UPD4616112

DATA SHEET MOS INTEGRATED CIRCUIT µPD4616112 16M-BIT CMOS MOBILE SPECIFIED RAM 1M-WORD BY 16-BIT Description The µPD4616112 is a high speed, low power, 16,777,216 bits (1,048,576 words by 16 bits) CMOS mobile specified RAM featuring low power static RAM compatible function and pin configuration. The µPD4616112 is fabricated with advanced CMOS technology using one-transistor memory cell. The µPD4616112 is packed in 48-pin TAPE FBGA. Features • 1,048,576 words by 16 bits organization 5 • Fast access time: 80, 90 ns (MAX.) • Byte data control: /LB (I/O0 - I/O7), /UB (I/O8 - I/O15) • Low voltage operation: VCC = 2.6 to 3.0 V • Operating ambient temperature: TA = –20 to +70 °C • Output Enable input for easy application • Chip Enable input: /CS pin • Standby Mode input: MODE pin • Standby Mode1: Normal standby (Memory cell data hold valid) • Standby Mode2: Memory cell data hold invalid Product name Access time ns (MAX.) Operating supply Operating ambient Voltage temperature °C Supply current At operating mA (MAX.) 35 At standby µA (MAX.) 100 / 10 5 µPD4616112-BCxx 80, 90 2.6 to 3.0 –20 to +70 The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. M15085EJ5V0DS00 (5th edition) Date Published October 2001 NS CP (K) Printed in Japan The mark 5 shows major revised points. © 2000 µPD4616112 5 Ordering Information Part number Package Access time ns (MAX.) Operating supply voltage V Operating temperature °C –20 to +70 BC version Remark µPD4616112F9-BC80-BC2 µPD4616112F9-BC90-BC2 48-pin TAPE FBGA (8 x 6) 80 90 2.6 to 3.0 5 Marking Image Part number Marking (XX) B1 B2 µPD4616112F9-BC80-BC2 µPD4616112F9-BC90-BC2 J MS16M0-XX Index mark Lot number 2 Data Sheet M15085EJ5V0DS µPD4616112 Pin Configuration /xxx indicates active low signal. 48-pin TAPE FBGA (8 x 6) Top View Bottom View A B C D E F G H 1 2 3 4 5 6 6 5 4 3 2 1 1 A B C D E F G H /LB I/O8 I/O9 GND VCC I/O14 I/O15 A18 2 /OE /UB I/O10 I/O11 I/O12 I/O13 A19 A8 3 A0 A3 A5 A17 GND A14 A12 A9 4 A1 A4 A6 A7 A16 A15 A13 A10 5 A2 /CS I/O1 I/O3 I/O4 I/O5 /WE A11 6 MODE I/O0 I/O2 VCC GND I/O6 I/O7 GND A B C D E F G H 6 MODE I/O0 I/O2 VCC GND I/O6 I/O7 GND 5 A2 /CS I/O1 I/O3 I/O4 I/O5 /WE A11 4 A1 A4 A6 A7 A16 A15 A13 A10 3 A0 A3 A5 A17 GND A14 A12 A9 2 /OE /UB I/O10 I/O11 I/O12 I/O13 A19 A8 1 /LB I/O8 I/O9 GND VCC I/O14 I/O15 A18 A0 - A19 I/O0 - I/O15 /CS MODE /WE : Address inputs : Data inputs / outputs : Chip Select : Standby mode : Write enable /OE /LB, /UB VCC GND : Output enable : Byte data select : Power supply : Ground Remark Refer to Package Drawing for the index mark. Data Sheet M15085EJ5V0DS 3 µPD4616112 Block Diagram Standby mode control VCC GND Refresh control Refresh counter A0 A19 Row decoder Address buffer Memory cell array 16,777,216 bits I/O0 - I/O7 I/O8 - I/O15 Input data controller Sense amplifier / Switching circuit Column decoder Output data controller Address buffer /CS MODE /LB /UB /WE /OE 4 Data Sheet M15085EJ5V0DS µPD4616112 Truth Table /CS MODE /OE × × H L /WE × × H H /LB × × × L L H H × L L L H H /UB × × × L H L H L H L H Mode I/O0 - I/O7 H H L H L H Not selected (Standby Mode 1) Not selected (Standby Mode 2) Output disable Word read Lower byte read Upper byte read Output disable Word write Lower byte write Upper byte write Write abort High impedance High impedance High impedance DOUT DOUT High impedance High impedance DIN DIN High impedance High impedance I/O I/O8 - I/O15 High impedance High impedance High impedance DOUT High impedance DOUT High impedance DIN High impedance DIN High impedance ISB1 ISB2 ICCA Supply current Caution MODE pin must be fixed to High except Standby Mode 2. Remark ×: VIH or VIL 5 Initialization The µPD4616112 is initialized in the power-on sequence according to the following. (1) To stabilize internal circuits, before turning on the power, a 200 µs or longer wait time must precede any signal toggling. (2) After the wait time, read operation must be performed at least 3 times. After that, it can be normal operation. Initialization Timing Chart VCC (MIN.) VCC Address (Input) MODE (Input) VIH (MIN.) tRC /CS (Input) VIH (MIN.) tCP Power On Wait Time 200 µs Read Operation 3 times Normal Operation Cautions 1. Following power application, make MODE and /CS high level during the wait time interval. 