UPD16813

DATA SHEET MOS INTEGRATED CIRCUIT µPD16813 MONOLITHIC DUAL H BRIDGE DRIVER CIRCUIT DESCRIPTION The µPD16813 is a monolithic dual H bridge driver circuit which uses power MOS FETs in its driver stage. By complementing the P channel and N channel of the output stage, the circuit current has been substantially inproved as compared with that of conventional charge pump drivers. The µPD16813 is therefore ideal as the driver circuit of the 2-phase excitation, bipolar-driven stepping motor for the head actuator of an FDD. FEATURES • Low ON resistance (sum of ON resistors of top and bottom transistors) RON = 2.0 Ω TYP. • Low current consumption: IDD = 100 µA MAX. • Noise reduction circuit that operates when INC is OFF. • Compact surface mount package: 16-pin plastic SOP (300 mil) PIN CONFIGURATION (Top View) VM1 1A PGND1 2A VDD IN1 IN2 INC 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 NC 1B PGND2 2B VM2 SEL NC DGND ORDERING INFORMATION Part Number Package 16-pin plastic SOP (300 mil) µPD16813GS Document No. S10590EJ2V0DS00 (2nd edition) Date Published July 1997 N Printed in Japan © 1997 µPD16813 BLOCK DIAGRAM VDD VM VM1 + IN1 1A IN2 ‘‘H” BRIDGE 1 1B PGND1 VM2 2A ‘‘H” BRIDGE 2 2B DGND PGND2 SEL CONTROL CIRCUIT INC FUNCTION TABLE • In stop mode (SEL = High) Excitation Direction – INC H H H H L IN1 H L L H × IN2 H H L L × H1 F R R F Stop H2 F F R R H1 F • In brake mode (SEL = Low) Excitation Direction – INC H H H H L IN1 H L L H × IN2 H H L L × H1 F R R F Brake H2 F F R R H2 R H2 F H1 R F : Forward R : Reverse × : Don’t care 2 µPD16813 FORWARD VM REVERSE VM STOP VM BRAKE VM ON OFF OFF ON OFF OFF OFF OFF A B A B A B A B OFF ON ON OFF OFF OFF ON ON ABSOLUTE MAXIMUM RATINGS (TA = +25 °C) Parameter Supply voltage (motor block) Supply voltage (control block) Power consumption Symbol VM VDD Pd1 Pd2 Instantaneous H bridge driver current Input voltage Operating temperature range Operation junction temperature Storage temperature range ID (pulse) VIN TA Tj MAX. Tstg Rating –0.5 to +7 –0.5 to +7 0.862Note 1 1.087Note 2 ± 1.0Note 2, 3 –0.5 to VDD + 0.5 0 to 60 150 –55 to +125 A V °C °C °C Unit V V W Notes 1. IC only 2. When mounted on a printed circuit board (100 × 100 × 1 mm, glass epoxy) 3. t ≤ 5 ms, Duty ≤ 40 % Pd – TA Characteristics 1.2 When mounted on printed circuid boad 1.0 Average power consumption Pd (W) IC only 0.8 0.6 0.4 0.2 0 20 40 60 80 Ambient temperature TA (˚C) 3 µPD16813 RECOMMENDED OPERATING CONDITIONS Parameter Supply voltage (motor block) Supply voltage (control block) H bridge driver currentNote Symbol VM VDD IDR TA 0 MIN. 4.0 4.0 TYP. 5.0 5.0 MAX. 6.0 6.0 ± 310 60 Unit V V mA °C Operating temperature Note When mounted on a printed circuit board (100 × 100 × 1 mm, glass epoxy) ELECTRICAL SPECIFICATIONS (Within recommended operating conditions unless otherwise specified) Parameters OFF VM pin current VDD pin current Control pin high-level input current Control pin low-level input current Control pin high-level input voltage Control pin low-level input voltage H bridge