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UPD780022AGB-XXX-8EU

UPD780022AGB-XXX-8EU

  • 厂商:

    NEC(日电电子)

  • 封装:

  • 描述:

    UPD780022AGB-XXX-8EU - 8-BIT SINGLE-CHIP MICROCONTROLLERS - NEC

  • 数据手册
  • 价格&库存
UPD780022AGB-XXX-8EU 数据手册
DATA SHEET µPD780021A, 780022A, 780023A, 780024A 780021AY, 780022AY, 780023AY, 780024AY 8-BIT SINGLE-CHIP MICROCONTROLLERS MOS INTEGRATED CIRCUIT DESCRIPTION The µPD780021A, 780022A, 780023A, and 780024A are members of the µPD780024A Subseries of the 78K/0 Series. Only selected functions of the existing µPD78054 Subseries are provided, and the serial interface is enhanced. The µPD780021AY, 780022AY, 780023AY, and 780024AY are the µPD780024A Subseries with a multimaster supporting I2C bus interface, which makes them suitable for AV equipment. Flash memory versions, the µPD78F0034A, 78F0034B, 78F0034AY, and 78F0034BY, that can operate in the same power supply voltage range as the mask ROM versions, and various development tools, are also available. Detailed function descriptions are provided in the following user’s manuals. Be sure to read them before designing. µPD780024A, 780034A, 780024AY, 780034AY Subseries User’s Manual: U14046E 78K/0 Series Instructions User’s Manual: U12326E FEATURES • Internal ROM and RAM Item Part Number Program Memory (Internal ROM) 8 KB 16 KB 24 KB 32 KB 1024 bytes Data Memory (Internal High-Speed RAM) 512 bytes Package • 64-pin plastic SDIP (19.05 mm (750)) • 64-pin plastic QFP (14 x 14) • 64-pin plastic LQFP (14 x 14) • 64-pin plastic TQFP (12 x 12) • 64-pin plastic LQFP (10 x 10) • 73-pin plastic FBGA (9 x 9) µPD780021A, 780021AY µPD780022A, 780022AY µPD780023A, 780023AY µPD780024A, 780024AY • External memory expansion space: 64 KB • Minimum instruction execution time • Expanded-specification products of µPD780021A, 780022A, 780023A, 780024A: 0.166 µs (fX = 12 MHz, VDD = 4.5 to 5.5 V) • µPD780021AY, 780022AY, 780023AY, 780024AY and conventional products of µPD780021A, 780022A, 780023A, 780024A: 0.238 µs (fX = 8.38 MHz, VDD = 4.0 to 5.5 V) • I/O ports: 51 (N-ch open-drain (5 V withstanding voltage): 4) • 8-bit resolution A/D converter: 8 channels (AVDD = 1.8 to 5.5 V) • Serial interface: 3 channels • µPD780021A, 780022A, 780023A, 780024A: UART mode, 3-wire serial I/O mode (2 channels) • µPD780021AY, 780022AY, 780023AY, 780024AY: UART mode, 3-wire serial I/O mode, I2C bus mode • Timer: 5 channels • Power supply voltage: VDD = 1.8 to 5.5 V The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. U14042EJ4V0DS00 (4th edition) Date Published December 2002 N CP(K) Printed in Japan The mark shows major revised points. © © 2000 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY APPLICATIONS Telephones, household electrical appliances, pagers, AV equipment, car audios, office automation equipment, etc. ORDERING INFORMATION (1/2) (1) µPD780024A Subseries Part Number Package 64-pin plastic SDIP (19.05 mm (750)) 64-pin plastic QFP (14 x 14) 64-pin plastic LQFP (14 x 14) 64-pin plastic TQFP (12 x 12) 64-pin plastic LQFP (10 x 10) 73-pin plastic FBGA (9 x 9) 64-pin plastic SDIP (19.05 mm (750)) 64-pin plastic QFP (14 x 14) 64-pin plastic LQFP (14 x 14) 64-pin plastic TQFP (12 x 12) 64-pin plastic LQFP (10 x 10) 73-pin plastic FBGA (9 x 9) 64-pin plastic SDIP (19.05 mm (750)) 64-pin plastic QFP (14 x 14) 64-pin plastic LQFP (14 x 14) 64-pin plastic TQFP (12 x 12) 64-pin plastic LQFP (10 x 10) 73-pin plastic FBGA (9 x 9) 64-pin plastic SDIP (19.05 mm (750)) 64-pin plastic QFP (14 x 14) 64-pin plastic LQFP (14 x 14) 64-pin plastic TQFP (12 x 12) 64-pin plastic LQFP (10 x 10) 73-pin plastic FBGA (9 x 9) µPD780021ACW-××× µPD780021AGC-×××-AB8 µPD780021AGC-×××-8BS µPD780021AGK-×××-9ET µPD780021AGB-×××-8EU µPD780021AF1-×××-CN3 µPD780022ACW-××× µPD780022AGC-×××-AB8 µPD780022AGC-×××-8BS µPD780022AGK-×××-9ET µPD780022AGB-×××-8EU µPD780022AF1-×××-CN3 µPD780023ACW-××× µPD780023AGC-×××-AB8 µPD780023AGC-×××-8BS µPD780023AGK-×××-9ET µPD780023AGB-×××-8EU µPD780023AF1-×××-CN3 µPD780024ACW-××× µPD780024AGC-×××-AB8 µPD780024AGC-×××-8BS µPD780024AGK-×××-9ET µPD780024AGB-×××-8EU µPD780024AF1-×××-CN3 Remark ××× indicates ROM code suffix. 2 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY ORDERING INFORMATION (2/2) (2) µPD780024AY Subseries Part Number Package 64-pin plastic SDIP (19.05 mm (750)) 64-pin plastic QFP (14 x 14) 64-pin plastic LQFP (14 x 14) 64-pin plastic TQFP (12 x 12) 64-pin plastic LQFP (10 x 10) 73-pin plastic FBGA (9 x 9) 64-pin plastic SDIP (19.05 mm (750)) 64-pin plastic QFP (14 x 14) 64-pin plastic LQFP (14 x 14) 64-pin plastic TQFP (12 x 12) 64-pin plastic LQFP (10 x 10) 73-pin plastic FBGA (9 x 9) 64-pin plastic SDIP (19.05 mm (750)) 64-pin plastic QFP (14 x 14) 64-pin plastic LQFP (14 x 14) 64-pin plastic TQFP (12 x 12) 64-pin plastic LQFP (10 x 10) 73-pin plastic FBGA (9 x 9) 64-pin plastic SDIP (19.05 mm (750)) 64-pin plastic QFP (14 x 14) 64-pin plastic LQFP (14 x 14) 64-pin plastic TQFP (12 x 12) 64-pin plastic LQFP (10 x 10) 73-pin plastic FBGA (9 x 9) µPD780021AYCW-××× µPD780021AYGC-×××-AB8 µPD780021AYGC-×××-8BS µPD780021AYGK-×××-9ET µPD780021AYGB-×××-8EU µPD780021AYF1-×××-CN3 µPD780022AYCW-××× µPD780022AYGC-×××-AB8 µPD780022AYGC-×××-8BS µPD780022AYGK-×××-9ET µPD780022AYGB-×××-8EU µPD780022AYF1-×××-CN3 µPD780023AYCW-××× µPD780023AYGC-×××-AB8 µPD780023AYGC-×××-8BS µPD780023AYGK-×××-9ET µPD780023AYGB-×××-8EU µPD780023AYF1-×××-CN3 µPD780024AYCW-××× µPD780024AYGC-×××-AB8 µPD780024AYGC-×××-8BS µPD780024AYGK-×××-9ET µPD780024AYGB-×××-8EU µPD780024AYF1-×××-CN3 Remark ××× indicates ROM code suffix. Data Sheet U14042EJ4V0DS 3 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY EXPANDED-SPECIFICATION PRODUCTS AND CONVENTIONAL PRODUCTS The expanded-specification product and conventional product refer to the following products. Expanded-specification product: µPD780021A, 780022A, 780023A, 780024A for which orders were received after December 1, 2001. (Products with a rankNote other than K, E, P, X) Conventional product: Products other than the above expanded specification products. (Products with rankNote K, E, P, X) µPD780021AY, 780022AY, 780023AY, 780024AY Note The rank is indicated by the 5th digit from the left in the lot number marked on the package. Lot number Year code Week code NEC Electronics control code Rank Expanded-specification products and conventional products differ in the power supply voltage range and operating frequency ratings. Power Supply Voltage (VDD) Guaranteed Operating Speed (Operating Frequency) Conventional Products 4.5 to 5.5 V 4.0 to 5.5 V 3.0 to 5.5 V 2.7 to 5.5 V 1.8 to 5.5 V 8.38 MHz (0.238 µs) 8.38 MHz (0.238 µs) 5 MHz (0.4 µs) 5 MHz (0.4 µs) 1.25 MHz (1.6 µs) Expanded-Specification Products 12 MHz (0.166 µs) 8.38 MHz (0.238 µs) 8.38 MHz (0.238 µs) 5 MHz (0.4 µs) 1.25 MHz (1.6 µs) Remark The parenthesized values indicates the minimum instruction execution time. CORRESPONDENCE BETWEEN MASK ROM PRODUCTS AND FLASH MEMORY PRODUCTS Mask ROM Products Expanded-specification products of µPD780021A, 780022A, 780023A, 780024A Conventional products of µPD780021A, 780022A, 780023A, 780024A Flash Memory Products µPD78F0034B µPD78F0034A µPD78F0034AY, 78F0034BY µPD780021AY, 780022AY, 780023AY, 780024AY Remark The µPD78F0034A and 78F0034B differ in the operating frequency ratings and communication mode of flash memory programming. The µPD78F0034AY and 78F0034BY only differ in the communication mode of flash memory programming. Refer to the data sheet of the products. 4 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 78K/0 SERIES LINEUP The products in the 78K/0 Series are listed below. The names enclosed in boxes are subseries names. Products in mass production Products under development Y subseries products are compatible with I2C bus. Control 100-pin 100-pin 100-pin 100-pin 80-pin 80-pin 80-pin 80-pin 64-pin 64-pin 64-pin 52-pin 52-pin 64-pin 64-pin 42/44-pin µ PD78075B µ PD78078 µ PD78070A µ PD780058 µ PD78058F µPD78054 µPD780065 µ PD780078 µ PD780034A µ PD780024A µ PD780034AS µ PD780024AS µPD78014H EMI-noise reduced version of the µPD78078 µPD78078Y µ PD78070AY µ PD780018AY µ PD780058Y µ PD78058FY µ PD78054Y µ PD78054 with timer and enhanced external interface ROMless version of the µ PD78078 µ PD78078Y with enhanced serial I/O and limited function µ PD78054 with enhanced serial I/O EMI-noise reduced version of the µ PD78054 µ PD78018F with UART and D/A converter, and enhanced I/O µ PD780024A with expanded RAM µ PD780034A with timer and enhanced serial I/O µ PD780078Y µ PD780034AY µ PD780024A with enhanced A/D converter µ PD780024AY µ PD78018F with enhanced serial I/O 52-pin version of the µ PD780034A 52-pin version of the µ PD780024A EMI-noise reduced version of the µ PD78018F µPD78018F µ PD78083 Inverter control µ PD78018FY Basic subseries for control On-chip UART, capable of operating at low voltage (1.8 V) 64-pin µPD780988 VFD drive On-chip inverter control circuit and UART. EMI-noise reduced. 100-pin 80-pin 80-pin 80-pin µ PD780208 µ PD780232 µPD78044H µPD78044F LCD drive µ PD78044F with enhanced I/O and VFD C/D. Display output total: 53 For panel control. On-chip VFD C/D. Display output total: 53 µ PD78044F with N-ch open-drain I/O. Display output total: 34 Basic subseries for driving VFD. Display output total: 34 78K/0 Series 100-pin 100-pin 120-pin 120-pin 120-pin 100-pin 100-pin 100-pin µ PD780354 µ PD780344 µ PD780338 µ PD780328 µPD780318 µ PD780308 µPD78064B µPD78064 µPD780354Y µ PD780344Y µ PD780344 with enhanced A/D converter µ PD780308 with enhanced display function and timer. µ PD780308 with enhanced display function and timer. µ PD780308 with enhanced display function and timer. µ PD780308 with enhanced display function and timer. Segment signal output: 40 pins max. Segment signal output: 40 pins max. Segment signal output: 32 pins max. Segment signal output: 24 pins max. µPD780308Y µ PD78064Y µ PD78064 with enhanced SIO, and expanded ROM and RAM EMI-noise reduced version of the µ PD78064 Basic subseries for driving LCDs, on-chip UART Bus interface supported 100-pin 80-pin 80-pin 80-pin 80-pin 64-pin µ PD780948 µ PD78098B µ PD780702Y µPD780703Y µ PD780833Y µPD780816 Meter control On-chip CAN controller µ PD78054 with IEBusTM controller On-chip IEBus controller On-chip CAN controller On-chip controller compliant with J1850 (Class 2) Specialized for CAN controller function 100-pin 80-pin 80-pin µPD780958 µPD780852 µPD780828B For industrial meter control On-chip automobile meter controller/driver For automobile meter driver. On-chip CAN controller Remark VFD (Vacuum Fluorescent Display) is referred to as FIPTM (Fluorescent Indicator Panel) in some documents, but the functions of the two are same. Data Sheet U14042EJ4V0DS 5 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY The major functional differences among the subseries are listed below. • Non-Y subseries Function Subseries Name Control ROM Timer 8-Bit 10-Bit 8-Bit Capacity (Bytes) 8-Bit 16-Bit Watch WDT A/D A/D D/A 1 ch 1 ch 1 ch 8 ch – Serial Interface I/O VDD External MIN. Value Expansion 1.8 V √ µPD78075B 32 K to 40 K 4 ch µPD78078 µPD78070A 48 K to 60 K – 2 ch 3 ch (UART: 1 ch) 88 61 3 ch (time-division UART: 1 ch) 3 ch (UART: 1 ch) 68 69 2.7 V 1.8 V 2.7 V 2.0 V µPD780058 24 K to 60 K 2 ch µPD78058F 48 K to 60 K µPD78054 16 K to 60 K – 2 ch 1 ch 8 ch – 4 ch 8 ch – 4 ch – – 8 ch µPD780065 40 K to 48 K µPD780078 48 K to 60 K µPD780034A 8 K to 32 K µPD780024A µPD780034AS µPD780024AS 4 ch (UART: 1 ch) 3 ch (UART: 2 ch) 3 ch (UART: 1 ch) 60 52 51 2.7 V 1.8 V 39 – µPD78014H µPD78018F 8 K to 60 K µPD78083 Inverter control VFD drive 8 K to 16 K – – – 1 ch 2 ch 53 √ 1 ch (UART: 1 ch) – 8 ch – 3 ch (UART: 2 ch) 33 47 4.0 V – √ – µPD780988 16 K to 60 K 3 ch Note µPD780208 32 K to 60 K 2 ch µPD780232 16 K to 24 K 3 ch µPD78044H 32 K to 48 K 2 ch µPD78044F 16 K to 40 K 1 ch – 1 ch 1 ch – 1 ch 1 ch 8 ch 4 ch 8 ch – – 2 ch 74 40 2.7 V 4.5 V 2.7 V 1 ch 2 ch 68 LCD drive µPD780354 24 K to 32 K 4 ch µPD780344 µPD780338 48 K to 60 K 3 ch µPD780328 µPD780318 µPD780308 48 K to 60 K 2 ch µPD78064B 32 K µPD78064 16 K to 32 K 2 ch 1 ch 1 ch 1 ch – 8 ch 8 ch – – 3 ch (UART: 1 ch) 66 1.8 V – 2 ch – 10 ch 1 ch 2 ch (UART: 1 ch) 54 62 70 1 ch 8 ch – – 3 ch (time-division UART: 1 ch) 2 ch (UART: 1 ch) 57 2.0 V Bus interface µPD780948 60 K µPD78098B 40 K to 60 K 2 ch 1 ch 2 ch 2 ch 1 ch 1 ch 8 ch – – 2 ch 3 ch (UART: 1 ch) 79 69 4.0 V 2.7 V 4.0 V 2.2 V √ – supported µPD780816 32 K to 60 K Meter control Dashboard control 12 ch – 1 ch – – – – 2 ch (UART: 1 ch) 2 ch (UART: 1 ch) 46 69 µPD780958 48 K to 60 K 4 ch µPD780852 32 K to 40 K 3 ch µPD780828B 32 K to 60 K – 1 ch 1 ch 1 ch 5 ch – – 3 ch (UART: 1 ch) 56 59 4.0 V – Note 16-bit timer: 2 channels 10-bit timer: 1 channel 6 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY • Y subseries Function Subseries Name Control ROM Capacity (Bytes) Timer 8-Bit 10-Bit 8-Bit A/D – D/A 2 ch 3 ch (UART: 1 ch, I2C: 1 ch) 88 61 – 3 ch (I C: 1 ch) 2 2 Serial Interface I/O 8-Bit 16-Bit Watch WDT A/D 1 ch 1 ch 1 ch 8 ch VDD External MIN. Value Expansion 1.8 V 2.7 V √ µPD78078Y 48 K to 60 K 4 ch µPD78070AY – µPD780018AY 48 K to 60 K 88 68 69 1.8 V 2.7 V 2.0 V µPD780058Y 24 K to 60 K 2 ch µPD78058FY 48 K to 60 K 2 ch 3 ch (time-division UART: 1 ch, I C: 1 ch) 3 ch (UART: 1 ch, I C: 1 ch) 2 µPD78054Y 16 K to 60 K µPD780078Y 48 K to 60 K µPD780034AY 8 K to 32 K µPD780024AY 2 ch 1 ch 8 ch – 2 ch (I2C: 1 ch) 1 ch 1 ch 1 ch – 8 ch 8 ch – – 4 ch (UART: 1 ch, I2C: 1 ch) 3 ch (time-division UART: 1 ch, I2C: 1 ch) 2 ch (UART: 1 ch, I C: 1 ch) 3 ch 2 ch 1 ch 1 ch 16 ch – – 4 ch (UART: 1 ch, I2C: 1 ch) 67 2 – 8 ch – 4 ch (UART: 2 ch, I C: 1 ch) 2 2 52 1.8 V 3 ch (UART: 1 ch, I C: 1 ch) 51 µPD78018FY 8 K to 60 K LCD drive 53 66 1.8 V – µPD780354Y 24 K to 32 K 4 ch µPD780344Y µPD780308Y 48 K to 60 K 2 ch 57 2.0 V µPD78064Y 16 K to 32 K Bus µPD780701Y 60 K interface µPD780703Y supported µPD780833Y 3.5 V – 65 4.5 V Remark The functions of non-Y subseries and Y subseries products are the same, except for the serial interface. Data Sheet U14042EJ4V0DS 7 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY OVERVIEW OF FUNCTIONS (1/2) Part Number Item Internal memory Memory space General-purpose registers Minimum instruction execution time ROM High-speed RAM µPD780021A µPD780021AY 8 KB 512 bytes 64 KB µPD780022A µPD780022AY 16 KB µPD780023A µPD780023AY 24 KB 1024 bytes µPD780024A µPD780024AY 32 KB 8 bits × 32 registers (8 bits × 8 registers × 4 banks) On-chip minimum instruction execution time cycle variable function When main system • Expanded-specification products of µPD780021A, 780022A, 780023A, 780024A: clock selected 0.166 µs/0.333 µs/0.666 µs/1.33 µs/2.66 µs (@12 MHz, VDD = 4.5 to 5.5 V operation) • µPD780021AY, 780022AY, 780023AY, 780024AY and conventional products of µPD780021A, 780022A, 780023A, 780024A: 0.238 µs/0.48 µs/0.95 µs/1.91 µs/3.81 µs (@8.38 MHz, VDD = 4.0 to 5.5 V operation) When subsystem clock selected 122 µs (@ 32.768 kHz operation) • 16-bit operation • Multiply/divide (8 bits × 8 bits,16 bits ÷ 8 bits) • Bit manipulation (set, reset, test, Boolean operation) • BCD adjust, etc. Instruction set I/O ports Total: 51 • CMOS input: 8 • CMOS I/O: 39 • N-ch open-drain I/O (5 V withstanding voltage): 4 A/D converter • 8-bit resolution × 8 channels • Low-voltage operation available: AVDD = 1.8 to 5.5 V Serial interface • µPD780021A, 780022A, 780023A, 780024A UART mode: 1 channel 3-wire serial I/O mode: 2 channels • µPD780021AY, 780022AY, 780023AY, 780024AY UART mode: 1 channel 3-wire serial I/O mode: 1 channel I2C bus mode (multimaster supporting): 1 channel • • • • 16-bit timer/event counter: 8-bit timer/event counter: Watch timer: Watchdog timer: 1 2 1 1 channel channels channel channel Timers Timer outputs 3 (8-bit PWM output capable: 2) 8 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY OVERVIEW OF FUNCTIONS (2/2) Part Number Item Clock output µPD780021A µPD780021AY µPD780022A µPD780022AY µPD780023A µPD780023AY µPD780024A µPD780024AY • Expanded-specification products of µPD780021A, 780022A, 780023A, 780024A: 93.75 kHz, 187.5 kHz, 375 kHz, 750 kHz, 1.25 MHz, 3 MHz, 6 MHz, 12 MHz (@12MHz operation with main system clock) 32.768 kHz (@ 32.768 kHz operation with subsystem clock) • µPD780021AY, 780022AY, 780023AY, 780024AY and conventional products of µPD780021A, 780022A, 780023A, 780024A: 65.5 kHz, 131 kHz, 262 kHz, 524 kHz, 1.05 MHz, 2.10 MHz, 4.19 MHz, 8.38 MHz (@ 8.38 MHz operation with main system clock) 32.768 kHz (@ 32.768 kHz operation with subsystem clock) • Expanded-specification products of µPD780021A, 780022A, 780023A, 780024A: 1.46 kHz, 2.93 kHz, 5.86 kHz, 11.7 kHz (@ 12 MHz operation with main system clock) • µPD780021AY, 780022AY, 780023AY, 780024AY and conventional products of µPD780021A, 780022A, 780023A, 780024A: 1.02 kHz, 2.05 kHz, 4.10 kHz, 8.19 kHz (@ 8.38 MHz operation with main system clock) Maskable Non-maskable Software Internal: 13, external: 5 Internal: 1 1 VDD = 1.8 to 5.5 V TA = –40 to +85°C • 64-pin plastic SDIP (19.05 mm (750)) • 64-pin plastic QFP (14 x 14) • 64-pin plastic LQFP (14 x 14) • 64-pin plastic TQFP (12 x 12) • 64-pin plastic LQFP (10 x 10) • 73-pin plastic FBGA (9 x 9) Buzzer output Vectored interrupt sources Power supply voltage Operating ambient temperature Package Data Sheet U14042EJ4V0DS 9 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY CONTENTS 1. PIN CONFIGURATION (TOP VIEW) ................................................................................................. 