2. Following power application, make MODE high level during the wait time and three read operations. 3. The read operation must satisfy the specs described on page 10 (Read Cycle (BC Version)). 4. The address is don’t care (VIH or VIL) during read operation. 5. Read operation must be executed with toggled the /CS pin. 6. To prevent bus contention, it is recommended to set /OE to high level. 7. Do not input data to the I/O pins if /OE is low level during a read operation. Data Sheet M15085EJ5V0DS 5 µPD4616112 Electrical Specifications Absolute Maximum Ratings Parameter Supply voltage Input / Output voltage Operating ambient temperature Storage temperature Symbol VCC VT TA Tstg –0.5 Note Condition Rating –0.5 Note Unit V V °C °C to +3.3 to VCC + 0.4 (3.3 V MAX). –20 to +70 –55 to +125 Note –1.0 V (MIN.) (Pulse width: 30 ns) Caution Exposing the device to stress above those listed in Absolute Maximum Rating could cause permanent damage. The device is not meant to be operated under conditions outside the limits described in the operational section of this specification. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Condition µPD4616112-BCxx MIN. MAX. 3.0 VCC+0.3 0.2VCC +70 Unit Supply voltage High level input voltage Low level input voltage Operating ambient temperature VCC VIH VIL TA 2.6 0.8VCC –0.3 Note V V V °C –20 Note –0.5 V (MIN.) (Pulse width: 30 ns) Capacitance (TA = 25°C, f = 1 MHz) Parameter Input capacitance Input / Output capacitance Symbol CIN CI/O Test condition VIN = 0 V VI/O = 0 V MIN. TYP. MAX. 8 10 Unit pF pF Remarks 1. VIN: Input voltage VI/O: Input / Output voltage 2. These parameters are not 100% tested. 6 Data Sheet M15085EJ5V0DS µPD4616112 DC Characteristics (Recommended Operating Conditions Unless Otherwise Noted) Parameter Symbol Test condition MIN. Input leakage current I/O leakage current ILI ILO VIN = 0 V to VCC VI/O = 0 V to VCC, /CS = VIH or /WE = VIL or /OE = VIH Operating supply current ICCA /CS = VIL, Minimum cycle time, II/O = 0 mA Standby supply current ISB1 ISB2 High level output voltage Low level output voltage VOH VOL /CS ≥ VCC − 0.2 V, MODE ≥ VCC − 0.2 V /CS ≥ VCC − 0.2 V, MODE ≤ 0.2 V IOH = –0.5 mA IOL = 1 mA 0.8VCC 0.2VCC 100 10 V V 35 mA –1.0 –1.0 µPD4616112-BCxx TYP. MAX. +1.0 +1.0 Unit µA µA µA Remarks 1. VIN: Input voltage VI/O: Input / Output voltage 2. These DC characteristics are in common regardless of product classifications. Data Sheet M15085EJ5V0DS 7 µPD4616112 5 Standby Mode State Machine Power on /CS = VIH, MODE = VIH Wait 200 µ s Dummy read operation (3 times) Initial State /CS = VIL /CS = VIH, MODE = VIH Active MODE = VIH /CS = VIH, MODE = VIH /CS = VIH, MODE = VIL /CS = VIL, MODE = VIH Standby Mode1 /CS = VIH, MODE = VIL Standby Mode2 Standby Mode Characteristics Standby Mode Mode 1 Mode 2 Memory Cell Data Hold Valid Invalid Standby Supply Current (µA) 100 (ISB1) 10 (ISB2) 8 Data Sheet M15085EJ5V0DS µPD4616112 AC Characteristics (Recommended Operating Conditions Unless Otherwise Noted) AC Test Conditions 5 [ µPD4616112-BC80, µPD4616112-BC90 ] Input Waveform (Rise and Fall Time ≤ 5 ns) Vcc 0.8 Vcc Vcc/2 0.2 Vcc GND 5ns Test points Vcc/2 Output Waveform Vcc/2 Test points Vcc/2 Output Load AC characteristics directed with the note should be measured with the output load shown in Figure 1. Figure 1 CL: 50 pF 5 pF (tCLZ, tOLZ, tBLZ, tCHZ, tOHZ, tBHZ, tWHZ, tOW) ZO = 50 Ω I/O (Output) 50 Ω CL VCC/2 Data Sheet M15085EJ5V0DS 9 µPD4616112 5 Read Cycle (BC version) Parameter Symbol µPD4616112-BC80 MIN. MAX. 10,000 10,000 10 10 80 80 35 35 10 10 5 5 25 25 25 µPD4616112-BC90 MIN. 90 90 MAX. 10,000 10,000 20 10 90 90 40 40 10 10 5 5 25 25 25 Unit Notes Read cycle time Identical address read cycle time Address skew time /CS pulse width Address access time /CS access time /OE to output valid /LB, /UB to output valid Output hold from address change /CS to output in low impedance /OE to output in low impedance /LB, /UB to output in low impedance /CS to output in high impedance /OE to output in high impedance /LB, /UB to output in high impedance tRC tRC1 tSKEW tCP tAA tACS tOE tBA tOH tCLZ tOLZ tBLZ tCHZ tOHZ tBHZ 80 80 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 1 2 3 4 5 Notes 1. One read cycle (tRC) must satisfy the minimum value (tRC(MIN.)) and maximum value (tRC(MAX.) = 10 µs). tRC 5 indicates the time from the /CS low level input point or address change start point, whichever is later, to the /CS high level input point or the next address change start point, whichever is earlier. As a result, there are the following four conditions for tRC. 1) Time from address change start point to /CS high level input point 2) Time from address change start point to next address change start point 3) Time from /CS low level input point to next address change start point 4) Time from /CS low level input point to /CS high level input point (address access) (address access) (/CS access) (/CS access) 5 5 2. The identical address read cycle time (tRC1) is the cycle time of one read operation when performing continuous read operations toggling /OE , /LB, and /UB with the address fixed and /CS low level. Perform settings so that the sum (tRC) of the identical address read cycle times (tRC1) is 10 µs or less. 3. tSKEW indicates the following three types of time depending on the condition. 1) When switching /CS from high level to low level, tSKEW is the time from the /CS low level input point until the next address is determined. 2) When switching /CS from low level to high level, tSKEW is the time from the address change start point to the /CS high level input point. 3) When /CS is fixed to low level, tSKEW is the time from the address change start point until the next address is determined. Since specs are defined for tSKEW only when /CS is active, tSKEW is not subject to limitations when /CS is switched from high level to low level following address determination, or when the address is changed after /CS is switched from low level to high level. 4. Regarding tAA and tACS, only tAA is satisfied during address access (refer to 1) and 2) of Note 1), and only tACS is satisfied during /CS access (refer to 3) of Note 1). 5. Regarding tBA and tOE, only tBA is satisfied if /OE becomes active later than /UB and /LB, and only tOE is satisfied if /UB and /LB become active before /OE. 10 Data Sheet M15085EJ5V0DS µPD4616112 5 Read Cycle Timing Chart 1 tSKEW tSKEW Address (Input) tCP tRC tCP /CS (Input) tACS tCLZ /OE (Input) tOE tOLZ /LB, /UB (Input) tBA tBLZ High impedance I/O (Output) tBHZ tOH tOHZ tCHZ Data out tRC tSKEW tSKEW Address (Input) tCP tCP tACS /CS (Input) tCLZ tCHZ /OE (Input) tOE tOLZ /LB, /UB (Input) tBA tBLZ High impedance I/O (Output) tBHZ tOHZ Data out Caution If the address is changed using a value that is either lower than the minimum value or higher than the maximum value for the read cycle time (tRC), none of the data can be guaranteed. Remark In read cycle, /WE should be fixed to High. Data Sheet M15085EJ5V0DS 11 12 5 Data Sheet M15085EJ5V0DS Read Cycle Timing Chart 2 tRC tSKEW tSKEW tRC tSKEW tSKEW Address (Input) tCP tACS /CS (Input) tCLZ tCHZ tACS tCLZ tOE tOLZ /LB, /UB (Input) tBA tBLZ High impedance I/O (Output) tOH tOH tBLZ tBHZ tBA tOH tBLZ tBHZ tBA tBHZ tOHZ tCHZ tACS tCLZ tCHZ tAA tAA tRC tRC tCP tRC /OE (Input) Data out Data out Data out Data out Data out Caution If the address is changed using a value that is either lower than the minimum value or higher than the maximum value for the read cycle µ µ µPD4616112 µ time (tRC), none of the data can be guaranteed. Remark In read cycle, /WE should be fixed to High. 5 Data Sheet M15085EJ5V0DS Read Cycle Timing Chart 3 tRC tSKEW tSKEW tRC tSKEW tRC tSKEW tRC tSKEW tRC Address (Input) tACS /CS (Input) tCLZ tOE tOHZ tOLZ /LB (Input) tBA tBHZ tBLZ I/O0~7 (Output) Hi-Z tOH tAA tAA /OE (Input) tOE tOHZ tOLZ tBA tBHZ tBLZ tOH tOLZ tOE tOHZ Data out Data out /UB (Input) tBA tBHZ tOH tBLZ tBA tBHZ tOH tBLZ I/O8~15 (Output) High impedance Data out Data out µ µ µPD4616112 µ Caution If the address is changed using a value that is either lower than the minimum value or higher than the maximum value for the read cycle time (tRC), none of the data can be guaranteed. Remark In read cycle, /WE should be fixed to High. 13 µPD4616112 5 Read Cycle Timing Chart 4 tRC tSKEW tSKEW Address (Input) tRC1 tACS /CS (Input) tOE /OE (Input) tOLZ tOHZ tOE tOLZ tOHZ Note tRC1 Note tBA tBLZ /LB, /UB (Input) tBA tBLZ tBHZ tBHZ I/O (Output) High impedance Data out Data out High impedance Caution If the address is changed using a value that is either lower than the minimum value or higher than the maximum value for the read cycle time (tRC), none of the data can be guaranteed. Note To perform a continuous read toggling /OE, /UB, and /LB with /CS low level at an identical address, make settings so that the sum (tRC) of the identical address read cycle times (tRC1) is 10 µs or less. Remark In read cycle, /WE should be fixed to High. 14 Data Sheet M15085EJ5V0DS µPD4616112 5 Write Cycle (BC version) Parameter Symbol µPD4616112-BC80 MIN. MAX. 10,000 10,000 10 40 30 35 30 20 10 0 20 20 0 5 25 25 5 µPD4616112-BC90 MIN. 90 90 MAX. 10,000 10,000 20 50 35 45 35 20 10 0 20 25 0 5 25 25 5 Unit Notes Write cycle time Identical address write cycle time Address skew time /CS to end of write /LB, /UB to end of write Address valid to end of write Write pulse width Write recovery time /CS pulse width Address setup time Byte write hold time Data valid to end of write Data hold time /OE to output in low impedance /WE to output in high impedance /OE to output in high impedance Output active from end of write tWC tWC1 tSKEW tCW tBW tAW tWP tWR tCP tAS tBWH tDW tDH tOLZ tWHZ tOHZ tOW 80 80 ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns 1 2 3 4 5 Notes 1. One write cycle (tWC) must satisfy the minimum value (tWC(MIN.)) and the maximum value (tWC(MAX.) = 10 µs). 5 tWC indicates the time from the /CS low level input point or address change start point, whichever is after, to the /CS high level input point or the next address change start point, whichever is earlier. As a result, there are the following four conditions for tWC. 5 5 1) Time from address change start point to /CS high level input point 2) Time from address change start point to next address change start point 3) Time from /CS low level input point to next address change start point 4) Time from /CS low level input point to /CS high level input point 2. The identical address read cycle time (tWC1) is the cycle time of one write cycle when performing continuous write operations with the address fixed and /CS low level, changing /LB and /UB at the same time, and toggling /WE, as well as when performing a continuous write toggling /LB and /UB. Make settings so that the sum (tWC) of the identical address write cycle times (tWC1) is 10 µs or less. 3. tSKEW indicates the following three types of time depending on the condition. 