UPG2012TB-E3

NEC's ¼W SINGLE CONTROL UPG2012TB L-BAND SPDT SWITCH FEATURES • SUPPLY VOLTAGE: VDD = 2.7 to 3.0 V (2.8 V TYP.) • SWITCH CONTROL VOLTAGE: Vcont (H) = 2.7 to 3.0 V (2.8 V TYP.) Vcont (L) = −0.2 to +0.2 V (0 V TYP.) • LOW INSERTION LOSS: LINS1 = 0.27 dB TYP. @ f = 0.5 to 1.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V LINS2 = 0.30 dB TYP. @ f = 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V LINS3 = 0.35 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V (Reference value) • HIGH ISOLATION: ISL1 = = 28 dB TYP. @ f = 0.5 to 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V ISL2 = 25 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V (Reference value) • HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) DESCRIPTION NEC's UPG2012TB is a single control GaAs MMIC L-band SPDT (Single Pole Double Throw) switch for mobile phone and L-band applications. This device can operate from 0.5 to 2.5 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin super minimold package, suitable for high-density surface mounting. APPLICATIONS • L-band digital cellular or cordless handsets • PCS, W-LAN, WLL and BluetoothTM • Short Range Wireless ORDERING INFORMATION Part Number UPG2012TB-E3 Package 6-pin super minimold Marking G3A Supplying Form • Embossed tape 8 mm wide • Pin 1, 2, 3 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPG2012TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. California Eastern Laboratories UPG2012TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 4 3 (Top View) 44 (Bottom View) 3 Pin No. 1 2 5 2 55 2 3 4 6 1 66 1 5 6 Pin Name OUTPUT1 GND OUTPUT2 VCont INPUT VDD 2 1 TRUTH TABLE Vcont Low High INPUT−OUTPUT1 OFF ON INPUT−OUTPUT2 ON OFF ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Supply Voltage Switch Control Voltage Input Power Power Dissipation Operating Ambient Temperature Storage Temperature Symbol VDD Vcont Pin PD TA Tstg Ratings +6.0 +6.0 +26 150 Note −45 to +85 −55 to +150 Unit V V dBm mW °C °C Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C RECOMMENDED OPERATING RANGE (TA = 25°C, unless otherwise specified) Parameter Switch Voltage Switch Control Voltage (H) Switch Control Voltage (L) Symbol VDD Vcont (H) Vcont (L) MIN. 2.7 2.7 −0.2 TYP. 2.8 2.8 0 MAX. 3.0 3.0 0.2 Unit V V V G3A 3 UPG2012TB ELECTRICAL CHARACTERISTICS (TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Insertion Loss1 Insertion Loss2 Isolation1 Input Return Loss Output Return Loss 0.1 dB Gain Compression Input Power Note Supply Current Switching Control Current Symbol LINS1 LINS2 ISL1 RLin RLout Pin(0.1 dB) IDD Icont Test Conditions f = 0.5 to 1.0 GHz f = 2.0 GHz f = 0.5 to 2.0 GHz f = 0.5 to 2.5 GHz f = 0.5 to 2.5 GHz f = 2.0 GHz MIN. − − 24 15 15 +17.5 − − TYP. 0.27 0.30 28 20 20 +20.5 50 4 MAX. 0.50 0.50 − − − − 100 20 Unit dB dB dB dB dB dBm µA µA Note Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Insertion Loss3 Isolation2 1 dB Gain Compression Input Power Note Switching Control Speed Symbol LINS3 ISL2 Pin(1 dB) tSW Test Conditions f = 2.5 GHz f = 2.5 GHz f = 2.0 GHz MIN. − − − − TYP. 0.30 25 +24.0 300 MAX. − − − − Unit dB dB dBm ns Caution It is necessary to use DC blocking capacitors with the device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. UPG2012TB EVALUATION CIRCUIT (VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF) OUTPUT1 OUTPUT2 56 pF 56 pF 1 2 3 6 5 4 56 pF 1 000 pF 1 000 pF VDD INPUT Vcont The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4-277 UPG2012TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD VDD 6pin SMM SPDT SW Vc1 OUTPUT1 OUT 1 C2 C 2 C 4 C1 G3A INPUT C1 IN C3 C1 C C 5 1 C2 OUT 2 OUTPUT2 Vc2 Vcont USING THE NEC EVALUATION BOARD Symbol C1, C2, C3 C4, C5 Values 56 pF 1 000 pF UPG2012TB UPG2012TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 1.25±0.1 2.0±0.2 1.3 0.65 0.65 0.1 MIN. 0.9±0.1 0.7 0–0.1 0.15+0.1 -0.05 0.2+0.1 –0.05 UPG2012TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (package surface temperature) Time at temperature of 200°C or higher Preheating time at 120 to 150°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 215°C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 120°C or below : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below Condition Symbol IR260 VPS VP215 Wave Soldering WS260 Partial Heating HS350 Caution Do not use different soldering methods together (except for partial heating). Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 02/19/2004 A Business Partner of NEC Compound Semiconductor Devices, Ltd.