11 2. BLOCK DIAGRAM .............................................................................................................................15 3. PIN FUNCTIONS ................................................................................................................................16 3.1 3.2 3.3 Port Pins .................................................................................................................................................... 16 Non-Port Pins ............................................................................................................................................ 17 Pin I/O Circuits and Recommended Connection of Unused Pins ..................................................... 19 4. MEMORY SPACE ...............................................................................................................................21 5. PERIPHERAL HARDWARE FUNCTION FEATURES...................................................................... 22 5.1 5.2 5.3 5.4 5.5 5.6 Ports ........................................................................................................................................................... 22 Clock Generator ........................................................................................................................................ 23 Timer/Counter ........................................................................................................................................... 24 Clock Output/Buzzer Output Controller ................................................................................................ 28 A/D Converter ........................................................................................................................................... 29 Serial Interface .......................................................................................................................................... 30 6. INTERRUPT FUNCTIONS .................................................................................................................33 7. EXTERNAL DEVICE EXPANSION FUNCTION ...............................................................................36 8. STANDBY FUNCTION .......................................................................................................................36 9. RESET FUNCTION ............................................................................................................................36 10. MASK OPTION ...................................................................................................................................36 11. INSTRUCTION SET ...........................................................................................................................37 12. ELECTRICAL SPECIFICATIONS ......................................................................................................39 12.1 Expanded-Specification Products of µPD780021A, 780022A, 780023A, 780024A .......................... 39 12.2 µPD780021AY, 780022AY, 780023AY, 780024AY, and Conventional Products of µPD780021A, 780022A, 780023A, 780024A .................................................................................................................................... 55 12.3 Timing Chart .............................................................................................................................................. 71 13. PACKAGE DRAWINGS .....................................................................................................................77 14. RECOMMENDED SOLDERING CONDITIONS ................................................................................83 APPENDIX A. DEVELOPMENT TOOLS ................................................................................................87 APPENDIX B. RELATED DOCUMENTS ...............................................................................................91 10 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 1. PIN CONFIGURATION (TOP VIEW) • 64-pin plastic SDIP (19.05 mm (750)) P40/AD0 P41/AD1 P42/AD2 P43/AD3 P44/AD4 P45/AD5 P46/AD6 P47/AD7 P50/A8 P51/A9 P52/A10 P53/A11 P54/A12 P55/A13 P56/A14 P57/A15 VSS0 VDD0 P30 P31 P32/SDA0Note 1 P33/SCL0Note 1 P34/SI31Note 2 P35/SO31Note 2 P36/SCK31Note 2 P20/SI30 P21/SO30 P22/SCK30 P23/RxD0 P24/TxD0 P25/ASCK0 VDD1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 P67/ASTB P66/WAIT P65/WR P64/RD P75/BUZ P74/PCL P73/TI51/TO51 P72/TI50/TO50 P71/TI01 P70/TI00/TO0 P03/INTP3/ADTRG P02/INTP2 P01/INTP1 P00/INTP0 VSS1 X1 X2 IC XT1 XT2 RESET AVDD AVREF P10/ANI0 P11/ANI1 P12/ANI2 P13/ANI3 P14/ANI4 P15/ANI5 P16/ANI6 P17/ANI7 AVSS Notes 1. SDA0 and SCL0 are incorporated only in the µPD780024AY Subseries. 2. SI31, SO31, and SCK31 are incorporated only in the µPD780024A Subseries. Cautions 1. Connect the IC (Internally Connected) pin directly to VSS0 or VSS1. 2. Connect the AVSS pin to VSS0. Remark When the µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, and 780024AY are used in applications where the noise generated inside the microcontroller needs to be reduced, the implementation of noise reduction measures, such as supplying voltage to VDD0 and VDD1 individually and connecting VSS0 and VSS1 to different ground lines, is recommended. Data Sheet U14042EJ4V0DS 11 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY • 64-pin plastic QFP (14 x 14) • 64-pin plastic LQFP (14 x 14) • 64-pin plastic TQFP (12 x 12) • 64-Pin plastic LQFP (10 x 10) P73/TI51/TO51 P72/TI50/TO50 P67/ASTB P66/WAIT P75/BUZ P47/AD7 P46/AD6 P45/AD5 P44/AD4 P43/AD3 P42/AD2 P41/AD1 P40/AD0 P50/A8 P51/A9 P52/A10 P53/A11 P54/A12 P55/A13 P56/A14 P57/A15 VSS0 VDD0 P30 P31 P32/SDA0Note 1 P33/SCL0Note 1 P34/SI31Note 2 P35/SO31 Note 2 1 2 3 4 5 6 7 8 9 64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 P74/PCL P65/WR P64/RD P71/TI01 P70/TI00/TO0 P03/INTP3/ADTRG P02/INTP2 P01/INTP1 P00/INTP0 VSS1 X1 X2 IC XT1 XT2 RESET AVDD AVREF P10/ANI0 10 11 12 13 14 15 16 33 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 P36/SCK31Note 2 P21/SO30 P23/RxD0 P20/SI30 P22/SCK30 P24/TxD0 P25/ASCK0 AVSS VDD1 P17/ANI7 P16/ANI6 P15/ANI5 P14/ANI4 P13/ANI3 P12/ANI2 Notes 1. SDA0 and SCL0 are incorporated only in the µPD780024AY Subseries. 2. SI31, SO31, and SCK31 are incorporated only in the µPD780024A Subseries. Cautions 1. Connect the IC (Internally Connected) pin directory to VSS0 or VSS1. 2. Connect the AVSS pin to VSS0. Remark When the µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, and 780024AY are used in applications where the noise generated inside the microcontroller needs to be reduced, the implementation of noise reduction measures, such as supplying voltage to VDD0 and VDD1 individually and connecting VSS0 and VSS1 to different ground lines, is recommended. 12 Data Sheet U14042EJ4V0DS P11/ANI1 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY • 73-pin plastic FBGA (9 x 9) Top View 9 8 7 6 5 4 3 2 1 ABCDEFGHJ JHGFEDCBA Bottom View Index mark Pin No. A1 A2 A3 A4 A5 A6 A7 A8 A9 B1 B2 B3 B4 B5 B6 B7 B8 B9 Pin Name NC P46/AD6 P44/AD4 P41/AD1 P67/ASTB P65/WR P74/PCL NC NC P51/A9 P47/AD7 P43/AD3 P40/AD0 P66/WAIT P75/BUZ P72/TI50/TO51 P71/TI01 P70/TI00/TO0 Pin No. C1 C2 C3 C4 C5 C6 C7 C8 C9 D1 D2 D3 D4 D5 D6 D7 D8 D9 Pin Name P52/A10 P53/A11 P45/AD5 P42/AD2 P64/RD P73/TI51/TO51 P03/INTP3/ADTRG P01/INTP1 VSS1 P55/A13 P56/A14 P50/A8 NC − − P02/INTP2 IC X1 Pin No. E1 E2 E3 E4 E5 E6 E7 E8 E9 F1 F2 F3 F4 F5 F6 F7 F8 F9 Pin Name P57/A15 VDD0 P54/A12 − − − P00/INTP0 XT1 X2 P30 P31 VSS0 − − − P14/ANI4 RESET XT2 Pin No. G1 G2 G3 G4 G5 G6 G7 G8 G9 H1 H2 H3 H4 H5 H6 H7 H8 H9 Pin Name P33/SCL0Note 1 P32/SDA0Note 1 P20/SI30 P21/SO30 P24/TxD0 VDD1 P16/ANI6 AVDD NC P34/SI31Note 2 P35/SO31Note 2 P23/RxD0 P22/SCK30 AVSS P15/ANI5 P11/ANI1 P10/ANI0 AVREF Pin No. J1 J2 J3 J4 J5 J6 J7 J8 J9 Pin Name NC P36/SCK31Note 2 NC P25/ASCK0 NC P17/ANI7 P12/ANI2 P13/ANI3 NC Notes 1. SDA0 and SCL0 are incorporated only in the µPD780024AY Subseries. 2. SI31, SO31, and SCK31 are incorporated only in the µPD780024A Subseries. Cautions 1. Connect the IC (Internally Connected) pin directory to VSS0 or VSS1. 2. Connect the AVSS pin to VSS0. Remark When the µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, and 780024AY are used in applications where the noise generated inside the microcontroller needs to be reduced, the implementation of noise reduction measures, such as supplying voltage to VDD0 and VDD1 individually and connecting VSS0 and VSS1 to different ground lines, is recommended. Data Sheet U14042EJ4V0DS 13 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY A8 to A15: AD0 to AD7: ADTRG: ANI0 to ANI7: ASCK0: ASTB: AVDD: AVREF: AVSS: BUZ: IC: INTP0 to INTP3: NC: P00 to P03: P10 to P17: P20 to P25: P30 to P36: P40 to P47: P50 to P57: Address bus Address/data bus AD trigger input Analog input Asynchronous serial clock Address strobe Analog power supply Analog reference voltage Analog ground Buzzer clock Internally connected External interrupt input No connection Port 0 Port 1 Port 2 Port 3 Port 4 Port 5 P64 to P67: P70 to P75: PCL: RD: RESET: RxD0: SDA0: SI30, SI31: SO30, SO31: TO0, TO50, TO51: TxD0: VDD0, V DD1: VSS0, VSS1: WAIT: WR: X1, X2: XT1, XT2: Port 6 Port 7 Programmable clock Read strobe Reset Receive data Serial data Serial input Serial output Timer output Transmit data Power supply Ground Wait Write strobe Crystal (main system clock) Crystal (subsystem clock) SCK30, SCK31, SCL0: Serial clock TI00, TI01, TI50, TI51: Timer input 14 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 2. BLOCK DIAGRAM TI00/TO0/P70 TI01/P71 TI50/TO50/P72 TI51/TO51/P73 16-bit timer/ event counter 8-bit timer/ event counter 50 8-bit timer/ event counter 51 Watchdog timer Watch timer SI30/P20 SO30/P21 SCK30/P22 SI31/P34 SO31/P35 SCK31/P36 RxD0/P23 TxD0/P24 ASCK0/P25 SDA0/P32 SCL0/P33 ANI0/P10 to ANI7/P17 AVDD AVSS AVREF INTP0/P00 to INTP3/P03 BUZ/P75 PCL/P74 Port 0 P00 to P03 Port 1 P10 to P17 Port 2 P20 to P25 Port 3 P30 to P36 78K/0 CPU core ROM Port 4 P40 to P47 Serial interface 30 Port 5 P50 to P57 Port 6 Serial interface 31Note 1 RAM UART0 P64 to P67 Port 7 P70 to P75 AD0/P40 to AD7/P47 A8/P50 to A15/P57 External access RD/P64 WR/P65 WAIT/P66 ASTB/P67 I2C busNote 2 A/D converter RESET X1 X2 XT1 XT2 Interrupt control Buzzer output Clock output control System control VDD0 VDD1 VSS0 VSS1 IC Notes 1. Incorporated only in the µPD780024A Subseries. 2. Incorporated only in the µPD780024AY Subseries. Remark The internal ROM and RAM capacities vary depending on the product. Data Sheet U14042EJ4V0DS 15 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 3. PIN FUNCTIONS 3.1 Port Pins (1/2) Pin Name I/O Function After Reset P00 to P02 I/O Port 0 4-bit I/O port P03 Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be used by setting software. Input Port 1 8-bit input only port P20 P21 P22 P23 P24 P25 P30 P31 P32 P33 P34 P35 P36 P40 to P47 I/O Port 4 8-bit I/O port Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be used by setting software. The interrupt request flag (KRIF) is set to 1 by falling edge detection. Input An on-chip pull-up resistor can be used by setting software. I/O Port 3 7-bit I/O port Input/output can be specified in 1-bit units. N-ch open-drain I/O port An on-chip pull-up resistor can be specified by the mask option. LEDs can be driven directly. SCL0Note 1 SI31Note 2 SO31Note 2 SCK31Note 2 AD0 to AD7 SDA0Note 1 Input I/O Port 2 6-bit I/O port Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be used by setting software. RxD0 TxD0 ASCK0 — Input SI30 SO30 SCK30 Input Input Alternate Function INTP0 to INTP2 INTP3/ADTRG P10 to P17 ANI0 to ANI7 P50 to P57 I/O Port 5 8-bit I/O port LEDs can be driven directly. Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be used by setting software. Input A8 to A15 P64 P65 P66 P67 I/O Port 6 4-bit I/O port Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be used by setting software. Input RD WR WAIT ASTB Notes 1. SDA0 and SCL0 are incorporated only in the µPD780024AY Subseries. 2. SI31, SO31, and SCK31 are incorporated only in the µPD780024A Subseries. 16 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 3.1 Port Pins (2/2) Pin Name I/O Function After Reset P70 P71 P72 P73 P74 P75 I/O Port 7 6-bit I/O port Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be used by setting software. TI51/TO51 PCL BUZ Input Alternate Function TI00/TO0 TI01 TI50/TO50 3.2 Non-Port Pins (1/2) Pin Name I/O Function After Reset INTP0 INTP2 INTP2 INTP3 SI30 SI31Note 1 SO30 SO31Note 1 SDA0Note 2 SCK30 SCK31Note 1 SCL0Note 2 RxD0 TxD0 ASCK0 TI00 Input Output Input Input Serial data input for asynchronous serial interface Serial data output for asynchronous serial interface Serial clock input for asynchronous serial interface External count clock input to 16-bit timer/event counter 0 Capture trigger input to capture register 01 (CR01) of 16-bit timer/event counter 0 TI01 TI50 TI51 TO0 TO50 TO51 PCL BUZ AD0 to AD7 A8 to A15 RD WR WAIT ASTB Input Output Output Output I/O Output Output Output Capture trigger input to capture register 00 (CR00) of 16-bit timer/event counter 0 External count clock input to 8-bit timer/event counter 50 External count clock input to 8-bit timer/event counter 51 16-bit timer/event counter 0 output 8-bit timer/event counter 50 output (also used for 8-bit PWM output) 8-bit timer/event counter 51 output (also used for 8-bit PWM output) Clock output (for trimming of main system clock and subsystem clock) Buzzer output Lower address/data bus for expanding memory externally Higher address bus for expanding memory externally Strobe signal output for reading from external memory Strobe signal output for writing to external memory Wait insertion at external memory access Strobe output that externally latches address information output to ports 4 and 5 to access external memory Input Input Input Input Input Input Input Input Input P71 P72/TO50 P73/TO51 P70/TI00 P72/TI50 P73/TI51 P74 P75 P40 to P47 P50 to P57 P64 P65 P66 P67 Input Input Input Input I/O I/O Serial Interface serial data input/output Serial interface serial clock input/output Input Input Output Serial interface serial data output Input Input Serial interface serial data input Input Input External interrupt request input for which the valid edge (rising edge, falling edge, or both rising and falling edges) can be specified Input Alternate Function P00 P01 P02 P03/ADTRG P20 P34 P21 P35 P32 P22 P36 P33 P23 P24 P25 P70/TO0 Notes 1. SI31, SO31, and SCK31 are incorporated only in the µPD780024A Subseries. 