UPD43256B-AXX

DATA SHEET MOS INTEGRATED CIRCUIT µPD43256B 256K-BIT CMOS STATIC RAM 32K-WORD BY 8-BIT Description The µPD43256B is a high speed, low power, and 262,144 bits (32,768 words by 8 bits) CMOS static RAM. Battery backup is available. And A and B versions are wide voltage operations. The µPD43256B is packed in 28-pin plastic DIP, 28-pin plastic SOP and 28-pin plastic TSOP (I) (8 x 13.4 mm). Features • 32,768 words by 8 bits organization • Fast access time: 70, 85, 100, 120, 150 ns (MAX.) • Low voltage operation (A version: VCC = 3.0 to 5.5 V, B version: VCC = 2.7 to 5.5 V) • Low VCC data retention: 2.0 V (MIN.) • /OE input for easy application Part number Access time ns (MAX.) Operating supply Operating ambient voltage V temperature °C 0 to 70 At operating mA (MAX.) 45 Supply current At standby At data retention µA (MAX.) 50 15 µA (MAX.) Note1 3 2 µPD43256B-xxL µPD43256B-xxLL µPD43256B-Axx µPD43256B-Bxx Note2 70, 85 4.5 to 5.5 85, 100 Note2 , 120 Note2 3.0 to 5.5 2.7 to 5.5 100, 120, 150 Notes 1. TA ≤ 40 °C, VCC = 3.0 V 2. Access time: 85 ns (MAX.) (VCC = 4.5 to 5.5 V) Version X and P This Data sheet can be applied to the version X and P. Each version is identified with its lot number. Letter X in the fifth character position in a lot number signifies version X, letter P, version P. JAPAN D43256B Lot number The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. M10770EJCV0DS00 (12th edition) Date Published June 2000 NS CP (K) Printed in Japan The mark 5 shows major revised points. © 1990, 1993, 1994 µPD43256B Ordering Information Part number Package Access time ns (MAX.) Operating supply Operating ambient voltage V temperature °C 0 to 70 L version Remark µPD43256BCZ-70L µPD43256BCZ-85L µPD43256BCZ-70LL µPD43256BCZ-85LL µPD43256BGU-70L µPD43256BGU-85L µPD43256BGU-70LL µPD43256BGU-85LL µPD43256BGU-A85 µPD43256BGU-A10 µPD43256BGU-A12 µPD43256BGU-B10 µPD43256BGU-B12 µPD43256BGW-70LL-9JL µPD43256BGW-85LL-9JL µPD43256BGW-A85-9JL µPD43256BGW-A10-9JL µPD43256BGW-A12-9JL µPD43256BGW-B10-9JL µPD43256BGW-B12-9JL µPD43256BGW-B15-9JL µPD43256BGW-70LL-9KL µPD43256BGW-85LL-9KL µPD43256BGW-A85-9KL µPD43256BGW-A10-9KL µPD43256BGW-A12-9KL µPD43256BGW-B10-9KL µPD43256BGW-B12-9KL µPD43256BGW-B15-9KL 28-PIN PLASTIC DIP (15.24 mm (600)) 70 85 70 85 4.5 to 5.5 LL version 28-PIN PLASTIC SOP (11.43 mm (450)) 70 85 70 85 85 100 120 100 120 2.7 to 5.5 3.0 to 5.5 L version LL version A version B version 28-PIN PLASTIC TSOP (I) (8x13.4) (Normal bent) 70 85 85 100 120 100 120 150 4.5 to 5.5 LL version 3.0 to 5.5 A version 2.7 to 5.5 B version 28-PIN PLASTIC TSOP (I) (8x13.4) (Reverse bent) 70 85 85 100 120 100 120 150 4.5 to 5.5 LL version 3.0 to 5.5 A version 2.7 to 5.5 B version 2 Data Sheet M10770EJCV0DS00 µPD43256B Pin Configurations (Marking Side) /xxx indicates active low signal. 