UPC3025TJ-E2

DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC3018, 3025 LOW-SATURATION STABILIZED POWER SUPPLY WITH ON/OFF FUNCTION (1 A OUTPUT) DESCRIPTION The µPC3018 and 3025 are low-saturation type regulators with an output current of 1 A at respective output voltages of 1.8 and 2.5 V. These regulators are also provided with an ON/OFF function, which reduces the dissipation when there is no load, making them ideal for systems requiring low power consumption. FEATURES • ON/OFF pin for output control (active-high) • Output current capacitance: 1 A • Low minimum voltage difference between input and output (VDIF = 0.5 V MAX. (when IO = 0.5 A)) • Output voltage accuracy: ±2% • On-chip inrush current protection circuit for when input voltage rises (when input voltage is low) • On-chip overcurrent limiter and thermal shutdown circuit • On-chip safe operating area controller PIN CONFIGURATION (Marking Side) MP-3Z (5 pin), MP-3 (5 pin) 1: ON/OFF 2: INPUT 3: GND 4: OUTPUT 5: NC 6: GND (Fin) 6 1 2 3 4 5 ORDERING INFORMATION Part Number Package MP-3Z (5 pin) Marking 30xx 30xx • In bags • 16 mm embossed taping • Pin 1 in tape pull-out direction • 2000/reel Packing Type µ PC30xxTJ µ PC30xxTJ-E1 MP-3Z (5 pin) µ PC30xxTJ-E2 MP-3Z (5 pin) 30xx • 16 mm embossed taping • Pin 1 in tape wind-up direction • 2000/reel µ PC30xxHB MP-3 (5 pin) 30xx • In bags “xx” in the part number and marking corresponds to the following output voltage. Example Output Voltage 1.8 V 2.5 V Part Number Marking 3018 3025 µ PC3018TJ µ PC3025TJ The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. G15506EJ2V0DS00 (2nd edition) Date Published July 2002 NS CP(K) Printed in Japan The mark 5 shows major revised points. © 2001,2002 µPC3018, 3025 BLOCK DIAGRAM INPUT Safe operating area controller ON/OFF ON/OFF circuit Reference voltage circuit Error amplifier Driver Inrush current protection circuit OUTPUT Starter circuit Thermal shutdown circuit Overcurrent limiter GND 2 Data Sheet G15506EJ2V0DS µPC3018, 3025 ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified) Parameter Input Voltage ON/OFF pin voltage Internal Power Dissipation (TC = 25°C) Operating Ambient Temperature Operating Junction Temperature Storage Temperature Thermal Resistance (junction to case) Thermal Resistance (junction to ambient) Symbol VIN VON/OFF PT TA TJ Tstg Rth(J-C) Rth(J-A) Rating –0.3 to +20 –0.3 to VIN +0.3 V (however, VON/OFF ≤ 20) 10Note –30 to +85 –30 to +150 –55 to +150 12.5 125 W °C °C °C °C/W °C/W Unit V Note The total dissipation is limited by an internal circuit. Where TJ > 150°C, an internal protection circuit cuts off the output. Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. TYPICAL CONNECTION ON/OFF D1 INPUT CIN PC3018, PC3025 + COUT OUTPUT D2 Must be 0.1 µF or more. Determine the capacitance in accordance with the line between the power supply smoothing circuit and input pin. Be sure to connect this capacitor to prevent abnormal oscillation. Use of a capacitor with excellent voltage and temperature characteristics, such as a film capacitor, is recommended. Note that some laminated ceramic capacitors have poor temperature and voltage characteristics. When using a laminated ceramic capacitor, the capacitance