UPD5713TK-E2

DATA SHEET CMOS INTEGRATED CIRCUIT μPD5713TK WIDE BAND SPDT SWITCH DESCRIPTION The μPD5713TK is a CMOS MMIC for wide band SPDT (Single Pole Double Throw) switch which were developed for mobile communications, wireless communications and another general-purpose RF switching application. This device can operate frequency from 0.05 to 2.5 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin lead-less minimold (1511) package. And this package is able to high-density surface mounting. FEATURES • Supply voltage • Switch control voltage • Low insertion loss : VDD = 1.8 to 3.6 V (2.8 V TYP.) : Vcont (H) = 1.8 to 3.6 V (2.8 V TYP.) : Vcont (L) = −0.2 to +0.4 V (0 V TYP.) : Lins1 = 0.6 dB TYP. @ f = 0.05 to 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V : Lins2 = 0.8 dB TYP. @ f = 1.0 to 2.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V : Lins3 = 0.95 dB TYP. @ f = 2.0 to 2.5 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V • High isolation : ISL1 = 32.5 dB TYP. @ f = 0.05 to 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V : ISL2 = 25 dB TYP. @ f = 1.0 to 2.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V : ISL3 = 22.5 dB TYP. @ f = 2.0 to 2.5 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V • Handling power : Pin (1 dB) = +21.0 dBm TYP. @ f = 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V : Pin (0.1 dB) = +17.0 dBm TYP. @ f = 1.0 GHz, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V • High-density surface mounting : 6-pin lead-less minimold package (1.5 × 1.1 × 0.55 mm) APPLICATIONS • Mobile communications • Wireless communications • Another general-purpose RF switching applications ORDERING INFORMATION Part Number Order Number Package 6-pin lead-less minimold (1511) (Pb-Free) Marking C3Q Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 5 kpcs/reel μPD5713TK-E2 μPD5713TK-E2-A Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPD5713TK Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PU10627EJ01V0DS (1st edition) Date Published September 2006 NS CP(K) Printed in Japan 2006 μPD5713TK PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. 1 Pin Name OUTPUT1 GND OUTPUT2 Vcont INPUT VDD (Top View) 1 2 3 6 5 4 1 2 3 (Top View) 6 5 4 6 5 4 (Bottom View) 1 2 2 3 4 TRUTH TABLE Vcont Low High INPUT−OUTPUT1 OFF ON INPUT−OUTPUT2 ON OFF ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Supply Voltage Switch Control Voltage Voltage Difference Symbol VDD Vcont Vcont (H) − VDD Input Power Operating Ambient Temperature Storage Temperature Pin TA Tstg +23 −45 to +85 −55 to +150 dBm °C °C Ratings −0.5 to +4.6 −0.5 to +4.6 +0.5 Unit V V V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter Supply Voltage Switch Control Voltage (H) Switch Control Voltage (L) Symbol VDD Vcont (H) Vcont (L) MIN. +1.8 +1.8 −0.2 TYP. +2.8 +2.8 0 MAX. +3.6 +3.6 +0.4 Unit V V V Remark VDD − 0.4 V ≤ Vcont (H) ≤ VDD + 0.2 V C3Q 3 5 6 2 Data Sheet PU10627EJ01V0DS μPD5713TK ELECTRICAL CHARACTERISTICS (TA = +25°C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, DC cut capacitors = 1 000 pF, unless otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Insertion Loss 3 Isolation 1 Isolation 2 Isolation 3 Input Return Loss Output Return Loss 0.1 dB Loss Compression Input Power Note 1 Symbol Lins1 Lins2 Lins3 ISL1 ISL2 ISL3 RLin RLout Test Conditions f = 0.05 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 0.05 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 0.05 to 2.5 GHz f = 0.05 to 2.5 GHz MIN. − − − 30 22 20 13 13 +13.0 TYP. 0.6 0.8 0.95 32.5 25 22.5 17 17 +17.0 MAX. 0.8 1.0 1.2 − − − − − − Unit dB dB dB dB dB dB dB dB dBm Pin (0.1 dB) f = 1.0 GHz 1 dB Loss Compression Input Power Note 2 Pin (1 dB) f = 1.0 GHz − +21.0 − dBm Supply Current Switch Control Current Switch Control Speed IDD Icont tSW VDD = Vcont = 2.8 V, RF off VDD = Vcont = 2.8 V, RF off f = 1.0 GHz − − − 0.01 0.01 30 1.0 1.0 100 μA μA ns Notes 1. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. 2. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution This device is used it is necessary to use DC cut capacitors. The value of DC cut capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. Data Sheet PU10627EJ01V0DS 3 μPD5713TK EVALUATION CIRCUIT VDD INPUT Vcont C0 1 000 pF 6 5 4 1 000 pF 1 2 3 C0 C0 OUTPUT1 OUTPUT2 Remark C0 = 1 000 pF Caution This IC has pull down resistance between RF line and GND, witch fixes electric potential of RF line to 0 V, then the IC cannot be used for DC switching. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PU10627EJ01V0DS μPD5713TK ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vcont 6pinL2MM SPDT SW Vc2 OUTPUT2 OUT 2 C2 C 2 C 4 C1 INPUT C1 IN C 5 C3 C3Q C1 C 1 C2 OUT 1 OUTPUT1 Vc1 VDD USING THE NEC EVALUATION BOARD Symbol C1, C2, C3 C4, C5 Values 1 000 pF 1 000 pF Data Sheet PU10627EJ01V0DS 5 μPD5713TK TYPICAL CHARACTERISTICS (TA = +25°C, VDD = 2.8 V, Vcont (H) = 2.8 V, Vcont (L) = 0 V, Pin = 0 dBm, DC cut capacitors = 1 000 pF, unless otherwise specified) INPUT–OUTPUT1 INSERSION LOSS vs. FREQUENCY 2.5 2.0 Insersion Loss Lins (dB) INPUT–OUTPUT2 INSERSION LOSS vs. FREQUENCY 2.5 2.0 Insersion Loss Lins (dB) 1.5 1.0 0.5 0 –0.5 –1.0 –1.5 –2.0 –2.5 0 0.5 1.0 1.5 2.0 1 2 3 4 1: –0.584 dB 0.5 GHz 2: –0.659 dB 1.0 GHz 3: –0.730 dB 1.5 GHz 4: –0.811 dB 2.0 GHz 5: –0.924 dB 2.5 GHz 1.5 1.0 0.5 0 –0.5 –1.0 –1.5 –2.0 –2.5 1 2 3 4 1: –0.584 dB 0.5 GHz 2: –0.653 dB 1.0 GHz 3: –0.731 dB 1.5 GHz 4: –0.826 dB 2.0 GHz 5: –0.968 dB 2.5 GHz 5 5 2.5 3.0 0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (GHz) Frequency f (GHz) INPUT–OUTPUT1 ISOLATION vs. FREQUENCY 40 30 20 Isolation ISL (dB) INPUT–OUTPUT2 ISOLATION vs. FREQUENCY 40 30 20 Isolation ISL (dB) 10 0 –10 –20 –30 –40 –50 –60 0 1: –38.2 dB 0.5 GHz 2: –31.7 dB 1.0 GHz 3: –27.4 dB 1.5 GHz 4: –23.9 dB 2.0 GHz 5: –22.4 dB 2.5 GHz 10 0 –10 –20 –30 –40 –50 –60 1: –39.0 dB 0.5 GHz 2: –31.8 dB 1.0 GHz 3: –27.9 dB 1.5 GHz 4: –24.4 dB 2.0 GHz 5: –21.6 dB 2.5 GHz 1 2 3 4 5 1 2 3 4 5 0.5 1.0 1.5 2.0 2.5 3.0 0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (MHz) Frequency f (MHz) INPUT–OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY 40 30 Input Return Loss RLin (dB) INPUT–OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY 40 30 Input Return Loss RLin (dB) 20 10 0 –10 –20 –30 –40 –50 –60 0 1: –26.0 dB 0.5 GHz 2: –21.5 dB 1.0 GHz 3: –19.5 dB 1.5 GHz 4: –18.3 dB 2.0 GHz 5: –18.9 dB 2.5 GHz 20 10 0 –10 –20 –30 –40 –50 –60 1: –26.4 dB 0.5 GHz 2: –21.8 dB 1.0 GHz 3: –19.6 dB 1.5 GHz 4: –18.5 dB 2.0 GHz 5: –18.3 dB 2.5 GHz 1 2 3 4 5 1 2 3 4 5 0.5 1.0 1.5 2.0 2.5 3.0 0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (MHz) Frequency f (MHz) Remark The graphs indicate nominal characteristics. 6 Data Sheet PU10627EJ01V0DS μPD5713TK INPUT–OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY 40 30 20 10 0 –10 –20 –30 –40 –50 –60 0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (MHz) 1: –23.6 dB 0.5 GHz 2: –22.4 dB 1.0 GHz 3: –19.0 dB 1.5 GHz 4: –19.4 dB 2.0 GHz 5: –18.5 dB 2.5 GHz INPUT–OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY 40 30 20 10 0 –10 –20 –30 –40 –50 –60 0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (MHz) 1: –24.4 dB 0.5 GHz 2: –22.9 dB 1.0 GHz 3: –20.0 dB 1.5 GHz 4: –20.6 dB 2.0 GHz 5: –19.4 dB 2.5 GHz Output Return Loss RLout (dB) 1 2 3 4 5 Output Return Loss RLout (dB) 1 2 3 4 5 OUTPUT POWER vs. INPUT POWER +35 f = 1 GHz +30 +25 +20 +15 +10 +5 +5 Output Power Pout (dBm) +10 +15 +20 +25 +30 +35 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PU10627EJ01V0DS 7 μPD5713TK MOUNTING PAD DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) 0.26 0.45 0.48 0.48 Remark The mounting pad layouts in this document are for reference only. 8 Data Sheet PU10627EJ01V0DS 1.10 μPD5713TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) (Top View) (Bottom View) 0.48±0.05 0.48±0.05 1.5±0.1 1.1±0.1 1.3±0.05 0.2±0.1 0.16±0.05 0.9±0.1 0.55±0.03 0.11+0.1 –0.05 Data Sheet PU10627EJ01V0DS 9 μPD5713TK RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260 For soldering Preheating temperature (package surface temperature) : 120°C or below Caution Do not use different soldering methods together (except for partial heating). 10 Data Sheet PU10627EJ01V0DS μPD5713TK • T he information in this document is current as of September, 2006. 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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 Data Sheet PU10627EJ01V0DS 11 μPD5713TK For further information, please contact NEC Compound Semiconductor Devices Hong Kong Limited E-mail: contact@ncsd-hk.necel.com Hong Kong Head Office TEL: +852-3107-7303 FAX: +852-3107-7309 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Korea Branch Office TEL: +82-2-558-2120 FAX: +82-2-558-5209 NEC Electronics (Europe) GmbH http://www.eu.necel.com/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Compound Semiconductor Devices Division NEC Electronics Corporation URL: http://www.ncsd.necel.com/ 0604