UPG154TB

DATA SHEET GaAs INTEGRATED CIRCUIT µPG154TB L-BAND SPDT SWITCH DESCRIPTION The µPG154TB is an L-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital cellular or cordless telephone application. The device can operate from 100 MHz to 2.5 GHz, having the low insertion loss. It housed in an original 6-pin super minimold package that is smaller than usual 6-pin minimold easy to install and contributes to miniaturizing the system. FEATURES • Low Insertion Loss : LINS = 0.65 dB TYP. @VCONT = +3.0 V/0 V, VDD = +3.0 V, CX = 2.0 pF, f = 2 GHz • High Power Switching : Pin (1 dB) = +30 dBm TYP. @VCONT = +3.0 V/0 V, VDD = +3.0 V, CX = 2.0 pF, f = 2 GHz • Small 6-pin super minimold package (Size: 2.0 × 1.25 × 0.9 mm) APPLICATIONS • L, S-band digital cellular or cordless telephone • PCS, WLAN and WLL applications ORDERING INFORMATION Part Number Marking G1K Package 6-pin super minimold Supplying Form Embossed tape 8 mm wide. Pin 1, 2, 3 face to tape perforation side. Qty 3 kp/reel. µPG154TB-E3 Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPG154TB) Caution The IC must be handled with care to prevent static discharge because its circuit is composed of GaAs MES FET. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P13656EJ2V0DS00 (2nd edition) Date Published September 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1998, 1999 µPG154TB ABSOLUTE MAXIMUM RATINGS (TA = +25°C) Parameter Control Voltage 1, 2 Supply Voltage Input Power Total Power Dissipation Operating Temperature Storage Temperature Symbol VCONT1, 2 VDD Pin Ptot TA Tstg Ratings –6.0 to +6.0 5.0 +31 0.15 –45 to +85 –55 to +150 Note Unit V V dBm W °C °C Note Condition 2.5 ≤ | VCONT1 – VCONT2 | ≤ 6.0 V Remarks 1. Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB, TA = +85°C 2. Operation in excess of any one of these parameters may result in permanent damage. PIN CONNECTIONS Pin No. 1 2 3 Connection OUT1 VDD OUT2 Pin No. 4 5 6 Connection VCONT2 IN VCONT1 2 1 3 (Top View) (Bottom View) 4 5 6 4 5 6 3 2 1 RECOMMENDED OPERATING CONDITIONS (TA = +25°C) Parameter Control Voltage (Low) Control Voltage (High) Supply Voltage Symbol VCONT VCONT VDD MIN. –0.2 +2.5 +2.5 TYP. 0 +3.0 VCONT(H) MAX. +0.2 +5.3 VCONT(H) + 0.3 Unit V V V 2 Data Sheet P13656EJ2V0DS00 G1K µPG154TB ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = +25°C, VCONT1 = 3 V, VCONT2 = 0 V or VCONT1 = 0 V, VCONT2 = 3 V, ZO = 50 Ω, VDD = 3.0 V, Off chip DC blocking capacitors value; 51 pF) Parameter Insertion Loss Symbol LINS Test Conditions f = 100 M to 1.0 GHz, CX = 12.0 pF f = 2.0 GHz, CX = 2.0 pF Isolation ISL f = 1.0 GHz, CX = 12.0 pF f = 1.5 GHz, CX = 4.5 pF f = 2.0 GHz, CX = 2.0 pF Input Return Loss RLin f = 100 M to 2.0 GHz, CX = 2.0 pF f = 100 M to 2.0 GHz, CX = 2.0 pF f = 2.0 GHz, CX = 2.0 pF MIN. − − 20 − 18 11 TYP. 0.30 MAX. 0.65 Unit dB 0.65 24 22 21 15 0.90 − − − − − − − − 10 dB dB Output Return Loss RLout 11 − 15 dB Input Power at 0.1 dB Note Compression Point Input Power at 1 dB Note Compression Point Switching Speed Control Current Pin (0.1 dB) 26.5 dBm Pin (1 dB) f = 2.0 GHz, CX = 2.0 pF 27 − 30 dBm tsw ICONT VCONT = 3 V/0 V 30 2 ns − µA Note Pin (1 dB) and Pin (0.1 dB) are measured the input power level when the insertion loss increase more 1 dB or 0.1 dB than that of linear range. All other characteristics are measured in linear range. Cautions 1. The value of trap capacitor to improve the isolation performance should be chosen to accommodate the operating frequency, band width, switching speed and the condition with actual board of your system. The distance between IC’s No.2 pin and trap capacitor CX should be placed as shorter as possible to avoid parasitic parameters. 