of 0.1 µF or more must be reserved in the voltage and temperature ranges used. COUT: Must be 10 µF or more. Be sure to connect this capacitor to prevent oscillation and to improve transient load stability. Connect CIN and COUT as close to the IC pins as possible (within 1 to 2 cm). Also, when using the device at 0°C or less, use an electrolytic capacitor with low impedance characteristics. D1: Connect a diode if the voltage on the OUTPUT pin is higher than that on the INPUT pin. D2: Connect a Schottky barrier diode if the voltage on the OUTPUT pin is lower than that on the GND pin. CIN: Caution Ensure that voltage is not applied to the OUTPUT pin externally. Supply VIN and VON/OFF from different power supplies. Design so that VIN and VON/OFF either rise at the same time or VON/OFF rises after VIN. Data Sheet G15506EJ2V0DS 3 µPC3018, 3025 RECOMMENDED OPERATING CONDITIONS Parameter Input Voltage Symbol VIN Corresponding Model MIN. 2.8 3.5 0 0 − 30 − 30 TYP. MAX. 16 16 VIN 1 + 85 + 125 A °C °C Unit V V µ PC3018 µ PC3025 ON/OFF Pin Voltage Output Current VON/OFF IO All models All models All models All models Operating Ambient Temperature TA Operating Junction Temperature TJ Caution The recommended operating range may be exceeded without causing any problems provided the absolute maximum ratings are not exceeded. However, if the device is operated in a way that exceeds the recommended operating conditions, the margin between the actual conditions of use and the absolute maximum ratings is small, and therefore thorough evaluation is necessary. The recommended operating conditions do not imply that the device can be used with all values at their maximum values. ELECTRICAL CHARACTERISTICS µPC3018 (TJ = 25°C, VIN = 2.8 V, VON/OFF = 2.8 V, IO = 0.5 A, CIN = 0.1 µF, COUT = 10 µF, unless otherwise specified) Parameter Output Voltage Symbol VO 0°C ≤ TJ ≤ 125°C, 2.8 V ≤ VIN ≤ 5 V, 0 mA ≤ IO ≤ 1 A Line Regulation Load Regulation Quiescent Current REGIN REGL IBIAS 2.8 V ≤ VIN ≤ 16 V 0 A ≤ IO ≤ 1 A IO = 0 A IO = 1 A Startup Quiescent Current IBIAS (s) VIN = 2.4 V, VON/OFF = 2.0 V, IO = 0 A VIN = 2.4 V, VON/OFF = 2.0 V, IO = 1 A Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage 0°C ≤ TJ ≤ 125°C, 2.8 V ≤ VIN ≤ 16 V 10 Hz ≤ f ≤ 100 kHz f = 120 Hz, 2.8 V ≤ VIN ≤ 9 V IO = 0.5 A 0°C ≤ TJ ≤ 125°C, IO = 1 A Short Circuit Current IOshort VIN = 2.8 V VIN = 16 V Peak Output Current IOpeak VIN = 2.8 V VIN = 3.3 V VIN = 16 V Temperature Coefficient of Output Voltage ON Voltage OFF Voltage ON/OFF Pin Current 1.0 1.0 1.2 (45) 6 7 2 20 10 25 30 4 60 30 80 2.9 40 60 0.25 0.7 1.7 1.2 1.5 1.7 1.1 − 0.4 2.0 0.8 VIN = 2.8 V, VON/OFF = 2.8 V VIN = 3.3 V, VON/OFF = 3.3 V VIN = 5 V, VON/OFF = 5 V Standby Current IBIAS (OFF) VON/OFF = 0 V 90 110 160 10 mV/°C V V 3.0 3.0 A 3.0 A 0.5 20 mA mA mV mV mA Conditions MIN. 1.764 (1.71) TYP. 1.8 MAX. 1.836 (1.854) Unit V ∆IBIAS Vn R•R VDIF µ Vr.m.s. dB V ∆VO /∆T VON/OFF VON/OFF ION/OFF 0°C ≤ TJ ≤ 125°C, IO = 5 mA µA µA Remark Values in parentheses are reference values obtained during product design. 