1) When switching /CS from high level to low level, tSKEW is the time from the /CS low level input point until the next address is determined. 2) When switching /CS from low level to high level, tSKEW is the time from the address change start point to the /CS high level input point. 3) When /CS is fixed to low level, tSKEW is the time from the address change start point until the next address is determined. Since specs are defined for tSKEW only when /CS is active, tSKEW is not subject to limitations when /CS is switched from high level to low level following address determination, or when the address is changed after /CS is switched from low level to high level. Data Sheet M15085EJ5V0DS 15 µPD4616112 4. Definition of write start and write end /CS Write start pattern 1 H to L /WE L /LB, /UB L Status If /WE, /LB, /UB are low level, time when /CS changes from high level to low level Write start pattern 2 L H to L L If /CS, /LB, /UB are low level, time when /WE changes from high level to low level Write start pattern 3 L L H to L If /CS, /WE are low level, time when /LB or /UB changes from high level to low level Write end pattern 1 L L to H L If /CS, /WE, /LB, /UB are low level, time when /WE changes from low level to high level Write end pattern 2 L L L to H When /CS, /WE, /LB, /UB are low level, time when /LB or /UB changes from low level to high level 5. Definition of write end recovery time (tWR) 1) Time from write end to address change start point, or from write end to /CS high level input point 2) When /CS, /LB, /UB are low level and continuously written to the identical address, time from /WE high level input point to /WE low level input point 3) When /CS, /WE are low level and continuously written to the identical address, time from /LB or /UB high level input point, whichever is later, to /LB or /UB low level input point, whichever is earlier. 4) When /CS is low level and continuously written to the identical address, time from write end to point at which /WE , /LB, or /UB starts to change from high level to low level, whichever is earliest. 16 Data Sheet M15085EJ5V0DS µPD4616112 5 Write Cycle Timing Chart 1 tWC tSKEW tSKEW tWC Address (Input) tCW /CS (Input) tCP tCW tWP /WE (Input) tAS /LB, /UB (Input) tBW tWR tAS tWP tWR tBW tDW I/O (Input) High impedance tDH High impedance tDW tDH Data in Data in tSKEW tWC tSKEW tWC tSKEW Address (Input) tCW /CS (Input) tCP tCW tWP /WE (Input) tBW /LB, /UB (Input) tWR tWP tWR tBW tDW I/O (Input) High impedance tDH High impedance tDW tDH Data in Data in Cautions 1. During address transition, at least one of pins /CS, /WE should be inactivated. 2. Do not input data to the I/O pins while they are in the output state. 3. If the address is changed using a value that is either lower than the minimum value or higher than the maximum value for the write cycle time (tWC), none of the data can be guaranteed. Remark Write operation is done during the overlap time of a Low /CS, /WE, /LB and/or /UB. Data Sheet M15085EJ5V0DS 17 µPD4616112 5 Write Cycle Timing Chart 2 (/WE Controlled) tWC tSKEW tSKEW tWC tSKEW tWC tSKEW tSKEW Address (Input) tCW /CS (Input) tAS /WE (Input) tWP tAS tAW tWR tOW tAW tAW tCP tAS tWP tWHZ tWR tWP tWR /OE (Input) tDW I/O (Input / Output) High impedance tDH tOLZ tOHZ Indefinite data out High impedance tDW tDH tDW tDH Data in Data in High impedance High impedance Data in High impedance tWC tSKEW tSKEW Address (Input) Note Note tWC1 /CS (Input) tAS /WE (Input) tBW /LB, /UB (Input) tWP tWC1 tWR tWP tWR tDW I/O (Input) High impedance tDH tDW tDH Data in High impedance Data in High impedance Cautions 1. During address transition, at least one of pins /CS, /WE should be inactivated. 2. Do not input data to the I/O pins while they are in the output state. 