UPG131GR

DATA SHEET GaAs INTEGRATED CIRCUIT µPG133G L-BAND SPDT SWITCH DESCRIPTION UPG133G is an L-Band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital cellular or cordless telephone application. The device can operate from 100 MHz to 2.5 GHz, having the low insertion loss. It housed in an original 8 pin SSOP that is smaller than usual 8 pin SOP and easy to install and contributes to miniaturizing the system. It can be used in wide-band switching applications. FEATURES • Maximum transmission power : • Low insertion loss • High switching speed • Small package : : : 0.25 W (typ.) 0.6 dB (typ.) at f = 2 GHz 10 ns 8 pins SSOP APPLICATION • Digital cordless telephone : PHS, PCS, DECT etc. • Digital hand-held cellular phone, WLAN ORDERING INFORMATION PART NUMBER PACKAGE 8 pin plastic SSOP PACKING FORM Carrier tape width 12 mm. QTY 2kp/Reel. µPG133G-E1 For evaluation sample order, please contact your local NEC sales office. ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C) Control Voltage Input Power Total Power Dissipation Operating Case Temperature Storage Temperature CAUTION: VCONT Pin Ptot Topt Tstg –6 to +0.6 25 0.2 –65 to +90 –65 to +150 V dBm W ˚C ˚C The IC must be handled with care to prevent static discharge because its circuit is composed of GaAs MES FET. Document No. P10733EJ2V0DS00 (2nd edition) Date Published April 1996 P Printed in Japan © 1996 µPG133G PIN CONNECTION DIAGRAM (Top View) 1. VCONT2 1 2 3 4 8 7 6 5 2. OUT2 3. GND 4. GND 5. IN 6. GND 7. OUT1 8. VCONT1 SPDT SWITCH IC SERIES PRODUCTS PART NUMBER Pin (1dB) (dBm) +34 +30 +34 +30 +30 +25 LINS (dB) 0.5 @1G 0.6 @2G 0.5 @1G 0.6 @2G 0.6 @2G 0.6 @2G ISL (dB) 32 @1G 23 @2G 32 @1G 23 @2G 22 @2G 20 @2G VCONT (V) –5/0 –4/0 –5/0 –4/0 +3/0 –3/0 PACKAGE 8 pin SOP (225 mil) 8 pin SSOP (175 mil) APPLICATIONS PDC, IS-136, PHS PHS, PCS, WLAN PDC, IS-136, PHS PHS, PCS, WLAN PHS, PCS, WLAN DIVERSITY etc µPG130GR µPG131GR µPG130G µPG131G µPG132G µPG133G Remark: As for detail information of series products, please refer to each data sheet. EQUIVALENT CIRCUIT OUT1 GND IN VCONT1 VCONT2 GND OUT2 2 µPG133G RECOMMENDED OPERATING CONDITIONS PARAMETER Control Voltage (ON) Control Voltage (OFF) Input Power Level SYMBOL VCONT VCONT Pin MIN. –0.2 –5.0 TYP. 0 –3.0 21 MAX. +0.2 –2.7 24 UNIT V V dBm ELECTRICAL CHARACTERISTICS (TA = 25 ˚C) CHARACTERISTICS Insertion Loss SYMBOL LINS MIN. TYP. 0.6 0.8Note1 Isolation ISL 20 20Note1 Input Return Loss Output Return Loss Input Power at 1dB Compression Point Switching Speed Control Current RLin RLout Pin (1dB)Note2 11 11 21 20 20 25 dB dB dBm dB f = 2.5 GHz f = 100 MHz to 2 GHz VCONT1 = 0 V VCONT2 = –3 V or tsw ICONT 10 50 ns VCONT1 = –3 V VCONT2 = 0 V MAX. 1.0 UNIT dB f = 2.5 GHz TEST CONDITION µA Notes 1: Characteristic for reference at 2.0 to 2.5 GHz 2: Pin (1dB) is measured the input power level when the insertion loss increase more 1dB than that of linear range. All other characteristics are measured in linear range. NOTE ON CORRECT USE • Insertion loss and isolation of the IN-OUT2 is better than that of IN-OUT1, because No. 7 pin (OUT1) is placed to same side of No. 5 pin (IN). • The distance between IC’s GND pins and ground pattern of substrate should be as shorter as possible to avoid parasitic parameters. 