2. SDA0 and SCL0 are incorporated only in the µPD780024AY Subseries. Data Sheet U14042EJ4V0DS 17 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 3.2 Non-Port Pins (2/2) Pin Name I/O Function After Reset ANI0 to ANI7 ADTRG AVREF AVDD AVSS RESET X1 X2 XT1 XT2 VDD0 VSS0 VDD1 VSS1 IC NC Note Alternate Function P10 to P17 P03/INTP3 — — — — — — — — — — — — — — Input Input Input — — Input Input — Input — — — — — — — A/D converter analog input A/D converter trigger signal input A/D converter reference voltage input A/D converter analog power supply. Set potential to that of VDD0 or VDD1 A/D converter ground potential. Set potential to that of VSS0 or VSS1 System reset input Connecting crystal resonator for main system clock oscillation Input Input — — — — — — Connecting crystal resonator for subsystem clock oscillation — — Positive power supply for ports Ground potential of ports Positive power supply (except ports) Ground potential (except ports) Internally connected. Connect directly to VSS0 or VSS1. Not internally connected. Leave open. — — — — — — Note NC pins are incorporated only in the 73-pin plastic FBGA. 18 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 3.3 Pin I/O Circuits and Recommended Connection of Unused Pins The I/O circuit type of each pin and recommended connection of unused pins are shown in Table 3-1. For the I/O circuit configuration of each type, see Figure 3-1. Table 3-1. Types of Pin I/O Circuits Pin Name P00/INTP0 to P02/INTP2 P03/INTP3/ADTRG P10/ANI0 to P17/ANI7 P20/S130 P21/SO30 P22/SCK30 P23/RxD0 P24/TxD0 P25/ASCK0 P30, P31 P32, P33 (µPD780024A Subseries only) P32/SDA0 (µPD780024AY Subseries only) P33/SCL0 (µPD780024AY Subseries only) P34/SI31Note P35/SO31Note P36/SCK31Note P40/AD0 to P47/AD7 P50/A8 to P57/A15 P64/RD P65/WR P66/WAIT P67/ASTB P70/TI00/TO0 P71/TI01 P72/TI50/TO50 P73/TI51/TO51 P74/PCL P75/BUZ RESET XT1 XT2 AVDD AVREF AVSS IC — 2 16 — Input — Connect directly to VDD0 or VDD1. Leave open. Connect to directly VDD0 or VDD1. Connect to directly VSS0 or VSS1. 5-H 8-C 8-C 5-H 8-C 5-H Input: Independently connect to VDD0, VDD1, VSS0, or VSS1 via a resistor. Output: Leave open. Input: Independently connect to VDD0 or VDD1 via a resistor. Output: Leave open. Input: Independently connect to VDD0, VDD1, VSS0, or VSS1 via a resistor. Output: Leave open. 5-H 8-C 13-Q 13-S 13-R Input: Connect directly to VSS0 or VSS1. Output: Leave open at low-level output. 25 8-C 5-H 8-C Input I/O I/O Circuit Type 8-C I/O I/O Recommended Connection of Unused Pins Input: Independently connect to VSS0 or VSS1 via a resistor. Output: Leave open. Connect directly to VDD0, VDD1, VSS0, or VSS1 via a resistor. Input: Independently connect to VDD0, VDD1, VSS0, or VSS1 via a resistor. Output: Leave open. Note SI31, SO31, and SCK31 are incorporated only in the µPD780024A Subseries. Data Sheet U14042EJ4V0DS 19 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Figure 3-1. Pin I/O Circuits TYPE 2 TYPE 13-R IN/OUT Data Output disable IN VSS0 N-ch Schmitt-triggered input with hysteresis characteristics TYPE 5-H VDD0 TYPE 13-S    Mask   option  VDD0 IN/OUT Pull-up enable Data P-ch VDD0 P-ch Data Output disable N-ch VSS0 IN/OUT Output disable Input enable TYPE 8-C VDD0 Feedback cut-off Pull-up enable Data P-ch VDD0 P-ch IN/OUT Output disable N-ch VSS0 XT1 XT2 P-ch TYPE 16 N-ch VSS0 TYPE 13-Q    VDD0 Mask   option  IN/OUT TYPE 25 P-ch Comparator + – Data Output disable N-ch VSS0 N-ch VSS0 VREF (threshold voltage) Input enable IN Input enable 20 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 4. MEMORY SPACE Figure 4-1 shows the memory map of the µ PD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, and 780024AY. Figure 4-1. Memory Map FFFFH Special function registers (SFR) 256 × 8 bits FF00H FEFFH FEE0H FEDFH General-purpose registers 32 × 8 bits Internal high-speed RAMNote mmmmH mmmmH – 1 Data memory space nnnnH Reserved 1000H 0FFFH F800H F7FFH CALLF entry area 0800H 07FFH External memory Program area 0080H 007FH CALLT table area 0040H 003FH Vector table area 0000H 0000H Program area Program memory space nnnnH + 1 nnnnH Internal ROM Note Note The internal ROM and internal high-speed RAM capacities vary depending on the product (see the following table). Part Number Last Address of Internal ROM nnnnH 1FFFH 3FFFH 5FFFH 7FFFH FB00H Start Address of Internal High-Speed RAM mmmmH FD00H µPD780021A, 780021AY µPD780022A, 780022AY µPD780023A, 780023AY µPD780024A, 780024AY Data Sheet U14042EJ4V0DS 21 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 5. PERIPHERAL HARDWARE FUNCTION FEATURES 5.1 Ports The following 3 types of I/O ports are available. • CMOS input (port 1): • CMOS I/O (ports 0, 2, 4 to 7, P34 to P36): • N-channel open-drain I/O (P30 to P33): Total: 8 39 4 51 Table 5-1. Port Functions Name Port 0 Pin Name P00 to P03 Function I/O port. Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be used by setting software. Input-only port. I/O port. Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be used by setting software. N-channel open-drain I/O port. Input/output can be specified in 1-bit units. A pull-up resistor can be specified by mask option. LEDs can be driven directly. I/O port. Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be used by setting software. I/O port. Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be used by setting software. The interrupt request flag (KRIF) is set to 1 by falling edge detection. Port 5 P50 to P57 I/O port. Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be used by setting software. LEDs can be driven directly. I/O port. Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be used by setting software. I/O port. Input/output can be specified in 1-bit units. An on-chip pull-up resistor can be used by setting software. Port 1 Port 2 P10 to P17 P20 to P25 Port 3 P30 to P33 P34 to P36 Port 4 P40 to P47 Port 6 P64 to P67 Port 7 P70 to P75 22 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 5.2 Clock Generator A system clock generator is incorporated. The minimum instruction execution time can be changed. • Expanded-specification products of µPD780021A, 780022A, 780023A, 780024A 0.166 µs/0.333 µs/0.666 µs/1.33 µs/2.66 µs (@12 MHz, VDD = 4.5 to 5.5 V operation with main system clock) 122 µs (@32.768 kHz, VDD = 4.0 to 5.5 V operation with subsystem clock) • µPD780021AY, 780022AY, 780023AY, 780024AY, and conventional products of µPD780021A, 780022A, 780023A, 780024A 0.238 µs/0.48 µs/0.95 µs/1.91 µs/3.81 µs (@8.38 MHz, VDD = 4.0 to 5.5 V operation with main system clock) 122 µs (@32.768 kHz, VDD = 4.0 to 5.5 V operation with subsystem clock) Figure 5-1. Clock Generator Block Diagram XT1 XT2 Subsystem clock oscillator fXT Watch timer, clock output function Prescaler 1 X1 X2 Main system clock oscillator Prescaler fX fX 2 fX 22 fX 23 fX 24 2 fXT 2 Clock to peripheral hardware STOP Selector Standby controller Wait controller CPU clock (fCPU) HALT Data Sheet U14042EJ4V0DS 23 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 5.3 Timer/Counter Five timer/counter channels are incorporated. • 16-bit timer/event counter: 1 channel • 8-bit timer/event counter: • Watch timer: • Watchdog timer: 2 channels 1 channel 1 channel Table 5-2. Operations of Timer/Event Counter 16-Bit Timer/ Event Counter 0 Operation mode Interval timer External event counter Function Timer outputs PPG outputs PWM output Pulse width measurement Square wave outputs Interrupt sources 1 1 — 2 inputs 1 2 2 — 2 — 2 2 — — — — — 2 — — — — — 1 1 channel 1 channel 2 channels 2 channels 1 channelNote 1 — 1 channelNote 2 — 8-Bit Timer/ Event Counters 50, 51 Watch Timer Watchdog Timer Notes 1. The watch timer can perform both watch timer and interval timer functions at the same time. 2. The watchdog timer has watchdog timer and interval timer functions. However, use the watchdog timer by selecting either the watchdog timer function or the interval timer function. 24 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Figure 5-2. Block Diagram of 16-Bit Timer/Event Counter 0 Internal bus Selector INTTM00 Selector TI01/P71 Noise eliminator 16-bit capture/compare register 00 (CR00) Match Selector fX fX/22 fX/26 16-bit timer counter 0 (TM0) Match Clear Output controller TO0/TI00/P70Note fX/23 Noise eliminator Noise eliminator TI00/TO0/P70Note 16-bit capture/compare register 01 (CR01) Selector INTTM01 Internal bus Note TI00 input and TO0 output cannot be used at the same time. Data Sheet U14042EJ4V0DS 25 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Figure 5-3. Block Diagram of 8-Bit Timer/Event Counter 50 Internal bus Mask circuit 8-bit compare register 50 (CR50) TI50/TO50/P72 fX fX/22 fX/24 fX/26 fX/28 fX/210 Match Selector INTTM50 Selector Note 1 8-bit timer OVF counter 50 (TM50) Clear Selector S Q INV R Note 2 TO50/TI50/P72 3 Selector S R Level inversion TCL502 TCL501 TCL500 Timer clock selection register 50 (TCL50) TCE50 TMC506 TMC504 LVS50 LVR50 TMC501 TOE50 Timer mode control register 50 (TMC50) Internal bus Figure 5-4. Block Diagram of 8-Bit Timer/Event Counter 51 Internal bus Mask circuit 8-bit compare register 51 (CR51) TI51/TO51/P73 fX/2 fX/23 fX/25 fX/27 fX/29 fX/211 Match Selector Selector INTTM51 Note 1 8-bit timer counter 51 (TM51) OVF Selector S Q INV R Note 2 TO51/TI51/P73 Clear 3 Selector S R Level inversion TCL512 TCL511 TCL510 Timer clock selection register 51 (TCL51) TCE51 TMC516 TMC514 LVS51 LVR51 TMC511 TOE51 Timer mode control register 51 (TMC51) Internal bus Notes 1. Timer output F/F 2. PWM output F/F 26 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Figure 5-5. Watch Timer Block Diagram Clear Selector fX/2 7 fW fW 24 9-bit prescaler fW 25 fW 26 fW 27 fW 28 fW 29 Selector 5-bit counter Clear INTWT fXT INTWTI WTM7 WTM6 WTM5 WTM4 WTM1 WTM0 Watch timer mode control register (WTM) Internal bus Figure 5-6. Watchdog Timer Block Diagram fX Clock input controller Divided clock selector fX/28 Divider Output controller INTWDT RESET RUN Division mode selector 3 WDT mode signal OSTS2 OSTS1 OSTS0 Oscillation stabilization time selection register (OSTS) WDCS2 WDCS1 WDCS0 RUN WDTM4 WDTM3 Watchdog timer clock selection register (WDCS) Watchdog timer mode register (WDTM) Internal bus Data Sheet U14042EJ4V0DS 27 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 5.4 Clock Output/Buzzer Output Controller A clock output/buzzer output controller is incorporated. Clocks with the following frequencies can be output as clock output. • Expanded-specification products of µPD780021A, 780022A, 780023A, 780024A • 93.75 kHz/187.5 kHz/375 kHz/750 kHz/1.25 MHz/3 MHz/6 MHz/12 MHz (@12 MHz operation with main system clock) • 32.768 kHz (@32.768 kHz operation with subsystem clock) • µPD780021AY, 780022AY, 780023AY, 780024AY, and conventional products of µPD780021A, 780022A, 780023A, 780024A • 65.5 kHz/131 kHz/262 kHz/524 kHz/1.05 MHz/2.10 MHz/4.19 MHz/8.38 MHz (@8.38 MHz operation with main system clock) • 32.768 kHz (@32.768 kHz operation with subsystem clock) Clocks with the following frequencies can be output as buzzer output. • Expanded-specification products of µPD780021A, 780022A, 780023A, 780024A 1.46 kHz/2.93 kHz/5.86 kHz/11.7 kHz (@12 MHz operation with main system clock) • µPD780021AY, 780022AY, 780023AY, 780024AY, and conventional products of µPD780021A, 780022A, 780023A, 780024A 1.02 kHz/2.05 kHz/4.10 kHz/8.19 kHz (@8.38 MHz operation with subsystem clock) Figure 5-7. Block Diagram of Clock Output/Buzzer Output Control Circuit fX Prescaler 8 4 fX/210 to fX/213 Selector BUZ/P75 BZOE fX to fX/27 Selector BCS0, BCS1 Clock controller CLOE PCL/P74 fXT BZOE BCS1 BCS0 CLOE CCS3 CCS2 CCS1 CCS0 Clock output selection register (CKS) Internal bus 28 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 5.5 A/D Converter An A/D converter consisting of eight 8-bit resolution channels is incorporated. The following two A/D conversion operation startup methods are available. • Hardware start • Software start Figure 5-8. A/D Converter Block Diagram Series resistor string ANI0/P10 ANI1/P11 ANI2/P12 ANI3/P13 ANI4/P14 ANI5/P15 ANI6/P16 ANI7/P17 Successive approximation register (SAR) AVSS Selector Tap selector Sample & hold circuit Voltage comparator AVDD AVREF INTP3/ADTRG/P03 Edge detector Controller INTAD Edge detector A/D conversion result register (ADCR0) INTP3 Internal bus Data Sheet U14042EJ4V0DS 29 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 5.6 Serial Interface Three serial interface channels are incorporated. • µPD780024A Subseries Serial interface UART0: Serial interface SIO30, SIO31: • µPD780024AY Subseries Serial interface UART0: Serial interface SIO30: Serial interface IIC0 (1) Serial interface UART0 Serial interface UART0 has two modes: asynchronous serial interface (UART) mode and infrared data transfer mode. • Asynchronous serial interface (UART) mode This mode enables full-duplex operation wherein one byte of data starting from the start bit is transmitted and received. The on-chip UART-dedicated baud-rate generator enables communication using a wide range of selectable baud rates. In addition, a baud rate can also be defined by dividing the clock input to the ASCK0 pin. The UART-dedicated baud-rate generator can also be used to generate a MIDI-standard baud rate (31.25 kbps). • Infrared data transfer mode This mode enables pulse output and pulse reception in data format. This mode can be used for office equipment applications such as personal computers. Figure 5-9. Block Diagram of Serial Interface UART0 1 channel 1 channel 1 channel 1 channel 2 channels Internal bus Asynchronous serial interface mode register 0 (ASIM0) TXE0 RXE0 PS01 PS00 CL0 SL0 ISRM0 IRDAM0 Receive RXB0 buffer register 0 RxD0/P23 RX0 Receive shift register 0 Asynchronous serial interface status register 0 (ASIS0) TXS0 Transmit shift PE0 FE0 OVE0 register 0 TxD0/P24 Receive controller (parity check) Transmit INTSER0 controller INTSR0 (parity addition) INTST0 Baud rate generator P25/ASCK0 fX/2 to fX/27 30 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (2) Serial interface SIO3n Serial interface SIO3n has one mode: 3-wire serial I/O mode. • 3-wire serial I/O mode (fixed as MSB first) This is an 8-bit data transfer mode using three lines: a serial clock line (SCK3n), serial output line (SO3n), and serial input line (SI3n). Since simultaneous transmit and receive operations are enabled in the 3-wire serial I/O mode, the processing time for data transfer is reduced. The first bit in 8-bit data in the serial transfer is fixed as MSB. The 3-wire serial I/O mode is useful for connection to peripheral I/O devices, and display controllers, etc., that include a clocked serial interface. Figure 5-10. Block Diagram of Serial Interface SIO3n Internal bus 8 SI3n Serial I/O shift register 3n (SIO3n) SO3n SCK3n Serial clock counter Serial clock controller Interrupt request signal generator INTCSI3n fX/23 fX/24 fX/25 Selector Remark µPD780024A Subseries: n = 0, 1 µPD780024AY Subseries: n = 0 Data Sheet U14042EJ4V0DS 31 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (3) Serial interface IIC0 (µPD780024AY Subseries only) Serial interface IIC0 has one mode: I2C (Inter IC) bus mode (supporting multimaster). • I2C bus mode (supporting multimaster) This is an 8-bit data transfer mode using two lines: a serial clock line (SCL0) and a serial data bus line (SDA0). This mode complies with the I2C bus format, and can output a “start condition”, “data”, and a “stop condition” during transmission via the serial data bus. This data is automatically detected by hardware during reception. Since SCL0 and SDA0 are open-drain outputs in IIC0, pull-up resistors for the serial clock line and the serial data bus line are required. Figure 5-11. Block Diagram of Serial Interface IIC0 Internal bus IIC status register 0 (IICS0) MSTS0 ALD0 EXC0 COI0 TRC0 ACKD0 STD0 SPD0 IIC control register 0 (IICC0) SDA0/P32 Noise eliminator Slave address register 0 (SVA0) Match signal IICE0 LREL0 WREL0 SPIE0 WTIM0 ACKE0 STT0 SPT0 CLEAR SET SO0 latch D CL00 IIC shift register 0 (IIC0) N-ch opendrain output Data hold time corrector Acknowledge detector Wake-up controller Acknowledge detector Start condition detector SCL0/P33 Noise eliminator Stop condition detector Interrupt request signal generator Serial clock counter INTIIC0 Serial clock controller N-ch open-drain output fX Prescaler Serial clock wait controller CLD0 DAD0 SMC0 DFC0 CL00 IIC transfer clock select register 0 (IICCL0) Internal bus 32 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 6. INTERRUPT FUNCTIONS A total of 20 interrupt sources are provided, divided into the following three types. • Non-maskable: 1 • Maskable: • Software: 18 1 Table 6-1. Interrupt Source List Interrupt Type Nonmaskable Maskable Default PriorityNote 1 — Name INTWDT Interrupt Source Trigger Watchdog timer overflow (with watchdog timer mode 1 selected) Watchdog timer overflow (with interval timer mode selected) Pin input edge detection External 0006H 0008H 000AH 000CH Serial interface UART0 reception error generation End of serial interface UART0 reception End of serial interface UART0 transmission End of serial interface SIO30 transfer End of serial interface SIO31 transfer [Only for µPD780024A Subseries] 10 INTIIC0 End of serial interface IIC0 transfer [Only for µPD780024AY Subseries] Reference time interval signal from watch timer Match between TM0 and CR00 (when CR00 is specified as compare register) Detection of TI01 valid edge (when CR00 is specified as capture register) 13 INTTM01 Match between TM0 and CR01 (when CR01 is specified as compare register) Detection of TI00 valid edge (when CR01 is specified as capture register) Match between TM50 and CR50 Match between TM51 and CR51 End of A/D conversion Watch timer overflow Port 4 falling edge detection BRK instruction execution External — 001EH 0018H Internal 000EH (B) Internal/ External Internal Vector Table Address Basic Configuration TypeNote 2 0004H (A) 0 INTWDT (B) 1 2 3 4 5 INTP0 INTP1 INTP2 INTP3 INTSER0 (C) 6 7 8 9 INTSR0 INTST0 INTCSI30 INTCSI31 0010H 0012H 0014H 0016H 11 12 INTWTI INTTM00 001AH 001CH 14 15 16 17 18 Software — INTTM50 INTTM51 INTAD0 INTWT INTKR BRK 0020H 0022H 0024H 0026H 0028H 003EH (D) (E) Notes 1. The default priority is the priority when several maskable interrupt requests are generated at the same time. 0 is the highest, and 18 is the lowest. 