UPD120N18TA-E1

DATA SHEET µPD120Nxx Series THREE-TERMINAL LOW-DROPOUT POSITIVE-VOLTAGE REGULATOR (OUTPUT CURRENT: 0.3 A) MOS INTEGRATED CIRCUIT DESCRIPTION The µPD120Nxx series provides low-voltage output regulators with the output current capacitance of 0.3 A. The output voltage varies according to the product (1.5 V, 1.8 V, 2.5 V, or 3.3 V). The circuit current is low due to the CMOS structure, so the power consumption in the ICs can be reduced. Moreover, since ICs are mounted in the small package of the µPD120Nxx series, this contributes to the miniaturization of the application set. FEATURES • Output current: 0.3 A • On-chip overcurrent protection circuit • On-chip thermal protection circuit • Small circuit operation current: 60 µA TYP. APPLICATIONS Digital TV, Audio, HDD, DVD, etc. PIN CONFIGURATION (Marking Side) SC-74A SC-62 N.C. GND GND 5 1 2 4 3 1 2 3 OUTPUT GND INPUT OUTPUT GND INPUT The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. S17145EJ2V0DS00 (2nd edition) Date Published February 2005 NS CP(K) Printed in Japan 2005 µPD120Nxx Series BLOCK DIAGRAM INPUT Overcurrent Protection Circuit Reference Voltage Circuit + Error Amp. − OUTPUT Thermal Protection Circuit GND 2 Data Sheet S17145EJ2V0DS µPD120Nxx Series ORDERING INFORMATION Part Number Package SC-74A SC-62 SC-74A SC-62 SC-74A SC-62 SC-74A SC-62 Output Voltage 1.5 V 1.5 V 1.8 V 1.8 V 2.5 V 2.5 V .3.3 V 3.3 V Marking K71 7D K72 7E K73 7F K74 7G µ PD120N15TA µ PD120N15T1B µ PD120N18TA µ PD120N18T1B µ PD120N25TA µ PD120N25T1B µ PD120N33TA µ PD120N33T1B Remark -E1 or -E2 is suffixed to the end of the part number of taping products, and -A or -AZ to that of Pb-free products. See the table below for details. Part Number Note1 Package SC-74A SC-74A SC-74A • Unit • Unit Package Type µ PD120NxxTA Note2 µ PD120NxxTA-A µ PD120NxxTA-E1 • 8 mm wide embossed taping • Pin 1 on take-up side • 3000 pcs/reel (MAX.) µ PD120NxxTA-E1-A Note2 SC-74A • 8 mm wide embossed taping • Pin 1 on take-up side • 3000 pcs/reel (MAX.) µ PD120NxxTA-E2 SC-74A • 8 mm wide embossed taping • Pin 1 on draw-out side • 3000 pcs/reel (MAX.) µ PD120NxxTA-E2-A Note2 SC-74A • 8 mm wide embossed taping • Pin 1 on draw-out side • 3000 pcs/reel (MAX.) µ PD120NxxT1B Note3 µ PD120NxxT1B-AZ µ PD120NxxT1B-E1 SC-62 SC-62 SC-62 • Unit • Unit • 12 mm wide embossed taping • Pin 1 on take-up side • 1000 pcs/reel (MAX.) µ PD120NxxT1B-E1-AZ Note3 SC-62 • 12 mm wide embossed taping • Pin 1 on take-up side • 1000 pcs/reel (MAX.) µ PD120NxxT1B-E2 SC-62 • 12 mm wide embossed taping • Pin 1 on draw-out side • 1000 pcs/reel (MAX.) µ PD120NxxT1B-E2-AZ Note3 SC-62 • 12 mm wide embossed taping • Pin 1 on draw-out side • 1000 pcs/reel (MAX.) Notes 1. xx stands for symbols that indicate the output voltage. 2. Pb-free (This product does not contain Pb in external electrode and other parts.) 