UPG2030TK_1

DATA SHEET GaAs INTEGRATED CIRCUIT μPG2030TK L, S-BAND SPDT SWITCH DESCRIPTION The μPG2030TK is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch which were developed for mobile phone and other L, S-band applications. This device can operate 2 control switching by control voltage 2.7 to 5.3 V, at frequencies from 0.5 to 2.5 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin lead-less minimold package and is suitable for high-density surface mounting. FEATURES • Switch control voltage • Low insertion loss : Vcont (H) = 2.7 to 5.3 V (2.8 V TYP.) : Vcont (L) = −0.2 to +0.2 V (0 V TYP.) : LINS1 = 0.25 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont = 2.8 V/0 V : LINS2 = 0.30 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont = 2.8 V/0 V : LINS3 = 0.35 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont = 2.8 V/0 V • High isolation • High power : ISL1 = 27 dB TYP. @ f = 0.5 to 2.0 GHz, Vcont = 2.8 V/0 V : ISL2 = 24 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont = 2.8 V/0 V : Pin (0.1 dB) = +27.0 dBm TYP. @ f = 2.0 GHz, Vcont = 2.8 V/0 V : Pin (1 dB) = +30.0 dBm TYP. @ f = 2.0 GHz, Vcont = 2.8 V/0 V (Reference value) • High-density surface mounting : 6-pin lead-less minimold package (1.5 × 1.1 × 0.55 mm) APPLICATIONS • PCS, W-LAN, WLL and BluetoothTM etc. ORDERING INFORMATION Part Number Order Number Package 6-pin lead-less minimold (1511 PKG) (Pb-free) Marking G3R Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 5 kpcs/reel μPG2030TK-E2 μPG2030TK-E2-A Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: μPG2030TK Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10409EJ03V0DS (3rd edition) Date Published August 2009 NS Printed in Japan The mark shows major revised points. 2003, 2009 The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field. μPG2030TK PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. 1 Pin Name OUTPUT1 GND OUTPUT2 Vcont2 INPUT Vcont1 (Top View) 1 2 3 OUTPUT1 6 1 5 GND 2 (Top View) Vcont1 6 INPUT 5 Vcont2 4 6 5 4 (Bottom View) 1 2 2 3 4 TRUTH TABLE Vcont1 Low High Vcont2 High Low INPUT−OUTPUT1 ON OFF INPUT−OUTPUT2 OFF ON ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Symbol Vcont Pin TA Tstg Ratings 6.0 Note G3R Parameter OUTPUT2 4 3 3 5 6 Unit V dBm °C °C Switch Control Voltage Input Power Operating Ambient Temperature Storage Temperature +33 −45 to +85 −55 to +150 Note ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Symbol Vcont (H) Vcont (L) MIN. 2.7 −0.2 TYP. 2.8 0 MAX. 5.3 0.2 Unit V V Switch Control Voltage (H) Switch Control Voltage (L) 2 Data Sheet PG10409EJ03V0DS μPG2030TK ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont = 2.8 V/0 V, DC cut capacitors = 56 pF, unless otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Insertion Loss 3 Isolation 1 Isolation 2 Input Return Loss Output Return Loss 0.1 dB Gain Compression Input Power Note Symbol LINS1 LINS2 LINS3 ISL1 ISL2 RLin RLout Test Conditions f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 0.5 to 2.0 GHz f = 2.0 to 2.5 GHz f = 0.5 to 2.5 GHz f = 0.5 to 2.5 GHz MIN. − − − 23 20 15 15 +25.5 +25.5 − − TYP. 0.25 0.30 0.35 27 24 20 20 +27.0 +27.0 4 50 MAX. 0.45 0.50 0.55 − − − − − − 20 500 Unit dB dB dB dB dB dB dB dBm dBm Pin (0.1 dB) f = 2.0 GHz f = 2.5 GHz Icont tSW No signal Switch Control Current Switch Control Speed μA ns Note Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, Vcont = 2.8 V/0 V, DC cut capacitors = 56 pF, unless otherwise specified) Parameter 1 dB Gain Compression Input Power Note