UPC8106TB

PRELIMINARY DATA SHEET BIPOLAR ANALOG INTEGRATED CIRCUIT µPC8172TB SILICON MMIC 2.5 GHz FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER DESCRIPTION The µPC8172TB is a silicon monolithic integrated circuit designed as frequency up-converter for wireless transceiver transmitter stage. This IC is manufactured using NEC’s 30 GHz fmax. UHS0 (Ultra High Speed Process) silicon bipolar process. This IC is as same circuit current as conventional µPC8106TB, but operates at higher frequency, higher gain and lower distortion. Consequently this IC is suitable for mobile communications. FEATURES • Recommended operating frequency : fRFout = 0.8 to 2.5 GHz • Higher IP3 • High-density surface mounting • Supply voltage : CG = 9.5 dB TYP., OIP3 = +7.5 dBm TYP. @ fRFout = 0.9 GHz : 6-pin super minimold package : VCC = 2.7 to 3.3 V APPLICATIONS • PCS1900M • 2.4 GHz band transmitter/receiver system (wireless LAN etc.) ORDERING INFORMATION Part Number Package 6-pin super minimold Marking C3A Supplying Form • Embossed tape 8 mm wide. • Pin 1, 2, 3 face the tape perforation side. • Qty 3 kpcs/reel. µPC8172TB-E3 Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPC8172TB) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P14729EJ1V0DS00 (1st edition) Date Published June 2000 N CP(K) Printed in Japan © 2000 µPC8172TB PIN CONNECTIONS Pin No. (Top View) (Bottom View) Pin Name IFinput GND LOinput PS VCC RFoutput 1 C3A 3 4 4 3 2 3 2 5 5 2 4 6 6 1 1 5 6 SERIES PRODUCTS (TA = +25°C, VCC = VPS = VRFout = 3.0 V, ZS = ZL = 50 Ω) Part Number ICC (mA) 9 9 5 16.5 fRFout (GHz) 0.8 to 2.5 0.4 to 2.0 0.4 to.2.0 0.8 to 2.0 CG (dB) @RF 0.9 GHz 9.5 9 6 9 Note @RF 1.9 GHz 8.5 7 4 5.5 @RF 2.4 GHz 8.0 − − − µPC8172TB µPC8106TB µPC8109TB µPC8163TB PO(sat) (dBm) Part Number @RF 0.9 GHz Note OIP3 (dBm) @RF 2.4 GHz −0.5 − − − @RF 0.9 GHz +7.5 +5.5 +1.5 +9.5 Note @RF 1.9 GHz 0 −4 −7.5 −2 @RF 1.9 GHz +6.0 +2.0 −1.0 +6.0 @RF 2.4 GHz +4.0 − − − µPC8172TB µPC8106TB µPC8109TB µPC8163TB +0.5 −2 −5.5 +0.5 Note fRFout = 0.83 GHz @ µPC8163TB Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. To know the associated product, please refer to each latest data sheet. BLOCK DIAGRAM (FOR THE µPC8172TB) (Top View) LOinput PS GND VCC IFinput RFoutput 2 Preliminary Data Sheet P14729EJ1V0DS00 µPC8172TB SYSTEM APPLICATION EXAMPLES (SCHEMATICS OF IC LOCATION IN THE SYSTEM) Wireless Transceiver Low Noise Tr. RX DEMOD. I Q SW VCO ÷N PLL PLL I 0° TX PA Phase shifter µPC8172TB 90° Q To know the associated products, please refer to each latest data sheet. Preliminary Data Sheet P14729EJ1V0DS00 3 µPC8172TB PIN EXPLANATION Applied Voltage (V) − Pin Voltage Note (V) 1.4 Pin No. 1 Pin Name IFinput Function and Explanation Equivalent Circuit This pin is IF input to double balanced mixer (DBM). The input is designed as high impedance. The circuit contributes to suppress spurious signal. Also this symmetrical circuit can keep specified performance insensitive to process-condition distribution. For above reason, double balanced mixer is adopted. GND pin. Ground pattern on the board should be formed as wide as possible. Track Length should be kept as short as possible to minimize ground impedance. Local input pin. Recommendable input level is −10 to 0 dBm. Supply voltage pin. This pin is RF output from DBM. This pin is designed as open collector. Due to the high impedance output, this pin should be externally equipped with LC matching circuit to next stage. Power save control pin. Bias controls operation as follows. Pin bias VCC GND Control 4 VCC 5 5 6 3 2 GND GND − 1 3 LOinput − 2.3 − − 5 6 VCC RFoutput 2.7 to 3.3 Same bias as VCC through external inductor VCC/GND 2 4 PS − Operation Power Save GND 2 Note Each pin voltage is measured with VCC = VPS = VRFout = 3.0 V. 4 Preliminary Data Sheet P14729EJ1V0DS00 µPC8172TB ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage PS pin Input Voltage Power Dissipation of Package Symbol VCC VPS PD TA = +25°C TA = +25°C Mounted on double-side copperclad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85°C) Test Conditions Rating 3.6 3.6 200 Unit V V mW Operating Ambient Temperature Storage Temperature Maximum Input Power TA Tstg Pin −40 to +85 −55 to +150 +10 °C °C dBm RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Symbol VCC Test Conditions The