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UPC8172TB

UPC8172TB

  • 厂商:

    NEC(日电电子)

  • 封装:

  • 描述:

    UPC8172TB - SILICON RFIC HI-IP3 FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER - NEC

  • 数据手册
  • 价格&库存
UPC8172TB 数据手册
SILICON RFIC HI-IP3 FREQUENCY UP-CONVERTER FOR WIRELESS TRANSCEIVER FEATURES • HIGH OUTPUT FREQUENCY: fRFout = 0.8 to 2.5 GHz • SUPPLY VOLTAGE: VCC = 2.7 to 3.3 V • HIGH IP3 AND CONVERSION GAIN: OIP3 = +10 dBm typ at fRFout = 0.9 GHz CG = +11 dBm typ at fRFout = 0.9 GHz • HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package LO input UPC8187TB BLOCK DIGRAM (Top View) GND GND VCC IF input RF output DESCRIPTION The UPC8187TB is a silicon monolithic integrated circuit designed as a frequency up-converter for wireless transceivers. This IC has higher operating frequency, lower distortion and higher conversion gain than the conventional UPC8163TB. This device is manufactured using NEC's 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. NEC's stringent quality assurance and test procedures ensure the highest reliability and performance. APPLICATIONS • TDMA, PCS, CDMA • Digital Cellular/Cordless Phones • Wireless Tranceivers ELECTRICAL CHARACTERISTICS (TA = 25°C, VCC = VRFOUT = 2.8 V, fIFin = 150 MHz, PLOin = -5 dBm) PART NUMBER PACKAGE OUTLINE SYMBOLS ICC CG1 CG2 CG3 PO(SAT)1 PO(SAT)2 PO(SAT)3 OIP31 OIP32 OIP33 IIP31 IIP32 IIP33 SSB•NF1 SSB•NF2 SSB•NF3 PARAMETERS AND CONDITIONS1 Circuit Current (no signal) fRFout = 0.83 GHz, PIFin = -20 dBm Conversion Gain, fRFout = 1.9 GHz, PIFin = -20 dBm fRFout = 2.4 GHz, PIFin = -20 dBm fRFout = 0.83 GHz, PIFin = 0 dBm Saturated RF Output Power, fRFout = 1.9 GHz, PIFin = 0 dBm fRFout = 2.4 GHz, PIFin = 0 dBm Output Third-Order Distortion Intercept Point, fRFout = 0.83 GHz fIFin1 = 150 MHz fRFout = 1.9 GHz fIFin2 = 151 MHz fRFout = 2.4 GHz Input Third-Order Distortion Intercept Point, fRFout = 0.83 GHz fIFin1 = 150 MHz fRFout = 1.9 GHz fIFin2 = 151 MHz fRFout = 2.4 GHz fRFout = 0.83 GHz SSB Noise Figure, fRFout = 1.9 GHz fIFin1 = 150 MHz fRFout = 2.4 GHz UNITS mA dB dB dB dBm dBm dBm dBm dBm dBm dBm dBm dBm dB dB dB MIN 11 8 8 7 +1.5 0 -1.5 – – – – – – – – – UPC8187TB S06 TYP 15 11 11 10 +4 +2.5 +1 10 10 8.5 -1.0 -1.0 -1.5 11 12 12.5 MAX 19 14 14 13 – – – – – – – – – – – – Note: 1. fRFout < fLOin @ fRFout = 0.83 GHz fLOin < fRFout @ fRFout = 1.9 GHz/2.4 GHz California Eastern Laboratories UPC8187TB ABSOLUTE MAXIMUM RATINGS1 (TA = +25°C unless otherwise specified) SYMBOLS VCC PD TA TSTG PIN PARAMETERS Supply Voltage Power Dissipation2 Operating Ambient Temperature Storage Temperature Maximum Input Power UNITS V mW °C °C dBm RATINGS 3.6 270 -40 to +85 PLOin -55 to +150 +10 fRFout fIFin RECOMMENDED OPERATING CONDITIONS SYMBOLS VCC TA PARAMETERS Supply Voltage1 Operating Ambient Temperature Local Input Level2 RF Output Frequency3 IF Input Frequency UNITS MIN V ˚C dBm GHz MHz 2.7 -40 -10 0.8 50 TYP MAX 2.8 +25 -5 – – 3.3 +85 0 2.5 400 Notes: 1. Operation in excess of any one of these conditions may result in permanent damage. 