Symbol Pin (1 dB) Test Conditions f = 2.0 GHz MIN. − TYP. +30.0 MAX. − Unit dBm Note Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution This device is used it is necessary to use DC cut capacitors. The value of DC cut capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC cut capacitor value is less than 100 pF. Data Sheet PG10409EJ03V0DS 3 μPG2030TK EVALUATION CIRCUIT (Vcont = 2.8 V/0 V, DC cut capacitors = 56 pF) Vcont1 INPUT Vcont2 56 pF 1 000 pF 6 5 4 1 000 pF 1 2 3 56 pF 56 pF OUTPUT1 OUTPUT2 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10409EJ03V0DS μPG2030TK ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vcont2 6pin L2MM SPDT SW Vc1 OUTPUT2 OUT 1 C2 C 2 C 4 C1 INPUT C1 IN C 5 C3 G3R C1 C 1 C2 OUT 2 OUTPUT1 Vc2 Vcont1 USING THE NEC EVALUATION BOARD Symbol C1, C2, C3 C4, C5 Values 56 pF 1 000 pF Data Sheet PG10409EJ03V0DS 5 μPG2030TK TYPICAL CHARACTERISTICS (TA = +25°C, Vcont = 2.8 V/0 V, DC cut capacitors = 56 pF, unless otherwise specified) INPUT–OUTPUT1 INSERSION LOSS vs. FREQUENCY 0.5 0.4 Insersion Loss LINS (dB) Insersion Loss LINS (dB) INPUT–OUTPUT2 INSERSION LOSS vs. FREQUENCY 0.5 0.4 0.3 0.2 0.1 0 –0.1 –0.2 –0.3 –0.4 –0.5 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) 0.3 0.2 0.1 0 –0.1 –0.2 –0.3 –0.4 –0.5 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) INPUT–OUTPUT1 ISOLATION vs. FREQUENCY 50 40 30 Isolation ISL (dB) INPUT–OUTPUT2 ISOLATION vs. FREQUENCY 50 40 30 Isolation ISL (dB) 20 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) 20 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) INPUT–OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY 50 40 Input Return Loss RLin (dB) Input Return Loss RLin (dB) INPUT–OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY 50 40 30 20 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) 30 20 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Remark The graphs indicate nominal characteristics. 6 Data Sheet PG10409EJ03V0DS μPG2030TK INPUT–OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY 50 40 30 20 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) INPUT–OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY 50 40 30 20 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Output Return Loss RLout (dB) OUTPUT POWER vs. INPUT POWER 40 f = 1.0 GHz 35 35 40 Output Return Loss RLout (dB) OUTPUT POWER vs. INPUT POWER f = 2.5 GHz Output Power Pout (dBm) 30 25 20 15 10 5 0 10 15 20 25 30 35 40 Output Power Pout (dBm) 30 25 20 15 10 5 0 10 15 20 25 30 35 40 Input Power Pin (dBm) Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. Data Sheet PG10409EJ03V0DS 7 μPG2030TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm) (Top View) (Bottom View) 0.48±0.05 0.48±0.05 1.5±0.1 1.1±0.1 1.3±0.05 *1 0.2±0.1 a 0.16±0.05 0.9±0.1 b *2 c 0.55±0.03 Remark Dimension is bigger than dimension (dimension = a + b + c). *1 0.11+0.1 –0.05 *2 *2 8 Data Sheet PG10409EJ03V0DS μPG2030TK RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260 For soldering Preheating temperature (package surface temperature) : 120°C or below Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10409EJ03V0DS 9 μPG2030TK Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. • T he information in this document is current as of August, 2009. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. 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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E0904E 10 Data Sheet PG10409EJ03V0DS μPG2030TK Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.