2. Basic configuration types (A) to (E) correspond to (A) to (E) in Figure 6-1. Remark The watchdog timer interrupt (INTWDT) can be selected from a non-maskable interrupt or a maskable interrupt (internal). Data Sheet U14042EJ4V0DS 33 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Figure 6-1. Basic Configuration of Interrupt Function (1/2) (A) Internal non-maskable interrupt Internal bus Interrupt request Priority controller Vector table address generator Standby release signal (B) Internal maskable interrupt Internal bus MK IE PR ISP Interrupt request IF Priority controller Vector table address generator Standby release signal (C) External maskable interrupt (INTP0 to INTP3) Internal bus External interrupt edge enable register (EGP, EGN) MK IE PR ISP Interrupt request Edge detector IF Priority controller Vector table address generator Standby release signal 34 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Figure 6-1. Basic Configuration of Interrupt Function (2/2) (D) External maskable interrupt (INTKR) Internal bus MK IE PR ISP Interrupt request Falling edge detector IF Priority controller Vector table address generator Standby release signal (E) Software interrupt Internal bus Interrupt request Vector table address generator IF: IE: ISP: MK: PR: Interrupt request flag Interrupt enable flag In-service priority flag Interrupt mask flag Priority specification flag Data Sheet U14042EJ4V0DS 35 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 7. EXTERNAL DEVICE EXPANSION FUNCTION The external device expansion function is for connecting external devices to areas other than the internal ROM, RAM, and SFR areas. Ports 4 to 6 are used for external device connection. 8. STANDBY FUNCTION The following two standby modes are available for further reduction of system power consumption. • HALT mode: In this mode, the CPU operation clock is stopped. The average power consumption can be reduced by intermittent operation by combining this mode with the normal operation mode. • STOP mode: In this mode, oscillation of the main system clock is stopped. All the operations performed on the main system clock are suspended, and only the subsystem clock is used, resulting in extremely small power consumption. This can be used only when the main system clock is operating (the subsystem clock oscillation cannot be stopped). Figure 8-1. Standby Function CSS = 1 Main system clock operation STOP instruction Interrupt request HALT mode Clock supply for CPU is stopped, oscillation is maintained CSS = 0 HALT instruction Interrupt request HALT modeNote Clock supply for CPU is stopped, oscillation is maintained Subsystem clock operationNote HALT instruction Interrupt request STOP mode Main system clock operation is stopped Note The power consumption can be reduced by stopping the main system clock. When the CPU is operating on the subsystem clock, set bit 7 (MCC) of the processor clock control register (PCC). The STOP instruction cannot be used. Caution When the main system clock is stopped and the device is operating on the subsystem clock, wait until the oscillation stabilization time has been secured by the program before switching back to the main system clock. 9. RESET FUNCTION The following two reset methods are available. • External reset by RESET signal input • Internal reset by watchdog timer program loop time detection 10. MASK OPTION Table 10-1 Pin Mask Option Selection Subseries Name Pins P30 to P33 P30 and P31 Mask Option An on-chip pull-up resistor can be specified in 1-bit units. µPD780024A Subseries µPD780024AY Subseries The mask option can be used to specify the connection of an on-chip pull-up resistor to P30 to P33Note, in 1-bit units. Note The µPD780024AY Subseries has P30 and P31 only. Data Sheet U14042EJ4V0DS 36 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 11. INSTRUCTION SET (1) 8-bit instructions MOV, XCH, ADD, ADDC, SUB, SUBC, AND, OR, XOR, CMP, MULU, DIVUW, INC, DEC, ROR, ROL, RORC, ROLC, ROR4, ROL4, PUSH, POP, DBNZ 2nd Operand 1st Operand A #byte A r [HL + byte] Note sfr saddr !addr16 PSW [DE] [HL] [HL + B] [HL + C] $addr16 1 None ADD ADDC SUB SUBC AND OR XOR CMP MOV XCH ADD ADDC SUB SUBC AND OR XOR CMP MOV XCH MOV XCH ADD ADDC SUB SUBC AND OR XOR CMP MOV XCH ADD ADDC SUB SUBC AND OR XOR CMP MOV MOV XCH MOV XCH ADD ADDC SUB SUBC AND OR XOR CMP MOV XCH ADD ADDC SUB SUBC AND OR XOR CMP ROR ROL RORC ROLC r MOV MOV ADD ADDC SUB SUBC AND OR XOR CMP INC DEC B, C sfr saddr MOV MOV ADD ADDC SUB SUBC AND OR XOR CMP !addr16 PSW MOV MOV MOV MOV MOV MOV MOV DBNZ DBNZ INC DEC PUSH POP [DE] [HL] ROR4 ROL4 [HL + byte] [HL + B] [HL + C] X C MOV MULU DIVUW Note Except r = A Data Sheet U14042EJ4V0DS 37 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (2) 16-bit instructions MOVW, XCHW, ADDW, SUBW, CMPW, PUSH, POP, INCW, DECW 2nd Operand 1st Operand AX #word ADDW SUBW CMPW MOVW MOVW MOVW MOVW MOVWNote MOVW MOVW MOVW MOVW AX rpNote MOVW XCHW sfrp MOVW saddrp MOVW !addr16 MOVW SP MOVW None rp sfrp saddrp !addr16 SP INCW, DECW PUSH, POP Note Only when rp = BC, DE or HL (3) Bit manipulation instructions MOV1, AND1, OR1, XOR1, SET1, CLR1, NOT1, BT, BF, BTCLR 2nd Operand 1st Operand A.bit A.bit sfr.bit saddr.bit PSW.bit [HL].bit CY MOV1 $addr16 BT BF BTCLR BT BF BTCLR BT BF BTCLR BT BF BTCLR BT BF BTCLR None SET1 CLR1 SET1 CLR1 SET1 CLR1 SET1 CLR1 SET1 CLR1 sfr.bit MOV1 saddr.bit MOV1 PSW.bit MOV1 [HL].bit MOV1 CY MOV1 AND1 OR1 XOR1 MOV1 AND1 OR1 XOR1 MOV1 AND1 OR1 XOR1 MOV1 AND1 OR1 XOR1 MOV1 AND1 OR1 XOR1 SET1 CLR1 NOT1 (4) Call instructions/branch instructions CALL, CALLF, CALLT, BR, BC, BNC, BZ, BNZ, BT, BF, BTCLR, DBNZ 2nd Operand 1st Operand Basic instruction Compound instruction BR AX !addr16 CALL BR !addr11 CALLF [addr5] CALLT $addr16 BR, BC, BNC BZ, BNZ BT, BF BTCLR DBNZ (5) Other instructions ADJBA, ADJBS, BRK, RET, RETI, RETB, SEL, NOP, EI, DI, HALT, STOP 38 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 12. ELECTRICAL SPECIFICATIONS 12.1 Expanded-Specification Products of µ PD780021A, 780022A, 780023A, 780024A Absolute Maximum Ratings (TA = 25°C) Parameter Supply voltage Symbol VDD AVDD AVREF AVSS Conditions Ratings –0.3 to +6.5 –0.3 to VDD + 0.3Note –0.3 to VDD + 0.3Note –0.3 to +0.3 Unit V V V V V Input voltage VI1 P00 to P03, P10 to P17, P20 to P25, P34 to P36, P40 to P47, P50 to P57, P64 to P67, P70 to P75, X1, X2, XT1, XT2, RESET –0.3 to VDD + 0.3Note VI2 P30 to P33 N-ch open-drain Without pull-up resistor With pull-up resistor –0.3 to + 6.5 –0.3 to VDD + 0.3Note –0.3 to VDD + 0.3Note 0.3Note V V V V Output voltage Analog input voltage VO VAN P10 to P17 Analog input pin AVSS – 0.3 to AVREF0 + and –0.3 to VDD + 0.3Note –10 –15 –15 20 Output current, high IOH Per pin Total for P00 to P03, P40 to P47, P50 to P57, P64 to P67, P70 to P75 Total for P20 to P25, P30 to P36 mA mA mA mA Output current, low IOL Per pin for P00 to P03, P20 to P25, P34 to P36, P40 to P47, P64 to P67, P70 to P75 Per pin for P30 to P33, P50 to P57 Total for P00 to P03, P40 to P47, P64 to P67, P70 to P75 Total for P20 to P25 Total for P30 to P36 Total for P50 to P57 30 50 mA mA 20 100 100 –40 to +85 mA mA mA °C Operating ambient temperature Storage temperature TA Tstg –65 to +150 °C Note 6.5 V or below Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. Caution Remark Unless otherwise specified, the characteristic of alternate-function pins are the same as those of port pins. Data Sheet U14042EJ4V0DS 39 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Capacitance (TA = 25°C, VDD = VSS = 0 V) Parameter Input capacitance I/O capacitance CIO Symbol CIN f = 1 MHz Unmeasured pins returned to 0 V. f = 1 MHz Unmeasured pins returned to 0 V. P00 P34 P50 P70 to to to to P03, P20 to P25, P36, P40 to P47, P57, P64 to P67, P75 15 pF Conditions MIN. TYP. MAX. 15 Unit pF P30 to P33 20 pF Remark Unless otherwise specified, the characteristic of alternate-function pins are the same as those of port pins. Main System Clock Oscillator Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V) Resonator Ceramic resonator IC X2 X1 Recommended Circuit Parameter Oscillation frequency (fX) Oscillation stabilization Crystal resonator C2 C1 Note 1 Conditions 4.5 V ≤ VDD ≤ 5.5 V 3.0 V ≤ VDD < 4.5 V 1.8 V ≤ VDD < 3.0 V After VDD reaches MIN. 1.0 1.0 1.0 TYP. MAX. 12.0 8.38 5.0 4 Unit MHz C2 C1 ms timeNote 2 oscillation voltage range MIN. 4.5 V ≤ VDD ≤ 5.5 V 3.0 V ≤ VDD < 4.5 V 1.8 V ≤ VDD < 3.0 V 4.0 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 4.0 V 4.5 V ≤ VDD ≤ 5.5 V 3.0 V ≤ VDD < 4.5 V 1.8 V ≤ VDD < 3.0 V 4.5 V ≤ VDD ≤ 5.5 V 3.0 V ≤ VDD < 4.5 V 1.8 V ≤ VDD < 3.0 V 1.0 1.0 1.0 38 50 85 1.0 1.0 1.0 12.0 8.38 5.0 10 30 12.0 8.38 5.0 500 500 500 ns MHz ms MHz IC X2 X1 Oscillation frequency (fX)Note 1 Oscillation stabilization timeNote 2 External clock X2 X1 X1 input frequency (fX)Note 1 X1 input high-/low-level width (tXH, tXL) Notes 1. Indicates only oscillator characteristics. Refer to AC Characteristics for instruction execution time. 2. Time required to stabilize oscillation after reset or STOP mode release. Cautions 1. When using the main system clock oscillator, wire as follows in the area enclosed by the broken lines in the above figures to avoid an adverse effect from wiring capacitance. • Keep the wiring length as short as possible. • Do not cross the wiring with the other signal lines. • Do not route the wiring near a signal line through which a high fluctuating current flows. • Always make the ground point of the oscillator capacitor the same potential as VSS1. • Do not ground the capacitor to a ground pattern through which a high current flows. • Do not fetch signals from the oscillator. 2. When the main system clock is stopped and the system is operating on the subsystem clock, wait until the oscillation stabilization time has been secured by the program before switching back to the main system clock. 40 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Subsystem Clock Oscillator Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V) Resonator Crystal resonator Recommended Circuit XT2 R C4 Parameter Oscillation frequency (fXT)Note 1 Oscillation stabilization timeNote 2 XT1 input frequency (fXT)Note 1 XT1 input high-/low-level width (tXTH , tXTL) Conditions MIN. 32 TYP. 32.768 MAX. 35 Unit kHz XT1 IC C3 4.0 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 4.0 V 32 1.2 2 10 38.5 s External clock kHz XT2 XT1 12 15 µs Notes 1. Indicates only oscillator characteristics. Refer to AC Characteristics for instruction execution time. 2. Time required to stabilize oscillation after VDD reaches oscillation voltage range MIN. Cautions 1. When using the subsystem clock oscillator, wire as follows in the area enclosed by the broken lines in the above figures to avoid an adverse effect from wiring capacitance. • Keep the wiring length as short as possible. • Do not cross the wiring with the other signal lines. • Do not route the wiring near a signal line through which a high fluctuating current flows. • Always make the ground point of the oscillator capacitor the same potential as VSS1. • Do not ground the capacitor to a ground pattern through which a high current flows. • Do not fetch signals from the oscillator. 2. The subsystem clock oscillator is designed as a low-amplitude circuit for reducing power consumption, and is more prone to malfunction due to noise than the main system clock oscillator. Particular care is therefore required with the wiring method when the subsystem clock is used. Remark For the resonator selection and oscillator constant, customers are required to either evaluate the oscillation themselves or apply to the resonator manufacturer for evaluation. Data Sheet U14042EJ4V0DS 41 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Recommended Oscillator Constant Main system clock: Ceramic resonator (TA = –40 to +85°C) Manufacturer Part Number Frequency (MHz) Murata Mfg. Co., Ltd. CSBFB1M00J58 CSBLA1M00J58 CSTCC2M00G56 CSTLS2M00G56 CSTCC3M58G53 CSTLS3M58G53 CSTCR4M00G53 CSTLS4M00G53 CSTCR4M19G53 CSTLS4M19G53 CSTCR4M91G53 CSTLS4M91G53 CSTCR5M00G53 CSTLS5M00G53 CSTCE8M00G52 CSTLS8M00G53 CSTCE8M38G52 CSTLS8M38G53 CSTCE10M0G52 CSTLS10M0G53 CSTCE12M0G52 CSTLA12M0T55 TDK CCR3.58MC3 CCR4.19MC3 CCR5.0MC3 CCR8.0MC5 CCR8.38MC5 1.00 1.00 2.00 2.00 3.58 3.58 4.00 4.00 4.19 4.19 4.91 4.91 5.00 5.00 8.00 8.00 8.38 8.38 10.00 10.00 12.00 12.00 3.58 4.19 5.00 8.00 8.38 Recommended Circuit Constant C1 (pF) 100 100 On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip C2 (pF) 100 100 On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip R1 (kΩ) 2.2 2.2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Oscillation Voltage Range MIN. (V) 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 3.0 3.0 3.0 3.0 4.5 4.5 4.5 4.5 1.8 1.8 1.8 2.0 2.0 MAX. (V) 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 Caution The oscillator constant is a reference value based on evaluation in specific environments by the resonator manufacturer. If the oscillator characteristics need to be optimized in the actual application, request the resonator manufacturer for evaluation on the implementation circuit. Note that the oscillation voltage and oscillation frequency merely indicate the characteristics of the oscillator. Use the internal operation conditions of the µPD780024A Subseries within the specifications of the DC and AC characteristics. 42 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY DC Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V) Parameter Output current, high Output current, low Symbol IOH Per pin All pins IOL Conditions MIN. TYP. MAX. –1 –15 10 Unit mA mA mA Per pin for P00 to P03, P20 to P25, P34 to P36, P40 to P47, P64 to P67, P70 to P75 Per pin for P30 to P33, P50 to P57 Total for P00 to P03, P40 to P47, P64 to P67, P70 to P75 Total for P20 to P25 Total for P30 to P36 Total for P50 to P57 15 20 10 70 70 mA mA mA mA mA V V V V V V V V V V V V V V V V V V V V V V V V V V Input voltage, high VIH1 P10 to P17, P21, P24, P35, P40 to P47, P50 to P57, P64 to P67, P74, P75 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 0.7VDD 0.8VDD 0.8VDD 0.85VDD 0.7VDD 0.8VDD VDD – 0.5 VDD – 0.2 0.8VDD 0.9VDD 0 0 0 0 0 0 0 0 0 0 0 VDD – 1.0 VDD – 0.5 VDD VDD VDD VDD 5.5 5.5 VDD VDD VDD VDD 0.3VDD 0.2VDD 0.2VDD 0.15VDD 0.3VDD 0.2VDD 0.1VDD 0.4 0.2 0.2VDD 0.1VDD VDD VDD 2.0 0.4 2.0 0.4 VIH2 P00 to P03, P20, P22, P23, P25, P34, P36, P70 to P73, RESET VIH3 P30 to P33 (N-ch open-drain) VIH4 X1, X2 VIH5 XT1, XT2 4.0 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 4.0 V Input voltage, low VIL1 P10 to P17, P21, P24, P35, P40 to P47, P50 to P57, P64 to P67, P74, P75 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 4.