2. Mounted on a double-sided copper clad 50x50x1.6 mm epoxy glass PWB, TA = +85°C. Notes: 1. Same voltage applied to pins 5 and 6. 2. ZS = 50 (without matching). 3. With external matching circuit. SERIES PRODUCTS1 (TA = +25°C, VCC = VPS = VRFout = 3.0 V, ZS = ZL = 50 ) Part Number UPC8187TB UPC8106TB UPC8172TB UPC8109TB UPC8163TB ICC (mA) 15 9 9 5 fRFout (GHz) 0.8 to 2.5 0.4 to 2.0 0.8 to 2.5 0.4 to 2.0 @RF 0.9 GHz2 CG (dB @RF 1.9 GHz OIP3 (dBm) @RF 2.4 GHz @RF 0.9 GHz2 @RF 1.9 GHz @RF 2.4 GHz @RF 0.9 GHz2 PO(SAT) @RF 1.9 GHz @RF 2.4 GHz 11 9 9.5 6 9 11 7 8.5 4 5.5 10 – 8.0 – – +10 +5.5 +7.5 +1.5 +9.5 +10 +2.0 +6.0 -1.0 +6.0 +8.5 – +4.0 – – +4 -2 +0.5 -5.5 +0.5 +2.5 -4 0 -7.5 -2 +1 – -0.5 – – 16.5 0.8 to 2.0 Notes: 1. Typical performance. 2. fRFout = 0.83 GHz @ UPC8163TB and UPC8187TB. PIN FUNCTIONS (Pin Voltage is measured at VCC = VPS = VRFOUT = 2.8V) Pin No. 1 Pin Name IFinput Applied Voltage (V) — Pin Voltage (V) 1.2 Function and Explanation Equivalent Circuit This pin is the IF input pin to the double balanced mixer (DBM). The input is designed as a high impedance. The circuit helps suppress spurious signals. Also this symmetrical circuit can keep specified performance insensitive to processcondition distribution. For that reason, a double balanced mixer is adopted. GND pin. Ground pattern on the board should be formed as wide as possible. Track length should be kept as short as possible to minimize ground inductance. Local input pin. Recommended input level is -10 to 0 dBm. Supply voltage pin. This pin is the RF output from the double balanced mixer. This pin is designed as an open collector. Due to the high impedance output, this pin should be externally equipped with an LC matching circuit to the next stage. 5 6 3 2 4 GND GND — 1 3 5 6 LOinput VCC – 2.7 to 3.3 2.1 — — 2 RFoutput Same bias as VCC through external inductor UPC8187TB TYPICAL PERFORMANCE CURVES (Unless otherwise specified, TA = 25˚C) fRFout = 0.83 GHz CONVERSION GAIN vs. LOCAL INPUT POWER 15 10 RF OUTPUT POWER vs. IF INPUT POWER RF Output Power, PRFout (dBm) Conversion Gain, CG (dB) 5 10 0 5 -5 0 -10 -5 -10 -30 fIFin = 150 MHz fLOin = 980 MHz PIFin = -20 dBm VCC = 2.8 V -20 -10 0 -10 -15 -20 -20 -20 -20 fIFin = 150 MHz fLOin = 980 MHz PIFin = -5 dBm VCC = 2.8 V -20 -20 Local Input Power, PLOin (dBm) IF Input Power, PIFin (dBm) fRFout = 1.9 GHz CONVERSION GAIN vs. LOCAL INPUT POWER 15 RF OUTPUT POWER vs. IF INPUT POWER 10 10 RF Output Power, PRFout (dBm) Conversion Gain, CG (dB) 0 5 -10 0 -20 fIFin = 150 MHz fLOin = 1750 MHz PIFin = -5 dBm VCC = 2.8 V -20 -10 0 10 -5 -10 -10 -10 -10 fIFin = 150 MHz fLOin = 1750 MHz PIFin = -20 dBm VCC = 2.8 V -10 -10 -30 -30 Local Input Power, PLOin (dBm) IF Input Power, PIFin (dBm) fRFout = 2.4 GHz CONVERSION GAIN vs. LOCAL INPUT POWER 15 RF OUTPUT POWER vs. IF INPUT POWER 10 10 RF Output Power, PRFout (dBm) Conversion Gain, CG (dB) 0 5 -10 0 -20 fIFin = 150 MHz fLOin = 2250 MHz PIFin = -5 dBm VCC = 2.8 V -20 -10 0 10 -5 -10 -30 -20 -10 fIFin = 150 MHz fLOin = 2250 MHz PIFin = -20 dBm VCC = 2.8 V 0 10 -30 -30 Local Input Power, PLOin (dBm) IF Input Power, PIFin (dBm) UPC8187TB