UPG2185T6R-E2-A

DATA SHEET GaAs INTEGRATED CIRCUIT μPG2185T6R SPDT SWITCH FOR 2 GHz TO 6 GHz DESCRIPTION The μPG2185T6R is a GaAs MMIC SPDT (Single Pole Double Throw) switch which was designed for 2 GHz to 6 GHz applications, including dual-band wireless LAN. This device can operate frequency from 2 GHz to 6 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin plastic TSSON (Thin Shrink Small Out-line Non-leaded) package. And this package is able to high-density surface mounting. FEATURES • Operating frequency • Switch control voltage • Low insertion loss • High isolation • Handling power : f = 2.0 to 6.0 GHz : Vcont (H) = 2.8 to 3.3 V (3.0 V TYP.) : Vcont (L) = −0.2 to 0.2 V (0 V TYP.) : Lins1 = 0.40 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins2 = 0.50 dB TYP. @ f = 2.5 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL1 = 26 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL2 = 25 dB TYP. @ f = 2.5 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +30.5 dBm TYP. @ f = 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +30.5 dBm TYP. @ f = 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V • High-density surface mounting : 6-pin plastic TSSON package (1.0 × 1.0 × 0.37 mm) APPLICATIONS • Wireless LAN (IEEE802.11a/b/g/n) • UWB, near field communications ORDERING INFORMATION Part Number Order Number Package 6-pin plastic TSSON (Pb-Free) Marking G8 Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 5 kpcs/reel μPG2185T6R-E2 μPG2185T6R-E2-A Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPG2185T6R Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10719EJ02V0DS (2nd edition) Date Published August 2008 NS Printed in Japan The mark shows major revised points. 2008 The revised points can be easily searched by copying an "" in the PDF file and specifying it in the "Find what:" field. μPG2185T6R PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 1 6 1 (Top View) 6 6 (Bottom View) 1 Pin No. 1 2 3 Pin Name OUTPUT1 GND OUTPUT2 Vcont2 INPUT Vcont1 G8 Vcont1 High Low Parameter Parameter 2 5 2 5 5 2 4 5 6 3 4 3 4 4 3 Remark Exposed pad : GND TRUTH TABLE Vcont2 Low High INPUT−OUTPUT1 OFF ON INPUT−OUTPUT2 ON OFF ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Symbol Vcont Pin PD TA Tstg Ratings 6.0 Note Unit V dBm mW °C °C Switch Control Voltage Input Power Power Dissipation Operating Ambient Temperature Storage Temperature +31 150 −40 to +90 −55 to +150 Note ⏐Vcont1 − Vcont2⏐ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Symbol Vcont (H) Vcont (L) f MIN. 2.8 −0.2 2.0 TYP. 3.0 0 − MAX. 3.3 +0.2 6.0 Unit V V GHz Switch Control Voltage (H) Switch Control Voltage (L) Operating Frequency 2 Data Sheet PG10719EJ02V0DS μPG2185T6R ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 3.0 V, Vcont otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Isolation 1 (INPUT−OFF Port) Isolation 2 (INPUT−OFF Port) Isolation 3 (OUTPUT1−OUTPUT2) Isolation 4 (OUTPUT1−OUTPUT2) Input Return Loss 1 Input Return Loss 2 Input Return Loss 3 Output Return Loss 1 Output Return Loss 2 Output Return Loss 3 0.1 dB Loss Compression Note Input Power 1 dB Loss Compression Note Input Power Input 3rd Order Intercept Point Switch Control Current Switch Control Speed Symbol Lins1 Lins2 ISL1 ISL2 ISL3 ISL4 RLin1 RLin2 RLin3 RLout1 RLout2 RLout3 Pin (0.1 dB) (L) = 0 V, Z0 = 50 Ω, DC blocking capacitors = 6 pF, unless Test Conditions f = 2.0 to 2.5 GHz f = 2.5 to 6.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 6.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 6.0 GHz f = 2.0 to 2.5 GHz f = 4.9 to 6.0 GHz f = 2.5 to 4.9 GHz f = 2.0 to 2.5 GHz f = 4.9 to 6.0 GHz f = 2.5 to 4.9 GHz f = 2.5 GHz f = 6.0 GHz MIN. − − 23 22 24 24 15 15 12 15 15 12 +26 +26 − − − − − TYP. 0.40 0.50 26 25 27 27 20 20 17 20 20 17 +29 +29 +30.5 +30.5 +50 0.1 20 MAX. 0.60 0.80 − − − − − − − − − − − − − − − 1.0 100 Unit dB dB dB dB dB dB dB dB dB dB dB dB dBm dBm dBm dBm dBm Pin (1 dB) f = 2.5 GHz f = 6.0 GHz IIP3 Icont tSW f = 2.5 GHz RF None 50% CTL to 90/10% μA ns Note Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution This device is used it is necessary to use DC blocking capacitors. Data Sheet PG10719EJ02V0DS 3 μPG2185T6R EVALUATION CIRCUIT Vcont1 INPUT Vcont2 1 000 pF 6 pF 1 000 pF 6 5 4 1 2 3 6 pF 6 pF OUTPUT1 OUTPUT2 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10719EJ02V0DS μPG2185T6R MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 6-PIN PLASTIC TSSON (UNIT: mm) MOUNTING PAD 0.15 0.15 0.15 0.65 0.15 1.2 0.45 0.35 1.2 0.35 SOLDER MASK 0.13 0.15 0.13 0.125 0.13 1.15 0.75 0.45 0.35 0.75 1.15 0.35 Solder thickness : 0.08 mm Remark The mounting pad and solder mask layouts in this document are for reference only. 0.225 0.6 0.225 Data Sheet PG10719EJ02V0DS 5 μPG2185T6R PACKAGE DIMENSIONS 6-PIN PLASTIC TSSON (T6R) (UNIT: mm) (Top View) 1.0±0.1 1.0±0.1 (Bottom View) 1.0±0.1 0.08 MIN. 0.15+0.07 –0.05 A 0.08 MIN. A 0.15+0.07 –0.05 0.35±0.06 0.35±0.06 0.45 ±0.1 1.0±0.1 A A 0.13±0.07 0.23±0.07 0.175±0.075 0.37+0.03 –0.05 Remark A > 0 6 Data Sheet PG10719EJ02V0DS μPG2185T6R RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260 For soldering Preheating temperature (package surface temperature) : 120°C or below Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10719EJ02V0DS 7 μPG2185T6R • T he information in this document is current as of August, 2008. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. 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GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.