UPG2164T5N-E2-A

DATA SHEET GaAs INTEGRATED CIRCUIT μPG2164T5N DPDT SWITCH FOR 2.4 GHz AND 6 GHz DUAL-BAND WIRELESS LAN DESCRIPTION The μPG2164T5N is a GaAs MMIC DPDT (Double Pole Double Throw) switch which was developed for 2.4 GHz and 6 GHz dual-band wireless LAN. This device can operate frequency from 2.4 GHz band and 6 GHz band, having the low insertion loss and high isolation. This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) package. And this package is able to high-density surface mounting. FEATURES • Operating frequency • Switch control voltage • Low insertion loss • High isolation • Handling power : f = 2.4 to 2.5 GHz and 4.9 to 6.0 GHz : Vcont (H) = 2.8 to 5.0 V (3.0 V TYP.) : Vcont (L) = −0.3 to 0.3 V (0 V TYP.) : Lins1 = 0.50 dB TYP. @ f = 2.4 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins2 = 0.70 dB TYP. @ f = 4.9 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL1 = 25 dB TYP. @ f = 2.4 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL2 = 17 dB TYP. @ f = 4.9 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +31.0 dBm TYP. @ f = 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +29.0 dBm TYP. @ f = 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V • High-density surface mounting : 6-pin plastic TSON package (1.5 × 1.5 × 0.37 mm) APPLICATION • Dual-band wireless LAN (IEEE802.11a + b/g) ORDERING INFORMATION Part Number Order Number Package 6-pin plastic TSON (Pb-Free) Marking G5B Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 3 kpcs/reel μPG2164T5N-E2 μPG2164T5N-E2-A Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPG2164T5N Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10636EJ02V0DS (2nd edition) Date Published February 2008 NS Printed in Japan The mark shows major revised points. 2006, 2008 The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field. μPG2164T5N PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View) (Bottom View) Pin No. 1 Pin Name ANT2 Vcont2 OUT2 (RX) OUT1 (TX) Vcont1 ANT1 1 6 1 6 6 1 2 3 G5B Vcont1 High Low Vcont2 Low High Parameter Parameter 2 5 2 5 5 2 4 5 6 3 4 3 4 4 3 Remark Exposed pad : GND TRUTH TABLE ANT1−OUT1 (TX) OFF ON ANT1− OUT2 (RX) ON OFF ANT2− OUT1 (TX) ON OFF ANT2−OUT2 (RX) OFF ON ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Symbol Vcont Pin TA Tstg Ratings −6.0 to +6.0 +32 −45 to +85 −55 to +135 Unit V dBm °C °C Switch Control Voltage Input Power Operating Ambient Temperature Storage Temperature RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Symbol Vcont (H) Vcont (L) f1 f2 MIN. 2.8 −0.3 2.4 4.9 TYP. 3.0 0 − − MAX. 5.0 0.3 2.5 6.0 Unit V V GHz GHz Switch Control Voltage (H) Switch Control Voltage (L) Operating Frequency 1 Operating Frequency 2 2 Data Sheet PG10636EJ02V0DS μPG2164T5N ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 3.0 V, Vcont otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Isolation 1 (ANT to OUT) Isolation 2 (ANT to OUT) Isolation 3 (ANT1 to ANT2, TX to RX) Isolation 4 (ANT1 to ANT2, TX to RX) Input Return Loss 1 Input Return Loss 2 Output Return Loss 1 Output Return Loss 2 1 dB Loss Compression Note Input Power 1 1 dB Loss Compression Note Input Power 2 Input 3rd Order Intercept Point Symbol Lins1 Lins2 ISL1 ISL2 ISL3 ISL4 RLin1 RLin2 RLout1 RLout2 (L) = 0 V, Z0 = 50 Ω, DC blocking capacitors = 4 pF, unless Test Conditions f = 2.4 to 2.5 GHz f = 4.9 to 6.0 GHz f = 2.4 to 2.5 GHz f = 4.9 to 6.0 GHz f = 2.4 to 2.5 GHz f = 4.9 to 6.0 GHz f = 2.4 to 2.5 GHz f = 4.9 to 6.0 GHz f = 2.4 to 2.5 GHz f = 4.9 to 6.0 GHz MIN. − − 22 14 22 15 − − − − − − − − TYP. 0.50 0.70 25 17 25 17 15 15 15 15 +31.0 MAX. 0.75 1.00 − − − − − − − − − − − Unit dB dB dB dB dB dB dB dB dB dB dBm Pin (1 dB) 1 f = 2.4 to 2.5 GHz Pin (1 dB) 2 f = 4.9 to 6.0 GHz +29.0 dBm IIP3 f1 = 2 500 MHz, f2 = 2 501 MHz, Pin (1 tone) = +20 dBm +50 dBm Switch Control Current Switch Control Speed Icont tSW 50% CTL to 90/10% 0.1 50 1.0 − μA ns − Note Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution This device is used it is necessary to use DC blocking capacitors. Data Sheet PG10636EJ02V0DS 3 μPG2164T5N EVALUATION CIRCUIT 4 pF ANT2 1 6 4 pF ANT1 Vcont2 1 000 pF 2 5 1 000 pF Vcont1 OUT2 (RX) 4 pF 3 4 4 pF OUT1 (TX) The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10636EJ02V0DS μPG2164T5N MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) MOUNTING PAD 0.3 0.5 0.3 1.0 0.3 0.2 0.3 SOLDER MASK 0.475 0.25 0.475 0.35 0.55 0.15 0.25 Solder thickness : 0.08 mm Remark The mounting pad and solder mask layouts in this document are for reference only. 0.5 0.5 0.5 0.5 Data Sheet PG10636EJ02V0DS 5 μPG2164T5N PACKAGE DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) (Top View) 1.5±0.1 (Side View) (Bottom View) 0.3±0.07 0.5±0.06 1.5±0.1 0.37+0.03 –0.05 0.2±0.1 0.2+0.07 –0.05 0.7±0.1 6 Data Sheet PG10636EJ02V0DS 1.2±0.1 μPG2164T5N RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260 For soldering Preheating temperature (package surface temperature) : 120°C or below Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10636EJ02V0DS 7 μPG2164T5N • T he information in this document is current as of February, 2008. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. 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GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.