TYPICAL SCATTERING PARAMETERS (TA = 25˚C) LO port RF port (without matching) S11 S22 1.0 GHz 1.0 GHz 2.25 GHz 1.75 GHz 2.25 GHz VCC = VRFOUT = 2.8 V parameters are monitored at DUT pins 1.75 GHz START STOP 0.1 GHz 3.1 GHz START STOP 0.1 GHz 3.1 GHz IF port S11 150 MHz START STOP 0.1 GHz 1.0 GHz UPC8187TB TEST CIRCUIT 1 (fRFout = 0.83 GHz) Strip Line Spectrum Analyzer C6 100 pF L2 5.6 nH Signal Generator L1 6 50Ω 12 nH 5 VCC GND 2 Signal Generator 100 pF 4 VCC C5 0.1 µF C4 10 pF C3 1000 pF GND LOinput 3 C1 50 RFoutput IFinput 1 C2 50 1000 pF ILLUSTRATION OF THE TEST CIRCUIT 1 ASSEMBLED ON EVALUATION BOARD COMPONENT LIST FORM Chip Capacitor SYMBOL C1, C6 C4 C2, C3 C5 Chip Inductor L1 L2 VALUE 100 pF 10 pF 1000 pF 0.1µF 12 nH 5.6nH 1. 1.5 x 1.5 x 0.028", Getek laminate, double sided copper 2. Ground pattern on rear board 3. Solder plated patterns 4. Through holes UPC8187TB TEST CIRCUIT 2 (fRFout = 1.9 GHz) Strip Line Spectrum Analyzer C6 100 pF 6 RFoutput IFinput 1 50 L2 1.2 nH L1 8.2 nH 5 VCC 1000 pF VCC C3 12 pF C5 10 pF C4 1000 pF 4 GND GND 2 100 pF LOinput 3 C1 50 Signal Generator C2 50 Signal Generator 1000 pF ILLUSTRATION OF TEST CIRCUIT 2 ASSEMBLED ON EVALUATION BOARD COMPONENT LIST FORM Chip Capacitor SYMBOL C1, C2, C4 C7 C6 C3 C5 Chip Inductor L1 L2 VALUE 1000 pF 0.1µF 100 pF 12 pF 10 pF 8.2 nH 1.2 nH 1. 1.5 x 1.5 x 0.028", Getek laminate, double sided copper 2. Ground pattern on rear board 3. Solder plated patterns 4. Through holes UPC8187TB TEST CIRCUIT 3 (fRFout = 2.4 GHz) Strip Line Spectrum Analyzer C6 100 pF C7 1.2 pF 6 RFoutput IFinput 1 L 470 nH 5 VCC 1000 pF VCC C3 C4 10 pF C5 1000 pF 4 GND GND 2 100 pF LOinput 3 C2 50 C1 C9 1.8 pF 50 C10 1.5 pF Signal Generator Signal Generator 1000 pF 50 1000 pF ILLUSTRATION OF TEST CIRCUIT 3 ASSEMBLED ON EVALUATION BOARD COMPONENT LIST FORM Chip Capacitor SYMBOL C1, C3, C5 C2, C6 C4 C7 C9 C10 Chip Inductor L VALUE 1000 pF 100 pF 10 pF 1.2 pF 1.8 pF 1.5 pF 470 nH 1. 1.5 x 1.5 x 0.028", Getek laminate, double sided copper 2. Ground pattern on rear board 3. Solder plated patterns 4. Through holes UPC8187TB OUTLINE DIMENSIONS (Units in mm) PACKAGE OUTLINE S06 2.1 ±0.1 1.25 ±0.1 PIN CONNECTIONS (Top View) (Bottom View) 4 5 6 4 5 6 3 2 1 3 0.2 -0.05 2.0 ±0.2 1.3 0.65 0.65 +0.10 2 1 0.1 MIN C3G PIN NO. 1 2 3 4 5 6 PIN NAME IFinput GND LOinput GND VCC RFoutput 0.9 ± 0.1 0.7 0 to 0.1 0.15 +0.10 -0.05 Note: All dimensions are typical unless otherwise specified. ORDERING INFORMATION Part Number UPC8187TB-E3 Quantity 3 K pcs/reel Note: Embossed tape, 8 mm wide. Pins 1, 2 and 3 face the tape perforation side. SYSTEM APPLICATION EXAMPLE (Schematic of IC location in the system) LNA RX DEMO I Q VCO SW ÷N PLL PLL I 0˚ TX PA Phase Shifter 90˚ UPC8187TB Q EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS CALIFORNIA EASTERN LABORATORIES • Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279 24-Hour Fax-On-Demand: 800-390-3232 (U.S. and Canada only) • Internet: http://WWW.CEL.COM 06/14/2001 DATA SUBJECT TO CHANGE WITHOUT NOTICE
UPC8172TB 价格&库存

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