UPG2150T5L-E2

DATA SHEET GaAs INTEGRATED CIRCUIT μPG2150T5L SP3T SWITCH FOR Bluetooth TM AND 802.11b/g DESCRIPTION The μPG2150T5L is a GaAs MMIC SP3T switch which was developed for Bluetooth and wireless LAN. This device can operate frequency from 0.5 to 2.5 GHz, having the low insertion loss and high isolation. This device is housed in a 12-pin plastic TSQFN (Thin Small Quad Flat Non-leaded) package. And this package is able to high-density surface mounting. FEATURES • Operation frequency • Control voltage • Low insertion loss • High isolation : fopt = 0.5 to 2.5 GHz : Vcont (H) = 2.3 to 3.6 V (2.85 V TYP.) : Vcont (L) = −0.2 to 0.2 V (0 V TYP.) : Lins3 = 0.50 dB TYP. @ f = 2.5 GHz, ANT to RF1, 2, Vcont (H) = 2.85 V, Vcont (L) = 0 V : Lins6 = 0.60 dB TYP. @ f = 2.5 GHz, ANT to RF3, Vcont (H) = 2.85 V, Vcont (L) = 0 V : ISL3 = 35 dB TYP. @ f = 2.5 GHz, ANT to RF3, On port ANT to RF1, 2, RF1 to RF3, On port ANT to RF1, Vcont (H) = 2.85 V, Vcont (L) = 0 V : ISL6 = 18 dB TYP. @ f = 2.5 GHz, ANT to RF1, On port ANT to RF2, 3, ANT to RF2, On port ANT to RF1, 3, Vcont (H) = 2.85 V, Vcont (L) = 0 V • Handling power : Pin (1 dB) = +31.0 dBm TYP. @ f = 2.5 GHz, ANT to RF1, 2, Vcont (H) = 2.85 V, Vcont (L) = 0 V : Pin (1 dB) = +25.0 dBm TYP. @ f = 2.5 GHz, ANT to RF3, Vcont (H) = 2.85 V, Vcont (L) = 0 V • High-density surface mounting : 12-pin plastic TSQFN package (2.0 × 2.0 × 0.37 mm) APPLICATIONS • Antenna switch for Bluetooth and 802.11b/g ORDERING INFORMATION Part Number Order Number Package 12-pin plastic TSQFN (Pb-Free) Marking 2150 Supplying Form • Embossed tape 8 mm wide • Pin 10, 11, 12 face the perforation side of the tape • Qty 3 kpcs/reel μPG2150T5L-E2 μPG2150T5L-E2-A Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPG2150T5L Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10653EJ02V0DS (2nd edition) Date Published April 2007 NS CP(N) Printed in Japan The mark shows major revised points. 2007 The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field. μPG2150T5L PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. 1 Pin Name ANT GND Vcont2 RF2 GND RF3 Vcont3 GND Vcont1 RF1 N.C. N.C. (Top View) 12 11 10 (Top View) 12 11 10 (Bottom View) 10 11 12 2 3 4 1 2 3 9 8 7 1 2 3 9 8 7 9 8 7 1 2 3 5 6 7 8 9 10 11 12 2150 4 5 6 Vcont1 High Low Low Low High Low Parameter Parameter 4 5 6 6 5 4 Remark Exposed pad : GND TRUTH TABLE Vcont2 Vcont3 Low Low High ANT−RF1 ON OFF OFF ANT−RF2 OFF ON OFF ANT−RF3 OFF OFF ON ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Symbol Vcont Pin1 Pin2 TA Tstg Ratings −6.0 to +6.0 +31.5 +25.5 −45 to +85 −55 to +150 Note Unit V dBm dBm °C °C Switch Control Voltage Input Power1 (ANT−RF1, ANT−RF2) Input Power2 (ANT−RF3) Operating Ambient Temperature Storage Temperature Note ⎪Vcont (H) − Vcont (L)⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Symbol fopt Vcont (H) Vcont (L) MIN. 0.5 2.3 −0.2 TYP. − 2.85 0 MAX. 2.5 3.6 0.2 Unit GHz V V Operating Frequency Switch Control Voltage (H) Switch Control Voltage (L) 2 Data Sheet PG10653EJ02V0DS