UPD444016LE-8

DATA SHEET MOS INTEGRATED CIRCUIT µPD444016 4M-BIT CMOS FAST SRAM 256K-WORD BY 16-BIT Description The µPD444016 is a high speed, low power, 4,194,304 bits (262,144 words by 16 bits) CMOS static RAM. Operating supply voltage is 5.0 V ± 0.5 V. The µPD444016 is packaged in 44-pin plastic SOJ and 44-pin plastic TSOP (II). Features • 262,144 words by 16 bits organization • Fast access time : 8, 10, 12 ns (MAX.) • Byte data control : /LB (I/O1 - I/O8), /UB (I/O9 - I/O16) • Output Enable input for easy application • Single +5.0 V power supply Ordering Information Part number Package Access time ns (MAX.) Supply current mA (MAX.) At operating 220 200 190 220 200 190 At standby 10 µPD444016LE-8 µPD444016LE-10 µPD444016LE-12 µPD444016G5-8-7JF µPD444016G5-10-7JF µPD444016G5-12-7JF 44-pin plastic SOJ (10.16 mm (400)) 8 10 12 44-pin plastic TSOP (II) (10.16 mm (400)) (Normal bent) 8 10 12 The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. M14430EJ4V0DS00 (4th edition) Date Published January 2001 NS CP(K) Printed in Japan The mark • shows major revised points. © 1999 µPD444016 Pin Configuration (Marking Side) /××× indicates active low signal. 44-pin plastic SOJ (10.16 mm (400)) [ µPD444016LE ] 44-pin plastic TSOP (II) (10.16 mm (400)) (Normal bent) [ µPD444016G5-××-7JF ] A0 A1 A2 A3 A4 /CS I/O1 I/O2 I/O3 I/O4 VCC GND I/O5 I/O6 I/O7 I/O8 /WE A5 A6 A7 A8 A9 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 A17 A16 A15 /OE /UB /LB I/O16 I/O15 I/O14 I/O13 GND VCC I/O12 I/O11 I/O10 I/O9 NC A14 A13 A12 A11 A10 A0 - A17 : Address Inputs I/O1 - I/O16 : Data Inputs / Outputs /CS /WE /OE /LB, /UB VCC GND NC : Chip Select : Write Enable : Output Enable : Byte data select : Power supply : Ground : No connection Remark Refer to Package Drawings for the 1-pin index mark. 2 Data Sheet M14430EJ4V0DS µPD444016 Block Diagram Address buffer A0 | A17 Row decoder Memory cell array 4,194,304 bits I/O1 - I/O8 Input data controller Sense amplifier / Switching circuit Column decoder Output data controller I/O9 - I/O16 /WE /CS /LB Address buffer /UB /OE VCC GND Truth Table /CS /OE /WE /LB /UB Mode I/O1 - I/O8 H L × L × H × L L H L × L L L H L L H × H × × H × L H L L H L × H Output disable Write Not selected Read High impedance DOUT DOUT High impedance DIN DIN High impedance High impedance High impedance I/O I/O9 - I/O16 High impedance DOUT High impedance DOUT DIN High impedance DIN High impedance High impedance ISB ICC Supply current Remark × : Don’t care Data Sheet M14430EJ4V0DS 3 µPD444016 Electrical Specifications Absolute Maximum Ratings Parameter Supply voltage Input / Output voltage Operating ambient temperature Storage temperature Symbol VCC VT TA Tstg Condition –0.5 Rating Note Unit V V °C °C to +7.0 –0.5 Note to VCC+0.5 0 to 70 –55 to +125 Note –2.0 V (MIN.) (pulse width : 2 ns) Caution Exposing the device to stress above those listed in Absolute Maximum Rating could cause permanent damage. The device is not meant to be operated under conditions outside the limits described in the operational section of this specification. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Recommended Operating Conditions Parameter Supply voltage High level input voltage Low level input voltage Operating ambient temperature Symbol VCC VIH VIL TA Condition MIN. 4.5 2.2 –0.5 0 Note TYP. 5.0 MAX. 5.5 VCC+0.5 +0.8 70 Unit V V V °C Note –2.0 V (MIN.) (pulse width : 2 ns) 4 Data Sheet M14430EJ4V0DS µPD444016 DC Characteristics (Recommended Operating Conditions Unless Otherwise Noted) Parameter Input leakage current Output leakage current Symbol ILI ILO Test condition VIN = 0 V to VCC VI/O = 0 V to VCC, /CS = VIH or /OE = VIH or /WE = VIL or /LB = VIH or /UB = VIH Operating supply current ICC /CS = VIL, II/O = 0 mA, Cycle time : 8 ns Cycle time : 10 ns 220 200 190 40 10 mA mA MIN. –2 –2 TYP. MAX. +2 +2 Unit µA µA Minimum cycle time Cycle time : 12 ns Standby supply current ISB ISB1 /CS = VIH, VIN = VIH or VIL /CS ≥ VCC – 0.2 V, VIN ≤ 0.2 V or VIN ≥ VCC – 0.2 V High level output voltage Low level output voltage VOH VOL IOH = –4.0 mA IOL = +8.0 mA 2.4 V 0.4 V Remarks 1. VIN : Input voltage VI/O : Input / Output voltage 2. These DC characteristics are in common regardless of package types. Capacitance (TA = 25 °C, f = 1 MHz) Parameter Input capacitance Input / Output capacitance Symbol CIN CI/O VIN = 0 V VI/O = 0 V Test condition MIN. TYP. MAX. 6 8 Unit pF pF Remarks 1. VIN : Input voltage VI/O : Input / Output voltage 2. These parameters are periodically sampled and not 100% tested. Data Sheet M14430EJ4V0DS 5 µPD444016 AC Characteristics (Recommended Operating Conditions Unless Otherwise Noted) AC Test Conditions Input Waveform (Rise and Fall Time ≤ 3 ns) 3.0 V 1.5 V GND Test Points 1.5 V Output Waveform 1.5 V Test Points 1.5 V Output Load AC characteristics directed with the note should be measured with the output load shown in Figure 1 or Figure 2. Figure 1 (tAA, tACS, tOE, tABD, tOH) VTT = +1.5 V Figure 2 (tCLZ, tOLZ, tBLZ, tCHZ, tOHZ, tBHZ, tWHZ, tOW ) +5.0 V 50 Ω ZO = 50 Ω I/O (Output) 30 pF CL I/O (Output) 255 Ω 480 Ω 5 pF CL Remark CL includes capacitances of the probe and jig, and stray capacitances. 6 Data Sheet M14430EJ4V0DS µPD444016 Read Cycle Parameter Symbol µPD444016-8 MIN. MAX. µPD444016-10 MIN. 10 MAX. µPD444016-12 MIN. 12 MAX. Unit Notes Read cycle time Address access time /CS access time /OE access time /LB, /UB access time Output hold from address change /CS to output in low impedance /OE to output in low impedance /LB, /UB to output in low impedance /CS to output in high impedance /OE to output hold in high impedance /LB, /UB to output hold in high impedance tRC tAA tACS tOE tABD tOH tCLZ tOLZ tBLZ tCHZ tOHZ tBHZ 8 8 8 4 4 3 3 0 0 4 4 4 ns 12 12 6 6 ns ns ns ns ns ns ns ns 6 6 6 ns ns ns 2, 3 1 10 10 5 5 3 3 0 0 5 5 5 3 3 0 0 Notes 1. See the output load shown in Figure 1. 2. Transition is measured at ± 200 mV from steady-state voltage with the output load shown in Figure 2. 3. These parameters are periodically sampled and not 100% tested. Remark These AC characteristics are in common regardless of package types. Read Cycle Timing Chart 1 (Address Access) tRC Address (Input) tAA tOH I/O (Output) Previous data out Data out Remarks 1. In read cycle, /WE should be fixed to high level. 2. /CS = /OE = /LB (or /UB) = VIL Data Sheet M14430EJ4V0DS 7 µPD444016 Read Cycle Timing Chart 2 (/CS Access) tRC Address (Input) tAA tACS /CS (Input) tCLZ /OE (Input) tOE tOLZ /LB, /UB (Input) tABD tBLZ I/O (Output) High impedance Data out tBHZ High impedance tOHZ tCHZ Caution Address valid prior to or coincident with /CS low level input. Remark In read cycle, /WE should be fixed to high level. 8 Data Sheet M14430EJ4V0DS µPD444016 Write Cycle Parameter Symbol µPD444016-8 MIN. MAX. µPD444016-10 MIN. 10 7 7 7 7 5 0 0 0 MAX. µPD444016-12 MIN. 12 8 8 8 8 6 0 0 0 MAX. Unit Notes Write cycle time /CS to end of write Address valid to end of write Write pulse width /LB, /UB to end of write Data valid to end of write Data hold time Address setup time Write recovery time /WE to output in high impedance Output active from end of write tWC tCW tAW tWP tBW tDW tDH tAS tWR tWHZ tOW 8 6 6 6 6 4 0 0 0 4 3 ns ns ns ns ns ns ns ns ns 6 ns ns 1, 2 5 3 3 Notes 1. Transition is measured at ± 200 mV from steady-state voltage with the output load shown in Figure 2. 