UPG173TA-E3

PRELIMINARY DATA SHEET GaAs INTEGRATED CIRCUIT PPG173TA L-BAND PA DRIVER AMPLIFIER DESCRIPTION The PPG173TA is L-Band PA driver amplifier developed for digital cellular telephone and PCS applications. This device feature high output power and low distortion with 2.8 V low voltage and 25 mA low current operation. It is housed in a very small 6 pin mini-mold package available on tape-and-reel and easy to install and contributes to miniaturizing the systems. FEATURES { Low Operation Voltage : VDD = 2.8 V { Low distortion : Padj 1 = –60 dBc typ. @ VDD = 2.8 V, fRF = 925 to 960 MHz, Pout = +9 dBm External output matching { Low operation Current : IDD = 25 mA typ. @ VDD = 2.8 V, fRF = 925 to 960 MHz, Pout = +9 dBm External output matching { 6 pin mini-mold package APPLICATION { Digital Cellular: PDC, GSM, IS-95, IS-136, PCS etc. ORDERING INFORMATION PART NUMBER PACKAGE 6 pin Mini-Mold PACKING FORM Carrier tape width is 8 mm, Quantity is 3 kpcs per reel. PPG173TA-E3 Remark For sample order, please contact your local NEC sales office. (Part number for sample order: PPG173TA) ABSOLUTE MAXIMUM RATINGS (TA = 25°C) PARAMETERS Supply Voltage Input Power Total Power Dissipation Operating Temperature Storage Temperature SYMBOL VDD Pin Ptot TA Tstg RATINGS 6.0 –8 170 Note UNIT V dBm mW °C °C –30 to +90 –35 to +150 Note Mounted on a 50 u 50 u 1.6 mm double copper clad epoxy glass PWB, TA = +85°C Caution The IC must be handled with care to prevent static discharge because its circuit composed of GaAs HJ-FET. The information in this document is subject to change without notice. Document No. P13059EJ1V0DS00 (1st edition) Date Published November 1997 N Printed in Japan © 1997 PPG173TA PIN CONNECTION AND INTERNAL BLOCK DIAGRAM Pin No. 1 2 3 Connection VDD1 GND VDD2 & OUT Pin No. 4 5 6 Connection Non Connection GND IN (Top View) 3 2 1 (Bottom View) 3 4 5 6 4 5 6 4 5 6 3 2 1 2 1 RECOMMENDED OPERATING CONDITIONS (TA = 25°C) PARAMETERS Supply Voltage 1, 2 Input Power SYMBOL VDD1, 2 Pin MIN. +2.7 TYP. +2.8 –18 MAX. +3.0 UNIT V dBm ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = 25°C, VDD1 = VDD2 = +2.8 V, S/4DQPSK modulated signal input, External output matching) PARAMETERS Operating Frequency Linear Gain Total Current Adjacent Channel Power Leakage 1 Adjacent Channel Power Leakage 2 Input Return Loss Output Return Loss SYMBOL f GL IDD Padj1 Padj2 RLin RLout External matching Pin = –18 dBm Pin = –18 dBm Pout = +9 dBm, 'f = r50 kHz Pout = +9 dBm, 'f = r100 kHz TEST CONDITIONS MIN. 925 27 28.5 25 –60 –65 10 10 30 –55 –60 TYP. MAX. 960 UNIT MHz dB mA dBc dBc dB dB 2 G1C Preliminary Data Sheet PPG173TA EVALUATION CIRCUIT (Preliminary) VDD1 = VDD2 = +2.8 V, f = 925 to 960 MHz VDD1 VDD2 C2 R1 C1 L1 L2 OUT C3 1 2 3 Zo = 50 Ω G1C 6 5 4 IN Zo = 50 Ω Non Connection Using the NEC Evaluation board C1, C2 C3 R1 L1 L2 1000 pF 2.0 pF 10 : 8.2 nH 10 nH Preliminary Data Sheet 3 PPG173TA EVALUATION BOARD (Epoxy Glass, H = 4.6, 0.4 mm thickness) VDD1 OUT VDD2 38 mm IN 40 mm 6 PIN MINI-MOLD PACKAGE DIMENSIONS (UNIT: mm) 0.3 –0.0 +0.1 0.13 ±0.1 1 2.8 –0.3 +0.2 2 3 1.5 –0.1 +0.2 0 to 0.1 6 5 0.95 4 0.95 0.8 1.1–0.1 +0.2 1.9 2.9 ±0.2 4 Preliminary Data Sheet PPG173TA RECOMMENDED SOLDERING CONDITIONS This Product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives. Recommended condition symbol IR35-00-3 Soldering process Infrared ray reflow Soldering conditions Package peak temperature: 235°C Hour: within 30 s. (more than 210°C) Note Time: 3 times, Limited days: no. Package peak temperature: 215°C Hour: within 40 s. (more than 200°C) Note Time: 3 times, Limited days: no. Soldering tub temperature: less than 260°C, Hour: within 10 s. Note Time: 1 time, Limited days: no. Pin area temperature: less than 300°C, Hour: within 3 s. Note Limited days: no. VPS VP15-00-3 Wave Soldering WS60-00-1 Pin part heating Note It is the storage days after opening a dry pack, the storage conditions are 25°C, less than 65%, RH. Caution The combined use of soldering method is to be avoided (However, except the pin area heating method). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Preliminary Data Sheet 5 PPG173TA [MEMO] 6 Preliminary Data Sheet PPG173TA [MEMO] Preliminary Data Sheet 7 PPG173TA Caution The Great Care must be taken in dealing with the devices in this guide. The reason is that the material of the devices is GaAs (Gallium Arsenide), which is designated as harmful substance according to the law concerned. Keep the law concerned and so on, especially in case of removal. The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product. M4 96. 5