UPG158TB-E3

DATA SHEET GaAs INTEGRATED CIRCUIT µPG158TB L, S- BAND SPDT SWITCH DESCRIPTION The µPG158TB is a L-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital cellular, cordless telephone and other L, S-band wireless application. The device can operate from 500 MHz to 2.5 GHz, having the low insertion loss. It housed in an original 6-pin super minimold package that is smaller than usual 6-pin minimold easy to install and contributes to miniaturizing the system. FEATURES • Low Insertion Loss: LINS = 0.3 dB TYP. @VCONT = +3.0 V/0 V, f = 1 GHz LINS = 0.4 dB TYP. @VCONT = +3.0 V/0 V, f = 2 GHz LINS = 0.5 dB TYP. @VCONT = +3.0 V/0 V, f = 2.5 GHz • High isolation: ISL = 27 dB TYP. @VCONT = +3.0 V/0 V, f = 0.5 to 2 GHz • Small 6-pin super minimold package (Size: 2.0 × 1.25 × 0.9 mm) APPLICATIONS • L, S-band digital cellular or cordless telephone • PCS, WLAN, WLL and Bluetooth applications ORDERING INFORMATION Part Number Marking G1M Package 6-pin super minimold Supplying Form Embossed tape 8 mm wide. Pin 1, 2, 3 face to tape perforation side. Qty 3 kp/reel. µPG158TB-E3 Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPG158TB) Caution The IC must be handled with care to prevent static discharge because its circuit is composed of GaAs MES FET. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P14267EJ2V0DS00 (2nd edition) Date Published November 1999 N CP(K) Printed in Japan The mark shows major revised points. © 1999 µPG158TB ABSOLUTE MAXIMUM RATINGS (TA = +25 °C) Parameter Control Voltage 1, 2 Input Power Total Power Dissipation Operating Temperature Storage Temperature Symbol VCONT1, 2 Pin Ptot TA Tstg Ratings −6.0 to +6.0 +28 0.15 −45 to +85 −45 to +150 Note Unit V dBm W °C °C Note Condition 2.5 ≤ | VCONT1 − VCONT2| ≤ 6.0 V Remarks 1. 2. Mounted on a 50 × 50 × 1.6 mm double copper clad epoxy glass PWB, TA = +85 °C Operation in excess of any one of these parameters may result in permanent damage. PIN CONNECTIONS Pin No. 1 2 3 Connection OUT1 GND OUT2 Pin No. 4 5 6 Connection VCONT2 IN VCONT1 1 3 2 (Top View) 4 5 4 5 (Bottom View) 3 2 6 6 1 RECOMMENDED OPERATING CONDITIONS (TA = +25 °C) Parameter Control Voltage (High) Control Voltage (Low) Symbol VCONT VCONT MIN. +2.5 −0.2 TYP. +3.0 0 MAX. +5.3 +0.2 Unit V V 2 Data Sheet P14267EJ2V0DS00 µPG158TB ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 °C, VCONT1 = 3 V, VCONT2 = 0 V or VCONT1 = 0 V, VCONT2 = 3 V, Off chip DC blocking capacitors value; 51 pF) Parameter Insertion Loss Symbol LINS Test Conditions f = 0.5 to 1.0 GHz f = 2.0 GHz f = 2.5 GHz Isolation ISL f = 0.5 to 2.0 GHz f = 2.5 GHz Input Return Loss Output Return Loss Input Power at 0.1 dB Note2 Compression Point Input Power at 1 dB Note2 Compression Point Switching Speed Control Current RLin RLout Pin(0.1 dB) f = 0.5 to 2.0 GHz f = 0.5 to 2.0 GHz f = 1.0 GHz, VCONT = 3 V/0 V MIN. − − − 22 − 13 13 − TYP. 0.3 0.4 0.5 Note1 MAX. 0.55 0.65 − − − − − − − Unit dB 27 23 Note1 dB 19 19 23.0 dB dB dBm Pin(1 dB) f = 1.0 GHz, VCONT = 3 V/0 V 22.0 − 26.5 dBm tsw ICONT VCONT = 3 V/0 V 50 0.5 200 10 ns − µA Notes 1. Characteristic for reference at 2.0 to 2.5 GHz 2. Pin(0.1 dB) or Pin(1 dB) is measured the input power level when the insertion loss increases more 0.1 dB or 1 dB than that of linear range. All other characteristics are measured in linear range. Cautions 1. When the µPG158TB is used it is necessary to use DC blocking capacitors for No. 1 (OUT1), No.3 (OUT2) and No.5 (IN). The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, band width, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. 