μPG2150T5L ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 2.85 V, Vcont specified) Parameter Insertion Loss 1 Insertion Loss 2 Insertion Loss 3 Insertion Loss 4 Insertion Loss 5 Insertion Loss 6 Isolation 1 Symbol Lins1 Lins2 Lins3 Lins4 Lins5 Lins6 ISL1 ANT to RF3 On port ANT to Isolation 2 ISL2 RF1, 2 RF1 to RF3 Isolation 3 ISL3 On port ANT to RF1 Isolation 4 ISL4 ANT to RF1 On port ANT to Isolation 5 ISL5 RF2, 3 ANT to RF2 Isolation 6 ISL6 On port ANT to RF1, 3 Input Return Loss Output Return Loss 1 dB Loss Compression Input Power Note (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise Pass ANT to RF1, 2 Test Conditions f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz MIN. − − − − − − 29 TYP. 0.40 0.45 0.50 0.45 0.55 0.60 32 MAX. 0.55 0.60 0.65 0.60 0.70 0.75 − Unit dB dB dB dB dB dB dB ANT to RF3 f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz 29 32 − dB f = 2.0 to 2.5 GHz 30 35 − dB f = 0.5 to 1.0 GHz 23 26 − dB f = 1.0 to 2.0 GHz 17 20 − dB f = 2.0 to 2.5 GHz 15 18 − dB RLin RLout Pin (1 dB) ANT to RF1, 2, 3 ANT to RF1, 2, 3 ANT to RF1, 2 f = 0.5 to 2.5 GHz f = 0.5 to 2.5 GHz f = 1.0 GHz f = 2.0 GHz f = 2.5 GHz 15 15 +28.0 +28.0 +28.0 +22.0 +22.0 +22.0 − − 20 20 +31.0 +31.0 +31.0 +25.0 +25.0 +25.0 0.05 50 − − − − − − − − 1.0 − dB dB dBm dBm dBm dBm dBm dBm ANT to RF3 f = 1.0 GHz f = 2.0 GHz f = 2.5 GHz Switch Control Current Switch Control Speed Icont tSW ANT to RF1, 2, 3 ANT to RF1, 2, 3 RF None 50% CTL to 90/10% RF μA ns Note Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Data Sheet PG10653EJ02V0DS 3 μPG2150T5L EVALUATION CIRCUIT RF1 56 pF 12 56 pF ANT 1 11 10 9 Vcont1 1 000 pF 2 8 Vcont2 1 000 pF 3 7 Vcont3 1 000 pF 4 5 6 56 pF 56 pF RF2 RF3 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10653EJ02V0DS μPG2150T5L MOUNTING PAD AND SOLDER PAD LAYOUT DIMENSIONS 12-PIN PLASTIC TSQFN (UNIT: mm) MOUNTING PAD 0.33 0.77 0.5 0.77 0.5 0.33 0.94 0.5 12–0.23 0.94 0.5 SOLDER PAD 0.28 0.77 0.5 0.77 0.5 0.28 0.49 0.5 12–0.18 0.49 0.5 Solder thickness : 0.08 mm Remark The mounting pad and solder pad layouts in this document are for reference only. 0.28 0.77 0.77 0.28 0.33 0.77 0.77 0.33 Data Sheet PG10653EJ02V0DS 5 μPG2150T5L PACKAGE DIMENSIONS 12-PIN PLASTIC TSQFN (UNIT: mm) 2.0±0.1 0.37+0.03 –0.05 2.0±0.1 (Bottom View) (C 0.17±0.07) 0.50±0.06 0.23±0.1 0.94±0.1 Remark ( ) : Reference value 6 Data Sheet PG10653EJ02V0DS 0.94±0.1 0.23+0.07 –0.05 μPG2150T5L RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260 For soldering Preheating temperature (package surface temperature) : 120°C or below Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10653EJ02V0DS 7 μPG2150T5L Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. • T he information in this document is current as of April, 2007. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. 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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 8 Data Sheet PG10653EJ02V0DS μPG2150T5L Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.