GND NC ON/OFF NC The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. G12905EJ4V0DS00 (4th edition) Date Published August 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1997 µPC29S00 Series BLOCK DIAGRAM INPUT Start-up circuit Error amp. ON/OFF ON/OFF control circuit Saturation protection Reference voltage Thermal shutdown Over current protection Drive circuit OUTPUT GND ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified.) Rating Parameter Input Voltage Internal Power Dissipation Operating Ambient Temperature Operating Junction Temperature Storage Temperature Thermal Resistance (Junction to Ambient) Symbol VIN PTNote TA TJ Tstg Rth (J-A) 104 1.2 –30 to +85 –30 to +150 –55 to +150 260 µPC29S78H, 29S78TA 20 µPC29S78GR, 29S10GR Unit V 0.48 W °C °C °C °C/W Note TA ≤ 25°C, Internally limited When operating junction temperature rises up to 150°C, the internal circuit shutdown output voltage. Caution Exposure to Absolute Maximum Ratings for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently. The device should be operated within the limits specified under DC and AC Characteristics. 2 Data Sheet G12905EJ4V0DS00 µPC29S00 Series TYPICAL CONNECTION ON/OFF D1 INPUT µ PC29S00 OUTPUTNote + D2 CIN COUT CIN : 0.1 to 0.47 µF. Be sure to connect to prevent abnormal oscillation. For using capacitors, film capacitors whose voltage and temperature characteristics are excellent are recommended. Take care that some monolithic ceramic capacitor is inferior in the temperature and voltage characteristics. When using the monolithic ceramic capacitor, the CIN needs to be held these capacities in voltage and temperature used. COUT : 10 µF or higher. Be sure to connect to prevent oscillation and to improve the transient load stabilization. Remark Connect the CIN and COUT to IC pins as close as possible (2 cm or less). D1 D2 : Need for VO > VIN : Need a shottky barrier diode for VO < GND. Note When output is off (VON/OFF = low level), OUTPUT pin should not be supplied higher voltage than VIN voltage from external. Caution When using the µPC29S78GR and µPC29S10GR, design your circuit and mounting with consideration for heat radiation. Data Sheet G12905EJ4V0DS00 3 µPC29S00 Series RECOMMENDED OPERATING CONDITIONS Parameter Input Voltage Symbol VIN Condition MIN. 8.8 11 0 –30 –30 TYP. MAX. 18 18 100 +85 +125 Unit V V mA °C °C µPC29S78 µPC29S10 Output Current Operating Ambient Temperature Operating Junction Temperature IO TA TJ Caution If the Absolute Maximum Rating is not exceeded, there is no problem for using recommended operating range or more. Use and evaluate the µPC29S00 Series since the leeway is decreased with the Absolute Maximum Rating. Moreover, the recommended operating range is not prescribed to use when all parameters are maximum value. ELECTRICAL CHARACTERISTICS