UPC3215TB

PRELIMINARY DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC3215TB 5 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER DESCRIPTION The µPC3215TB is a silicon monolithic IC designed as wideband amplifier. systems required wideband operation from HF to L band. This IC is manufactured using NEC’s 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. The package is 6-pin super minimold suitable for surface mount. The µPC3215TB is suitable to FEATURES • Wideband response • Noise figure • Power gain • Supply voltage : fu = 2.9 GHz TYP. @3 dB bandwidth : NF = 2.3 dB TYP. @f = 1.5 GHz : GP = 20.5 dB TYP. @f = 1.5 GHz : VCC = 4.5 to 5.5 V • High-density surface mounting: 6-pin super minimold package APPLICATION • Systems required wideband operation from HF to L band ORDERING INFORMATION Part Number Package 6-pin super minimold Marking C3H Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face the perforation side of the tape. Qty 3 kpcs/reel. µPC3215TB-E3 Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC3215TB) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P14765EJ1V0DS00 (1st edition) Date Published April 2000 N CP(K) Printed in Japan © 2000 µPC3215TB PIN CONNECTIONS (Top View) (Bottom View) 4 4 3 Pin No. 1 2 Pin Name INPUT GND GND OUTPUT GND VCC 3 2 C3H 5 5 2 3 4 1 6 6 1 5 6 PRODUCT LINE-UP OF 5V-BIAS SILICON MMIC WIDEBAND AMPLIFIERS (TA = +25 °C, VCC = 5.0 V, ZS = ZL = 50 Ω) fu (GHz) 2.9 PO (sat) (dBm) +1.0 GP (dB) 13 NF (dB) 5.0 @f = 1 GHz 4.5 @f = 1 GHz 3.4 @f = 1.5 GHz 2.3 @f = 1.5 GHz ICC (mA) 12 Part No. Package 6-pin minimold 6-pin super minimold Marking C1G µPC2711T µPC2711TB µPC2712T µPC2712TB µPC3210TB µPC3215TB 2.6 +3.0 20 12 6-pin minimold 6-pin super minimold C1H 2.3 +3.5 20 15 6-pin super minimold C2X 2.9 +3.5 20.5 14 6-pin super minimold C3H Remark Caution Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. The package size distinguishes between minimold and super minimold. 2 Preliminary Data Sheet P14765EJ1V0DS00 µPC3215TB PIN EXPLANATION Applied Voltage (V)  Pin Voltage Note (V) 0.82 Pin No. 1 Pin Name Function and Applications Internal Equivalent Circuit INPUT Signal input pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wideband. A multifeedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. Signal output pin. A internal matching circuit, configured with resistors, enables 50 Ω connection over a wideband. This pin must be coupled to next stage with capacitor for DC cut. Power supply pin. This pin should be externally equipped with bypass capacitor to minimize ground impedance. VCC 6 4 OUT IN 1 2 3 5 GND 0  2 GND 5 4 OUTPUT  3.8 3 GND 6 VCC 4.5 to 5.5  Note Pin voltage is measured at VCC = 5.0 V Preliminary Data Sheet P14765EJ1V0DS00 3 µPC3215TB ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Circuit Current Input Power Power Dissipation Operating Ambient Temperature Storage Temperature Symbol VCC ICC Pin PD TA Tstg TA = +25 °C TA = +25 °C TA = +25 °C TA = +85 °C Note Conditions Ratings 6.0 30 +10 200 –40 to +85 –55 to +150 Unit V mA dBm mW °C °C Note Mounted on 50 × 50 × 1.6-mm epoxy glass PWB, with copper patterning on both sides. RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Operating Ambient Temperature Input Power Input Frequency Symbol VCC TA Pin Fin MIN. 4.5 –40 – 0.1 TYP. 5.0 +25 – – MAX. 5.5 +85 0 2.9 Unit V °C dBm GHz ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 Ω) Parameter Circuit Current Power Gain Noise Figure Upper Limit Operating Frequency Isolation Input Return Loss Output Return Loss 1 dB Compression Point Symbol ICC GP NF fu Test Conditions No input signals f = 1.5 GHz, Pin = –30 dBm f = 1.5 GHz 3 dB down below from gain at f = 0.1 GHz f = 1.5 GHz, Pin = –30 dBm f = 1.5 GHz, Pin = –30 dBm f = 1.5 GHz, Pin = –30 dBm MIN. 10.5 18.5 – 2.5 TYP. 14.0 20.5 2.3 2.9 MAX. 17.5 – 3.0 – Unit mA dB dB GHz ISL RLin RLout P-1 39 10 6.5 –4 44 15 9.5 –1.5 – – – – dB dB dB dBm STANDARD CHARACTERISTICS (TA = +25°C, VCC = 5.0 V, ZS = ZL = 50 Ω) Parameter Saturated Output Power Output Intercept Point Gain Flatness Symbol PO(sat) OIP3 ∆GP Pin = 0 dBm f1 = 1.5 GHz, f2 = 1.501 GHz f = 0.1 to 2.15 GHz Test Conditions Reference Values +3.5 +10 1.0 Unit dBm dBm dB 4 Preliminary Data Sheet P14765EJ1V0DS00 µPC3215TB TEST CIRCUIT VCC 1 000 pF C3 6 50 Ω IN 1 000 pF C1 1 4 C2 1 000 pF 50 Ω OUT 2, 3, 5 EXAMPLE OF APPLICATION CIRCUIT VCC 1 000 pF 1 000 pF 6 50 Ω IN 1 000 pF 1 4 1 000 pF 1 000 pF 50 to 200 Ω 2, 3, 5 Please connect these component to stabilize operation. 1 6 4 1 000 pF 50 Ω OUT 2, 3, 5 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. Capacitors for VCC, input and output pins 1 000 pF capacitors are recommendable as bypass capacitor for VCC pin and coupling capacitors for input/output pins. Bypass capacitor for VCC pin is intended to minimize VCC pin’s ground impedance. Therefore, stable bias can be supplied against VCC fluctuation. Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC. To get flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 π fZs).] Preliminary Data Sheet P14765EJ1V0DS00 5 µPC3215TB PACKAGE DIMENSIONS 6 PIN SUPER MINIMOLD (UNIT: mm) 0.2 +0.1 –0.05 0.1 MIN. 0.15 +0.1 –0.05 1.25 ±0.1 2.1 ±0.1 0 to 0.1 0.65 1.3 0.65 0.7 0.9 ±0.1 2.0 ±0.2 6 Preliminary Data Sheet P14765EJ1V0DS00 µPC3215TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). (3) Keep the track length of the ground pins as short as possible. (4) A low pass filter must be attached to VCC line. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235 °C or below Time: 30 seconds or less (at 210 °C) Note Count: 3, Exposure limit: None Package peak temperature: 215 °C or below Time: 40 seconds or less (at 200 °C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260 °C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300 °C Time: 3 seconds or less (per side of device) Note Exposure limit: None Recommended Condition Symbol IR35-00-3 VPS VP15-00-3 Wave Soldering WS60-00-1 Partial Heating – Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Preliminary Data Sheet P14765EJ1V0DS00 7 µPC3215TB • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • N o part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • D escriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8