3. If the address is changed using a value that is either lower than the minimum value or higher than the maximum value for the write cycle time (tWC), none of the data can be guaranteed. Note If /LB and /UB are changed at the same time with /CS low level and a continuous write operation toggling /WE is performed, make settings so that the sum (tWC) of the identical address write cycle time (tWC1) is 10 µs or less. Remarks 1. Write operation is done during the overlap time of a Low /CS, /WE, /LB and/or /UB. 2. When /WE is at Low, the I/O pins are always high impedance. When /WE is at High, read operation is executed. Therefore /OE should be at High to make the I/O pins high impedance. 18 Data Sheet M15085EJ5V0DS µPD4616112 5 Write Cycle Timing Chart 3 (/CS Controlled) Address (Input) tWC /CS (Input) tAS tCW tWR tAS tWC tCW tWR /WE (Input) /LB, /UB (Input) tDW I/O (Input) tDH tDW tDH High impedance Data in High impedance Data in High impedance Address (Input) tWC /CS (Input) tAS tCW tWR tAS tWC tCW tWR /WE (Input) /LB, /UB (Input) tDW I/O (Input) tDH tDW tDH Data in High impedance High impedance Data in High impedance Cautions 1. During address transition, at least one of pins /CS, /WE should be inactivated. 2. Do not input data to the I/O pins while they are in the output state. 3. If the address is changed using a value that is either lower than the minimum value or higher than the maximum value for the write cycle time (tWC), none of the data can be guaranteed. Remark Write operation is done during the overlap time of a Low /CS, /WE, /LB and/or /UB. Data Sheet M15085EJ5V0DS 19 µPD4616112 5 Write Cycle Timing Chart 4 (/LB, /UB Controlled 1) tWC tSKEW Address (Input) tSKEW tWC tCW /CS (Input) tAW tWP /WE (Input) tAS /LB, /UB (Input) tBW tWR tAS tBW tWR tDW I/O (Input) High impedance Data in tDH High impedance tDW Data in tDH tWC tWC Address (Input) tSKEW tSKEW tCW /CS (Input) tAW tWP /WE (Input) tAS /LB, /UB (Input) tBW tWR tAS tBW tWR tDW I/O (Input) High impedance Data in tDH High impedance tDW Data in tDH Cautions 1. During address transition, at least one of pins /CS, /WE should be inactivated. 2. Do not input data to the I/O pins while they are in the output state. 3. If the address is changed using a value that is either lower than the minimum value or higher than the maximum value for the write cycle time (tWC), none of the data can be guaranteed. Remark Write operation is done during the overlap time of a Low /CS, /WE, /LB and/or /UB. 20 Data Sheet M15085EJ5V0DS µPD4616112 5 Write Cycle Timing Chart 5 (/LB, /UB Controlled 2) tWC tSKEW tSKEW Address (Input) tWC1 Note /CS (Input) tWC1 Note tWP /WE (Input) tAS /LB, /UB (Input) tBW tWR tBW tWR tDW I/O (Input) High impedance tDH tDW tDH Data in High impedance Data in High impedance Cautions 1. During address transition, at least one of pins /CS, /WE should be inactivated. 2. Do not input data to the I/O pins while they are in the output state. 3. If the address is changed using a value that is either lower than the minimum value or higher than the maximum value for the write cycle time (tWC), none of the data can be guaranteed. Note If /LB and /UB are changed at the same time with /CS low level and a continuous write operation toggling /WE is performed, make settings so that the sum (tWC) of the identical address write cycle time (tWC1) is 10 µs or less. Remark Write operation is done during the overlap time of a Low /CS, /WE, /LB and/or /UB. Data Sheet M15085EJ5V0DS 21 µPD4616112 5 Write Cycle Timing Chart 6 (/LB, /UB Independent Controlled 1) tWC Address (Input) tWC1 Note /CS (Input) tCW tWP /WE (Input) tWC1 Note /LB (Input) tAS tBW /UB (Input) tDW Data in High impedance tDW I/O8 - 15 (Input) High impedance tDH tDH tWR tBW tWR I/O0 - 7 (Input) Data in High impedance High impedance Cautions 1. During address transition, at least one of pins /CS, /WE should be inactivated. 