3 µPG133G TYPICAL CHARACTERISTICS (TA = 25 ˚C) Note This data is including loss of the test fixture. IN-OUT1 INSERTION LOSS vs. FREQUENCY + 2.0 VCONT1 = –3 V VCONT2 = 0 V Pin = 0 dBm IN-OUT1 ISOLATION vs. FREQUENCY 0 VCONT1 = 0 V VCONT2 = –3 V Pin = 0 dBm LINS - Insertion Loss - dB + 1.0 0 ISL - Isolation - dB 500 M LINS OUT1 IN 50 Ω OUT2 1G 2G 3G –10 –20 – 1.0 – 30 – 2.0 – 3.0 100 M 200 M f - Frequency - Hz – 40 – 50 100 M 200 M f - Frequency - Hz 500 M 1G ISL 2G 3G OUT1 IN 50 Ω OUT2 IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY + 10 VCONT1 = –3 V VCONT2 = 0 V Pin = 0 dBm IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY + 10 VCONT1 = –3 V VCONT2 = 0 V Pin = 0 dBm 0 RLout - Output Return Loss - dB RLin - Input Return Loss - dB 0 –10 –10 – 20 – 20 – 30 – 40 100 M 200 M f - Frequency - Hz – 30 – 40 100 M 200 M f - Frequency - Hz 500 M RLin 1G 2G 3G 500 M 1G 2G 3G RLOUT OUT1 OUT1 IN 50 Ω OUT2 IN 50 Ω OUT2 4 µPG133G IN-OUT2 INSERTION LOSS vs. FREQUENCY + 2.0 LINS - Insertion Loss - dB VCONT1 = 0 V VCONT2 = –3 V Pin = 0 dBm ISL - Isolation - dB IN-OUT2 ISOLATION vs. FREQUENCY 0 VCONT1 = –3 V VCONT2 = 0 V Pin = 0 dBm + 1.0 –10 0 –20 – 1.0 – 30 – 2.0 – 3.0 100 M 200 M f - Frequency - Hz OUT1 50 Ω IN LINS OUT2 – 40 – 50 100 M 200 M f - Frequency - Hz OUT1 50 Ω IN ISL OUT2 500 M 1G 2G 3G 500 M 1G 2G 3G IN-OUT2 INPUT RETURN LOSS vs. FREQUENCY + 10 RLin - Input Return Loss - dB VCONT1 = 0 V VCONT2 = –3 V Pin = 0 dBm IN-OUT2 OUTPUT RETURN LOSS vs. FREQUENCY + 10 RLout - Output Return Loss - dB VCONT1 = 0 V VCONT2 = –3 V Pin = 0 dBm 0 0 –10 –10 – 20 – 20 – 30 – 40 100 M 200 M f - Frequency - Hz – 30 – 40 100 M 200 M f - Frequency - Hz 500 M RLin 1G 2G 3G 500 M 1G 2G 3G OUT1 50 Ω OUT1 50 Ω IN OUT2 IN OUT2 RLOUT 5 µPG133G IN-OUT2 Pin vs. Pout VCONT1 = 0 V VCONT2 = –3 V f = 1.9 GHz 30 Pout - Output Power - dB 28 26 24 22 20 18 18 OUT1 50 Ω IN OUT2 20 22 24 26 28 30 Pin - Input Power - dBm INPUT POWER vs. OUTPUT POWER VCONT1 = 0 V VCONT2 = –3 V 30 f = 2GHz Non-modulated signal input (CW) 25 TA = –50 ˚C TA = +25 ˚C TA = +90 ˚C INSERTION LOSS, 2fo, 3fo vs. AMBIENT TEMPERATURE VCONT1 = 0 V VCONT2 = –3 V f = 2 GHz Pin = +20 dBm Signal input (CW) 1.0 0.8 0.6 LINS (dB) Pout (dBm) 3fo –50 20 –60 2fo 15 15 20 25 Pin (dBm) 30 –100 –50 0 TA (˚C) +50 +100 –70 6 2fo, 3fo Harmonics (dBC) LINS µPG133G TEST BOARD IN 0.9 mm width. NEC G130/131 R R OUT1 VCONT1 VCONT2 OUT2 TEST CIRCUIT 50 Ω VCONT2 = 0 V/–3 V 1 000 pF OUT2 2 ZO = 50 Ω 3 4 7 6 5 1 8 50 Ω ZO = 50 Ω ZO = 50 Ω   0.4 mm thickness  teflon glass  R = 50 Ω Using the same board that of µ PG130/131G 1 000 pF VCONT1 = –3 V/0 V OUT1 IN 7 µPG133G µPG133G TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE VCONT1 0V –3 V OUT1 0V IN OUT2 IN OUT1 OUT2 VCONT2 –3 V OUT1 IN OUT2 IN OUT1 OUT2 8-PIN PLASTIC SHRINK SOP (175 mil) (Unit mm) 8 5 Detail of lead end 1 3.0 MAX. 4 4.94 ±0.2 3.2 ±0.1 0.87 ±0.2 1.8 MAX. 1.5 ±0.1 0.15 +0.10 –0.05 0.1 ±0.1 0.575 MAX. 0.65 0.3 +0.10 –0.05 0.10 M 0.5 ±0.2 0.15 8 3˚+7 –3 µPG133G Floating the µPG133G It is possible to use the µPG133G with only a single +3 V supply by employing a technique known as “floating”. When the IC is floated using a +3 V supply, the voltage levels used to control the switch are elevated above ground by +3 V. When the µPG133G is floated it is necessary to use DC blocking (C2, C3, C5) and grounding (C1, C4) capacitors. This enables the IC to isolated so that +3 V can be applied to RF line. The value for DC blocking capacitors should be chosen to accommodate the frequency of operation. Grounding capacitors are required to float the IC above ground. The value for grounding capacitor should be chosen to accommodate the frequency of operation. It is not recommended to float the µPG133G for wide band application. (Floating the µPG133G with +3 V/0 V supply at 2 GHz-band, BW ≤ 50 MHz) GND C1 C2 OUT2 1 4 VCONT2 C3 IN 5 8 VCONT1 C4 C5 GND OUT1 PIN CONNECTIONS 1. VCONT2 2. OUT2 3. GND 4. GND 5. IN 6. GND 7. OUT1 8. VCONT1 C1, C4 = 10 pF below : C2, C3, C5 = 100 pF : Grounding capacitor DC blocking capacitor The distance between grounding capacitor and IC’s GND pins, grounding capacitor and ground of the substrate should be as shorter as possible to avoid the parasitic parameters. IC’s GND pin, No. 3, No. 4 and No. 6 are connected inside of the IC. 9 µPG133G RECOMMENDED SOLDERING CONDITIONS This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. [µPG133G] Recommended condition symbol IR30-00-2 Soldering process Infrared ray reflow Soldering conditions Package peak temperature: 230 ˚C Hour: within 30 s. (more than 210 ˚C) Time: 2 time, Limited days: no.Note Package peak temperature: 215 ˚C Hour: within 40 s. (more than 200 ˚C), Time: 2 time, Limited days: no.Note Soldering tub temperature: less than 260 ˚C, Hour: within 10 s. Time: 1 time, Limited days: no.Note Pin area temperature: less than 300 ˚C, Hour: within 10 s. Limited days: no.Note VPS VP15-00-2 Wave Soldering WS60-00-1 Pin part heating Note It is storage days after opening a dry pack, the storage conditions are 25 ˚C, less than 65 %, RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). 10 µPG133G [MEMO] 11 µPG133G Caution The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the Japanese law concerned. Keep the law concerned and so on, especially in case of removal. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: “Standard“, “Special“, and “Specific“. The Specific quality grade applies only to devices developed based on a customer designated “quality assurance program“ for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in “Standard“ unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product. M4 94.11 2