same voltage should be applied to pin 5 and 6 MIN. 2.7 −40 ZS = 50 Ω (without matching) With external matching circuit −10 0.8 50 TYP. 3.0 MAX. 3.3 Unit V Operating Ambient Temperature Local Input Level RF Output Frequency IF Input Frequency TA PLOin fRFout fIFin +25 −5 − − +85 0 2.5 400 °C dBm GHz MHz ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = VRFout = 3.0 V, fIFin = 240 MHz, PLOin = −5 dBm, and VPS ≥ 2.7 V unless otherwise specified) Parameter Circuit Current Circuit Current In Power Save Mode Conversion Gain Symbol ICC ICC(PS) Test Conditions No Signal VPS = 0 V fRFout = 0.9 GHz, PIFin = −30 dBm fRFout = 1.9 GHz, PIFin = −30 dBm fRFout = 2.4 GHz, PIFin = −30 dBm fRFout = 0.9 GHz, PIFin = 0 dBm fRFout = 1.9 GHz, PIFin = 0 dBm fRFout = 2.4 GHz, PIFin = 0 dBm Note MIN. 5.5 − TYP. 9.0 − MAX. 13 2 Unit mA µA dB dB dB dBm dBm dBm CG1 CG2 CG3 6.5 5.5 5 −2.5 −3.5 −4 9.5 8.5 8.0 +0.5 0 −0.5 12.5 11.5 11.0 − − − Saturated RF Output Power PO(sat)1 PO(sat)2 PO(sat)3 Note fRFout < fLoin @ fRFout = 0.9 GHz fLoin < fRFout @ fRFout = 1.9 GHz/2.4 GHz Preliminary Data Sheet P14729EJ1V0DS00 5 µPC8172TB OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY (TA = +25°C, VCC = VRFout = 3.0 V, PLOin = −5 dBm, and VPS ≥ 2.7 V unless otherwise specified) Parameter Output Third-Order Distortion Intercept Point Symbol OIP31 OIP32 OIP33 Input Third-Order Distortion Intercept Point IIP31 IIP32 IIP33 SSB Noise Figure SSB•NF1 SSB•NF2 SSB•NF3 Power Save Response Time Rise time Fall time TPS(rise) TPS(fall) fRFout = 0.9 GHz fRFout = 1.9 GHz fRFout = 2.4 GHz fRFout = 0.9 GHz fRFout = 1.9 GHz fRFout = 2.4 GHz fRFout = 0.9 GHz, fIFin = 240 MHz fRFout = 1.9 GHz, fIFin = 240 MHz fRFout = 2.4 GHz, fIFin = 240 MHz VPS: GND → VCC VPS: VCC → GND fIFin1 = 240 MHz fIFin2 = 241 MHz fIFin1 = 240 MHz fIFin2 = 241 MHz Test Conditions Note Data +7.5 +6.0 +4.0 −2.0 −2.5 −4.0 9.5 10.4 10.6 1 1.5 Unit dBm dBm dBm dBm dBm dBm dB dB dB µs µs Note fRFout < fLoin @ fRFout = 0.9 GHz fLoin < fRFout @ fRFout = 1.9 GHz/2.4 GHz 6 Preliminary Data Sheet P14729EJ1V0DS00 µPC8172TB TEST CIRCUIT 1 (fRFout = 900 MHz) Strip Line Spectrum Analyzer 100 pF 6 50 Ω 10 nH 5 1 000 pF VCC 1 µF 68 pF 1 µF 1 000 pF VCC GND 2 100 pF 4 PS LOinput 3 50 Ω Signal Generator RFoutput IFinput 1 50 Ω Signal Generator 100 pF 1 pF TEST CIRCUIT 2 (fRFout = 1.9 GHz) Strip Line Spectrum Analyzer 50 Ω 100 pF 6 2.75 pF 470 nH 5 1 000 pF VCC 1 µF 30 pF 1 µF 1 000 pF VCC GND 2 100 pF 4 PS LOinput 3 50 Ω Signal Generator RFoutput IFinput 1 50 Ω 100 pF Signal Generator TEST CIRCUIT 3 (fRFout = 2.4 GHz) Strip Line Spectrum Analyzer 50 Ω 100 pF 6 1.75 pF 470 nH 5 1 000 pF VCC 1 µF 10 pF 1 µF 1 000 pF VCC GND 2 100 pF 4 PS LOinput 3 50 Ω Signal Generator RFoutput IFinput 1 50 Ω Signal Generator 100 pF Preliminary Data Sheet P14729EJ1V0DS00 7 µPC8172TB PACKAGE DIMENSIONS 6-pin super minimold (Unit: mm) 2.1±0.1 1.25±0.1 2.0±0.2 1.3 0.65 0.65 0.1 MIN. 0.9±0.1 0.7 8 Preliminary Data Sheet P14729EJ1V0DS00 0 to 0.1 0.15+0.1 –0 0.2+0.1 –0.05 µPC8172TB NOTE ON CORRECT USE (1) Observe precautions for handling because of electrostatic sensitive devices. (2) Form a ground pattern as wide as possible to keep the minimum ground impedance (to prevent undesired oscillation). (3) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin. (4) Connect a matching circuit to the RF output pin. (5) The DC cut capacitor must be each attached to the input and output pins. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Note Count: 3, Exposure limit: None Package peak temperature: 215°C or below Time: 40 seconds or less (at 200°C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260°C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300°C Time: 3 seconds or less (per side of device) Note Exposure limit: None Recommended Condition Symbol IR35-00-3 VPS VP15-00-3 Wave Soldering WS60-00-1 Partial Heating − Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Preliminary Data Sheet P14729EJ1V0DS00 9 µPC8172TB [MEMO] 10 Preliminary Data Sheet P14729EJ1V0DS00 µPC8172TB [MEMO] Preliminary Data Sheet P14729EJ1V0DS00 11 µPC8172TB ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES • The information in this document is current as of June, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. 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