3. Pb-free (This product does not contain Pb in external electrode.) Data Sheet S17145EJ2V0DS 3 µPD120Nxx Series ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified.) Parameter Symbol Rating Unit µ PD120NxxTA Input Voltage Power Dissipation Note1 µ PD120NxxT1B −0.3 to +6 V 400/2000 –40 to +85 –40 to +150 –55 to +150 Note3 VIN PT TA TJ Tstg Rth(J-A) 695/245 Note2 180/510 Note2 mW °C °C °C Operating Ambient Temperature Operating Junction Temperature Storage Temperature Thermal Resistance (junction to ambient) 315/62.5 Note3 °C/W Note 1. Internally limited. When the operating junction temperature rises over 150°C, the internal circuit shuts down the output voltage. 2 2. Mounted on ceramic substrate of 75 mm x 0.7 mm 3. Mounted on ceramic substrate of 16 cm2 x 0.7 mm Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. STANDARD CONNECTION D1 INPUT CIN µ PD120Nxx COUT D2 OUTPUT CIN: 0.1 µF or higher. Set this value according to the length of the line between the regulator and INPUT pin. Be sure to connect CIN to prevent parasitic oscillation. If using a laminated ceramic capacitor, it is necessary to ensure that CIN is 0.1 µF or higher for the voltage and temperature range to be used. COUT: 10 µF or higher. Be sure to connect COUT to prevent oscillation and improve excessive load regulation. Place CIN and COUT as close as possible to the IC pins (within 2 cm). Be sure to use the capacitor of 10 µF or higher of capacity values and 1 to 8 Ω of equivalent series resistance under an operating condition. D1: If the OUTPUT pin has a higher voltage than the INPUT pin, connect a diode. D2: If the OUTPUT pin has a lower voltage than the GND pin, connect a schottky barrier diode. Caution Make sure that no voltage is applied to the OUTPUT pin from external. 4 Data Sheet S17145EJ2V0DS µPD120Nxx Series RECOMMENDED OPERATING CONDITIONS Parameter Input Voltage Symbol VIN Type Number MIN. 3.0 3.2 4.5 4.5 0 − 40 − 40 TYP. MAX. 5.5 5.5 5.5 5.5 0.3 + 85 + 125 Unit V V V V A °C °C µ PD120N15 µ PD120N18 µ PD120N25 µ PD120N33 Output Current IO All All All Operating Ambient Temperature TA Operating Junction Temperature TJ Caution Use of conditions other than the above-listed recommended operating conditions is not a problem as long as the absolute maximum ratings are not exceeded. However, since the use of such conditions diminishes the margin of safety, careful evaluation is required before such conditions are used. Moreover, using the MAX. value for all the recommended operating conditions is not guaranteed to be safe. ELECTRICAL CHARACTERISTICS µ PD120N15 (TJ = 25°C, VIN = 5.0 V, IO = 0.15 A, CIN = 0.1 µF, COUT = 10 µF, unless otherwise specified.) Parameter Output Voltage Line Regulation Load Regulation Quiescent Current Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage Short Circuit Current Peak Output Current Temperature Coefficient of Output Voltage Symbol VO1 VO2 REGIN REGL IBIAS 3.0 V ≤ VIN ≤ 5.5 V, 0 A ≤ IO ≤ 0.3 A 3.0 V ≤ VIN ≤ 5.5 V 0 A ≤ IO ≤ 0.3 A IO = 0 A 