circuit ON resistanceNote 1 RON relative accuracy Symbol IM IDD IIH IIL VIH VIL RON1 VM = 5 V, VDD = 5 V Excitation direction , Note 2 Excitation direction , VM = 5 V, VDD = 5 V,Note 3 TA = 25 °C, RM = 20 Ω 2.0 VIN = VDD VIN = 0 V 3.0 –0.3 2.0 Conditions VM = 6.0 V, VDD = 6.0 V MIN. TYP. MAX. 1.0 0.1 1.0 –1.0 VDD + 0.3 0.8 4.0 ±5 ± 10 2.5 Unit µA mA µA µA V V Ω % ∆RON ∆RON H bridge circuit propagation delay time H bridge circuit propagation delay time H bridge circuit rise time H bridge circuit fall time tPHL µs µs µs µs tPLH VM = 5 V, VDD = 5 V,Note 3 TA = 25 °C, RM = 20 Ω 0.4 0.65 tTHL tTLH 0.2 0.1 0.4 0.2 Notes 1. Sum of ON resistances of top and bottom transistors 2. For the excitation direction, refer to FUNCTION TABLE. 3. INC TPHL TPLH IM TTHL TTLH 4 µ PD16813 CHARACTERISTIC CURVES RON vs. Tj Characteristics 4 4 RON = 20 Ω RON vs. VDD (=VM) Characteristics H bridge ON resistance RON (Ω) H bridge ON resistance RON (Ω) 3 3 2 2 1 1 0 4.0 5.0 6.0 Supply voltage VDD (=VM) (V) 0 25 50 75 100 125 Operation junction temperature Tj (˚C) 150 TPHL – TA Characteristics 4 H bridge circuit propagation delay time TPHL (µs) H bridge circuit propagation delay time TPLH (µs) 0.8 0.7 TPLH – TA Characteristics 3 0.6 0.5 2 0.4 0.3 1 0.2 0.1 0 25 50 75 100 125 Operating temperature TA (˚C) 150 0 25 50 75 100 125 Operating temperature TA (˚C) 150 5 µPD16813 16 PIN PLASTIC SOP (300 mil) 16 9 detail of lead end 1 A G 8 H I J F K E C D M N M B L NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A B C D E F G H I J K L M N P 10.46 MAX. 0.78 MAX. 1.27 (T.P.) 0.40 +0.10 –0.05 0.1±0.1 1.8 MAX. 1.55 7.7±0.3 5.6 1.1 0.20 +0.10 –0.05 0.6±0.2 0.12 0.10 ° 3 ° +7° –3 P INCHES 0.412 MAX. 0.031 MAX. 0.050 (T.P.) 0.016 +0.004 –0.003 0.004±0.004 0.071 MAX. 0.061 0.303±0.012 0.220 0.043 0.008 +0.004 –0.002 0.024 +0.008 –0.009 0.005 0.004 ° 3 ° +7° –3 P16GM-50-300B-4 6 µPD16813 RECOMMENDED SOLDERING CONDITIONS It is recommended to solder this product under the conditions described below. For soldering methods and conditions other than those listed below, consult NEC. Surface mount type For the details of the recommended soldering conditions of this type, refer to Semiconductor Device Mounting Technology Manual (C10535E). Symbol of Recommended Soldering IR30-00 Soldering Method Infrared reflow Soldering Conditions Peak package temperature: 230 °C, Time: 30 seconds MAX. (210 °C MIN.), Number of times: 1, Number of days: NoneNote Peak package temperature: 215 °C, Time: 40 seconds MAX. (200 °C MIN.), Number of times: 1, Number of days: NoneNote Solder bath temperature: 260 °C MAX., Time: 10 seconds MAX., Number of times: 1, Number of days: NoneNote Pin temperature: 300 °C MAX., Time: 10 seconds MAX., Number of days: NoneNote VPS VP15-00 Wave soldering WS60-00 Partial heating – Note The number of storage days at 25 °C, 65 % RH after the dry pack has been opened Caution Do not use two or more soldering methods in combination (except partial heating). 7 µPD16813 No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96.5 2