28-PIN PLASTIC DIP (15.24 mm (600)) [ µPD43256BCZ-xxL ] [ µPD43256BCZ-xxLL ] A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O1 I/O2 I/O3 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VCC /WE A13 A8 A9 A11 /OE A10 /CS I/O8 I/O7 I/O6 I/O5 I/O4 A0 - A14 I/O1 - I/O8 /CS /WE /OE VCC GND : Address inputs : Data inputs / outputs : Chip Select : Write Enable : Output Enable : Power supply : Ground Remark Refer to Package Drawings for the 1-pin index mark. Data Sheet M10770EJCV0DS00 3 µPD43256B 28-PIN PLASTIC SOP (11.43 mm (450)) [ µPD43256BGU-xxL ] [ µPD43256BGU-xxLL ] [ µPD43256BGU-Axx ] [ µPD43256BGU-Bxx ] A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O1 I/O2 I/O3 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VCC /WE A13 A8 A9 A11 /OE A10 /CS I/O8 I/O7 I/O6 I/O5 I/O4 A0 - A14 I/O1 - I/O8 /CS /WE /OE VCC GND : Address inputs : Data inputs / outputs : Chip Select : Write Enable : Output Enable : Power supply : Ground Remark Refer to Package Drawings for the 1-pin index mark. 4 Data Sheet M10770EJCV0DS00 µPD43256B 28-PIN PLASTIC TSOP (I) (8x13.4) (Normal bent) [ µPD43256BGW-xxLL-9JL ] [ µPD43256BGW-Axx-9JL ] [ µPD43256BGW-Bxx-9JL ] /OE A11 A9 A8 A13 /WE VCC A14 A12 A7 A6 A5 A4 A3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 A10 /CS I/O8 I/O7 I/O6 I/O5 I/O4 GND I/O3 I/O2 I/O1 A0 A1 A2 28-PIN PLASTIC TSOP (I) (8x13.4) (Reverse bent) [ µPD43256BGW-xxLL-9KL ] [ µPD43256BGW-Axx-9KL ] [ µPD43256BGW-Bxx-9KL ] A10 /CS I/O8 I/O7 I/O6 I/O5 I/O4 GND I/O3 I/O2 I/O1 A0 A1 A2 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 /OE A11 A9 A8 A13 /WE VCC A14 A12 A7 A6 A5 A4 A3 A0 - A14 I/O1 - I/O8 /CS /WE /OE VCC GND : Address inputs : Data inputs / outputs : Chip Select : Write Enable : Output Enable : Power supply : Ground Remark Refer to Package Drawings for the 1-pin index mark. Data Sheet M10770EJCV0DS00 5 µPD43256B Block Diagram A0 A14 Address buffer Row decoder Memory cell array 262,144 bits I/O1 I/O8 Input data controller Sense amplifier / Switching circuit Column decoder Output data controller Address buffer /CS /OE /WE VCC GND Truth Table /CS H L L L /OE × H × L /WE × H L H Mode Not selected Output disable Write Read DIN DOUT I/O High impedance Supply current ISB ICCA Remark × : VIH or VIL 6 Data Sheet M10770EJCV0DS00 µPD43256B Electrical Specifications Absolute Maximum Ratings Parameter Supply voltage Input / Output voltage Operating ambient temperature Storage temperature Symbol VCC VT TA Tstg Condition Rating –0.5 –0.5 Note Unit V V °C °C to +7.0 Note to VCC + 0.5 0 to 70 –55 to +125 Note –3.0 V (MIN.) (Pulse width : 50 ns) Caution Exposing the device to stress above those listed in Absolute Maximum Rating could cause permanent damage. The device is not meant to be operated under conditions outside the limits described in the operational section of this specification. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Condition µPD43256B-xxL µPD43256B-xxLL MIN. MAX. 5.5 VCC+0.5 +0.8 70 µPD43256B-Axx µPD43256B-Bxx Unit MIN. 3.0 2.2 –0.3 0 Note MAX. 5.5 VCC+0.5 +0.5 70 MIN. 2.7 2.2 –0.3 0 Note MAX. 5.5 VCC+0.5 +0.5 70 V V V °C Supply voltage High level input voltage Low level input voltage Operating ambient temperature VCC VIH VIL TA 4.5 2.2 –0.3 0 Note Note –3.0 V (MIN.) (Pulse width: 50 ns) Capacitance (TA = 25 °C, f = 1 MHz) Parameter Input capacitance Input / Output capacitance Symbol CIN CI/O Test conditions VIN = 0 V VI/O = 0 V MIN. TYP. MAX. 5 8 Unit pF