3.0 V ≤ VIN ≤ 5.5 V 10 kHz ≤ f ≤ 100 kHz f = 1 kHz, 3.0 V ≤ VIN ≤ 5.5 V IO = 0.15 A IO = 0.3 A IOshort IOpeak VIN = 5 V VIN = 5 V IO = 0 A, 0°C ≤ TJ ≤ 125°C Conditions MIN. 1.47 1.455 − − − − − − − − − 0.3 − TYP. 1.5 − 1 2 60 − 100 63 0.6 1.0 0.2 − 0.01 MAX. 1.53 1.545 30 30 120 25 − − 0.9 − − − − Unit V V mV mV µA µA µ Vr.m.s. dB V V A A mV/°C ∆IBIAS Vn R•R VDIF ∆VO/∆T µ PD120N18 (TJ = 25°C, VIN = 5.0 V, IO = 0.15 A, CIN = 0.1 µF, COUT = 10 µF, unless otherwise specified.) Parameter Output Voltage Line Regulation Load Regulation Quiescent Current Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage Short Circuit Current Peak Output Current Temperature Coefficient of Output Voltage Symbol VO1 VO2 REGIN REGL IBIAS 3.2 V ≤ VIN ≤ 5.5 V, 0 A ≤ IO ≤ 0.3 A 3.2 V ≤ VIN ≤ 5.5 V 0 A ≤ IO ≤ 0.3 A IO = 0 A 3.2 V ≤ VIN ≤ 5.5 V 10 kHz ≤ f ≤ 100 kHz f = 1 kHz, 3.2 V ≤ VIN ≤ 5.5 V IO = 0.15 A VIN = 5 V VIN = 5 V IO = 0 A, 0°C ≤ TJ ≤ 125°C Conditions MIN. 1.764 1.746 − − − − − − − − 0.3 − TYP. 1.8 − 1 2 60 − 120 63 0.4 0.2 − 0.01 MAX. 1.836 1.854 30 30 120 25 − − 0.65 − − − Unit V V mV mV µA µA µ Vr.m.s. dB V A A mV/°C ∆IBIAS Vn R•R VDIF IOshort IOpeak ∆VO/∆T Data Sheet S17145EJ2V0DS 5 µPD120Nxx Series µ PD120N25 (TJ = 25°C, VIN = 5.0 V, IO = 0.15 A, CIN = 0.1 µF, COUT = 10 µF, unless otherwise specified.) Parameter Output Voltage Symbol VO1 VO2 Line Regulation Load Regulation Quiescent Current Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage Short Circuit Current Peak Output Current Temperature Coefficient of Output Voltage REGIN REGL IBIAS 4.5 V ≤ VIN ≤ 5.5 V, 0 A ≤ IO ≤ 0.3 A 4.5 V ≤ VIN ≤ 5.5 V 0 A ≤ IO ≤ 0.3 A IO = 0 A 4.5 V ≤ VIN ≤ 5.5 V 10 kHz ≤ f ≤ 100 kHz f = 1 kHz, 4.5 V ≤ VIN ≤ 5.5 V IO = 0.15 A VIN = 5 V VIN = 5 V IO = 0 A, 0°C ≤ TJ ≤ 125°C Conditions MIN. 2.45 2.425 − − − − − − − − 0.3 − TYP. 2.5 − 1 2 60 − 170 60 0.3 0.2 − 0.01 MAX. 2.55 2.575 30 30 120 25 − − 0.7 − − − Unit V V mV mV µA µA µ Vr.m.s. dB V A A mV/°C ∆IBIAS Vn R•R VDIF IOshort IOpeak ∆VO/∆T µ PD120N33 (TJ = 25°C, VIN = 5.0 V, IO = 0.15 A, CIN = 0.1 µF, COUT = 10 µF, unless otherwise specified.) Parameter Output Voltage Symbol VO1 VO2 Line Regulation Load Regulation Quiescent Current Quiescent Current Change Output Noise Voltage Ripple Rejection Dropout Voltage Short Circuit Current Peak Output Current Temperature Coefficient of Output Voltage REGIN REGL IBIAS 4.5 V ≤ VIN ≤ 5.5 V, 0 A ≤ IO ≤ 0.3 A 4.5 V ≤ VIN ≤ 5.5 V 0 A ≤ IO ≤ 0.3 A IO = 0 A 4.5 V ≤ VIN ≤ 5.5 V 10 kHz ≤ f ≤ 100 kHz f = 1 kHz, 4.5 V ≤ VIN ≤ 5.5 V IO = 0.15 A VIN = 5 V VIN = 5 V IO = 0 A, 0°C ≤ TJ ≤ 125°C Conditions MIN. 3.234 3.201 − − − − − − − − 0.3 − TYP. 3.3 − 1 2 60 − 220 60 0.2 0.2 − 0.01 MAX. 3.366 3.399 30 30 120 25 − − 0.6 − − − Unit V V mV mV µA µA µ Vr.m.s. dB V A A mV/°C ∆IBIAS Vn R•R VDIF IOshort IOpeak ∆VO/∆T 6 Data Sheet S17145EJ2V0DS µPD120Nxx Series TYPICAL CHARACTERISTICS (Reference Value) Pd vs. TA (µ PD120NxxTA) Pd - Internal Power Consumption - W Pd - Internal Power Consumption - W Pd vs. TA (µ PD120NxxT1B) 0.6 (Mounted on ceramic substrate of 75 mm2 x 0.7 2.5 (Mounted on ceramic substrate of 16 cm2 x 0.7 0.5 0.4 0.3 0.2 0.1 0 0 20 40 60 80 100 TA - Operating Ambient Temperature - °C (Without heatsink) 695°C/W 245°C/W 2 62.5°C/W 1.5 1 0.5 0 0 20 40 60 80 100 TA - Operating Ambient Temperature - °C (Without heatsink) 315°C/W ∆VO vs. TJ ∆VO - Output Voltage Variation - mV ∆VO - Output Voltage Variation - mV 10 IO = 0.15 A 5 ∆VO vs. TJ 10 IO = 0.15 A 5 0 µPD120N15 0 µPD120N33 -5 µPD120N25 - 10 -50 0 50 100 150 -5 µPD120N18 - 10 -50 0 50 100 150 TJ - Operating Junction Temperature - °C VO vs. VIN (µ PD120N15) TJ - Operating Junction Temperature - °C VO vs. VIN (µ PD120N18) 2 TJ = 25˚C VO - Output Voltage - V VO - Output Voltage - V 2 TJ = 25˚C IO = 5 mA IO = 150 mA IO = 300 mA 1 1 IO = 5 mA IO = 150 mA IO = 300 mA 0 0 1 2 3 4 5 6 VIN - Input Voltage - V 0 0 1 2 3 4 5 6 VIN - Input Voltage - V Data Sheet S17145EJ2V0DS 7 µPD120Nxx Series VO vs. VIN (µ PD120N25) VO vs. VIN (µ PD120N33) 4 TJ = 25˚C VO - Output Voltage - V VO - Output Voltage - V 5 4 3 2 1 TJ = 25˚C 3 2 IO = 5 mA IO = 150 mA IO = 300 mA 1 IO = 5 mA IO = 150 mA IO = 300 mA 0 0 1 2 3 4 5 6 VIN - Input Voltage - V IBIAS (IBIAS(S)) vs. VIN (µ PD120N15) 0 0 1 2 3 4 5 6 VIN - Input Voltage - V IBIAS (IBIAS(S)) vs. VIN (µ PD120N18) 1000 TJ = 25˚C IBIAS - Quiescent Current - µA 1000 TJ = 25˚C IBIAS - Quiescent Current - µA 800 600 IO = 300 mA 400 IO = 150 mA 200 IO = 5 mA 0 0 1 2 3 4 5 6 VIN - Input Voltage - V IBIAS (IBIAS(S)) vs. VIN (µ PD120N25) 800 600 400 IO = 150 mA 200 IO = 5 mA 0 0 1 2 3 4 5 6 VIN - Input Voltage - V IBIAS (IBIAS(S)) vs. VIN (µ PD120N33) IO = 300 mA 1000 TJ = 25˚C IBIAS - Quiescent Current - µA IBIAS - Quiescent Current - µA 1000 TJ = 25˚C 800 IO = 300 mA 600 800 600 IO = 300 mA 400 200 IO = 150 mA 400 200 IO = 150 mA IO = 5 mA 0 0 1 2 3 4 5 6 VIN - Input Voltage - V IO = 5 mA 0 0 1 2 3 4 5 6 VIN - Input Voltage - V 8 Data Sheet S17145EJ2V0DS µPD120Nxx Series VDIF vs. TJ 1 IOpeak - Peak Output Current - A IO = 0.15 A VDIF - Dropout Voltage - V 0.8 0.6 0.4 0.2 0 -25 0 25 50 75 100 125 150 TJ - Operating Junction Temperature - °C IOpeak vs. VDIF (µ PD120N18) µPD120N15 µPD120N18 µPD120N25 µPD120N33 IOpeak vs. VDIF (µ PD120N15) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 2 3 4 5 VDIF - Dropout Voltage - V TJ = 0°C TJ = 25°C TJ = 125°C IOpeak vs. VDIF (µ PD120N25) 0.7 IOpeak - Peak Output Current - A IOpeak - Peak Output Current - A 0.7 TJ = 0°C TJ = 25°C TJ = 125°C 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 2 3 4 5 0 1 2 3 4 VDIF - Dropout Voltage - V IOpeak vs. VDIF (µ PD120N33) VDIF - Dropout Voltage - V R•R vs. f 0.6 0.5 0.4 0.3 0.2 0.1 0 TJ = 0°C TJ = 25°C TJ = 125°C 0.7 IOpeak - Peak Output Current - A R•R - Ripple Rejection - dB 80 0.6 0.5 0.4 0.3 0.2 0.1 0 0 1 TJ = 0°C TJ = 25°C TJ = 125°C 