UPG2151TK-E2

DATA SHEET GaAs INTEGRATED CIRCUIT μPG2151TK L, S-BAND SPDT SWITCH DESCRIPTION The μPG2151TK is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch which was developed for mobile phone and another L, S-band application. This device can operate 2 control switching by control voltage 1.8 to 5.3 V. This device can operate frequency from 0.5 to 3.0 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin lead-less minimold (1511) package. And this package is able to high-density surface mounting. FEATURES • Switch control voltage • : Vcont (H) = 1.8 to 5.3 V (2.6 V TYP.) : Vcont (L) = −0.2 to +0.2 V (0 V TYP.) Low insertion loss : LINS1 = 0.30 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont (H) = 2.6 V, Vcont (L) = 0 V : LINS2 = 0.35 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont (H) = 2.6 V, Vcont (L) = 0 V : LINS3 = 0.50 dB TYP. @ f = 2.0 to 3.0 GHz, Vcont (H) = 2.6 V, Vcont (L) = 0 V High isolation : ISL1 = 25 dB TYP. @ f = 0.5 to 1.0 GHz, Vcont (H) = 2.6 V, Vcont (L) = 0 V : ISL2 = 18 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont (H) = 2.6 V, Vcont (L) = 0 V : ISL3 = 13 dB TYP. @ f = 2.0 to 3.0 GHz, Vcont (H) = 2.6 V, Vcont (L) = 0 V Handling power : Pin (0.1 dB) = +21.0 dBm TYP. @ f = 2.0 GHz, Vcont (H) = 2.6 V, Vcont (L) = 0 V High-density surface mounting : 6-pin lead-less minimold package (1.5 × 1.1 × 0.55 mm) • • • APPLICATIONS • L, S-band digital cellular or cordless telephone TM • W-LAN, WLL and Bluetooth etc. ORDERING INFORMATION Part Number Order Number Package 6-pin lead-less minimold (1511) (Pb-Free) Note Marking G4N Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 5 kpcs/reel μPG2151TK-E2 μPG2151TK-E2-A Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPG2151TK Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10600EJ01V0DS (1st edition) Date Published May 2006 NS CP(K) Printed in Japan 2006 μPG2151TK PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. 1 Pin Name OUTPUT1 GND OUTPUT2 Vcont2 INPUT Vcont1 (Top View) 1 2 3 6 5 4 1 2 3 (Top View) 6 5 4 6 5 4 (Bottom View) 1 2 3 TRUTH TABLE Vcont1 Low High Vcont2 High Low INPUT−OUTPUT1 OFF ON INPUT−OUTPUT2 ON OFF ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Switch Control Voltage Input Power Operating Ambient Temperature Storage Temperature Symbol Vcont Pin TA Tstg Ratings +6.0 Note Note ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter Switch Control Voltage (H) Switch Control Voltage (L) Symbol Vcont (H) Vcont (L) MIN. 1.8 −0.2 TYP. 2.6 0 MAX. 5.3 +0.2 Unit V V G4N 2 3 4 5 6 Unit V dBm °C °C +26 −45 to +85 −55 to +150 2 Data Sheet PG10600EJ01V0DS μPG2151TK ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 2.6 V, Vcont (L) = 0 V, DC cut capacitors = 56 pF, unless otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Insertion Loss 3 Isolation 1 Isolation 2 Isolation 3 Input Return Loss Output Return Loss 0.1 dB Loss Compression Input Power Note Symbol LINS1 LINS2 LINS3 ISL1 ISL2 ISL3 RLin RLout Pin (0.1 dB) Test Conditions f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 3.0 GHz f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 3.0 GHz f = 0.5 to 3.0 GHz f = 0.5 to 3.0 GHz f = 2.0 GHz MIN. − − − 22 15 10 − − +18.0 − TYP. 0.30 0.35 0.50 25 18 13 20 20 +21.0 MAX. 0.42 0.47 0.65 − − − − − − Unit dB dB dB dB dBm Switch Control Current Switch Control Speed Icont tSW 50% CTL to 90/10% RF 0.2 1.0 20 − μA μs − Note Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. Caution This device is used it is necessary to use DC cut capacitors. The value of DC cut capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC cut capacitor value is less than 100 pF. Data Sheet PG10600EJ01V0DS 3 μPG2151TK EVALUATION CIRCUIT Vcont1 INPUT Vcont2 1 000 pF C0 1 000 pF 6 5 4 1 2 GND 3 C0 C0 OUTPUT1 OUTPUT2 Remark C0 : 56 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10600EJ01V0DS μPG2151TK ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vcont2 6pin L2MM SPDT SW Vc1 OUTPUT2 OUT 1 C2 C 2 C 4 C1 INPUT C1 IN C 5 C3 G4N C1 C 1 C2 OUT 2 OUTPUT1 Vc2 Vcont1 USING THE NEC EVALUATION BOARD Symbol C1, C2, C3 C4, C5 Values 56 pF 1 000 pF Data Sheet PG10600EJ01V0DS 5 μPG2151TK TYPICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 2.6 V, Vcont (L) = 0 V, DC cut capacitors = 56 pF, using test fixture, unless otherwise specified) INPUT-OUTPUT1 INSERTION LOSS vs. FREQUENCY 5 4 Insertion Loss LINS (dB) 1: 2: 3: 4: 5: INPUT-OUTPUT2 INSERTION LOSS vs. FREQUENCY 5 4 Insertion Loss LINS (dB) 1: 2: 3: 4: 5: –0.534 dB 1.0 GHz –0.678 dB 1.5 GHz –0.801 dB 2.0 GHz –0.938 dB 2.5 GHz –1.067 dB 3.0 GHz –0.556 dB 1.0 GHz –0.688 dB 1.5 GHz 3 2 1 0 –1 –2 –3 –4 –5 0.5 1.0 1.5 2.0 2.5 1 2 3 4 3 2 1 0 –1 –2 –3 –4 1 2 3 4 –0.806 dB 2.0 GHz –0.947 dB 2.5 GHz –1.081 dB 3.0 GHz 5 5 3.0 3.5 –5 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Frequency f (GHz) Frequency f (GHz) Remark The graphs indicate nominal characteristics. Caution These characteristics values include the losses of NEC evaluation board. 6 Data Sheet PG10600EJ01V0DS μPG2151TK INPUT-OUTPUT1 ISORATION vs. FREQUENCY 50 40 30 1: 2: 3: 4: 5: INPUT-OUTPUT2 ISORATION vs. FREQUENCY 50 40 30 1: 2: 3: 4: 5: –25.11 dB 1.0 GHz –21.51 dB 1.5 GHz –19.13 dB 2.0 GHz –17.29 dB 2.5 GHz –15.55 dB 3.0 GHz –24.96 dB 1.0 GHz –21.36 dB 1.5 GHz –18.97 dB 2.0 GHz Isolation LSL (dB) Isolation LSL (dB) 20 10 0 –10 –20 –30 –40 –50 0.5 1.0 1.5 2.0 2.5 1 2 3 4 20 10 0 –10 –20 –30 –40 1 2 3 4 –17.14 dB 2.5 GHz –15.14 dB 3.0 GHz 5 5 3.0 3.5 –50 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Frequency f (GHz) Frequency f (GHz) INPUT-OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY 50 40 1: 2: 3: 4: 5: INPUT-OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY 50 1: 2: 3: 4: 5: –35.68 dB –33.53 dB 1.0 GHz Input Return Loss RLin (dB) Input Return Loss RLin (dB) 30 20 10 0 –10 –20 –30 –40 –50 0.5 1.0 1 2 1.5 3 2.0 4 2.5 1.0 GHz –31.34 dB 1.5 GHz –28.09 dB 2.0 GHz –28.09 dB 2.5 GHz –31.87 dB 3.0 GHz 40 30 20 10 0 –10 –20 –30 –40 1 2 1.0 1.5 3 2.0 4 2.5 –34.10 dB 1.5 GHz –31.36 dB 2.0 GHz –30.21 dB 2.5 GHz –30.48 dB 3.0 GHz 5 3.0 3.5 5 3.0 3.5 –50 0.5 Frequency f (GHz) Frequency f (GHz) INPUT-OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY 50 1: 2: 3: 4: 5: INPUT-OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY 50 1: 2: 3: 4: 5: –29.61 dB –31.11 dB 1.0 GHz Output Return Loss RLout (dB) Output Return Loss RLout (dB) 40 30 20 10 0 –10 –20 –30 –40 –50 0.5 1.0 2 1.5 1 3 4 1.0 GHz –28.18 dB 1.5 GHz –27.22 dB 2.0 GHz –29.01 dB 2.5 GHz –33.85 dB 3.0 GHz 40 30 20 10 0 –10 –20 –30 –40 –50 0.5 1.0 2 1.5 3 2.0 1 4 –30.20 dB 1.5 GHz –28.15 dB 2.0 GHz –27.69 dB 2.5 GHz –28.66 dB 3.0 GHz 5 3.0 3.5 5 2.0 2.5 3.0 3.5 2.5 Frequency f (GHz) Frequency f (GHz) Remark The graphs indicate nominal characteristics. Data Sheet PG10600EJ01V0DS 7 μPG2151TK OUTPUT POWER vs. INPUT POWER +35 f = 2.0 GHz +30 Output Power Pout (dBm) +25 +20 +15 +10 +5 0 –5 –5 0 +5 +10 +15 +20 +25 +30 +35 Input Power Pin (dBm) Remark The graph indicates nominal characteristics. 8 Data Sheet PG10600EJ01V0DS μPG2151TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) (Top View) (Bottom View) 0.48±0.05 0.48±0.05 1.5±0.1 1.1±0.1 1.3±0.05 0.2±0.1 0.16±0.05 0.9±0.1 0.55±0.03 0.11+0.1 –0.05 Data Sheet PG10600EJ01V0DS 9 μPG2151TK RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260 For soldering Preheating temperature (package surface temperature) : 120°C or below Caution Do not use different soldering methods together (except for partial heating). 10 Data Sheet PG10600EJ01V0DS μPG2151TK Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. • T he information in this document is current as of May, 2006. 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(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 Data Sheet PG10600EJ01V0DS 11 μPG2151TK Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth. For further information, please contact NEC Compound Semiconductor Devices Hong Kong Limited E-mail: contact@ncsd-hk.necel.com Hong Kong Head Office TEL: +852-3107-7303 FAX: +852-3107-7309 Taipei Branch Office TEL: +886-2-8712-0478 FAX: +886-2-2545-3859 Korea Branch Office TEL: +82-2-558-2120 FAX: +82-2-558-5209 NEC Electronics (Europe) GmbH http://www.eu.necel.com/ TEL: +49-211-6503-0 FAX: +49-211-6503-1327 California Eastern Laboratories, Inc. http://www.cel.com/ TEL: +1-408-988-3500 FAX: +1-408-988-0279 Compound Semiconductor Devices Division NEC Electronics Corporation URL: http://www.ncsd.necel.com/ 0604