pF Remarks 1. VIN : Input voltage VI/O : Input / Output voltage 2. These parameters are periodically sampled and not 100% tested. Data Sheet M10770EJCV0DS00 7 µPD43256B DC Characteristics (Recommended Operating Conditions Unless Otherwise Noted) (1/2) Parameter Symbol Test condition µPD43256B-xxL MIN. TYP. MAX. +1.0 +1.0 µPD43256B-xxLL MIN. –1.0 –1.0 TYP. MAX. +1.0 +1.0 Unit Input leakage current I/O leakage current ILI ILO VIN = 0 V to VCC VI/O = 0 V to VCC, /OE = VIH or /CS = VIH or /WE = VIL –1.0 –1.0 µA µA Operating supply current ICCA1 ICCA2 ICCA3 /CS = VIL, Minimum cycle time, II/O = 0 mA /CS = VIL, II/O = 0 mA /CS ≤ 0.2 V, Cycle = 1 MHz, II/O = 0 mA, VIL ≤ 0.2 V, VIH ≥ VCC – 0.2 V 45 10 10 45 10 10 mA Standby supply current ISB ISB1 /CS = VIH /CS ≥ VCC − 0.2 V IOH = –1.0 mA IOH = –0.1 mA IOL = 2.1 mA 2.4 VCC–0.5 3 1.0 50 2.4 VCC–0.5 3 0.5 15 mA µA V High level output voltage VOH1 VOH2 Low level output voltage VOL 0.4 0.4 V Remarks 1. VIN : Input voltage VI/O : Input / Output voltage 2. These DC characteristics are in common regardless of package types. 8 Data Sheet M10770EJCV0DS00 µPD43256B DC Characteristics (Recommended Operating Conditions Unless Otherwise Noted) (2/2) Parameter Symbol Test condition µPD43256B-Axx MIN. TYP. MAX. +1.0 +1.0 µPD43256B-Bxx MIN. –1.0 –1.0 TYP. MAX. +1.0 +1.0 Unit Input leakage current I/O leakage current ILI ILO VIN = 0 V to VCC VI/O = 0 V to VCC, /OE = VIH or /CS = VIH or /WE = VIL –1.0 –1.0 µA µA Operating supply current ICCA1 /CS = VIL, Minimum cycle time, II/O = 0 mA µPD43256B-Axx µPD43256B-Bxx VCC ≤ 3.3 V 45 – – 10 – 45 20 10 5 10 5 3 2 0.5 0.5 2.4 2.4 VCC–0.1 mA ICCA2 /CS = VIL, II/O = 0 mA VCC ≤ 3.3 V – 10 – 3 ICCA3 /CS ≤ 0.2 V, Cycle = 1 MHz, II/O = 0 mA, VIL ≤ 0.2 V, VIH ≥ VCC – 0.2 V VCC ≤ 3.3 V Standby supply current ISB /CS = VIH VCC ≤ 3.3 V mA – 0.5 15 – 2.4 2.4 VCC–0.1 ISB1 /CS ≥ VCC − 0.2 V VCC ≤ 3.3 V 15 10 µA High level output voltage VOH1 IOH = –1.0 mA, VCC ≥ 4.5 V IOH = –0.5 mA, VCC < 4.5 V V VOH2 Low level output voltage VOL IOH = –0.02 mA IOL = 2.1 mA, VCC ≥ 4.5 V IOL = 1.0 mA, VCC < 4.5 V 0.4 0.4 0.1 0.4 0.4 0.1 V VOL1 IOL = 0.02 mA Remarks 1. VIN : Input voltage VI/O : Input / Output voltage 2. These DC characteristics are in common regardless of package types. Data Sheet M10770EJCV0DS00 9 µPD43256B AC Characteristics (Recommended Operating Conditions Unless Otherwise Noted) AC Test Conditions [ µPD43256B-70L, µPD43256B-85L, µPD43256B-70LL, µPD43256B-85LL ] Input Waveform (Rise and Fall Time ≤ 5 ns) 2.2 V 1.5 V 0.8 V Test points 1.5 V Output Waveform 1.5 V Test points 1.5 V Output Load AC characteristics should be measured with the following output load conditions. Figure 1 (tAA, tACS, tOE, tOH) +5 V Figure 2 (tCHZ, tCLZ, tOHZ, tOLZ, tWHZ, tOW) +5 V 1.8 kΩ I/O (Output) 990 Ω 100 pF CL I/O (Output) 990 Ω 1.8 kΩ 5 pF CL Remark CL includes capacitance of the probe and jig, and stray capacitance. [ µPD43256B-A85, µPD43256B-A10, µPD43256B-A12, µPD43256B-B10, µPD43256B-B12, µPD43256B-B15 ] Input Waveform (Rise and Fall Time ≤ 5 ns) 2.2 V 1.5 V 0.5 V Test points 1.5 V Output Waveform 1.5 V Test points 1.5 V Output Load AC