70 60 50 40 30 20 10 0 µPD120N15 µPD120N25 TJ = 25°C IO = 0.15 A 2 3 10 100 1000 10000 100000 VDIF - Dropout Voltage - V f - Frequency - Hz Data Sheet S17145EJ2V0DS 9 µPD120Nxx Series R•R vs. f VDIF vs. IO 80 R•R - Ripple Rejection - dB VDIF - Dropout Voltage - V 70 60 50 40 30 20 10 0 10 µPD120N18 TJ = 25°C IO = 0.15 A 1 0.8 µPD120N33 0.6 0.4 µ PD120N15 µ PD120N18 µ PD120N25 µ PD120N33 0.2 0 100 1000 10000 100000 0 0.05 0.1 0.15 0.2 0.25 0.3 f - Frequency - Hz VO vs. IO (µ PD120N15) IO - Output Current - A VO vs. IO (µ PD120N18) 3 VO - Output Voltage - V VO - Output Voltage - V 3 2 2 1 1 0 0 200 400 600 800 0 0 200 400 600 800 IO - Output Current - A VO vs. IO (µ PD120N33) IO - Output Current - A VO vs. IO (µ PD120N25) 4 VO - Output Voltage - V VO - Output Voltage - V 5 4 3 3 2 2 1 1 0 0 200 400 600 800 IO - Output Current - A 0 0 200 400 600 800 IO - Output Current - A 10 Data Sheet S17145EJ2V0DS µPD120Nxx Series PACKAGE DRAWINGS (Unit: mm) SC-74A 5 PIN PLASTIC MINI MOLD detail of lead end F G R E A H B I J L S C D M M N K S ITEM A B C D E F G H I J K L M N R MILLIMETERS 2.9 ± 0.2 0.3 0.95 (T.P.) 0.32 + 0.05 − 0.02 0.05 ± 0.05 1.4 MAX. 1.1+ 0.2 − 0.1 2.8 ± 0.2 1.5+ 0.2 − 0.1 0.65 + 0.1 − 0.15 0.16 + 0.1 − 0.06 0.4 ± 0.2 0.19 0.1 5 °± 5 ° S5TA-95-15A Data Sheet S17145EJ2V0DS 11 µPD120Nxx Series SC-62 4.5 ±0.1 1.6 ±0.2 1.5 ±0.1 2.5 ±0.1 0.42 ±0.06 0.47 ±0.06 1.5 TYP. 3.0 TYP. 0.42 ±0.06 0.8 MIN. 4.0 ±0.25 0.41 +0.03 –0.05 12 Data Sheet S17145EJ2V0DS µPD120Nxx Series RECOMMENDED SOLDERING CONDITIONS The µ PD120Nxx series should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. For technical information, see the following website. Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html) Type of Surface Mount Device µ PD120N15TA, µ PD120N18TA, µ PD120N25TA, µ PD120N33TA: SC-74A µ PD120N15T1B, µ PD120N18T1B, µ PD120N25T1B, µ PD120N33T1B: SC-62 Process Infrared Ray Reflow Conditions Peak temperature: 235°C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflows processes: 3 times or less. Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature), Reflow time: 40 seconds or less (at 200°C or higher), Maximum number of reflows processes: 3 times or less. Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each side of the device). – WS60-00-1 VP15-00-3 Symbol IR35-00-3 µ PD120N15TA-A, µ PD120N18TA-A, µ PD120N25TA-A, µ PD120N33TA-A: SC-74A Note2 µ PD120N15T1B-AZ, µ PD120N18T1B-AZ, µ PD120N25T1B-AZ, µ PD120N33T1B-AZ: SC-62 Note1 Process Infrared Ray Reflow Conditions Peak temperature: 260°C or below (Package surface temperature), Reflow time: 30 seconds or less (at 210°C or higher), Maximum number of reflows processes: 3 times or less. Symbol IR60-00-3 Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less, Maximum number of flow processes: 1 time, Pre-heating temperature: 120°C or below (Package surface temperature). WS60-00-1 Partial Heating Method Pin temperature: 300°C or below, Heat time: 3 seconds or less (Per each side of the device). – Notes 1. Pb-free (This product does not contain Pb in external electrode and other parts.) 