µPC29S78 (VIN = 12 V, IO = 50 mA, VON/OFF = 5 V, TJ = 25°C, unless otherwise specified.) Parameter Output Voltage Symbol VO 8.5 V ≤ VIN ≤18 V, 0 mA ≤ IO ≤ 50 mA, 0°C ≤ TJ ≤ +125°C 0 mA ≤ IO ≤ 100 mA, 0°C ≤ TJ ≤ +125°C Line Regulation Load Regulation Quiescent Current REGIN REGL IBIAS 8.8 V ≤ VIN ≤ 18 V 0 mA ≤ IO ≤ 100 mA I O = 0 mA IO = 100 mA Start-up Quiescent Current IBIAS(s)1 IBIAS(s)2 Quiescent Current Change VIN = 7.3 V, IO = 0 mA VIN = 7.3 V, IO = 100 mA 8.8 V ≤ VIN ≤ 18 V, 0°C ≤ TJ ≤ +125°C 10 Hz ≤ f ≤ 100 kHz f = 120 Hz, 8.8 V ≤ VIN ≤ 13.5 V IO = 100 mA, 0°C ≤ TJ ≤ +125°C VIN = 9.8 V VIN = 18 V IO = 5 mA, 0°C ≤ TJ ≤ +125°C 150 250 250 –0.4 42 160 51 1.0 400 Conditions MIN. 7.64 7.56 TYP. 7.8 MAX. 7.96 8.04 Unit V 7.56 8.04 22 21 3.0 11 10 75 75 5.0 25 20 50 10 mV mV mA mA mA mA ∆IBIAS Vn R·R VDIF IO peak IO short Output Noise Voltage Ripple Rejection Dropout Voltage Peak Output Current Short Circuit Current Temperature Coefficient of Output Voltage ON/OFF Voltage µVr.m.s. dB V mA mA mV/°C ∆V O / ∆ T VON/OFF1 VON/OFF2 VIN = 12 V, IO = 10 mA VIN = 12 V, IO = 0 mA VON/OFF = 2.7 V, IO = 0 mA VON/OFF = 5 V, IO = 0 mA VON/OFF = 0 V, IO = 0 mA 0.8 1.8 1.6 250 450 2.0 V V ON/OFF Current ION/OFF1 ION/OFF2 450 800 10 µA µA µA Standby Current IBIAS OFF 4 Data Sheet G12905EJ4V0DS00 µPC29S00 Series µPC29S10 (VIN = 12 V, IO = 50 mA, VON/OFF = 5 V, TJ = 25°C, unless otherwise specified.) Parameter Output Voltage Symbol VO 11 V ≤ VIN ≤ 18 V, 0 mA ≤ IO ≤ 50 mA, 0°C ≤ TJ ≤ +125°C 0 mA ≤ IO ≤ 100 mA, 0°C ≤ TJ ≤ +125°C Line Regulation Load Regulation Quiescent Current REGIN REGL IBIAS 11 V ≤ VIN ≤ 18 V 0 mA ≤ IO ≤ 100 mA I O = 0 mA IO = 100 mA Start-up Quiescent Current IBIAS(s)1 IBIAS(s)2 Quiescent Current Change VIN = 9.5 V, IO = 0 mA VIN = 9.5 V, IO = 100 mA 11 V ≤ VIN ≤ 18 V, 0°C ≤ TJ ≤ +125°C 10 Hz ≤ f ≤ 100 kHz f = 120 Hz, 11 V ≤ VIN ≤ 13.5 V IO = 100 mA, 0°C ≤ TJ ≤ +125°C VIN = 12 V VIN = 18 V IO = 5 mA, 0°C ≤ TJ ≤ +125°C 150 40 1.0 Conditions MIN. 9.80 9.70 TYP. 10.00 MAX. 10.10 10.20 Unit V 9.70 10.20 27 18 3.3 12 10 100 100 5.0 25 20 50 10 mV mV mA mA mA mA ∆IBIAS Vn R·R VDIF IO peak IO short Output Noise Voltage Ripple Rejection Dropout Voltage Peak Output Current Short Circuit Current Temperature Coefficient of Output Voltage ON/OFF Voltage 210 48 0.4 250 180 –0.5 1.0 400 µVr.m.s. dB V mA mA mV/°C ∆V O / ∆ T VON/OFF1 VON/OFF2 VIN = 12 V, IO = 10 mA VIN = 12 V, IO = 0 mA VON/OFF = 2.7 V, IO = 0 mA VON/OFF = 5 V, IO = 0 mA VON/OFF = 0 V, IO = 0 mA 0.8 1.8 1.6 250 450 2.0 V V ON/OFF Current ION/OFF1 ION/OFF2 450 800 10 µA µA µA Standby Current IBIAS OFF Data Sheet G12905EJ4V0DS00 5 µPC29S00 Series TYPICAL CHARACTERISTICS (REFERENCE VALUES) PT vs TA 1.4 PT - Total Power Dissipation - W 1.2 1.0 0.8 0.6 0.4 0.2 0 12 TJ = 25°C IO = 50 mA VO vs VIN µ PC29S78H, 29S78TA 10 