2. Do not input data to the I/O pins while they are in the output state. 3. If the address is changed using a value that is either lower than the minimum value or higher than the maximum value for the write cycle time (tWC), none of the data can be guaranteed. Note If /LB and /UB are changed at the same time with /CS low level and a continuous write operation toggling /WE is performed, make settings so that the sum (tWC) of the identical address write cycle time (tWC1) is 10 µs or less. Remark Write operation is done during the overlap time of a Low /CS, /WE, /LB and/or /UB. 22 Data Sheet M15085EJ5V0DS µPD4616112 5 Write Cycle Timing Chart 7 (/LB, /UB Independent Controlled 2) Address (Input) tWC /CS (Input) tCW tCW tWP tWP /WE (Input) tBW /LB (Input) tAS tBWH tBW /UB (Input) tAS tDW Data in High impedance tDW I/O8 - 15 (Input) High impedance tDH tDH tWR tWR I/O0 - 7 (Input) Data in High impedance High impedance Cautions 1. During address transition, at least one of pins /CS, /WE should be inactivated. 2. Do not input data to the I/O pins while they are in the output state. 3. If the address is changed using a value that is either lower than the minimum value or higher than the maximum value for the write cycle time (tWC), none of the data can be guaranteed. Remark Write operation is done during the overlap time of a Low /CS, /WE, /LB and/or /UB. Data Sheet M15085EJ5V0DS 23 µPD4616112 Read Write Cycle (BC version) Parameter Read write cycle time Byte write setup time Byte read setup time Symbol MIN. MAX. 10,000 Unit ns ns ns Notes 1, 2 tRWC tBWS tBRS 20 20 Notes 1. Make settings so that the sum (tRWC) of the identical address read cycle time (tRC1) and the identical address write cycle time (tWC1) is 10 µs or less when a write is performed at the identical address using /UB following a read using /LB with /CS low level, or when a write is performed using /LB following a read using /UB. 2. Make settings so that the sum (tRWC) of the identical address read cycle time (tRC1) and the identical address write cycle time (tWC1) is 10 µs or less when a read is performed at the identical address using /UB following a write using /LB with /CS low level, or when a read is performed using /LB following a write using /UB. 24 Data Sheet M15085EJ5V0DS µPD4616112 5 Read Write Cycle Timing Chart 1 (/LB, /UB Independent Controlled 1) tRWC Address (Input) tRC1 Note tAA /CS (Input) tACS tWP /WE (Input) tBWS tWC1 Note /LB (Input) tBW /UB (Input) tWR tCLZ tBLZ tBHZ Data out High impedance tDW High impedance tDH I/O0 - 7 (Output) I/O8 - 15 (Input) Data in High impedance High impedance Cautions 1. During address transition, at least one of pins /CS, /WE should be inactivated. 2. Do not input data to the I/O pins while they are in the output state. 3. If the address is changed using a value that is either lower than the minimum value or higher than the maximum value for the identical address read cycle time (tRC1) and the identical address write cycle time (tWC1), none of the data can be guaranteed. Note Make settings so that the sum (tRWC) of the identical address read cycle time (tRC1) and the identical address write cycle time (tWC1) is 10 µs or less when a write is performed at the identical address using /UB following a read using /LB with /CS low level, or when a write is performed using /LB following a read using /UB. Remark Write operation is done during the overlap time of a Low /CS, /WE, /LB and/or /UB. Data Sheet M15085EJ5V0DS 25 µPD4616112 5 Read Write Cycle Timing Chart 2 (/LB, /UB Independent Controlled 2) tRWC Address (Input) tWC1 Note tCW /CS (Input) tWR tWP /WE (Input) tRC1 Note tBW /LB (Input) tAS tBRS /UB (Input) tDW Data in High impedance tBLZ tBA High impedance tBHZ tDH I/O0 - 7 (Input) I/O8 - 15 (Output) Data out High impedance High impedance Cautions 1. During address transition, at least one of pins /CS, /WE should be inactivated. 