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 4.0 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 4.0 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 4.0 V VIL2 P00 to P03, P20, P22, P23, P25, P34, P36, P70 to P73, RESET VIL3 P30 to P33 VIL4 X1, X2 VIL5 XT1, XT2 4.0 V ≤ VDD ≤ 5.5 V, IOH = –1 mA Output voltage, high Output voltage, low VOH1 1.8 V ≤ VDD < 4.0 V, IOH = –100 µA VOL1 P30 to P33 P50 to P57 4.0 V ≤ VDD ≤ 5.5 V, IOL = 15 mA P00 to P03, P20 to P25, P34 to P36, 4.0 V ≤ VDD ≤ 5.5 V, P40 to P47, P64 to P67, P70 to P75 VOL2 IOL = 400 µA IOL = 1.6 mA 0.5 V Remark Unless otherwise specified, the characteristics of alternate-function pins are the same as those of port pins. Data Sheet U14042EJ4V0DS 43 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY DC Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V) Parameter Input leakage current, high Symbol ILIH1 VIN = VDD Conditions P00 to P03, P10 to P17, P20 to P25, P34 to P36, P40 to P47, P50 to P57, P60 to P67, P70 to P75, RESET X1, X2, XT1, XT2 VIN = 5.5 V VIN = 0 V P30 to P33Note P00 to P03, P10 to P17, P20 to P25, P34 to P36, P40 to P47, P50 to P57, P64 to P67, P70 to P75, RESET X1, X2, XT1, XT2 P30 to P33 VOUT = VDD VOUT = 0 V VIN = 0 V, P30, P31, P32, P33 VIN = 0 V, P00 to P03, P20 to P25, P34 to P36, P40 to P47, P50 to P57, P64 to P67, P70 to P75 15 15 30 30 Note MIN. TYP. MAX. 3 Unit µA ILIH2 ILIH3 Input leakage current, low ILIL1 20 3 –3 µA µA µA ILIL2 ILIL3 Output leakage current, high Output leakage current, low Mask option pull-up resistance Software pullup resistance ILOH ILOL R1 R2 –20 –3 3 –3 90 90 µA µA µA µA kΩ kΩ Note When pull-up resistors are not connected to P30 to P33 (specified by the mask option). Remark Unless otherwise specified, the characteristics of alternate-function pins are the same as those of port pins. 44 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY DC Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V) Parameter Power supply currentNote 1 Symbol IDD1Note 2 Conditions 12.0 MHz VDD = 5.0 V crystal oscillation operating mode ±10%Note 3 When A/D converter is stopped When A/D converter is operatingNote 7 When A/D converter is stopped When A/D converter is operatingNote 7 VDD = 3.0 V + 10%Notes 3, 6 When A/D converter is stopped When A/D converter is operatingNote 7 5.00 MHz VDD = 3.0 V ±10%Note 3 crystal oscillation operating mode VDD = 2.0 V ±10%Note 4 When A/D converter is stopped When A/D converter is operatingNote 7 When A/D converter is stopped When A/D converter is operatingNote 7 IDD2 12.0 MHz VDD = 5.0 V ±10%Note 3 crystal oscillation HALT mode 8.38 MHz VDD = 5.0 V ±10%Note 3 crystal oscillation HALT mode When peripheral functions are stopped When peripheral functions are operating When peripheral functions are stopped When peripheral functions are operating VDD = 3.0 V + 10%Notes 3, 6 When peripheral functions are stopped When peripheral functions are operating 5.00 MHz VDD = 3.0 V ±10%Note 3 crystal oscillation HALT mode VDD = 2.0 V ±10%Note 4 When peripheral functions are stopped When peripheral functions are operating When peripheral functions are stopped When peripheral functions are operating IDD3 MIN. TYP. 8.5 9.5 5.5 6.5 3 4 2 3 0.4 1.4 2 MAX. 17 19 11 13 6 8 4 6 1.5 4.2 4 10 Unit mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA mA 8.38 MHz VDD = 5.0 V ±10%Note 3 crystal oscillation operating mode 1.1 2.2 4.7 0.5 1 4 0.35 0.7 1.7 0.15 0.4 1.1 32.768 kHz crystal oscillation operating modeNote 5 VDD = 5.0 V ±10% VDD = 3.0 V ±10% VDD = 2.0 V ±10% VDD = 5.0 V ±10% VDD = 3.0 V ±10% VDD = 2.0 V ±10% VDD = 5.0 V ±10% VDD = 3.0 V ±10% VDD = 2.0 V ±10% 40 20 10 30 6 2 0.1 0.05 0.05 80 40 20 60 18 10 30 10 10 µA µA µA µA µA µA µA µA µA IDD4 32.768 kHz crystal oscillation HALT mode Note 5 IDD5 XT1 = VDD STOP mode When feedback resistor is not used Data Sheet U14042EJ4V0DS 45 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Notes 1. Total current through the internal power supply (VDD0, VDD1) (except the current through pull-up resistors of ports). 2. IDD1 includes the peripheral operation current. 3. When the processor clock control register (PCC) is set to 00H. 4. When PCC is set to 02H. 5. When main system clock operation is stopped. 6. The values show the specifications when VDD = 3.0 to 3.3 V. The value in the TYP. column show the specifications when VDD = 3.0 V. 7. Includes the current through the AVDD pin. 46 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY AC Characteristics (1) Basic Operation (TA = –40 to +85°C, VDD = 1.8 to 5.5 V) Parameter Cycle time (Min. instruction execution time) Symbol TCY Operating with main system clock Conditions 4.5 V ≤ VDD ≤ 5.5 V 3.0 V ≤ VDD ≤ 4.5 V 2.7 V ≤ VDD ≤ 3.0 V 1.8 V ≤ VDD ≤ 2.7 V Operating with subsystem clock TI00, TI01 input high-/low-level width TI50, TI51 input frequency TI50, TI51 input high-/low-level width Interrupt request input high-/lowlevel width RESET low-level width tRSL tINTH, tINTL INTP0 to INTP3, P40 to P47 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 1 2 10 20 tTIH5, tTIL5 fTI5 tTIH0, tTIL0 3.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 3.0 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V MIN. 0.166 0.238 0.4 1.6 103.9Note 1 2/fsam+0.1Note 2 2/fsam+0.2Note 2 2/fsam+0.5Note 2 0 0 100 1.8 4 275 122 TYP. MAX. 16 16 16 16 125 Unit µs µs µs µs µs µs µs µs MHz kHz ns ns µs µs µs µs Notes 1. Value when the external clock is used. When a crystal resonator is used, it is 114 µs (MIN.). 2. Selection of fsam = fX, fX/4, fX/64 is possible using bits 0 and 1 (PRM00, PRM01) of prescaler mode register 0 (PRM0). However, if the TI00 valid edge is selected as the count clock, the value becomes fsam = fX/8. Data Sheet U14042EJ4V0DS 47 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY TCY vs. VDD (main system clock operation) 16.0 10.0 Cycle time TCY [ µ S] 5.0 Operation guaranteed range 2.0 1.6 1.0 0.4 0.238 0.166 0.1 0 1.0 1.8 2.0 2.7 3.0 4.0 4.5 5.0 5.5 6.0 Supply voltage VDD [V] 48 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (2) Read/Write Operation (TA = –40 to +85°C, VDD = 4.0 to 5.5 V) Parameter ASTB high-level width Address setup time Address hold time Data input time from address Symbol tASTH tADS tADH tADD1 tADD2 Address output time from RD↓ Data input time from RD↓ tRDAD tRDD1 tRDD2 Read data hold time RD low-level width tRDH tRDL1 tRDL2 Input time from RD↓ to WAIT↓ tRDWT1 tRDWT2 Input time from WR↓ to WAIT↓ WAIT low-level width Write data setup time Write data hold time WR low-level width Delay time from ASTB↓ to RD↓ Delay time from ASTB↓ to WR↓ Delay time from RD↑ to ASTB↑ at external fetch Address hold time from RD↑ at external fetch Write data output time from RD↑ Write data output time from WR↓ Address hold time from WR↑ Delay time from WAIT↑ to RD↑ Delay time from WAIT↑ to WR↑ tRDWD tWRWD tWRADH tWTRD tWTWR 40 10 0.8tCY – 15 0.8tCY 0.8tCY 60 1.2tCY + 30 2.5tCY + 25 2.5tCY + 25 ns ns ns ns ns tRDADH 0.8tCY – 15 1.2tCY + 30 ns tWRWT tWTL tWDS tWDH tWRL1 tASTRD tASTWR tRDAST (0.5 + n)tCY + 10 60 6 (1.5 + 2n)tCY – 15 6 2tCY – 15 0.8tCY – 15 1.2tCY 0 (1.5 + 2n)tCY – 33 (2.5 + 2n)tCY – 33 tCY – 43 tCY – 43 tCY – 25 (2 + 2n)tCY 0 Conditions MIN. 0.3tCY 20 6 (2 + 2n)tCY – 54 (3 + 2n)tCY – 60 100 (2 + 2n)tCY – 87 (3 + 2n)tCY – 93 MAX. (1/3) Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Caution Remarks TCY can only be used when the MIN. value is 0.238 µs. 1. 2. 3. tCY = TCY/4 n indicates the number of waits. CL = 100 pF (CL indicates the load capacitance of the AD0 to AD7, A8 to A15, RD, WR, WAIT, and ASTB pins.) Data Sheet U14042EJ4V0DS 49 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (2) Read/Write Operation (TA = –40 to +85°C, VDD = 2.7 to 4.0 V) (2/3) Parameter ASTB high-level width Address setup time Address hold time Input time from address to data Symbol tASTH tADS tADH tADD1 tADD2 Output time from RD↓ to address Input time from RD↓ to data tRDAD tRDD1 tRDD2 Read data hold time RD low-level width tRDH tRDL1 tRDL2 Input time from RD↓ to WAIT↓ tRDWT1 tRDWT2 Input time from WR↓ to WAIT↓ WAIT low-level width Write data setup time Write data hold time WR low-level width Delay time from ASTB↓ to RD↓ Delay time from ASTB↓ to WR↓ Delay time from RD↑ to ASTB↑ at external fetch Hold time from RD↑ to address at external fetch Write data output time from RD↑ Write data output time from WR↓ Hold time from WR↑ to address Delay time from WAIT↑ to RD↑ Delay time from WAIT↑ to WR↑ tRDWD tWRWD tWRADH tWTRD tWTWR 40 20 0.8tCY – 30 0.5tCY 0.5tCY 120 1.2tCY + 60 2.5tCY + 50 2.5tCY + 50 ns ns ns ns ns tRDADH 0.8tCY – 30 1.2tCY + 60 ns tWRWT tWTL tWDS tWDH tWRL1 tASTRD tASTWR tRDAST (0.5 + 2n)tCY + 10 60 10 (1.5 + 2n)tCY – 30 10 2tCY – 30 0.8tCY – 30 1.2tCY 0 (1.5 + 2n)tCY – 40 (2.5 + 2n)tCY – 40 tCY – 75 tCY – 60 tCY – 50 (2 + 2n)tCY 0 Conditions MIN. 0.3tCY 30 10 (2 + 2n)tCY – 108 (3 + 2n)tCY – 120 200 (2 + 2n)tCY – 148 (3 + 2n)tCY – 162 MAX. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Caution Remarks TCY can only be used when the MIN. value is 0.4 µs. 1. 2. 3. tCY = TCY/4 n indicates the number of waits. CL = 100 pF (CL indicates the load capacitance of the AD0 to AD7, AD8 to AD15, RD, WR, WAIT, and ASTB pins.) 50 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (2) Read/Write Operation (TA = –40 to +85°C, VDD = 1.8 to 2.7 V) (3/3) Parameter ASTB high-level width Address setup time Address hold time Input time from address to data Symbol tASTH tADS tADH tADD1 tADD2 Output time from RD↓ to address Input time from RD↓ to data tRDAD tRDD1 tRDD2 Read data hold time RD low-level width tRDH tRDL1 tRDL2 Input time from RD↓ to WAIT↓ tRDWT1 tRDWT2 Input time from WR↓ to WAIT↓ WAIT low-level width Write data setup time Write data hold time WR low-level width Delay time from ASTB↓ to RD↓ Delay time from ASTB↓ to WR↓ Delay time from RD↑ to ASTB↑ at external fetch Hold time from RD↑ to address at external fetch Write data output time from RD↑ Write data output time from WR↓ Hold time from WR↑ to address Delay time from WAIT↑ to RD↑ Delay time from WAIT↑ to WR↑ tRDWD tWRWD tWRADH tWTRD tWTWR 40 40 0.8tCY – 60 0.5tCY 0.5tCY 240 1.2tCY + 120 2.5tCY + 100 2.5tCY + 100 ns ns ns ns ns tRDADH 0.8tCY – 60 1.2tCY + 120 ns tWRWT tWTL tWDS tWDH tWRL1 tASTRD tASTWR tRDAST (0.5 + 2n)tCY + 10 60 20 (1.5 + 2n)tCY – 60 20 2tCY – 60 0.8tCY – 60 1.2tCY 0 (1.5 + 2n)tCY – 92 (2.5 + 2n)tCY – 92 tCY – 350 tCY – 132 tCY – 100 (2 + 2n)tCY 0 Conditions MIN. 0.3tCY 120 20 (2 + 2n)tCY – 233 (3 + 2n)tCY – 240 400 (2 + 2n)tCY – 325 (3 + 2n)tCY – 332 MAX. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Caution Remarks TCY can only be used when the MIN. value is 1.6 µs. 1. 2. 3. tCY = TCY/4 n indicates the number of waits. CL = 100 pF (CL indicates the load capacitance of the AD0 to AD7, AD8 to AD15, RD, WR, WAIT, and ASTB pins.) Data Sheet U14042EJ4V0DS 51 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (3) Serial Interface (TA = –40 to +85°C, VDD = 1.8 to 5.5 V) (a) 3-wire serial I/O mode (SCK3n... Internal clock output) Parameter SCK3n cycle time Symbol tKCY1 Conditions 4.5 V ≤ VDD ≤ 5.5 V 3.0 V ≤ VDD < 4.5 V 2.7 V ≤ VDD < 3.0 V 1.8 V ≤ VDD < 2.7 V SCK3n high-/ low-level width SI3n setup time (to SCK3n↑) tSIK1 tKH1, tKL1 3.0 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 3.0 V 3.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 3.0 V 1.8 V ≤ VDD < 2.7 V SI3n hold time (from SCK3n↑) Delay time from SCK3n↓ to SO3n output tKSO1 tKSI1 4.5 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 4.5 V C = 100 pF Note MIN. 666 954 1600 3200 tKCY1/2 – 50 tKCY1/2 – 100 100 150 300 300 400 TYP. MAX. Unit ns ns ns ns ns ns ns ns ns ns ns 4.5 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 4.5 V 200 300 ns ns Note C is the load capacitance of the SCK3n and SO3n output lines. (b) 3-wire serial I/O mode (SCK3n... External clock input) Parameter SCK3n cycle time Symbol tKCY2 Conditions 4.5 V ≤ VDD ≤ 5.5 V 3.0 V ≤ VDD < 4.5 V 2.7 V ≤ VDD < 3.0 V 1.8 V ≤ VDD < 2.7 V SCK3n high-/ low-level width tKH2, tKL2 4.5 V ≤ VDD ≤ 5.5 V 3.0 V ≤ VDD < 4.5 V 2.7 V ≤ VDD < 3.0 V 1.8 V ≤ VDD < 2.7 V SI3n setup time (to SCK3n↑) SI3n hold time (from SCK3n↑) Delay time from SCK3n↓ to SO3n output tKSO2 tKSI2 4.5 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 4.5 V C = 100 pF Note MIN. 666 800 1600 3200 333 400 800 1600 100 TYP. MAX. Unit ns ns ns ns ns ns ns ns ns tSIK2 300 400 200 300 ns ns ns ns 4.5 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 4.5 V Note C is the load capacitance of the SO3n output line. Remark n = 0, 1 52 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (c) UART mode (dedicated baud-rate generator output) Parameter Transfer rate Symbol Conditions 4.5 V ≤ VDD ≤ 5.5 V 3.0 V ≤ VDD < 4.5 V 2.7 V ≤ VDD < 3.0 V 1.8 V ≤ VDD < 2.7 V MIN. TYP. MAX. 187500 131031 78125 39063 Unit bps bps bps bps (d) UART mode (external clock input) Parameter ASCK0 cycle time Symbol tKCY3 Conditions 4.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 4.0 V 1.8 V ≤ VDD < 2.7 V ASCK0 high-/low-level width tKH3, tKL3 4.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 4.0 V 1.8 V ≤ VDD < 2.7 V Transfer rate 4.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 4.0 V 1.8 V ≤ VDD < 2.7 V MIN. 800 1600 3200 400 800 1600 39063 19531 9766 TYP. MAX. Unit ns ns ns ns ns ns bps bps bps (e) UART mode (infrared data transfer mode) Parameter Transfer rate Allowable bit rate error Output pulse width Input pulse width Symbol Conditions 4.0 V ≤ VDD ≤ 5.5 V 4.0 V ≤ VDD ≤ 5.5 V 4.0 V ≤ VDD ≤ 5.5 V 4.0 V ≤ VDD ≤ 5.5 V 1.2 4/fX MIN. MAX. 131031 ±0.87 0.24/fbrNote Unit bps % µs µs Note fbr: Specified baud rate Data Sheet U14042EJ4V0DS 53 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY A/D Converter Characteristics (TA = –40 to +85°C, VDD = AVDD = 1.8 to 5.5 V, AVSS = VSS = 0 V) Parameter Resolution Overall errorNote Symbol Conditions MIN. 8 TYP. 8 MAX. 8 ±0.4 ±0.6 ±1.2 Unit bit %FSR %FSR %FSR 4.0 V ≤ AVREF ≤ 5.5 V 2.7 V ≤ AVREF < 4.0 V 1.8 V ≤ AVREF < 2.7 V Conversion time tCONV 4.5 V ≤ AVDD ≤ 5.5 V 4.0 V ≤ AVDD < 4.5 V 2.7 V ≤ AVDD < 4.0 V 1.8 V ≤ AVDD < 2.7 V 12 14 17 28 0 1.8 96 96 96 96 AVREF AVDD 40 µs µs µs µs V V kΩ Analog input voltage Reference voltage Resistance between AVREF and AVSS VIAN AVREF RREF When A/D converter not operating 20 Note Excludes quantization error (±1/2 LSB). This value is indicated as a ratio (%FSR) to the full-scale value. Remark The impedance of the analog input pins is shown below. [Equivalent circuit] R1 ANIn (n = 0 to 3) C1 C2 C3 R2 [Parameter value] (TYP.) AVDD 2.7 V 4.5 V R1 12 kΩ 4 kΩ R2 8.0 kΩ 2.7 kΩ C1 3.0 pF 3.0 pF C2 3.0 pF 1.4 pF C3 2.0 pF 2.0 pF Data Memory STOP Mode Low Supply Voltage Data Retention Characteristics (TA = –40 to +85°C) Parameter Data retention power supply voltage Data retention power supply current Release signal set time Oscillation stabilization time Symbol VDDDR Conditions MIN. 1.6 TYP. MAX. 5.5 Unit V IDDDR Subsystem clock stop (XT1 = VDD) and feed-back resistor disconnected 0 Release by RESET Release by interrupt request 0.1 30 µA µs tSREL tWAIT 217/fx Note s s Note Selection of 212/fX and 214/fX to 217/fX is possible using bits 0 to 2 (OSTS0 to OSTS2) of the oscillation stabilization time select register (OSTS). 54 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 12.2 µPD780021AY, 780022AY, 780023AY, 780024AY, and Conventional Products of µPD780021A, 780022A, 780023A,780024A Absolute Maximum Ratings (TA = 25°C) Parameter Supply voltage Symbol VDD AVDD AVREF AVSS Conditions Ratings –0.3 to +6.5 –0.3 to VDD + –0.3 to VDD + 0.3Note 0.3Note Unit V V V V V –0.3 to +0.3 P00 to P03, P10 to P17, P20 to P25, P34 to P36, P40 to P47, P50 to P57, P64 to P67, P70 to P75, X1, X2, XT1, XT2, RESET –0.3 to VDD + 0.3Note Input voltage VI1 VI2 P30 to P33 N-ch open-drain Without pull-up resistor With pull-up resistor –0.3 to + 6.5 –0.3 to VDD + –0.3 to VDD + 0.3Note 0.3Note V V V V Output voltage Analog input voltage VO V AN P10 to P17 Analog input pin AVSS – 0.3 to AVREF0 + 0.3Note and –0.3 to VDD + 0.3Note –10 –15 –15 20 Output current, high IOH Per pin Total for P00 to P03, P40 to P47, P50 to P57, P64 to P67, P70 to P75 Total for P20 to P25, P30 to P36 mA mA mA mA Output current, low IOL Per pin for P00 to P03, P20 to P25, P34 to P36, P40 to P47, P64 to P67, P70 to P75 Per pin for P30 to P33, P50 to P57 Total for P00 to P03, P40 to P47, P64 to P67, P70 to P75 Total for P20 to P25 Total for P30 to P36 Total for P50 to P57 30 50 mA mA 20 100 100 –40 to +85 mA mA mA °C Operating ambient temperature Storage temperature TA Tstg –65 to +150 °C Note 6.5 V or below Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any parameter. That is, the absolute maximum ratings are rated values at which the product is on the verge of suffering physical damage, and therefore the product must be used under conditions that ensure that the absolute maximum ratings are not exceeded. Caution Remark Unless otherwise specified, the characteristic of alternate-function pins are the same as those of port pins. Data Sheet U14042EJ4V0DS 55 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Capacitance (TA = 25°C, VDD = VSS = 0 V) Parameter Input capacitance I/O capacitance CIO Symbol CIN f = 1 MHz Unmeasured pins returned to 0 V. f = 1 MHz Unmeasured pins returned to 0 V. P00 P34 P50 P70 to to to to P03, P20 to P25, P36, P40 to P47, P57, P64 to P67, P75 15 pF Conditions MIN. TYP. MAX. 15 Unit pF P30 to P33 20 pF Remark Unless otherwise specified, the characteristic of alternate-function pins are the same as those of port pins. Main System Clock Oscillator Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V) Recommended Circuit Resonator Ceramic resonator Parameter Oscillation Conditions 4.0 V ≤ VDD ≤ 5.5 V MIN. 1.0 1.0 TYP. MAX. 8.38 5.0 4 Unit MHz IC X2 X1 frequency Oscillation (fX)Note 1 1.8 V ≤ VDD < 4.0 V After VDD reaches oscillation voltage range MIN. 4.0 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 4.0 V 4.0 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 4.0 V 4.0 V ≤ VDD ≤ 5.5 V ms C2 C1 stabilization timeNote 2 Crystal resonator C2 C1 IC X2 X1 Oscillation frequency (fX)Note 1 Oscillation stabilization timeNote 2 1.0 1.0 8.38 5.0 10 30 MHz ms External clock X2 X1 X1 input frequency X1 input high-/low-level width (tXH, tXL) (fX)Note 1 1.0 1.0 50 85 8.38 5.0 500 500 MHz ns 1.8 V ≤ VDD < 4.0 V 4.0 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 4.0 V Notes 1. Indicates only oscillator characteristics. Refer to AC Characteristics for instruction execution time. 2. Time required to stabilize oscillation after reset or STOP mode release. Cautions 1. When using the main system clock oscillator, wire as follows in the area enclosed by the broken lines in the above figures to avoid an adverse effect from wiring capacitance. • Keep the wiring length as short as possible. • Do not cross the wiring with the other signal lines. • Do not route the wiring near a signal line through which a high fluctuating current flows. • Always make the ground point of the oscillator capacitor the same potential as VSS1. • Do not ground the capacitor to a ground pattern through which a high current flows. • Do not fetch signals from the oscillator. 