2. When the µPG154TB is used, it is necessary to use DC blocking capacitors for No.1 (OUT1), No.3 (OUT2) and No.5 (IN). The value of DC blocking capacitors should be chosen to accommodate the operating frequency, band width, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. Data Sheet P13656EJ2V0DS00 3 µPG154TB TYPICAL CHARACTERISTICS (Cx = 12 pF) TEST CONDITIONS: VCONT = 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using evaluation board. IN OUT1 OUT2 50 Ω IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY CH1 S11 log MAG 10 dB/REF 0 dB 1: –15.819 dB 1 GHz 2: –17.331 dB 1.5 GHz 3: –15.135 dB 2 GHz 4: –12.383 dB 2.5 GHz 2 3 4 IN-OUT1 ISOLATION vs. FREQUENCY CH1 S12 log MAG 10 dB/REF 0 dB 1: –25.11 dB 1 GHz 2: –16.514 dB 1.5 GHz 3: –9.938 dB 2 GHz 4: –5.895 dB 2.5 GHz 3 4 2 1 Input Return Loss RLin (dB) 0 –10 –20 –30 –40 1 Isolation ISL (dB) MARKER 1 1 GHz MARKER 1 1 GHz 0 –10 –20 –30 –40 START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) IN-OUT1 INSERTION LOSS vs. FREQUENCY CH1 S21 log MAG 1 dB/REF 0 dB 1: –0.705 dB 1 GHz 2: –0.913 dB 1.5 GHz 3: –1.684 dB 2 GHz 4: –3.617 dB 2.5 GHz 2 3 IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY CH1 S22 log MAG 10 dB/REF 0 dB 1: –16.072 dB 1 GHz 2: –16.268 dB 1.5 GHz 3: –11.895 dB 2 GHz 4: –8.346 dB 2.5 GHz 2 3 4 MARKER 1 1 GHz 0 –1 –2 –3 –4 1 Output Return Loss RLout (dB) Insertion Loss LINS (dB) MARKER 1 1 GHz 0 –10 –20 –30 –40 1 4 START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) Caution This data is including loss of the test fixture. 4 Data Sheet P13656EJ2V0DS00 µPG154TB TYPICAL CHARACTERISTICS (Cx = 4.5 pF) TEST CONDITIONS: VCONT = 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using evaluation board. IN OUT1 OUT2 50 Ω IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY CH1 S11 log MAG 10 dB/REF 0 dB 1: –16.788 dB 1 GHz 2: –17.799 dB 1.5 GHz 3: –14.495 dB 2 GHz 4: –10.133 dB 2.5 GHz 4 3 IN-OUT1 ISOLATION vs. FREQUENCY CH1 S12 log MAG 10 dB/REF 0 dB 1: –14.948 dB 1 GHz 2: –22.345 dB 1.5 GHz 3: –13.136 dB 2 GHz 4: –5.559 dB 2.5 GHz 4 1 2 3 Input Return Loss RLin (dB) 0 –10 –20 –30 –40 1 2 Isolation ISL (dB) MARKER 2 1.5 GHz MARKER 2 1.5 GHz 0 –10 –20 –30 –40 START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) IN-OUT1 INSERTION LOSS vs. FREQUENCY CH1 S21 log MAG 1 dB/REF 0 dB 1: –0.802 dB 1 GHz 2: –0.744 dB 1.5 GHz 3: –1.241 dB 2 GHz 4: –3.255 dB 2.5 GHz 2 3 IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY CH1 S22 log MAG 10 dB/REF 0 dB 1: –17.437 dB 1 GHz 2: –19.166 dB 1.5 GHz 3: –13.512 dB 2 GHz 4: –8.162 dB 2.5 GHz 4 1 3 2 MARKER 2 1.5 GHz 0 –1 –2 Output Return Loss RLout (dB) Insertion Loss LINS (dB) MARKER 2 1.5 GHz 0 –10 –20 –30 –40 1 4 –3 –4 START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) Caution This data is including loss of the test fixture. Data Sheet P13656EJ2V0DS00 5 µPG154TB TYPICAL CHARACTERISTICS (Cx = 2 pF) TEST CONDITIONS: VCONT = 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using evaluation board. IN OUT1 OUT2 50 Ω IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY CH1 S11 log MAG 