2. Do not input data to the I/O pins while they are in the output state. 3. If the address is changed using a value that is either lower than the minimum value or higher than the maximum value for the identical address read cycle time (tRC1) and the identical address write cycle time (tWC1), none of the data can be guaranteed. Note Make settings so that the sum (tRWC) of the identical address read cycle time (tRC1) and the identical address write cycle time (tWC1) is 10 µs or less when a write is performed at the identical address using /UB following a read using /LB with /CS low level, or when a write is performed using /LB following a read using /UB. Remark Write operation is done during the overlap time of a Low /CS, /WE, /LB and/or /UB. 26 Data Sheet M15085EJ5V0DS µPD4616112 5 Read Write Cycle Timing Chart 3 (/LB, /UB Independent Controlled 3) tRWC Address (Input) tWC1Note tCW /CS (Input) tWP /WE (Input) tAS tBW /LB (Input) tWR tRC1 Note /UB (Input) tDW Data in High impedance tBLZ tBA High impedance tBHZ tDH I/O0 - 7 (Input) I/O8 - 15 (Output) Data out High impedance High impedance Cautions 1. During address transition, at least one of pins /CS, /WE should be inactivated. 2. Do not input data to the I/O pins while they are in the output state. 3. If the address is changed using a value that is either lower than the minimum value or higher than the maximum value for the identical address read cycle time (tRC1) and the identical address write cycle time (tWC1), none of the data can be guaranteed. Note Make settings so that the sum (tRWC) of the identical address read cycle time (tRC1) and the identical address write cycle time (tWC1) is 10 µs or less when a write is performed at the identical address using /UB following a read using /LB with /CS low level, or when a write is performed using /LB following a read using /UB. Remark Write operation is done during the overlap time of a Low /CS, /WE, /LB and/or /UB. Data Sheet M15085EJ5V0DS 27 µPD4616112 5 Standby Mode 2 entry and recovery Timing Chart Address (Input) MODE (Input) tRC /CS (Input) tCM tCP Standby Mode 2 (Data invalid) Wait Time 200 µs Read Operation 3 times Normal Operation Parameter /CS High to MODE Low Symbol tCM MIN. 0 MAX. Unit ns Note Cautions 1. Make MODE and /CS high level during the wait time. 2. Make MODE high level during the wait time and three read operations. 3. The read operation must satisfy the specs described on page 10 (Read Cycle (BC Version)). 4. The read operation address can be either VIH or VIL. 5. Perform reading by toggling /CS. 6. To prevent bus contention, it is recommended to set /OE to high level. 7. Do not input data to the I/O pins if /OE is low level during a read operation. 28 Data Sheet M15085EJ5V0DS µPD4616112 5 Package Drawing 48-PIN TAPE FBGA (8x6) ZE E w SB ZD B A D 6 5 4 3 2 1 HGFEDCBA INDEX MARK w SA INDEX MARK A y1 S A2 S y S e A1 M φb φx S AB ITEM D E w e A A1 A2 b x y y1 ZD ZE MILLIMETERS 6.0 ± 0.1 8.0 ± 0.1 0.2 0.75 0.94 ± 0.10 0.24 ± 0.05 0.70 0.40 ± 0.05 0.08 0.1 0.2 1.125 1.375 P48F9-75-BC2 Data Sheet M15085EJ5V0DS 29 µPD4616112 Recommended Soldering Conditions Please consult with our sales offices for soldering conditions of the µPD4616112. Type of Surface Mount Device µPD4616112F9-BCxx-BC2: 48-pin TAPE FBGA (8 x 6) 30 Data Sheet M15085EJ5V0DS µPD4616112 NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD o r GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. Data Sheet M15085EJ5V0DS 31 µPD4616112 • The information in this document is current as of October, 2001. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. • NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. • NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4