characteristics should be measured with the following output load conditions. tAA, tACS, tOE, tOH 1TTL + 100 pF tCHZ, tCLZ, tOHZ, tOLZ, tWHZ, tOW 1TTL + 5 pF 10 Data Sheet M10770EJCV0DS00 µPD43256B Read Cycle (1/2) Parameter Symbol VCC ≥ 4.5 V Unit Condition µPD43256B-70 µPD43256B-85 µPD43256B-A85/A10/A12 µPD43256B-B10/B12/B15 MIN. Read cycle time Address access time /CS access time /OE access time Output hold from address change /CS to output in low impedance /OE to output in low impedance /CS to output in high impedance /OE to output in high impedance tRC tAA tACS tOE tOH tCLZ tOLZ tCHZ tOHZ 10 10 5 70 MAX. MIN. 85 MAX. ns 85 85 40 ns ns ns ns ns ns 30 30 ns ns Note 70 70 35 10 10 5 30 30 Note See the output load. Remark These AC characteristics are in common regardless of package types and L, LL versions. Read Cycle (2/2) Parameter Symbol VCC ≥ 3.0 V VCC ≥ 2.7 V Unit Condition µPD43256B -A85 µPD43256B -A10 µPD43256B -A12 µPD43256B -B10 µPD43256B -B12 µPD43256B -B15 MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. Read cycle time Address access time /CS access time /OE access time Output hold from address change /CS to output in low impedance /OE to output in low impedance /CS to output in high impedance /OE to output in high impedance tRC tAA 85 85 100 100 120 120 100 100 120 120 150 150 ns ns Note tACS tOE tOH tCLZ tOLZ tCHZ tOHZ 10 10 5 85 50 10 10 5 35 35 100 60 10 10 5 35 35 120 60 10 10 5 40 40 100 60 10 10 5 35 35 120 60 10 10 5 40 40 150 70 ns ns ns ns ns 50 50 ns ns Note See the output load. Remark These AC characteristics are in common regardless of package types. Data Sheet M10770EJCV0DS00 11 µPD43256B Read Cycle Timing Chart tRC Address (Input) tAA /CS (Input) tACS tCLZ tCHZ tOH /OE (Input) tOE tOLZ I/O (Output) High impedance Data out tOHZ Remark In read cycle, /WE should be fixed to high level. 12 Data Sheet M10770EJCV0DS00 µPD43256B Write Cycle (1/2) Parameter Symbol VCC ≥ 4.5 V Unit Condition µPD43256B-70 µPD43256B-85 µPD43256B-A85/A10/A12 µPD43256B-B10/B12/B15 MIN. Write cycle time /CS to end of write Address valid to end of write Write pulse width Data valid to end of write Data hold time Address setup time Write recovery time /WE to output in high impedance Output active from end of write tWC tCW tAW tWP tDW tDH tAS tWR tWHZ tOW 10 70 50 50 55 30 0 0 0 MAX. MIN. 85 70 70 60 35 0 0 0 MAX. ns ns ns ns ns ns ns ns 30 ns ns Note 30 10 Note See the output load. Remark These AC characteristics are in common regardless of package types and L, LL versions. Write Cycle (2/2) Parameter Symbol VCC ≥ 3.0 V VCC ≥ 2.7 V Unit Con- µPD43256B -A85 µPD43256B -A10 µPD43256B -A12 µPD43256B -B10 µPD43256B -B12 µPD43256B -B15 dition MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. Write cycle time /CS to end of write Address valid to end of write Write pulse width Data valid to end of write Data hold time Address setup Write recovery /WE to output in high impedance Output active from end of write tWC tCW tAW 85 70 70 100 70 70 120 90 90 100 70 70 120 90 90 150 100 100 ns ns ns tWP tDW 60 60 60 60 80 70 60 60 80 70 90 80 ns ns ns ns ns 50 ns ns Note tDH tAS tWR tWHZ tOW 0 0 0 30 10 0 0 0 35 10 0 0 0 40 10 0 0 0 35 10 0 0 0 40 10 0 0 0 10 Note See the output load. Remark These AC characteristics are in common regardless of package types. Data Sheet M10770EJCV0DS00 13 µPD43256B Write Cycle Timing Chart 1 (/WE Controlled) tWC Address (Input) tCW /CS (Input) tAW tAS /WE (Input) tOW tWHZ I/O (Input / Output) Indefinite data out High impedance tDW Data in tDH High impedance Indefinite data out tWP tWR Cautions 1. /CS or /WE should be fixed to high level during address transition. • 2. When I/O pins are in the output state, therefore the input signals must not be applied to the output. Remarks 1. Write operation is done during the overlap time of a low level /CS and a low level /WE. 2. When /WE is at low level, the I/O pins are always high impedance. When /WE is at high level, read operation is executed. Therefore /OE should be at high level to make the I/O pins high impedance. 3. If /CS changes to low level at the same time or after the change of /WE to low level, the I/O pins will remain high impedance state. 14 Data Sheet M10770EJCV0DS00 µPD43256B Write Cycle Timing Chart 2 (/CS Controlled) tWC Address (Input) tAS /CS (Input) tAW tWP /WE (Input) tCW tWR tDW High impedance I/O (Input) Data in tDH High impedance Cautions 1. /CS or /WE should be fixed to high level during address transition. • 2. When I/O pins are in the output state, therefore the input signals must not be applied to the output. Remark Write operation is done during the overlap time of a low level /CS and a low level /WE. Data Sheet M10770EJCV0DS00 15 µPD43256B Low VCC Data Retention Characteristics (TA = 0 to 70 °C) Parameter Symbol Test Condition µPD43256B-xxL µPD43256B-xxLL µPD43256B-Axx µPD43256B-Bxx Unit MIN. Data retention supply voltage Data retention supply current Chip deselection to data retention mode Operation recovery time VCCDR ICCDR tCDR /CS ≥ VCC − 0.2 V VCC = 3.0 V, /CS ≥ VCC − 0.2 V 0 2.0 TYP. MAX. 5.5 MIN. 2.0 TYP. MAX. 5.5 V 0.5 20 Note1 0.5 0 7 Note2 µA ns tR 5 5 ms Notes 1. 3 µA (TA ≤ 40 °C) 2. 2 µA (TA ≤ 40 °C), 1 µA (TA ≤ 25 °C) Data Retention Timing Chart tCDR VCC 4.5 V Note Data retention mode tR /CS VIH (MIN.) VCCDR (MIN.) /CS ≥ VCC – 0.2 V VIL (MAX.) GND Note A version : 3.0 V, B version : 2.7 V Remark The other pins (Address, /OE, /WE, I/O) can be in high impedance state. 16 Data Sheet M10770EJCV0DS00 µPD43256B Package Drawings 28-PIN PLASTIC DIP (15.24 mm (600)) 28 15 1 A 14 J I K L F D H G NOTES C N M B M R 1. Each lead centerline is located within 0.25 mm of its true position (T.P.) at maximum material condition. 2. Item "K" to center of leads when formed parallel. ITEM A B C D F G H I J K L M N R MILLIMETERS 38.10 MAX. 2.54 MAX. 2.54 (T.P.) 0.50 ± 0.10 1.2 MIN. 3.6 ± 0.3 0.51 MIN. 4.31 MAX. 5.72 MAX. 15.24 (T.P.) 13.2 0.25 + 0.10 − 0.05 0.25 0 - 15 ° P28C-100-600A1-2 Data Sheet M10770EJCV0DS00 17 µPD43256B • 28-PIN PLASTIC SOP (11.43 mm (450)) 28 15 detail of lead end P 1 A F G 14 H I S J C D E NOTE N M S B K L M ITEM A B C D E F G H I J K L M N P MILLIMETERS 18.0 + 0.6 − 0.05 1.27 MAX. 1.27 (T.P.) 0.42 + 0.08 − 0.07 0.2 ± 0.1 2.95 MAX. 2.55 ± 0.1 11.8 ± 0.3 8.4 ± 0.1 1.7 ± 0.2 0.22 ± 0.05 0.7 ± 0.2 0.12 0.10 3° +7° −3° P28GU-50-450A-4 Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. 