2. When the main system clock is stopped and the system is operating on the subsystem clock, wait until the oscillation stabilization time has been secured by the program before switching back to the main system clock. 56 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Subsystem Clock Oscillator Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V) Resonator Crystal resonator Recommended Circuit XT2 R C4 Parameter Oscillation frequency (fXT)Note 1 Oscillation stabilization timeNote 2 XT1 input frequency (fXT)Note 1 XT1 input high-/low-level width (tXTH , tXTL) Conditions MIN. 32 TYP. 32.768 MAX. 35 Unit kHz XT1 IC C3 4.0 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 4.0 V 32 1.2 2 10 38.5 s External clock kHz XT2 XT1 12 15 µs Notes 1. Indicates only oscillator characteristics. Refer to AC Characteristics for instruction execution time. 2. Time required to stabilize oscillation after VDD reaches oscillation voltage range MIN. Cautions 1. When using the subsystem clock oscillator, wire as follows in the area enclosed by the broken lines in the above figures to avoid an adverse effect from wiring capacitance. • Keep the wiring length as short as possible. • Do not cross the wiring with the other signal lines. • Do not route the wiring near a signal line through which a high fluctuating current flows. • Always make the ground point of the oscillator capacitor the same potential as VSS1. • Do not ground the capacitor to a ground pattern through which a high current flows. • Do not fetch signals from the oscillator. 2. The subsystem clock oscillator is designed as a low-amplitude circuit for reducing power consumption, and is more prone to malfunction due to noise than the main system clock oscillator. Particular care is therefore required with the wiring method when the subsystem clock is used. Remark For the resonator selection and oscillator constant, customers are required to either evaluate the oscillation themselves or apply to the resonator manufacturer for evaluation. Data Sheet U14042EJ4V0DS 57 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Recommended Oscillator Constant Main system clock: Ceramic resonator (TA = –40 to +85°C) Manufacturer Part Number Frequency (MHz) Murata Mfg. Co., Ltd. CSBFB1M00J58 CSBLA1M00J58 CSTCC2M00G56 CSTLS2M00G56 CSTCC3M58G53 CSTLS3M58G53 CSTCR4M00G53 CSTLS4M00G53 CSTCR4M19G53 CSTLS4M19G53 CSTCR4M91G53 CSTLS4M91G53 CSTCR5M00G53 CSTLS5M00G53 CSTCE8M00G52 CSTLS8M00G53 CSTCE8M38G52 CSTLS8M38G53 CSTCE10M0G52 CSTLS10M0G53 TDK CCR3.58MC3 CCR4.19MC3 CCR5.0MC3 CCR8.0MC5 CCR8.38MC5 1.00 1.00 2.00 2.00 3.58 3.58 4.00 4.00 4.19 4.19 4.91 4.91 5.00 5.00 8.00 8.00 8.38 8.38 10.00 10.00 3.58 4.19 5.00 8.00 8.38 Recommended Circuit Constant C1 (pF) 100 100 On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip C2 (pF) 100 100 On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip On-chip R1 (kΩ) 2.2 2.2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Oscillation Voltage Range MIN. (V) 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 1.8 3.0 3.0 3.0 3.0 4.5 4.5 1.8 1.8 1.8 2.0 2.0 MAX. (V) 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 5.5 Caution The oscillator constant is a reference value based on evaluation in specific environments by the resonator manufacturer. If the oscillator characteristics need to be optimized in the actual application, request the resonator manufacturer for evaluation on the implementation circuit. Note that the oscillation voltage and oscillation frequency merely indicate the characteristics of the oscillator. Use the internal operation conditions of the µPD780024A, 780024AY Subseries within the specifications of the DC and AC characteristics. 58 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY DC Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V) Parameter Output current, high Output current, low Symbol IOH Per pin All pins IOL Conditions MIN. TYP. MAX. –1 –15 10 Unit mA mA mA Per pin for P00 to P03, P20 to P25, P34 to P36, P40 to P47, P64 to P67, P70 to P75 Per pin for P30 to P33, P50 to P57 Total for P00 to P03, P40 to P47, P64 to P67, P70 to P75 Total for P20 to P25 Total for P30 to P36 Total for P50 to P57 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 15 20 10 70 70 0.7VDD 0.8VDD 0.8VDD 0.85VDD 0.7VDD 0.8VDD VDD – 0.5 VDD – 0.2 0.8VDD 0.9VDD 0 0 0 0 0 0 0 0 0 0 0 VDD – 1.0 VDD – 0.5 VDD VDD VDD VDD 5.5 5.5 VDD VDD VDD VDD 0.3VDD 0.2VDD 0.2VDD 0.15VDD 0.3VDD 0.2VDD 0.1VDD 0.4 0.2 0.2VDD 0.1VDD VDD VDD 2.0 0.4 2.0 0.4 mA mA mA mA mA V V V V V V V V V V V V V V V V V V V V V V V V V V Input voltage, high VIH1 P10 to P17, P21, P24, P35, P40 to P47, P50 to P57, P64 to P67, P74, P75 VIH2 P00 to P03, P20, P22, P23, P25, P34, P36, P70 to P73, RESET VIH3 P30 to P33 (N-ch open-drain) VIH4 X1, X2 VIH5 XT1, XT2 4.0 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 4.0 V Input voltage, low VIL1 P10 to P17, P21, P24, P35, P40 to P47, P50 to P57, P64 to P67, P74, P75 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 4.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 4.0 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 4.0 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 4.0 V VIL2 P00 to P03, P20, P22, P23, P25, P34, P36, P70 to P73, RESET VIL3 P30 to P33 VIL4 X1, X2 VIL5 XT1, XT2 Output voltage, high Output voltage, low VOH1 4.0 V ≤ VDD ≤ 5.5 V, IOH = –1 mA 1.8 V ≤ VDD < 4.0 V, IOH = –100 µA 4.0 V ≤ VDD ≤ 5.5 V, IOL = 15 mA VOL1 P30 to P33 P50 to P57 P00 to P03, P20 to P25, P34 to P36, 4.0 V ≤ VDD ≤ 5.5 V, P40 to P47, P64 to P67, P70 to P75 VOL2 IOL = 400 µA IOL = 1.6 mA 0.5 V Remark Unless otherwise specified, the characteristics of alternate-function pins are the same as those of port pins. Data Sheet U14042EJ4V0DS 59 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY DC Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V) Parameter Input leakage current, high Symbol ILIH1 VIN = VDD Conditions P00 to P03, P10 to P17, P20 to P25, P34 to P36, P40 to P47, P50 to P57, P60 to P67, P70 to P75, RESET X1, X2, XT1, XT2 VIN = 5.5 V VIN = 0 V P30 to P33Note 1 P00 to P03, P10 to P17, P20 to P25, P34 to P36, P40 to P47, P50 to P57, P64 to P67, P70 to P75, RESET X1, X2, XT1, XT2 P30 to VOUT = VDD VOUT = 0 V VIN = 0 V, P30, P31, P32Note 2, P33Note 2 VIN = 0 V, P00 to P03, P20 to P25, P34 to P36, P40 to P47, P50 to P57, P64 to P67, P70 to P75 15 15 30 30 P33Note 1 MIN. TYP. MAX. 3 Unit µA ILIH2 ILIH3 Input leakage current, low ILIL1 20 3 –3 µA µA µA ILIL2 ILIL3 Output leakage current, high Output leakage current, low Mask option pull-up resistance Software pullup resistance ILOH ILOL R1 R2 –20 –3 3 –3 90 90 µA µA µA µA kΩ kΩ Notes 1. µPD780021A, 780022A, 780023A, 780024A: When pull-up resistors are not connected to P30 to P33 (specified by the mask option). µPD780021AY, 780022AY, 780023AY, 780024AY: When pull-up resistors are not connected to P30 and P31 (specified by the mask option). 2. Only for the µPD780021A, 780022A, 780023A, and 780024A. Remark Unless otherwise specified, the characteristics of alternate-function pins are the same as those of port pins. 60 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY DC Characteristics (TA = –40 to +85°C, VDD = 1.8 to 5.5 V) Parameter Power supply currentNote 1 Symbol Conditions IDD1Note 2 8.38 MHz VDD = 5.0 V ±10%Note 3 crystal oscillation operating mode 5.00 MHz VDD = 3.0 V ±10%Note 3 crystal oscillation operating mode VDD = 2.0 V ±10%Note 4 MIN. When A/D converter is stopped When A/D converter is operatingNote 6 When A/D converter is stopped When A/D converter is operatingNote 6 When A/D converter is stopped When A/D converter is operatingNote 6 IDD2 8.38 MHz VDD = 5.0 V ±10%Note 3 crystal oscillation HALT mode 5.00 MHz crystal oscillation HALT mode VDD = 2.0 V ±10%Note 4 VDD = 3.0 V ±10%Note 3 When peripheral functions are stopped When peripheral functions are operating When peripheral functions are stopped When peripheral functions are operating When peripheral functions are stopped When peripheral functions are operating I DD3 TYP. 5.5 6.5 2 3 0.4 1.4 1.1 MAX. 11 13 4 6 1.5 4.2 2.2 4.7 Unit mA mA mA mA mA mA mA mA mA mA mA mA 0.35 0.7 1.7 0.15 0.4 1.1 32.768 kHz crystal oscillation operating modeNote 5 VDD = 5.0 V ±10% VDD = 3.0 V ±10% VDD = 2.0 V ±10% VDD = 5.0 V ±10% VDD = 3.0 V ±10% VDD = 2.0 V ±10% VDD = 5.0 V ±10% VDD = 3.0 V ±10% VDD = 2.0 V ±10% 40 20 10 30 6 2 0.1 0.05 0.05 80 40 20 60 18 10 30 10 10 µA µA µA µA µA µA µA µA µA IDD4 32.768 kHz crystal oscillation HALT modeNote 5 IDD5 XT1 = VDD STOP mode When feedback resistor is not used Notes 1. Total current through the internal power supply (VDD0, VDD1) (except the current through pull-up resistors of ports). 2. IDD1 includes the peripheral operation current. 3. When the processor clock control register (PCC) is set to 00H. 4. When PCC is set to 02H. 5. When main system clock operation is stopped. 6. Includes the current through the AVDD pin. Data Sheet U14042EJ4V0DS 61 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY AC Characteristics (1) Basic Operation (TA = –40 to +85°C, VDD = 1.8 to 5.5 V) Parameter Cycle time (Min. instruction execution time) Symbol TCY Operating with main system clock Conditions 4.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 4.0 V 1.8 V ≤ VDD < 2.7 V Operating with subsystem clock TI00, TI01 input high-/low-level width TI50, TI51 input frequency TI50, TI51 input high-/low-level width Interrupt request input high-/lowlevel width RESET low-level width tRSL tINTH, tINTL tTIH5, tTIL5 fTI5 tTIH0, tTIL0 4.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 4.0 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V INTP0 to INTP3, P40 to P47 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V 2.7 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 2.7 V MIN. 0.238 0.4 1.6 103.9Note 1 2/fsam+0.1Note 2 2/fsam+0.2Note 2 2/fsam+0.5Note 2 0 0 100 1.8 1 2 10 20 4 275 122 TYP. MAX. 16 16 16 125 Unit µs µs µs µs µs µs µs MHz kHz ns ns µs µs µs µs Notes 1. Value when the external clock is used. When a crystal resonator is used, it is 114 µs (MIN.). 2. Selection of fsam = fX, fX/4, fX/64 is possible using bits 0 and 1 (PRM00, PRM01) of prescaler mode register 0 (PRM0). However, if the TI00 valid edge is selected as the count clock, the value becomes fsam = fX/8. 62 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY TCY vs. VDD (main system clock operation) 16.0 10.0 Cycle time TCY [ µ S] 5.0 Operation guaranteed range 2.0 1.6 1.0 0.4 0.238 0.1 0 1.0 1.8 2.0 2.7 Supply voltage VDD [V] 3.0 4.0 5.0 5.5 6.0 Data Sheet U14042EJ4V0DS 63 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (2) Read/Write Operation (TA = –40 to +85°C, VDD = 4.0 to 5.5 V) Parameter ASTB high-level width Address setup time Address hold time Data input time from address Symbol tASTH tADS tADH tADD1 tADD2 Address output time from RD↓ Data input time from RD↓ tRDAD tRDD1 tRDD2 Read data hold time RD low-level width tRDH tRDL1 tRDL2 Input time from RD↓ to WAIT↓ tRDWT1 tRDWT2 Input time from WR↓ to WAIT↓ WAIT low-level width Write data setup time Write data hold time WR low-level width Delay time from ASTB↓ to RD↓ Delay time from ASTB↓ to WR↓ Delay time from RD↑ to ASTB↑ at external fetch Address hold time from RD↑ at external fetch Write data output time from RD↑ Write data output time from WR↓ Address hold time from WR↑ Delay time from WAIT↑ to RD↑ Delay time from WAIT↑ to WR↑ tRDWD tWRWD tWRADH tWTRD tWTWR 40 10 0.8tCY – 15 0.8tCY 0.8tCY 60 1.2tCY + 30 2.5tCY + 25 2.5tCY + 25 ns ns ns ns ns tRDADH 0.8tCY – 15 1.2tCY + 30 ns tWRWT tWTL tWDS tWDH tWRL1 tASTRD tASTWR tRDAST (0.5 + n)tCY + 10 60 6 (1.5 + 2n)tCY – 15 6 2tCY – 15 0.8tCY – 15 1.2tCY 0 (1.5 + 2n)tCY – 33 (2.5 + 2n)tCY – 33 tCY – 43 tCY – 43 tCY – 25 (2 + 2n)tCY 0 Conditions MIN. 0.3tCY 20 6 (2 + 2n)tCY – 54 (3 + 2n)tCY – 60 100 (2 + 2n)tCY – 87 (3 + 2n)tCY – 93 MAX. (1/3) Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Caution Remarks TCY can only be used when the MIN. value is 0.238 µs. 1. 2. 3. tCY = TCY/4 n indicates the number of waits. CL = 100 pF (CL indicates the load capacitance of the AD0 to AD7, A8 to A15, RD, WR, WAIT, and ASTB pins.) 64 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (2) Read/Write Operation (TA = –40 to +85°C, VDD = 2.7 to 4.0 V) (2/3) Parameter ASTB high-level width Address setup time Address hold time Input time from address to data Symbol tASTH tADS tADH tADD1 tADD2 Output time from RD↓ to address Input time from RD↓ to data tRDAD tRDD1 tRDD2 Read data hold time RD low-level width tRDH tRDL1 tRDL2 Input time from RD↓ to WAIT↓ tRDWT1 tRDWT2 Input time from WR↓ to WAIT↓ WAIT low-level width Write data setup time Write data hold time WR low-level width Delay time from ASTB↓ to RD↓ Delay time from ASTB↓ to WR↓ Delay time from RD↑ to ASTB↑ at external fetch Hold time from RD↑ to address at external fetch Write data output time from RD↑ Write data output time from WR↓ Hold time from WR↑ to address Delay time from WAIT↑ to RD↑ Delay time from WAIT↑ to WR↑ tRDWD tWRWD tWRADH tWTRD tWTWR 40 20 0.8tCY – 30 0.5tCY 0.5tCY 120 1.2tCY + 60 2.5tCY + 50 2.5tCY + 50 ns ns ns ns ns tRDADH 0.8tCY – 30 1.2tCY + 60 ns tWRWT tWTL tWDS tWDH tWRL1 tASTRD tASTWR tRDAST (0.5 + 2n)tCY + 10 60 10 (1.5 + 2n)tCY – 30 10 2tCY – 30 0.8tCY – 30 1.2tCY 0 (1.5 + 2n)tCY – 40 (2.5 + 2n)tCY – 40 tCY – 75 tCY – 60 tCY – 50 (2 + 2n)tCY 0 Conditions MIN. 0.3tCY 30 10 (2 + 2n)tCY – 108 (3 + 2n)tCY – 120 200 (2 + 2n)tCY – 148 (3 + 2n)tCY – 162 MAX. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Caution Remarks TCY can only be used when the MIN. value is 0.4 µs. 1. 2. 3. tCY = TCY/4 n indicates the number of waits. CL = 100 pF (CL indicates the load capacitance of the AD0 to AD7, AD8 to AD15, RD, WR, WAIT, and ASTB pins.) Data Sheet U14042EJ4V0DS 65 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (2) Read/Write Operation (TA = –40 to +85°C, VDD = 1.8 to 2.7 V) (3/3) Parameter ASTB high-level width Address setup time Address hold time Input time from address to data Symbol tASTH tADS tADH tADD1 tADD2 Output time from RD↓ to address Input time from RD↓ to data tRDAD tRDD1 tRDD2 Read data hold time RD low-level width tRDH tRDL1 tRDL2 Input time from RD↓ to WAIT↓ tRDWT1 tRDWT2 Input time from WR↓ to WAIT↓ WAIT low-level width Write data setup time Write data hold time WR low-level width Delay time from ASTB↓ to RD↓ Delay time from ASTB↓ to WR↓ Delay time from RD↑ to ASTB↑ at external fetch Hold time from RD↑ to address at external fetch Write data output time from RD↑ Write data output time from WR↓ Hold time from WR↑ to address Delay time from WAIT↑ to RD↑ Delay time from WAIT↑ to WR↑ tRDWD tWRWD tWRADH tWTRD tWTWR 40 40 0.8tCY – 60 0.5tCY 0.5tCY 240 1.2tCY + 120 2.5tCY + 100 2.5tCY + 100 ns ns ns ns ns tRDADH 0.8tCY – 60 1.2tCY + 120 ns tWRWT tWTL tWDS tWDH tWRL1 tASTRD tASTWR tRDAST (0.5 + 2n)tCY + 10 60 20 (1.5 + 2n)tCY – 60 20 2tCY – 60 0.8tCY – 60 1.2tCY 0 (1.5 + 2n)tCY – 92 (2.5 + 2n)tCY – 92 tCY – 350 tCY – 132 tCY – 100 (2 + 2n)tCY 0 Conditions MIN. 0.3tCY 120 20 (2 + 2n)tCY – 233 (3 + 2n)tCY – 240 400 (2 + 2n)tCY – 325 (3 + 2n)tCY – 332 MAX. Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Caution Remarks TCY can only be used when the MIN. value is 1.6 µs. 1. 2. 3. tCY = TCY/4 n indicates the number of waits. CL = 100 pF (CL indicates the load capacitance of the AD0 to AD7, AD8 to AD15, RD, WR, WAIT, and ASTB pins.) 66 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (3) Serial Interface (TA = –40 to +85°C, VDD = 1.8 to 5.5 V) (a) 3-wire serial I/O mode (SCK3n... Internal clock output) Parameter SCK3n cycle time Symbol tKCY1 Conditions 4.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 4.0 V 1.8 V ≤ VDD < 2.7 V SCK3n high-/ low-level width SI3n setup time (to SCK3n↑) tSIK1 tKH1, tKL1 4.0 V ≤ VDD ≤ 5.5 V 1.8 V ≤ VDD < 4.0 V 4.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 4.0 V 1.8 V ≤ VDD < 2.7 V SI3n hold time (from SCK3n↑) Delay time from SCK3n↓ to SO3n output tKSO1 C = 100 pF Note MIN. 954 1600 3200 tKCY1/2 – 50 tKCY1/2 – 100 100 150 300 400 TYP. MAX. Unit ns ns ns ns ns ns ns ns ns tKSI1 300 ns Note C is the load capacitance of the SCK3n and SO3n output lines. (b) 3-wire serial I/O mode (SCK3n... External clock input) Parameter SCK3n cycle time Symbol tKCY2 Conditions 4.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 4.0 V 1.8 V ≤ VDD < 2.7 V SCK3n high-/ low-level width tKH2, tKL2 4.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 4.0 V 1.8 V ≤ VDD < 2.7 V SI3n setup time (to SCK3n↑) SI3n hold time (from SCK3n↑) Delay time from SCK3n↓ to SO3n output tKSO2 C = 100 pF Note MIN. 800 1600 3200 400 800 1600 100 TYP. MAX. Unit ns ns ns ns ns ns ns tSIK2 tKSI2 400 ns 300 ns Note C is the load capacitance of the SO3n output line. Remark Conventional products of µPD780021A, 780022A, 780023A, 780024A: n = 0 or 1 µPD780021AY, 780022AY, 780023AY, 780024AY: n = 0 Data Sheet U14042EJ4V0DS 67 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (c) UART mode (dedicated baud-rate generator output) Parameter Transfer rate Symbol Conditions 4.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 4.0 V 1.8 V ≤ VDD < 2.7 V MIN. TYP. MAX. 131031 78125 39063 Unit bps bps bps (d) UART mode (external clock input) Parameter ASCK0 cycle time Symbol tKCY3 Conditions 4.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 4.0 V 1.8 V ≤ VDD < 2.7 V ASCK0 high-/low-level width tKH3, tKL3 4.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 4.0 V 1.8 V ≤ VDD < 2.7 V Transfer rate 4.0 V ≤ VDD ≤ 5.5 V 2.7 V ≤ VDD < 4.0 V 1.8 V ≤ VDD < 2.7 V MIN. 800 1600 3200 400 800 1600 39063 19531 9766 TYP. MAX. Unit ns ns ns ns ns ns bps bps bps (e) UART mode (infrared data transfer mode) Parameter Transfer rate Allowable bit rate error Output pulse width Input pulse width Symbol Conditions 4.0 V ≤ VDD ≤ 5.5 V 4.0 V ≤ VDD ≤ 5.5 V 4.0 V ≤ VDD ≤ 5.5 V 4.0 V ≤ VDD ≤ 5.5 V 1.2 4/fX MIN. MAX. 131031 ±0.87 0.24/fbrNote Unit bps % µs µs Note fbr: Specified baud rate 68 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (f) I2C bus mode (µPD780021AY, 780022AY, 780023AY, 780024AY only) Parameter SCL0 clock frequency Bus free time (between stop and start conditions) Hold timeNote 1 SCL0 clock low-level width SCL0 clock high-level width Start/restart condition setup time Data hold time CBUS-compatible master I2C bus Data setup time SDA0 and SCL0 signal rise time SDA0 and SCL0 signal fall time Stop condition setup time Spike pulse width controlled by input filter Capacitive load per bus line tSU:DAT tR tF tSU:STO tSP Cb tHD:STA tLOW tHIGH tSU:STA tHD:DAT 4.0 4.7 4.0 4.7 5.0 0Note 2 250 — — 4.0 — — — — — — — — — 1000 300 — — 400 0.6 1.3 0.6 0.6 — 0Note 2 100Note 4 20 + 0.1CbNote 5 20 + 0.1CbNote 5 0.6 0 — — — — — — 0.9 Note 3 — 300 300 — 50 400 Symbol fCLK tBUF Standard Mode MIN. MAX. 0 4.7 100 — High-Speed Mode MIN. MAX. 0 1.3 400 — Unit kHZ µs µs µs µs µs µs µs ns ns ns µs ns pF Notes 1. In the start condition, the first clock pulse is generated after this hold time. 2. To fill in the undefined area of the SCL0 falling edge, it is necessary for the device to internally provide at least 300 ns of hold time for the SDA0 signal (which is VIHmin. of the SCL0 signal). 3. If the device does not extend the SCL0 signal low hold time (tLOW), only the maximum data hold time tHD:DAT needs to be fulfilled. 4. The high-speed mode I2C bus is available in a standard mode I2C bus system. At this time, the conditions described below must be satisfied. • If the device does not extend the SCL0 signal low state hold time tSU:DAT ≥ 250 ns • If the device extends the SCL0 signal low state hold time Be sure to transmit the next data bit to the SDA0 line before the SCL0 line is released (tRmax. + tSU:DAT = 1000 + 250 = 1250 ns by standard mode I2C bus specification). 5. Cb: Total capacitance per bus line (unit: pF) Data Sheet U14042EJ4V0DS 69 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY A/D Converter Characteristics (TA = –40 to +85°C, VDD = AVDD = 1.8 to 5.5 V, AVSS = VSS = 0 V) Parameter Resolution Overall errorNote 4.0 V ≤ AVREF ≤ 5.5 V 2.7 V ≤ AVREF < 4.0 V 1.8 V ≤ AVREF < 2.7 V Conversion time tCONV 4.0 V ≤ AVDD ≤ 5.5 V 2.7 V ≤ AVDD < 4.0 V 1.8 V ≤ AVDD < 2.7 V Analog input voltage Reference voltage Resistance between AVREF and AVSS VIAN AVREF RREF When A/D converter not operating 14 19 28 0 1.8 20 40 Symbol Conditions MIN. 8 TYP. 8 MAX. 8 ±0.4 ±0.6 ±1.2 96 96 96 AVREF AVDD Unit bit %FSR %FSR %FSR µs µs µs V V kΩ Note Excludes quantization error (±1/2 LSB). This value is indicated as a ratio (%FSR) to the full-scale value. Remark The impedance of the analog input pins is shown below. [Equivalent circuit] R1 ANIn (n = 0 to 3) C1 C2 C3 R2 [Parameter value] (TYP.) AVDD 2.7 V 4.5 V R1 12 kΩ 4 kΩ R2 8.0 kΩ 2.7 kΩ C1 3.0 pF 3.0 pF C2 3.0 pF 1.4 pF C3 2.0 pF 2.0 pF Data Memory STOP Mode Low Supply Voltage Data Retention Characteristics (TA = –40 to +85°C) Parameter Data retention power supply voltage Data retention power supply current Release signal set time Oscillation stabilization time Symbol VDDDR Conditions MIN. 1.6 TYP. MAX. 5.5 Unit V IDDDR Subsystem clock stop (XT1 = VDD) and feed-back resistor disconnected 0 Release by RESET Release by interrupt request 0.1 30 µA µs tSREL tWAIT 217/fx Note s s Note Selection of 212/fX and 214/fX to 217/fX is possible using bits 0 to 2 (OSTS0 to OSTS2) of the oscillation stabilization time select register (OSTS). 70 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 12.3 Timing Chart AC Timing Test Points (excluding X1, XT1 inputs) 0.8VDD 0.2VDD Point of measurement 0.8VDD 0.2VDD Clock Timing 1/fX tXL tXH VIH4 (MIN.) VIL4 (MAX.) X1 input 1/fXT tXTL XT1 input tXTH VIH5 (MIN.) VIL5 (MAX.) TI Timing tTIL0 tTIH0 TI00, TI01 1/fT5 tTIL5 tTIH5 TI50, TI51 Data Sheet U14042EJ4V0DS 71 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Interrupt Request Input Timing tINTL tINTH INTP0 to INTP3 RESET Input Timing tRSL RESET 72 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Read/Write Operation External fetch (no wait): A8 to A15 Higher 8-bit address tADD1 AD0 to AD7 Lower 8-bit address tADS tASTH tADH Hi-Z tRDAD tRDD1 Instruction code tRDADH tRDAST ASTB RD tASTRD tRDL1 tRDH External fetch (wait insertion): A8 to A15 Higher 8-bit address tADD1 AD0 to AD7 Lower 8-bit address tADS tASTH tADH tRDAD Hi-Z tRDD1 Instruction code tRDADH tRDAST ASTB RD tASTRD WAIT tRDWT1 tWTL tWTRD tRDL1 tRDH Data Sheet U14042EJ4V0DS 73 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY External data access (no wait): A8 to A15 tADD2 AD0 to AD7 Lower 8-bit address tADS tASTH ASTB tADH Hi-Z tRDAD tRDD2 Higher 8-bit address Read Data Write data Hi-Z tRDH RD tASTRD WR tASTWR tWRL1 tRDL2 tRDWD tWRWD tWDS tWDH tWRADH External data access (wait insertion): A8 to A15 tADD2 AD0 to AD7 Lower 8-bit address Higher 8-bit address Hi-Z Hi-Z Read data tRDH Write data tADS tADH tASTH ASTB tRDAD tRDD2 tASTRD RD tRDL2 tRDWD tWRWD tWDS tWDH WR tASTWR WAIT tRDWT2 tWTL tWTRD tWRWT tWTL tWTWR tWRL1 tWRADH 74 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Serial Transfer Timing 3-wire serial I/O mode: tKCYm tKLm tKHm SCK3n tSIKm tKSIm SI3n tKSOm Input data SO3n Output data Remarks 1. m = 1, 2 2. µPD780021A, 780022A, 780023A, 780024A: n = 0, 1 µPD780021AY, 780022AY, 780023AY, 780024AY: n = 0 UART mode (external clock input): t KCY3 t KL3 t KH3 ASCK0 I2C bus mode (µPD780021AY, 780022AY, 780023AY, 780024AY only): tLOW SCL0 tHD:DAT tHD:STA tHIGH tSU:DAT tF tSU:STA tHD:STA tSP tSU:STO tR SDA0 tBUF Stop condition Start condition Restart condition Stop condition Data Sheet U14042EJ4V0DS 75 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Data Retention Timing (STOP Mode Release by RESET) Internal reset operation HALT mode STOP mode Operating mode Data retention mode VDD STOP instruction execution VDDDR tSREL RESET tWAIT Data Retention Timing (Standby Release Signal: STOP Mode Release by Interrupt Request Signal) HALT mode STOP mode Operating mode Data retention mode VDD STOP Instruction execution Standby release signal (interrupt request) VDDDR tSREL tWAIT 76 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 13. PACKAGE DRAWINGS 64-PIN PLASTIC SDIP (19.05mm(750)) 64 33 1 A 32 K J I L F D H G N M M C B R NOTES 1. Each lead centerline is located within 0.17 mm of its true position (T.P.) at maximum material condition. 2. Item "K" to center of leads when formed parallel. ITEM A B C D F G H I J K L M N R MILLIMETERS 58.0+0.68 -0.20 1.78 MAX. 1.778 (T.P.) 0.50 ± 0.10 0.9 MIN. 3.2 ± 0.3 0.51 MIN. 4.05+0.26 -0.20 5.08 MAX. 19.05 (T.P.) 17.0 ± 0.2 0.25+0.10 -0.05 0.17 0 ~ 15 ° P64C-70-750A,C-4 Remark The external dimensions and materials of the ES version are the same as those of the mass-produced version. Data Sheet U14042EJ4V0DS 77 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 64-PIN PLASTIC QFP (14x14) A B 48 49 33 32 detail of lead end S CD Q R 64 1 17 16 F G H J I M P K S N S L M ITEM A B C NOTE Each lead centerline is located within 0.15 mm of its true position (T.P.) at maximum material condition. MILLIMETERS 17.6 ± 0.4 14.0 ± 0.2 14.0 ± 0.2 D F 17.6 ± 0.4 1.0 G H 1.0 0.37 +0.08 -0.07 I J 0.15 0.8 (T.P.) 1.8 ± 0.2 0.8 ± 0.2 0.17 +0.08 -0.07 K L M N P Q R S 0.10 2.55 ± 0.1 0.1 ± 0.1 5 °± 5 ° 2.85 MAX. P64GC-80-AB8-5 Remark The external dimensions and materials of the ES version are the same as those of the mass-produced version. 78 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 64-PIN PLASTIC LQFP (14x14) A B 48 49 33 32 detail of lead end S P C D T R 64 1 F G H I M L U 17 16 Q J ITEM A B MILLIMETERS 17.2 ± 0.2 14.0 ± 0.2 14.0 ± 0.2 17.2 ± 0.2 1.0 1.0 0.37 + 0.08 − 0.07 0.20 0.8 (T.P.) 1.6 ± 0.2 0.8 0.17 + 0.03 − 0.06 0.10 1.4 ± 0.1 0.127 ± 0.075 +4° 3° −3° 1.7 MAX. 0.25 0.886 ± 0.15 P64GC-80-8BS K S C D F G H N S M I J K NOTE Each lead centerline is located within 0.20 mm of its true position (T.P.) at maximum material condition. L M N P Q R S T U Remark The external dimensions and materials of the ES version are the same as those of the mass-produced version. Data Sheet U14042EJ4V0DS 79 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 64-PIN PLASTIC TQFP (12x12) A B 48 49 33 32 S P detail of lead end T C D R L U 64 1 F G H I M 17 16 Q J ITEM A B C D F MILLIMETERS 14.0 ± 0.2 12.0 ± 0.2 12.0 ± 0.2 14.0 ± 0.2 1.125 1.125 0.32 + 0.06 − 0.10 0.13 0.65 (T.P.) 1.0 ± 0.2 0.5 0.17 + 0.03 − 0.07 0.10 1.0 0.1 ± 0.05 3°+4° −3° 1.1 ± 0.1 0.25 0.6 ± 0.15 P64GK-65-9ET-3 K S M N NOTE Each lead centerline is located within 0.13 mm of its true position (T.P.) at maximum material condition. G H I J K L M N P Q R S T U S Remark The external dimensions and materials of the ES version are the same as those of the mass-produced version. 80 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 64-PIN PLASTIC LQFP (10x10) A B 48 49 33 32 S P detail of lead end C D T R 64 1 F G H I M L U 17 16 Q J K S ITEM A B C D F G H I J K L M N P Q R S T U MILLIMETERS 12.0 ± 0.2 10.0 ± 0.2 10.0 ± 0.2 12.0 ± 0.2 1.25 1.25 0.22 ± 0.05 0.08 0.5 (T.P.) 1.0 ± 0.2 0.5 0.17 + 0.03 − 0.07 0.08 1.4 0.1 ± 0.05 3°+4° −3° 1.5 ± 0.10 0.25 0.6 ± 0.15 S64GB-50-8EU-1 N S M Remark The external dimensions and materials of the ES version are the same as those of the mass-produced version. Data Sheet U14042EJ4V0DS 81 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 73-PIN PLASTIC FBGA (9x9) D wSA ZE ZD A B E 9 8 7 6 5 4 3 2 1 JHGFEDCBA INDEX MARK wSB A y1 S A2 (UNIT:mm) S ITEM D E w DIMENSIONS 9.00 ± 0.10 9.00 ± 0.10 0.20 1.28 ± 0.10 0.35 ± 0.06 0.93 0.80 0.50 +0.05 –0.10 0.08 0.10 0.20 1.30 1.30 P73F1-80-CN3 y S e A1 A A1 A2 e b x y y1 ZD ZE φb φx M S AB Remark The external dimensions and materials of the ES version are the same as those of the mass-produced version. 82 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY 14. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology Manual (C10535E). For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative. Table 14-1. Surface Mounting Type Soldering Conditions (1/3) (1) µPD780021AGC-×××-AB8: 64-pin plastic QFP (14 x 14) µPD780022AGC-×××-AB8: 64-pin plastic QFP (14 x 14) µPD780023AGC-×××-AB8: 64-pin plastic QFP (14 x 14) µPD780024AGC-×××-AB8: 64-pin plastic QFP (14 x 14) µPD780021AYGC-×××-AB8: 64-pin plastic QFP (14 x 14) µPD780022AYGC-×××-AB8: 64-pin plastic QFP (14 x 14) µPD780023AYGC-×××-AB8: 64-pin plastic QFP (14 x 14) µPD780024AYGC-×××-AB8: 64-pin plastic QFP (14 x 14) Soldering Method Infrared reflow Soldering Conditions Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher), Count: Three times or less VPS Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher), Count: Three times or less Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once, Preheating temperature: 120°C Max. (package surface temperature) Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin row) – WS60-00-1 VP15-00-3 Recommended Condition Symbol IR35-00-3 Caution Do not use different soldering methods together (except for partial heating). (2) µPD780021AGC-×××-8BS: 64-pin plastic LQFP (14 x 14) µPD780022AGC-×××-8BS: 64-pin plastic LQFP (14 x 14) µPD780023AGC-×××-8BS: 64-pin plastic LQFP (14 x 14) µPD780024AGC-×××-8BS: 64-pin plastic LQFP (14 x 14) µPD780021AYGC-×××-8BS: 64-pin plastic LQFP (14 x 14) µPD780022AYGC-×××-8BS: 64-pin plastic LQFP (14 x 14) µPD780023AYGC-×××-8BS: 64-pin plastic LQFP (14 x 14) µPD780024AYGC-×××-8BS: 64-pin plastic LQFP (14 x 14) Soldering Method Infrared reflow Soldering Conditions Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher), Count: Two times or less VPS Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher), Count: Two times or less Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once, Preheating temperature: 120°C Max. (package surface temperature) Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin row) – WS60-00-1 VP15-00-2 Recommended Condition Symbol IR35-00-2 Caution Do not use different soldering methods together (except for partial heating). Data Sheet U14042EJ4V0DS 83 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Table 14-1. Surface Mounting Type Soldering Conditions (2/3) (3) µ PD780021AGK-×××-9ET: 64-pin plastic TQFP (12 x 12) µPD780022AGK-×××-9ET: 64-pin plastic TQFP (12 x 12) µPD780023AGK-×××-9ET: 64-pin plastic TQFP (12 x 12) µPD780024AGK-×××-9ET: 64-pin plastic TQFP (12 x 12) µPD780021AYGK-×××-9ET: 64-pin plastic TQFP (12 x 12) µPD780022AYGK-×××-9ET: 64-pin plastic TQFP (12 x 12) µPD780023AYGK-×××-9ET: 64-pin plastic TQFP (12 x 12) µPD780024AYGK-×××-9ET: 64-pin plastic TQFP (12 x 12) Soldering Method Infrared reflow Soldering Conditions Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher), Count: Two times or less, Exposure limit: 7 daysNote (after that, prebake at 125 °C for 10 hours) VPS Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher), Count: Two times or less, Exposure limit: 7 daysNote (after that, prebake at 125°C for 10 hours) Wave soldering Solder bath temperature: 260°C max., Time: 10 seconds max., Count: Once, Preheating temperature: 120°C Max. (package surface temperature), Exposure limit: 7 daysNote (after that, prebake at 125°C for 10 hours) Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin row) — WS60-107-1 VP15-107-2 Recommended Condition Symbol IR35-107-2 Note After opening the dry pack, store it at 25°C or less and 65%RH or less for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). 