10 dB/REF 0 dB 1: –16.635 dB 1 GHz 2: –20.537 dB 1.5 GHz 3: –16.53 dB 2 GHz 4: –10.019 dB 2.5 GHz 4 3 IN-OUT1 ISOLATION vs. FREQUENCY CH1 S12 log MAG 10 dB/REF 0 dB 1: –12.2 dB 1 GHz 2: –13.778 dB 1.5 GHz 3: –20.075 dB 2 GHz 4: –11.954 dB 2.5 GHz 2 3 4 Input Return Loss RLin (dB) 0 –10 –20 –30 –40 1 2 Isolation ISL (dB) MARKER 3 2 GHz MARKER 3 2 GHz 0 –10 –20 –30 –40 1 START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) IN-OUT1 INSERTION LOSS vs. FREQUENCY CH1 S21 log MAG 1 dB/REF 0 dB 1: –0.980 dB 1 GHz 2: –0.927 dB 1.5 GHz 3: –0.952 dB 2 GHz 4: –1.972 dB 2.5 GHz 2 3 4 IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY CH1 S22 log MAG 10 dB/REF 0 dB 1: –16.683 dB 1 GHz 2: –21.59 dB 1.5 GHz 3: –17.13 dB 2 GHz 4: –9.277 dB 2.5 GHz 4 MARKER 3 2 GHz 0 –1 –2 –3 –4 Output Return Loss RLout (dB) Insertion Loss LINS (dB) MARKER 3 2 GHz 0 –10 –20 –30 –40 1 2 3 1 START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) Caution This data is including loss of the test fixture. 6 Data Sheet P13656EJ2V0DS00 µPG154TB TYPICAL CHARACTERISTICS (Cx = 13 pF) TEST CONDITIONS: VCONT = 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using board for customer. IN OUT1 OUT2 50 Ω IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY CH1 S11 log MAG 10 dB/REF 0 dB 1: –14.995 dB 1 GHz 2: –18.465 dB 1.5 GHz 3: –19.04 dB 2 GHz 4: –14.189 dB 2.5 GHz 4 2 3 IN-OUT1 ISOLATION vs. FREQUENCY CH1 S12 log MAG 10 dB/REF 0 dB 1: –26.751 dB 1 GHz 2: –16.888 dB 1.5 GHz 3: –10.56 dB 2 GHz 4: –6.652 dB 2.5 GHz 3 4 2 1 Input Return Loss RLin (dB) 0 –10 –20 –30 –40 1 Isolation ISL (dB) MARKER 1 1 GHz MARKER 1 1 GHz 0 –10 –20 –30 –40 START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) IN-OUT1 INSERTION LOSS vs. FREQUENCY CH1 S21 log MAG 1 dB/REF 0 dB 1: –0.626 dB 1 GHz 2: –8.29 dB 1.5 GHz 3: –1.398 dB 2 GHz 4: –2.818 dB 2.5 GHz 2 3 4 IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY CH1 S22 log MAG 10 dB/REF 0 dB 1: –14.449 dB 1 GHz 2: –19.088 dB 1.5 GHz 3: –18.88 dB 2 GHz 4: –13.6 dB 2.5 GHz 3 4 MARKER 1 1 GHz 0 –1 –2 –3 –4 1 Output Return Loss RLout (dB) Insertion Loss LINS (dB) MARKER 1 1 GHz 0 –10 –20 –30 –40 1 2 START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) Caution This data is including loss of the test fixture. Data Sheet P13656EJ2V0DS00 7 µPG154TB TYPICAL CHARACTERISTICS (Cx = 5.5 pF) TEST CONDITIONS: VCONT = 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using board for customer. IN OUT1 OUT2 50 Ω IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY CH1 S11 log MAG 10 dB/REF 0 dB 1: –14.995 dB 1 GHz 2: –18.465 dB 1.5 GHz 3: –19.04 dB 2 GHz 4: –14.189 dB 2.5 GHz 4 3 IN-OUT1 ISOLATION vs. FREQUENCY CH1 S12 log MAG 10 dB/REF 0 dB 1: –14.383 dB 1 GHz 2: –23.015 dB 1.5 GHz 3: –13.513 dB 2 GHz 4: –7.75 dB 2.5 GHz 4 1 2 3 Input Return Loss RLin (dB) 0 –10 –20 –30 –40 1 2 Isolation ISL (dB) MARKER 2 1.5 GHz MARKER 2 1.5 GHz 0 –10 –20 –30 –40 START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) IN-OUT1 INSERTION LOSS vs. FREQUENCY CH1 S21 log MAG 1 dB/REF 0 dB 1: –0.79 dB 1 GHz 2: –0.728 dB 1.5 GHz 3: –1.105 dB 2 GHz 4: –2.404 dB 2.5 GHz 2 3 4 IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY CH1 S22 log MAG 10 dB/REF 0 dB 1: –14.449 dB 1 GHz 2: –19.088 dB 1.5 GHz 3: –18.88 dB 2 GHz 4: –13.36 dB 2.5 GHz 4 2 3 MARKER 2 1.5 GHz 0 –1 –2 –3 –4 1 Output Return Loss RLout (dB) Insertion Loss LINS (dB) MARKER 2 1.5 GHz 0 –10 –20 –30 –40 1 START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) Caution This data is including loss of the test fixture. 