4 Data Sheet G15506EJ2V0DS µPC3018, 3025 µPC3025 (TJ = 25°C, VIN = 3.5 V, VON/OFF = 3.5 V, IO = 0.5 A, CIN = 0.1 µF, COUT = 10 µF, unless otherwise specified) Parameter Output Voltage Symbol VO 0°C ≤ TJ ≤ 125°C, 3.5 V ≤ VIN ≤ 5 V, 0 mA ≤ IO ≤ 1 A Line Regulation Load Regulation Quiescent Current REGIN REGL IBIAS 3.5 V ≤ VIN ≤ 16 V 0 A ≤ IO ≤ 1 A IO = 0 A IO = 1 A Startup Quiescent Current IBIAS (s) VIN = 2.4 V, VON/OFF = 2.0 V, IO = 0 A VIN = 3.0 V, VON/OFF = 2.0 V, IO = 1 A Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage 0°C ≤ TJ ≤ 125°C, 3.5 V ≤ VIN ≤ 16 V 10 Hz ≤ f ≤ 100 kHz f = 120 Hz, 3.5 V ≤ VIN ≤ 9 V IO = 0.5 A 0°C ≤ TJ ≤ 125°C, IO = 1 A Short Circuit Current IOshort VIN = 3.5 V VIN = 16 V Peak Output Current IOpeak VIN = 3.5 V VIN = 5 V VIN = 16 V Temperature Coefficient of Output Voltage ON Voltage OFF Voltage ON/OFF Pin Current 1.0 1.0 1.2 (45) 6 7 2 20 10 25 30 4 60 30 80 2.9 40 60 0.25 0.7 1.7 1.2 1.5 2.1 1.1 −0.5 2.0 0.8 VIN = 3.5 V, VON/OFF = 3.5 V VIN = 5 V, VON/OFF = 5 V Standby Current IBIAS (OFF) VON/OFF = 0 V 110 160 10 mV/°C V V 3.0 3.0 A 3.0 A 0.5 20 mA mA mV mV mA Conditions MIN. 2.45 (2.375) TYP. 2.5 MAX. 2.55 (2.575) Unit V ∆IBIAS Vn R•R VDIF µ Vr.m.s. dB V ∆VO /∆T VON/OFF VON/OFF ION/OFF 0°C ≤ TJ ≤ 125°C, IO = 5 mA µA µA Remark Values in parentheses are reference values obtained during product design. Data Sheet G15506EJ2V0DS 5 µPC3018, 3025 5 TYPICAL CHARACTERISTICS (Reference Values) PD vs. TA VO vs. VIN ( µPC3018) 12 PD - Internal Power Consumption - W 2.5 TJ = 25˚C VON/OFF = 2 V 10 8 6 4 2 1.0 0 0 Without W in fin ite he at VO - Output Voltage - V ith 2.0 IO = 0 A sin 1.5 IO = 0.5 A IO = 1.0 A k 1.0 heatsink 0.5 0 50 100 TA - Operating Ambient Temperature - °C VO vs. VIN ( µPC3025) 150 0 1 2 3 4 5 6 7 8 VIN - Input Voltage - V IBIAS (IBIAS(s)) vs. VIN ( µ PC3018) 3.0 IO = 0 A TJ = 25˚C VON/OFF = 2 V 50 TJ = 25˚C VON/OFF = 2 V IBIAS - Quiescent Current - mA VO - Output Voltage - V 40 2.0 IO = 0.5 A IO = 1.0 A 30 IO = 1.0 A 20 IO = 0.5 A 10 IO = 0 A 1.0 0 0 1 2 3 4 5 6 7 8 VIN - Input Voltage - V 0 0 5 10 15 20 VIN - Input Voltage - V IBIAS (IBIAS(s)) vs. VIN ( µ PC3025) 50 100 VO vs. TJ 40 ∆VO - Output Voltage Deviation - mV TJ = 25˚C VON/OFF = 2 V VON/OFF = 2 V 75 50 25 0 –25 –50 –75 –100 –50 IBIAS - Quiescent Current - mA µPC3025 30 IO = 1.0 A 20 IO = 0.5 A 10 IO = 0 A 0 0 5 10 15 VIN - Input Voltage - V 20 µPC3018 –25 0 25 50 75 100 125 150 TJ - Operating Junction Temperature - °C 6 Data Sheet G15506EJ2V0DS µPC3018, 3025 VDIF vs. TJ IOpeak vs. VDIF 2.5 TJ = 25˚C VON/OFF = 2 V 1 VDIF - Dropout Voltage - V VDIF - Dropout Voltage - V 0.8 µPC3018 µPC3025 2 µPC3025 1.5 0.6 µPC3018 0.4 1 0.2 IO = 1.0 A VON/OFF = 2 V 0 –25 0.5 0 0 25 50 75 100 125 150 0 5 TJ - Operating Junction Temperature - °C 10 15 VIN - Input Voltage - V 20 R R vs. f 80 70 . R R vs. IO 80 . µPC3018 R R - Ripple Rejection - dB 75 70 65 60 55 50 45 40 35 30 100000 R R - Ripple Rejection - dB µPC3025 60 50 40 30 20 10 0 10 100 1000 TJ = 25˚C IO = 1.0 A VON/OFF = 2 V 10000 µPC3025 µPC3018 . . TJ = 25˚C, f = 120 Hz µ PC3018: 2.8 V ≤ VIN ≤ 9 V µ PC3025: 3.5 V ≤ VIN ≤ 9 V VON/OFF = 2 V 0 0.2 0.4 0.6 0.8 1 f - Frequency - Hz VDIF vs. IO ( µ PC3018) 1 TJ = 25˚C VON/OFF = 2 V VDIF - Dropout Voltage - V VDIF - Dropout Voltage - V IO - Output Current - A 1 VDIF vs. IO ( µ PC3025) TJ = 25˚C VON/OFF = 2 V 0.8 0.8 0.6 0.6 0.4 0.4 0.2 0.2 0 0 0.2 0.8 0.4 0.6 IO - Output Current - A 1 0 0 0.2 0.4 0.6 0.8 1 IO - Output Current - A Data Sheet G15506EJ2V0DS 7 µPC3018, 3025 VO vs. VON/OFF ( µ PC3018) 2.0 3.0 2.5 VO - Output Voltage - V VO vs. VON/OFF ( µ PC3025) 1.5 VO - Output Voltage - V 2.0 1.5 1.0 0.5 0 VIN = 20 V IO = 0.5 A TJ = 25˚C 0 5 10 15 20 1.0 0.5 VIN = 20 V IO = 0.5 A TJ = 25˚C 0 0 5 10 15 20 VON/OFF - ON/OFF pin Voltage - V VON/OFF - ON/OFF pin Voltage - V 8 Data Sheet G15506EJ2V0DS µPC3018, 3025 PACKAGE DRAWINGS MP-3Z (5 pin) (Unit: mm) 6.5± 0.2 5.0± 0.2 2.3 ±0.2 1.5+0.2 –0.1 0.5 ±0.1 4.3 MAX. 5.5±0.2 10.0 MAX. 2.0 MIN. 0.9 MAX. 1.27 1.27 0.8 MAX. 0.8 ' MP-3 (5 pin) (Unit: mm) 6.5± 0.2 5.0± 0.2 2.3 ±0.2 1.5 –0.1 +0.2 0.5 ±0.1 1.6 }0.2 5.5±0.2 1.1 }0.1 7.0 MIN. 1.27 1.27 0.5 {0.2 |0.1 13.7 MIN. 0.5 {0.2 |0.1 0.75 0.5 1.0 MIN. 1.5 TYP. Data Sheet G15506EJ2V0DS 9 µPC3018, 3025 RECOMMENDED SOLDERING CONDITIONS The µPC3018, 3025 should be soldered and mounted under the following recommended conditions. For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended below, contact our sales representative. Type of Surface Mount Device µPC3018TJ, µPC3025TJ: MP-3Z (5 pin) Process Infrared Ray Reflow Peak temperature: 235°C, Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflow processes: 3 times or less. Vapor Phase Soldering Peak temperature: 215°C, Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflow processes: 3 times or less. Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C MAX. (Package surface temperature). Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each side of the device). – WS60-00-1 VP15-00-3 Conditions Symbol IR35-00-3 Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the device will be damaged by heat stress. Remark It is recommended to use a rosin-type flux with a low chlorine element (chlorine: 0.2 Wt% or less). Type of Through-hole Device µPC3018HB, µPC3025HB: MP-3 (5 pin) Process Wave Soldering (only to leads) Partial Heating Method Solder temperature: 260°C or below, Flow time: 10 seconds or less Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each pin). Conditions Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered. 10 Data Sheet G15506EJ2V0DS µPC3018, 3025 CAUTION ON USE If the µPC3018 and µPC3025 Series are used with an input voltage that is lower than the recommended operating conditions, a large circuit current flows because the transistor in the output stage is saturated. The specification of this characteristic is the circuit operating current at startup, IBIAS (S). In this product, the circuit current flowing at startup is limited by an on-chip inrush current protection circuit, but a circuit current of up to 80 mA may still flow. The power supply on the input side must therefore have sufficient capacitance to handle this circuit current at startup. REFERENCE DOCUMENTS Document Name Usage of Three-Terminal Regulators Voltage Regulator of SMD User’s Manual Document No. G12702E G11872E Information C10535E X13769X Information Semiconductor Device Mounting Technology Manual SEMICONDUCTOR SELECTION GUIDE - Products and Packages- Data Sheet G15506EJ2V0DS 11 µPC3018, 3025 • The information in this document is current as of July, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4