2. The distance between IC’s GND pin and ground pattern of substrate should be as shorter as possible to avoid parasitic parameters. Data Sheet P14267EJ2V0DS00 3 µPG158TB TYPICAL CHARACTERISTICS TEST CONDITIONS: VCONT = 3 V/0 V, Pin = 0 dBm, TA = +25 °C OUT1 IN OUT2 50 Ω IN-OUT1 CH1 S11 INPUT RETURN LOSS vs. FREQUENCY 10 dB/ REF 0 dB 1: –23.433 dB 1 GHz 2: –30.102 dB 1.5 GHz 3: –25.504 dB 2 GHz 4: –16.018 dB 2.5 GHz CH1 S21 IN-OUT1 log MAG ISOLATION vs. FREQUENCY 10 dB/ REF 0 dB 1: –28.047 dB 1 GHz 2: –28.565 dB 1.5 GHz 3: –25.835 dB 2 GHz 4: –22.507 dB 2.5 GHz log MAG Input Return Loss RLin (dB) MARKER 1 1 GHz MARKER 1 1 GHz Isolation ISL (dB) 0 –10 –20 –30 –40 2 1 3 4 0 –10 –20 –30 2 –40 1 4 3 START 0.300 000 000 GHz STOP 3.300 000 000 GHz START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) Frequency f (GHz) IN-OUT1 CH1 S21 log MAG INSERTION LOSS vs. FREQUENCY 1 dB/ REF 0 dB 1: –0.574 dB 1 GHz 2: –0.662 dB 1.5 GHz 3: –0.795 dB 2 GHz 4: –1.111 dB 2.5 GHz 1 2 3 IN-OUT1 CH1 S22 OUTPUT RETURN LOSS vs. FREQUENCY 10 dB/ REF 0 dB 1: –22.502 dB 1 GHz 2: –28.139 dB 1.5 GHz 3: –25.867 dB 2 GHz 4: –15.601 dB 2.5 GHz log MAG 0 –1 –2 –3 –4 Output Return Loss RLout (dB) MARKER 1 1 GHz Insertion Loss LINS (dB) MARKER 1 1 GHz 0 –10 –20 –30 2 –40 1 4 3 4 START 0.300 000 000 GHz STOP 3.300 000 000 GHz START 0.300 000 000 GHz STOP 3.300 000 000 GHz Frequency f (GHz) Frequency f (GHz) Caution This data is including loss of the test fixture. 4 Data Sheet P14267EJ2V0DS00 µPG158TB TEST CIRCUIT TA= +25 °C, VCONT1 = +3 V, VCONT2 = 0 V or VCONT1 = 0 V, VCONT2 = +3 V, f = 2 GHz Off chip DC blocking capacitors value: C0 = 51 pF, C1 = 1000 pF (Bypass), Using NEC standard evaluation board OUT1 OUT2 C0 C0 1 2 3 6 C1 5 4 C1 C0 VCONT1 IN VCONT2 EVALUATION BOARD OUT1 OUT2 VCONT1 IN VCONT2 Data Sheet P14267EJ2V0DS00 5 µPG158TB TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE VCONT1 VCONT(H) VCONT2 VCONT(H) OUT1 IN OUT2 IN OUT2 OUT1 VCONT(L) VCONT(L) OUT1 IN OUT2 IN OUT2 OUT1 PACKAGE DIMENSIONS 6 PIN SUPER MINIMOLD (UNIT: mm) 0.1 MIN. 0.2 +0.1 –0 0.15 +0.1 –0 2.1 ±0.1 1.25 ±0.1 0 to 0.1 0.65 1.3 0.65 0.7 0.9 ±0.1 2.0 ±0.2 6 Data Sheet P14267EJ2V0DS00 µPG158TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. conditions other than those recommended below, contact your NEC sales representative. Recommended Condition Symbol IR35-00-3 For soldering method and Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235 °C or below Time: 30 seconds or less (at 210 °C) Note Count: 3, Exposure limit: None Package peak temperature: 215 °C or below Time: 40 seconds or less (at 200 °C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260 °C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300 °C Time: 3 seconds or less (per pin row) Note Exposure limit: None VPS VP15-00-3 Wave Soldering WS60-00-1 Partial Heating – Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Data Sheet P14267EJ2V0DS00 7 µPG158TB CAUTION The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal. • The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. • N o part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. • NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. • D escriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. • While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. • NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. M7 98. 8