8 Data Sheet P13656EJ2V0DS00 µPG154TB TYPICAL CHARACTERISTICS (Cx = 3 pF) TEST CONDITIONS: VCONT = 3 V/0 V, VDD = 3.0 V, Pin = 0 dBm, TA = +25°C, using board for customer. IN OUT1 OUT2 50 Ω IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY CH1 S11 log MAG 10 dB/REF 0 dB 1: –14.995 dB 1 GHz 2: –18.465 dB 1.5 GHz 3: –19.04 dB 2 GHz 4: –14.189 dB 2.5 GHz 4 3 IN-OUT1 ISOLATION vs. FREQUENCY CH1 S12 log MAG 10 dB/REF 0 dB 1: –11.549 dB 1 GHz 2: –13.477 dB 1.5 GHz 3: –20.71 dB 2 GHz 4: –11.895 dB 2.5 GHz 2 3 4 Input Return Loss RLin (dB) 0 –10 –20 –30 –40 1 2 Isolation ISL (dB) MARKER 3 2 GHz MARKER 3 2 GHz 0 1 –10 –20 –30 –40 START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) IN-OUT1 INSERTION LOSS vs. FREQUENCY CH1 S21 log MAG 1 dB/REF 0 dB 1: –0.991 dB 1 GHz 2: –0.899 dB 1.5 GHz 3: –0.847 dB 2 GHz 4: –1.530 dB 2.5 GHz 2 3 4 IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY CH1 S22 log MAG 10 dB/REF 0 dB 1: –14.449 dB 1 GHz 2: –19.088 dB 1.5 GHz 3: –18.88 dB 2 GHz 4: –13.6 dB 2.5 GHz 4 2 3 MARKER 3 2 GHz 0 –1 –2 –3 –4 Output Return Loss RLout (dB) Insertion Loss LINS (dB) MARKER 3 2 GHz 0 –10 –20 –30 –40 1 1 START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) Caution This data is including loss of the test fixture. Data Sheet P13656EJ2V0DS00 9 µPG154TB TEST CIRCUIT TA = +25°C, VCONT1 = +3 V, VCONT2 = 0 V or VCONT1 = 0 V, VCONT2 = +3 V, VDD = +3.0 V, f = 2 GHz, ZO = 50 Ω Off chip DC blocking capacitors value: C0 = 51 pF C1 = 1 000 pF (Bypass: Select a suitable value for your application, especially concerning switching speed), CX = 2.0 pF (In case of 2 GHz), using NEC standard evaluation board VDD C1 Cx OUT1 C0 1 2 3 C0 OUT2 G1K 6 C1 C0 5 4 C1 VCONT1 IN VCONT2 EVALUATION BOARD Board for customer VDD Evaluation board VDD OUT1 OUT2 OUT1 OUT2 VCONT1 IN VCONT2 VCONT1 IN VCONT2 10 Data Sheet P13656EJ2V0DS00 µPG154TB TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE VCONT1 VCONT(H) VCONT2 VCONT(H) OUT1 OUT1 IN OUT2 VCONT(L) IN OUT2 VCONT(L) OUT1 OUT1 IN OUT2 IN OUT2 PACKAGE DIMENTIONS 6 PIN SUPER MINIMOLD (Unit: mm) 0.1 MIN. 0.2 +0.1 –0 0.15 +0.1 –0 2.1 ±0.1 1.25 ±0.1 0 to 0.1 0.65 1.3 0.65 0.7 0.9 ±0.1 2.0 ±0.2 Data Sheet P13656EJ2V0DS00 11 µPG154TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. conditions other than those recommended below, contact your NEC sales representative. Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Note Count: 3, Exposure limit: None Package peak temperature: 215°C or below Time: 40 seconds or less (at 200°C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260°C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300°C Time: 3 seconds or less (per pin row) Note Exposure limit: None Recommended Condition Symbol IR35-00-3 For soldering method and VPS VP15-00-3 Wave Soldering WS60-00-1 Partial Heating – Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). 12 Data Sheet P13656EJ2V0DS00 µPG154TB [MEMO] Data Sheet P13656EJ2V0DS00 13 µPG154TB [MEMO] 14 Data Sheet P13656EJ2V0DS00 µPG154TB [MEMO] Data Sheet P13656EJ2V0DS00 15 µPG154TB Caution The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • N o part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • D escriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8