18 Data Sheet M10770EJCV0DS00 µPD43256B 28-PIN PLASTIC TSOP(I) (8x13.4) 1 28 detail of lead end S R 14 15 Q P I J S A G H L K N S D C M M B NOTES 1. Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition. 2. "A" excludes mold flash. (Includes mold flash : 8.4mm MAX.) ITEM A B C D G H I J K L M N P Q R S MILLIMETERS 8.0 ± 0.1 0.6 MAX. 0.55 (T.P.) 0.22 + 0.08 − 0.07 1.0 12.4 ± 0.2 11.8 ± 0.1 0.8 ± 0.2 0.145 + 0.025 − 0.015 0.5 ± 0.1 0.08 0.10 13.4 ± 0.2 0.1 ± 0.05 3° +7° −3° 1.2 MAX. P28GW-55-9JL-2 Data Sheet M10770EJCV0DS00 19 µPD43256B 28-PIN PLASTIC TSOP(I) (8x13.4) 1 28 detail of lead end Q R 14 15 S K H N S L D M C M B S G I P J A NOTE 1. Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition. 2. "A" excludes mold flash. (Includes mold flash : 8.4mm MAX.) ITEM A B C D G H I J K L M N P Q R S MILLIMETERS 8.0 ± 0.1 0.6 MAX. 0.55 (T.P.) 0.22 + 0.08 − 0.07 1.0 12.4 ± 0.2 11.8 ± 0.1 0.8 ± 0.2 0.145 + 0.025 − 0.015 0.5 ± 0.1 0.08 0.10 13.4 ± 0.2 0.1 ± 0.05 3° +7° −3° 1.2 MAX. P28GW-55-9KL-2 20 Data Sheet M10770EJCV0DS00 µPD43256B Recommended Soldering Conditions The following conditions (See table below) must be met when soldering µPD43256B. For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (C10535E). Please consult with our sales offices in case other soldering process is used, or in case soldering is done under different conditions. Types of Surface Mount Device µPD43256BGU-xxL µPD43256BGU-xxLL µPD43256BGU-Axx µPD43256BGU-Bxx µPD43256BGW-xxLL-9JL µPD43256BGW-xxLL-9KL µPD43256BGW-Axx-9JL µPD43256BGW-Axx-9KL µPD43256BGW-Bxx-9JL µPD43256BGW-Bxx-9KL : 28-PIN PLASTIC SOP (11.43 mm (450)) : 28-PIN PLASTIC SOP (11.43 mm (450)) : 28-PIN PLASTIC SOP (11.43 mm (450)) : 28-PIN PLASTIC SOP (11.43 mm (450)) : 28-PIN PLASTIC TSOP (I) (8x13.4) (Normal bent) : 28-PIN PLASTIC TSOP (I) (8x13.4) (Reverse bent) : 28-PIN PLASTIC TSOP (I) (8x13.4) (Normal bent) : 28-PIN PLASTIC TSOP (I) (8x13.4) (Reverse bent) : 28-PIN PLASTIC TSOP (I) (8x13.4) (Normal bent) : 28-PIN PLASTIC TSOP (I) (8x13.4) (Reverse bent) Please consult with our sales offices. Types of Through Hole Mount Device µPD43256BCZ-xxL µPD43256BCZ-xxLL : 28-PIN PLASTIC DIP (15.24 mm (600)) : 28-PIN PLASTIC DIP (15.24 mm (600)) Soldering process Soldering conditions Solder temperature : 260 °C or below, Flow time : 10 seconds or below Wave soldering (only to leads) Partial heating method Terminal temperature : 300 °C or below, Time : 3 seconds or below (Per one lead) Caution Do not jet molten solder on the surface of package. Data Sheet M10770EJCV0DS00 21 µPD43256B [ MEMO ] 22 Data Sheet M10770EJCV0DS00 µPD43256B NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD o r GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. Data Sheet M10770EJCV0DS00 23 µPD43256B • The information in this document is current as of June, 2000. The information is subject to change without notice. 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To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4