84 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Table 14-1. Surface Mounting Type Soldering Conditions (3/3) (4) µPD780021AGB-×××-8EU: 64-pin plastic LQFP (10 x 10) µPD780022AGB-×××-8EU: 64-pin plastic LQFP (10 x 10) µPD780023AGB-×××-8EU: 64-pin plastic LQFP (10 x 10) µPD780024AGB-×××-8EU: 64-pin plastic LQFP (10 x 10) µPD780021AYGB-×××-8EU: 64-pin plastic LQFP (10 x 10) µPD780022AYGB-×××-8EU: 64-pin plastic LQFP (10 x 10) µPD780023AYGB-×××-8EU: 64-pin plastic LQFP (10 x 10) µPD780024AYGB-×××-8EU: 64-pin plastic LQFP (10 x 10) Recommended Condition Symbol IR35-00-2 Soldering Method Infrared reflow Soldering Conditions Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher), Count: Twice or less Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher), Count: Twice or less Pin temperature: 300°C max., Time: 3 seconds max. (per pin row) VPS VP15-00-2 Partial heating –– Caution Do not use different soldering methods together (except for partial heating). (5) µPD780021AF1-×××-CN3: 73-pin plastic FBGA (9 x 9) µPD780022AF1-×××-CN3: 73-pin plastic FBGA (9 x 9) µPD780023AF1-×××-CN3: 73-pin plastic FBGA (9 x 9) µPD780024AF1-×××-CN3: 73-pin plastic FBGA (9 x 9) µPD780021AYF1-×××-CN3: 73-pin plastic FBGA (9 x 9) µPD780022AYF1-×××-CN3: 73-pin plastic FBGA (9 x 9) µPD780023AYF1-×××-CN3: 73-pin plastic FBGA (9 x 9) µPD780024AYF1-×××-CN3: 73-pin plastic FBGA (9 x 9) Soldering Method Infrared reflow Soldering Conditions Package peak temperature: 260° C, Time: 60 seconds max. (at 220°C or higher), Count: Three times or less, Exposure limit: 3 daysNote (after that, prebake at 125 °C for 20 hours) VPS Package peak temperature: 215° C, Time: 40 seconds max. (at 200°C or higher), Count: Three times or less, Exposure limit: 3 daysNote (after that, prebake at 125°C for 20 hours) VP15-203-3 Recommended Condition Symbol IR60-203-3 Note After opening the dry pack, store it at 25°C or less and 65%RH or less for the allowable storage period. Caution Do not use different soldering methods together. Data Sheet U14042EJ4V0DS 85 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Table 14-2. Insertion Type Soldering Conditions µPD780021ACW-×××: 64-pin plastic SDIP (19.05 mm (750)) µPD780022ACW-×××: 64-pin plastic SDIP (19.05 mm (750)) µPD780023ACW-×××: 64-pin plastic SDIP (19.05 mm (750)) µPD780024ACW-×××: 64-pin plastic SDIP (19.05 mm (750)) µPD780021AYCW-×××: 64-pin plastic SDIP (19.05 mm (750)) µPD780022AYCW-×××: 64-pin plastic SDIP (19.05 mm (750)) µPD780023AYCW-×××: 64-pin plastic SDIP (19.05 mm (750)) µPD780024AYCW-×××: 64-pin plastic SDIP (19.05 mm (750)) Soldering Method Wave soldering (only for pins) Partial heating Pin temperature: 300°C max., Time: 3 seconds max. (per pin row) Soldering Conditions Solder bath temperature: 260°C max., Time: 10 seconds max. Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with the package. 86 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY APPENDIX A. DEVELOPMENT TOOLS The following development tools are available for system development using the µPD780024A, 780024AY Subseries. Also refer to (6) Cautions on Using Development Tools. (1) Software Package SP78K0 CD-ROM in which various software tools for 78K/0 development are integrated in one package (2) Language Processing Software RA78K0 CC78K0 DF780024 CC78K0-L Assembler package common to 78K/0 Series C compiler package common to 78K/0 Series Device file for µPD780024A, 780024AY Subseries C compiler library source file common to 78K/0 Series (3) Flash Memory Writing Tools Flashpro III (FL-PR3, PG-FP3) Flashpro IV (FL-PR4, PG-FP4) FA-64CW FA-64GC FA-64GC-8BS-A FA-64GK-9ET FA-64GB-8EU FA-73F1-CN3-A Adapter for flash memory writing used connected to the Flashpro III/Flashpro IV. • FA-64CW: 64-pin plastic SDIP (CW type) • FA-64GC: 64-pin plastic QFP (GC-AB8 type) • FA-64GC-8BS-A: 64-pin plastic LQFP (GC-8BS type) • FA-64GK-9ET: 64-pin plastic TQFP (GK-9ET type) • FA-64GB-8EU: 64-pin plastic LQFP (GB-8EU type) • FA-73F1-CN3-A: 73-pin plastic FBGA (F1-CN3 type) Flash programmer dedicated to microcontrollers with on-chip flash memory Data Sheet U14042EJ4V0DS 87 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (4) Debugging Tools • When using in-circuit emulator IE-78K0-NS or IE-78K0-NS-A IE-78K0-NS IE-78K0-NS-PA IE-78K0-NS-A IE-70000-MC-PS-B IE-70000-98-IF-C IE-70000-CD-IF-A IE-70000-PC-IF-C IE-70000-PCI-IF-A IE-780034-NS-EM1 NP-64CW NP-H64CW NP-64GC NP-64GC-TQ NP-H64GC-TQ NP-64GK NP-H64GK-TQ NP-H64GB-TQ NP-73F1-CN3Note EV-9200GC-64 Emulation probe for 64-pin plastic LQFP (GB-8EU type) Emulation probe for 73-pin plastic FBGA (F1-CN3 type) Conversion socket to connect the NP64GC and a target system board on which a 64-pin plastic QFP (GC-AB8 type), 64-pin plastic LQFP (GC-8BS type) can be mounted. Conversion adapter to connect the NP-64GC-TQ or NP-H64GC-TQ and a target system board on which a 64-pin plastic QFP (GC-AB8 type), 64-pin plastic LQFP (GC-8BS type) can be mounted Conversion adapter to connect the NP-64GK or NP-H64GK-TQ and a target system on which a 64pin plastic TQFP (GK-9ET type) can be mounted Conversion socket to connect the NP-H64GB-TQ and a target system board on which a 64-pin plastic LQFP (GB-8EU type) can be mounted CSICE73A0909N01, LSPACK73A0909N01, CSSOCKET73A0909N01 ID78K0-NS SM78K0 DF780024 Integrated debugger for IE-78K0-NS and IE-78K0-NS-A System simulator common to 78K/0 Series Device file for µPD780024A, 780024AY Subseries Conversion socket to connect the NP-73F1-CN3 and a target system board on which a 73-pin plastic FBGA (F1-CN3 type) can be mounted Emulation probe for 64-pin plastic TQFP (GK-9ET type) Emulation probe for 64-pin plastic QFP (GC-AB8 type), 64-pin plastic LQFP (GC-8BS type) In-circuit emulator common to 78K/0 Series Performance board to enhance and expand the functions of IE-78K0-NS Combination of IE-78K-NS and IE-78K0-NS-PA Power supply unit for IE-78K0-N and IE-78K0-NS-A Adapter required when using PC-9800 series as host machine (excluding notebook PCs) (C bus supported) PC card and interface cable when using notebook PC as host machine (PCMCIA socket supported) Adapter required when using IBM PC/ATTM or compatible as host machine (ISA bus supported) Adapter required when using PC in which PCI bus is incorporated as host machine Emulation board to emulate µPD780024A, 780024AY Subseries Emulation probe for 64-pin plastic SDIP (CW type) TGC-064SAP TGK-064SBW TGB-064SDP Note The conversion socket (CSICE73A0909N01, LSPACK73A0909N01, or CSSOCKET73A0909N01) is supplied with the emulation probe (NP-73F1-CN3). 88 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY • When using in-circuit emulator IE-78001-R-A IE-78001-R-A IE-70000-98-IF-C IE-70000-PC-IF-C IE-70000-PCI-IF-A IE-780034-NS-EM1 IE-78K0-R-EX1 EP-78240CW-R EP-78240GC-R EP-78012GK-R EV-9200GC-64 In-circuit emulator common to 78K/0 Series Adapter required when using PC-9800 series as host machine (excluding notebook PCs) (C bus supported) Interface adapter when using IBM PC/AT or compatible as host machine (ISA bus supported) Adapter required when using PC in which PCI bus is incorporated as host machine Emulation board to emulate µPD780024A, 780024AY Subseries Emulation probe conversion board necessary when using IE-780034-NS-EM1 on IE-78001-R-A Emulation probe for 64-pin plastic SDIP (CW type) Emulation probe for 64-pin plastic QFP (GC-AB8 type) Emulation probe for 64-pin plastic TQFP (GK-9ET type) Conversion socket to connect the EP-78240GC-R and a target system board on which a 64-pin plastic QFP (GC-AB8 type) can be mounted Conversion adapter to connect the EP-78012GK-R and a target system board on which a 64-pin plastic TQFP (GK-9ET type) can be mounted Integrated debugger for IE-78001-R-A System simulator common to 78K/0 Series Device file for µPD780024A, 780024AY Subseries TGK-064SBW ID78K0 SM78K0 DF780024 (5) Real-Time OS RX78K0 Real-time OS for 78K/0 Series Caution The 64-pin plastic LQFP (GB-8EU type) and 73-pin plastic FBGA (F1-CN3 type) do not support the IE-78001-R-A. Data Sheet U14042EJ4V0DS 89 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY (6) Cautions on Using Development Tools • The ID78K0-NS, ID78K0, and SM78K0 are used in combination with the DF780024. • The CC78K0 and RX78K0 are used in combination with the RA78K0 and the DF780024. • FL-PR3, FL-PR4, FA-64CW, FA-64GC, FA-64GC-8BS-A, FA-64GK-9ET, FA-64GB-8EU, FA-73F1-CN3-A, NP-64CW, NP-H64CW, NP-64GC, NP-64GC-TQ, NP-H64GC-TQ, NP-64GK, NP-H64GK-TQ, NP-H64GB-TQ, and NP-73F1-CN3 are products made by Naito Densei Machida Mfg. Co., Ltd. (+81-45-475-4191). • TGC-064SAP, TGK-064SBW, TGB-064SDP, CSICE73A0909N01, LSPACK73A0909N01, and CSSOCKET73A0909N01 are products made by TOKYO ELETECH CORPORATION. Refer to: Daimaru Kogyo, Ltd. Tokyo Electronic Division (+81-3-3820-7112) Osaka Electronic Division (+81-6-6244-6672) • For third-party development tools, see the Single-chip Microcontroller Development Tool Selection Guide (U11069E). • The host machines and OSs supporting each software are as follows. Host Machine [OS] Software RA78K0 CC78K0 ID78K0-NS ID78K0 SM78K0 RX78K0 PC PC-9800 series [Japanese WindowsTM] IBM PC/AT and compatibles [Japanese/English Windows] √ Note √ Note EWS HP9000 series 700TM [HP-UXTM] SPARCstationTM [SunOSTM, SolarisTM] √ √ – – – √ √ √ √ √ Note Note DOS-based software 90 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY APPENDIX B. RELATED DOCUMENTS The related documents indicated in this publication may include preliminary versions. However, preliminary versions are not marked as such. Documents Related to Devices Document Name Document No. U14046E This document µPD780024A, 780034A, 780024AY, 780034AY Subseries User’s Manual µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Data Sheet µPD780021A(A), 780022A(A), 780023A(A), 780024A(A), 780021AY(A), 780022AY(A), 780023AY(A), 780024AY(A) Data Sheet µPD78F0034A, 78F0034AY Data Sheet µPD78F0034B, 78F0034BY, 78F0034B(A), 78F0034BY(A) Data Sheet 78K/0 Series Instructions User’s Manual U15131E U14040E To be prepared U12326E Documents Related to Development Software Tools (User’s Manuals) Document Name RA78K0 Assembler Package Operation Language Structured Assembly Language CC78K0 C Compiler Operation Language SM78K Series System Simulator Ver. 2.30 or Later Operation (Windows Based) External Part User Open Interface Specifications ID78K Series Integrated Debugger Ver. 2.30 or Later RX78K0 Real-time OS Operation (Windows Based) Fundamentals Installation Project Manager Ver. 3.12 or Later (Windows Based) Document No. U14445E U14446E U11789E U14297E U14298E U15373E U15802E U15185E U11537E U11536E U14610E Documents Related to Development Hardware Tools (User’s Manuals) Document Name IE-78K0-NS In-Circuit Emulator IE-78K0-NS-A In-Circuit Emulator IE-780034-NS-EM1 Emulation Board IE-78001-R-A In-Circuit Emulator IE-78K0-R-EX1 In-Circuit Emulator Document No. U13731E U14889E U14642E U14142E To be prepared Caution The related documents listed above are subject to change without notice. Be sure to use the latest version of each document for designing. Data Sheet U14042EJ4V0DS 91 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Documents Related to Flash Memory Writing Document Name PG-FP3 Flash Memory Programmer User’s Manual PG-FP4 Flash Memory Programmer User’s Manual Document No. U13502E U15260E Other Related Documents Document Name SEMICONDUCTOR SELECTION GUIDE - Products & Packages Semiconductor Device Mounting Technology Manual Quality Grades on NEC Semiconductor Devices NEC Semiconductor Device Reliability/Quality Control System Guide to Prevent Damage for Semiconductor Devices by Electrostatic Discharge (ESD) Document No. X13769E C10535E C11531E C10983E C11892E Caution The related documents listed above are subject to change without notice. Be sure to use the latest version of each document for designing. 92 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY [MEMO] Data Sheet U14042EJ4V0DS 93 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS Note: Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it once, when it has occurred. Environmental control must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using insulators that easily build static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work bench and floor should be grounded. The operator should be grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with semiconductor devices on it. 2 HANDLING OF UNUSED INPUT PINS FOR CMOS Note: No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused pin should be connected to V DD o r GND with a resistor, if it is considered to have a possibility of being an output pin. All handling related to the unused pins must be judged device by device and related specifications governing the devices. 3 STATUS BEFORE INITIALIZATION OF MOS DEVICES Note: Power-on does not necessarily define initial status of MOS device. Production process of MOS does not define the initial operation status of the device. Immediately after the power source is turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset signal is received. Reset operation must be executed immediately after power-on for devices having reset function. Note: Purchase of NEC Electronics l 2 C components conveys a license under the Philips I 2C Patent Rights to use these components in an I 2C system, provided that the system conforms to the I 2C Standard Specification as defined by Philips. FIP and IEBus are trademarks of NEC Electronics Corporation. Windows is either a registered trademark or a trademark of Microsoft Corporation in the United Status and/ or other countries. PC/AT is a trademark of International Business Machines Corporation. HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company. SPARCstation is a trademark of SPARC International, Inc. Solaris and SunOS are trademarks of Sun Microsystems, Inc. 94 Data Sheet U14042EJ4V0DS µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY Regional Information Some information contained in this document may vary from country to country. Before using any NEC Electronics product in your application, pIease contact the NEC Electronics office in your country to obtain a list of authorized representatives and distributors. They will verify: • • • • • Device availability Ordering information Product release schedule Availability of related technical literature Development environment specifications (for example, specifications for third-party tools and components, host computers, power plugs, AC supply voltages, and so forth) Network requirements • In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary from country to country. NEC Electronics America, Inc. (U.S.) Santa Clara, California Tel: 408-588-6000 800-366-9782 Fax: 408-588-6130 800-729-9288 • Filiale Italiana Milano, Italy Tel: 02-66 75 41 Fax: 02-66 75 42 99 • Branch The Netherlands Eindhoven, The Netherlands Tel: 040-244 58 45 Fax: 040-244 45 80 • Tyskland Filial Taeby, Sweden Tel: 08-63 80 820 Fax: 08-63 80 388 • United Kingdom Branch Milton Keynes, UK Tel: 01908-691-133 Fax: 01908-670-290 NEC Electronics Hong Kong Ltd. Hong Kong Tel: 2886-9318 Fax: 2886-9022/9044 NEC Electronics Hong Kong Ltd. Seoul Branch Seoul, Korea Tel: 02-528-0303 Fax: 02-528-4411 NEC Electronics (Europe) GmbH Duesseldorf, Germany Tel: 0211-65 03 01 Fax: 0211-65 03 327 • Sucursal en España Madrid, Spain Tel: 091-504 27 87 Fax: 091-504 28 60 • Succursale Française Vélizy-Villacoublay, France Tel: 01-30-67 58 00 Fax: 01-30-67 58 99 NEC Electronics Shanghai, Ltd. Shanghai, P.R. China Tel: 021-6841-1138 Fax: 021-6841-1137 NEC Electronics Taiwan Ltd. Taipei, Taiwan Tel: 02-2719-2377 Fax: 02-2719-5951 NEC Electronics Singapore Pte. Ltd. Novena Square, Singapore Tel: 6253-8311 Fax: 6250-3583 J02.11 Data Sheet U14042EJ4V0DS 95 µPD780021A, 780022A, 780023A, 780024A, 780021AY, 780022AY, 780023AY, 780024AY These commodities, technology or software, must be exported in accordance with the export administration regulations of the exporting country. Diversion contrary to the law of that country is prohibited. • The information in this document is current as of September, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. • While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features. • NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1
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