2. These parameters are periodically sampled and not 100% tested. Remark These AC characteristics are in common regardless of package types. Write Cycle Timing Chart 1 (/WE Controlled) tWC Address (Input) tCW /CS (Input) tAW tAS /WE (Input) tWP tWR tBW /LB, /UB (Input) tOW tWHZ I/O (Input / Output) Indefinite data out High impedance tDW Data in tDH High impedance Indefinite data out Cautions 1. /CS or /WE should be fixed to high level during address transition. 2. Do not input data to the I/O pins while they are in the output state. Remarks 1. Write operation is done during the overlap time of a low level /CS, a low level /WE and a low level /LB (or low level /UB). 2. When /WE is at low level, the I/O pins are always high impedance. When /WE is at high level, read operation is executed. Therefore /OE should be at high level to make the I/O pins high impedance. 9 Data Sheet M14430EJ4V0DS µPD444016 Write Cycle Timing Chart 2 (/CS Controlled) tWC Address (Input) tAS /CS (Input) tAW tWP /WE (Input) tCW tWR tBW /LB, /UB (Input) tDW High impedance I/O (Input) Data in tDH High impedance Cautions 1. /CS or /WE should be fixed to high level during address transition. 2. Do not input data to the I/O pins while they are in the output state. Remark Write operation is done during the overlap time of a low level /CS, a low level /WE and a low level /LB (or low level /UB). 10 Data Sheet M14430EJ4V0DS µPD444016 Write Cycle Timing Chart 3 (/LB, /UB Controlled) tWC Address (Input) tAW tCW /CS (Input) tWP /WE (Input) tAS /LB, /UB (Input) tDW High impedance I/O (Input) Data in tDH High impedance tBW tWR Cautions 1. /CS or /WE should be fixed to high level during address transition. 2. Do not input data to the I/O pins while they are in the output state. Remark Write operation is done during the overlap time of a low level /CS, a low level /WE and a low level /LB (or low level /UB). Data Sheet M14430EJ4V0DS 11 µPD444016 Package Drawings 44-PIN PLASTIC SOJ (10.16 mm (400)) B 44 23 C D 1 22 G J F E S U P M K I H N M T Q S NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM B C D E F G H I J K M N P Q T U MILLIMETERS 28.73 + 0.20 − 0.35 10.16 11.18 ± 0.20 1.03 ± 0.15 0.74 3.5 ± 0.2 2.3 ± 0.2 0.8 MIN. 2.6 1.27 (T.P.) 0.40 ± 0.10 0.12 9.4 ± 0.20 0.10 R 0.85 0.20 + 0.10 − 0.05 P44LE-400A-1 12 Data Sheet M14430EJ4V0DS µPD444016 44-PIN PLASTIC TSOP (II) (10.16 mm (400)) 44 23 detail of lead end F P E 1 A 22 H G S I J C D M M N S B K L NOTE Each lead centerline is located within 0.13 mm of its true position (T.P.) at maximum material condition. ITEM A B C D E F G H I J K L M N P MILLIMETERS 18.63 MAX. 0.93 MAX. 0.8 (T.P.) 0.32 + 0.08 − 0.07 0.1 ± 0.05 1.2 MAX. 0.97 11.76 ± 0.2 10.16 ± 0.1 0.8 ± 0.2 0.145+ 0.025 − 0.015 0.5 ± 0.1 0.13 0.10 +7° 3 °− 3 ° S44G5-80-7JF5-1 Data Sheet M14430EJ4V0DS 13 µPD444016 Recommended Soldering Conditions Please consult with our sales offices for soldering conditions of the µPD444016. Types of Surface Mount Device µPD444016LE µPD444016G5-7JF : 44-pin plastic SOJ (10.16 mm (400)) : 44-pin plastic TSOP (II) (10.16 mm (400)) (Normal bent) 14 Data Sheet M14430EJ4V0DS µPD444016 NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD o r GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. Data Sheet M14430EJ4V0DS 15 µPD444016 • The information in this document is current as of January, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. 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