VO - Output Voltage - V 8 µ PC29S10 µ PC29S78 6 4 2 0 µ PC29S78GR, 29S10GR 0 25 50 75 100 125 150 0 5 10 15 TA - Operating Ambient Temperature - °C VIN - Input Voltage - V IBIAS (IBIAS(s)) vs VIN (µPC29S78) 40 TJ = 25°C 35 IBIAS - Quiescent Current - mA 30 25 20 15 10 5 00 5 10 15 IO = 0 mA IO = 50 mA IO = 100 mA IBIAS - Quiescent Current - mA 35 30 25 40 IBIAS (IBIAS(s)) vs VIN (µPC29S10) TJ = 25°C IO = 100 mA 20 15 10 5 00 5 10 15 IO = 0 mA IO = 50 mA VIN - Input Voltage - V VIN - Input Voltage - V VO vs VON/OFF 12 40 VIN = 12 V IO = 5 mA ∆VO vs TJ ∆ VO - Output Voltage Deviation - mV 10 VO - Output Voltage - V 8 6 4 2 0 TJ = 25°C VIN = 12 V IO = 50 mA 0 1 2 3 4 5 20 0 – 20 – 40 – 60 – 80 µPC29S78 µPC29S10 – 100 – 50 – 25 0 25 50 75 100 125 150 VON/OFF - ON/OFF Voltage - V TJ - Operating Junction Temperature - °C 6 Data Sheet G12905EJ4V0DS00 µPC29S00 Series IO peak vs (VIN – VO) 400 IO peak - Peak Output Current - mA 350 300 250 200 150 100 50 0 2 4 6 8 10 12 0 0.01 0.1 1 f - Frequency - kHz TJ = 25 °C TJ = 0 °C 60 50 R•R - Ripple Rejection - dB 40 30 20 10 TJ = 25°C IO = 100 mA 10 100 R•R vs f µPC29S78 µPC29S10 TJ = 125 °C VIN – VO - Dropout Voltage - V VDIF vs IO 0.5 0.5 VDIF vs TJ VDIF - Dropout Voltage - V 0.3 TJ = 125°C TJ = 25°C VDIF - Dropout Voltage - V 0.4 0.4 0.3 IO = 100 mA 0.2 IO = 50 mA 0.1 IO = 5 mA 0.2 TJ = – 30°C 0.1 0 0 20 40 60 80 100 0 – 50 0 50 100 150 IO - Output Current - mA TJ - Operating Junction Temperature - °C Data Sheet G12905EJ4V0DS00 7 µPC29S00 Series PACKAGE DRAWINGS 4 PIN PLASTIC SIP (TO-126) A E N M Q D 1 4 K Y H C F J V U G M ITEM A C D E F G H J K M N Q U V Y MILLIMETERS 8.5 MAX. 1.1 MIN. 9.7 ± 0.3 INCHES 0.335 MAX. 0.043 MIN. 0.382 ± 0.012 NOTE Each lead centerline is located within 0.2 mm (0.008 inch) of its true position (T.P.) at maximum material condition. φ 3.2 ± 0.1 0.65 ± 0.1 0.2 2.0 1.25 MAX. 2.3 MIN. 11.5 MAX. 2.7 ± 0.2 14.5 MAX. 1.7 MAX. 0.55 ± 0.1 13.5 ± 0.7 φ 0.126 ± 0.004 0.026 +0.004 –0.005 0.008 0.079 0.05 MAX. 0.09 MIN. 0.453 MAX. 0.106 +0.009 –0.008 0.571 MAX. 0.067 MAX. 0.022 +0.004 –0.005 0.531 +0.029 –0.028 P4HP-200B-1 8 Data Sheet G12905EJ4V0DS00 µPC29S00 Series 4 PIN PLASTIC SIP (TO-126 GULLWING) A N P I H 1 4 (K) C S D B V M M detail of lead end F G J E R L ITEM A B C D E F G H I J K L M N P R S V MILLIMETERS 8.0 ± 0.2 0.65 ± 0.1 2.0 ± 0.3 0.65 ± 0.1 0.25 ± 0.15 3.2 MAX. 2.7 ± 0.1 11.0 ± 0.2 3.8 3.0 ± 0.5 2.5 1.3 ± 0.3 0.18 3.2 ± 0.1 φ 4.0 ° 3 ° +5° –3 1.25 ± 0.1 0.55 ± 0.1 Data Sheet G12905EJ4V0DS00 9 µPC29S00 Series 8 PIN PLASTIC SOP (225 mil) 8 5 detail of lead end P 1 A 4 H F G I J S B E D NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. L K N S C M M ITEM A B C D E F G H I J K L M N P MILLIMETERS 5.2 + 0.17 − 0.20 0.78 MAX. 1.27 (T.P.) 0.42 + 0.08 − 0.07 0.1 ± 0.1 1.59 ± 0.21 1.49 6.5 ± 0.3 4.4 ± 0.15 1.1 ± 0.2 0.17 + 0.08 − 0.07 0.6 ± 0.2 0.12 0.10 +7° 3° −3° S8GM-50-225B-5 10 Data Sheet G12905EJ4V0DS00 µPC29S00 Series RECOMMENDED SOLDERING CONDITIONS When soldering these products, it is highly recommended to observe the conditions as shown below. If other soldering processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales offices. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E). Surface mount devices µPC29S78TA: 4-pin plastic SIP (TO-126 Gullwing) Process Infrared ray reflow Conditions Peak temperature: 235°C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 2 times. Peak temperature: 215°C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 2 times. Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each side of the device). Symbol IR35-00-2 VPS VP15-00-2 Wave soldering WS60-00-1 Partial heating method – Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the device will be damaged by heat stress. µPC29S78GR, 29S10GR: 8-pin plastic SOP (225 mil) Process Infrared ray reflow Conditions Peak temperature: 235°C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 3 times. Peak temperature: 215°C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 3 times. Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each side of the device). Symbol IR35-00-3 VPS VP15-00-3 Wave soldering WS60-00-1 Partial heating method – Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or the device will be damaged by heat stress. Data Sheet G12905EJ4V0DS00 11 µPC29S00 Series Through-hole device µPC29S78H: 4-pin plastic SIP (TO-126) Process Wave soldering (only to leads) Partial heating method Conditions Solder temperature: 260˚C or below, Flow time: 10 seconds or less. Pin temperature: 300˚C or below, Heat time: 3 seconds or less (per each lead). Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. CAUTION ON USE When using the µPC29S00 series at the input voltage which is lower than in the recommended operating condition, the big quiescent current flows through device because the transistor of the output paragraph is saturated (Refer to IBIAS (IBIAS (s)) vs VIN curves in TYPICAL CHARACTERISTICS). The µPC29S00 series has saturation protection circuits, but they sometimes need about 50 mA current. Therefore the power supply on the input needs the enough current capacity to pass this quiescent current when the device start-up. REFERENCE DOCUMENTS QUALITY GRADES ON NEC SEMICONDUCTOR DEVICES SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL SEMICONDUCTORS SELECTION GUIDE C11531E C10535E X10679E 12 Data Sheet G12905EJ4V0DS00 µPC29S00 Series [MEMO] Data Sheet G12905EJ4V0DS00 13 µPC29S00 Series [MEMO] 14 Data Sheet G12905EJ4V0DS00 µPC29S00 Series [MEMO] Data Sheet G12905EJ4V0DS00 15 µPC29S00 Series [MEMO] • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98.8