2. Pb-free (This product does not contain Pb in external electrode.) Caution Do not use different soldering methods together (except for partial heating). Remark Flux: Rosin-based flux with low chlorine content (chlorine 0.2 Wt% or below) is recommended. Data Sheet S17145EJ2V0DS 13 µPD120Nxx Series N OTES FOR CMOS DEVICES 1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between VIL (MAX) and VIH (MIN). 2 HANDLING OF UNUSED INPUT PINS Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must be judged separately for each device and according to related specifications governing the device. 3 PRECAUTION AGAINST ESD A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors should be grounded. The operator should be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with mounted semiconductor devices. 4 STATUS BEFORE INITIALIZATION Power-on does not necessarily define the initial status of a MOS device. Immediately after the power source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the reset signal is received. A reset operation must be executed immediately after power-on for devices with reset functions. 5 POWER ON/OFF SEQUENCE In the case of a device that uses different power supplies for the internal operation and external interface, as a rule, switch on the external power supply after switching on the internal power supply. When switching the power supply off, as a rule, switch off the external power supply and then the internal power supply. Use of the reverse power on/off sequences may result in the application of an overvoltage to the internal elements of the device, causing malfunction and degradation of internal elements due to the passage of an abnormal current. The correct power on/off sequence must be judged separately for each device and according to related specifications governing the device. 6 INPUT OF SIGNAL DURING POWER OFF STATE Do not input signals or an I/O pull-up power supply while the device is not powered. The current injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements. Input of signals during the power off state must be judged separately for each device and according to related specifications governing the device. 14 Data Sheet S17145EJ2V0DS µPD120Nxx Series REFERENCE DOCUMENTS Document Name Usage of Three-Terminal Regulators User’s Manual Voltage Regulator of SMD Information Semiconductor Device Mount Manual SEMICONDUCTOR SELECTION GUIDE - Products and PackagesG12702E G11872E http://www.necel.com/pkg/en/mount/index.html X13769X Document No. • T he information in this document is current as of February, 2005. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. 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The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1