UPG2406TB

DATA SHEET GaAs INTEGRATED CIRCUIT μPG2406TB 0.01 to 3.0 GHz SPDT SWITCH DESCRIPTION The μPG2406TB is a GaAs MMIC for L, S-band SPDT (Single Pole Double Throw) switch which were designed for mobile phone and another L, S-band application. This device can operate 2 control switching by control voltage 1.8 to 5.3 V. This device can operate frequency from 0.01 to 3.0 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin super minimold package. And this package is able to high-density surface mounting. FEATURES • Switch control voltage • Low insertion loss • High isolation • Handling power : Vcont (H) = 1.8 to 5.3 V (2.7 V TYP.) : Vcont (L) = −0.2 to +0.2 V (0 V TYP.) : Lins = 0.40 dB TYP. @ f = 1.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V : Lins = 0.47 dB TYP. @ f = 2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V : ISL = 27 dB TYP. @ f = 1.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V : ISL = 17 dB TYP. @ f = 2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V : Pin (0.1 dB) = +29.0 dBm TYP. @ f = 2.0/2.5 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V : Pin (1 dB) = +30.5 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 2.7 V, Vcont (L) = 0 V • High-density surface mounting : 6-pin super minimold package (2.0× 1.25 × 0.9 mm) APPLICATIONS • L, S-band digital cellular or cordless telephone • W-LAN, WLL and BluetoothTM etc. ORDERING INFORMATION Part Number Order Number Package 6-pin super minimold (Pb-Free) Marking G5L Supplying Form • Embossed tape 8 mm wide • Pin 4, 5, 6 face the perforation side of the tape • Qty 3 kpcs/reel μPG2406TB-E4 μPG2406TB-E4-A Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: μPG2406TB Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10747EJ01V0DS (1st edition) Date Published January 2009 NS Printed in Japan 2009 μPG2406TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) RF1 1 2 3 6 5 4 1 GND 2 RF2 3 Vcont2 4 4 3 RFC 5 5 2 (Top View) Vcont1 6 6 (Bottom View) 1 Pin No. 1 2 3 4 5 6 Pin Name RF1 GND RF2 Vcont2 RFC Vcont1 SW TRUTH TABLE ON Path RFC-RF1 RFC-RF2 Vcont1 High Low Vcont2 Low High ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Parameter Switch Control Voltage Input Power f = 0.01 to 0.5 GHz f = 0.5 to 3.0 GHz Operating Ambient Temperature Storage Temperature Symbol Vcont Pin1 Pin2 TA Tstg Ratings +6.0 Note Note ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Parameter Switch Control Voltage (H) Switch Control Voltage (L) Symbol Vcont (H) Vcont (L) MIN. 1.8 −0.2 TYP. 2.7 0 MAX. 5.3 0.2 Unit V V G5L Unit V dBm +24.0 +31.0 −45 to +85 −55 to +150 °C °C 2 Data Sheet PG10747EJ01V0DS μPG2406TB ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 2.7 V, Vcont (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Insertion Loss 3 Insertion Loss 4 Insertion Loss 5 Insertion Loss 6 Isolation 1 Isolation 2 Isolation 3 Isolation 4 Isolation 5 Isolation 6 Input Return Loss 1 Input Return Loss 2 Input Return Loss 3 Output Return Loss 1 Output Return Loss 2 Output Return Loss 3 0.1 dB Loss Compression Input Power Note 3 Symbol Lins1 Lins2 Lins3 Lins4 Lins5 Lins6 ISL1 ISL2 ISL3 ISL4 ISL5 ISL6 RLin1 RLin2 RLin3 RLout1 RLout2 RLout3 Pin (0.1 dB) Test Conditions f = 0.01 to 0.05 GHz f = 0.05 to 0.5 GHz f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz f = 0.01 to 0.05 GHz f = 0.05 to 0.5 GHz f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz f = 0.01 to 0.05 GHz f = 0.05 to 0.5 GHz f = 0.5 to 3.0 GHz f = 0.01 to 0.05 GHz f = 0.05 to 0.5 GHz f = 0.5 to 3.0 GHz f = 2.0/2.5 GHz f = 0.5 to 3.0 GHz Note 1 Note 1 Note 1 Note 1 MIN. − − − − − − − 23 23 16 14 14 − 15 15 − 15 15 +26.0 − − TYP. 0.40 0.40 0.40 0.45 0.47 0.53 27 27 27 19 17 17 20 20 20 20 20 20 +29.0 +29.0 +30.5 MAX. − 0.45 0.45 0.50 0.55 0.60 − − − − − − − − − − − − − − − Unit dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dBm dBm dBm Note 2 Note 2 Note 2 Note 2 1 dB Loss Compression Input Power Note 4 Pin (1 dB) f = 0.5 to 3.0 GHz 2nd Harmonics 3rd Harmonics Intermodulation Intercept Point 2f0 3f0 IIP3 f = 2.0/2.5 GHz, Pin = +20 dBm f = 2.0/2.5 GHz, Pin = +20 dBm f = 0.5 to 3.0 GHz, 2 tone, 5 MHz spicing 65 65 − − − 75 75 +60 − − − dBc dBc dBm Switch Control Current Switch Control Speed Icont tSW No RF input 50% CTL to 90/10% RF 0.2 50 20 500 μA ns Notes 1. DC blocking capacitors = 10 000 pF at f = 0.01 to 0.05 GHz 2. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz 3. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. 4. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution This device is used it is necessary to use DC blocking capacitors. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 56 pF. Data Sheet PG10747EJ01V0DS 3 μPG2406TB ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 1.8 V, Vcont (L) = 0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Parameter Insertion Loss 7 Insertion Loss 8 Insertion Loss 9 Insertion Loss 10 Insertion Loss 11 Insertion Loss 12 Isolation 7 Isolation 8 Isolation 9 Isolation 10 Isolation 11 Isolation 12 Input Return Loss 4 Input Return Loss 5 Input Return Loss 6 Output Return Loss 4 Output Return Loss 5 Output Return Loss 6 0.1 dB Loss Compression Input Power Note 3 Symbol Lins7 Lins8 Lins9 Lins10 Lins11 Lins12 ISL7 ISL8 ISL9 ISL10 ISL11 ISL12 RLin4 RLin5 RLin6 RLout4 RLout5 RLout6 Pin (0.1 dB) Test Conditions f = 0.01 to 0.05 GHz f = 0.05 to 0.5 GHz f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz f = 0.01 to 0.05 GHz f = 0.05 to 0.5 GHz f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz f = 0.01 to 0.05 GHz f = 0.05 to 0.5 GHz f = 0.5 to 3.0 GHz f = 0.01 to 0.05 GHz f = 0.05 to 0.5 GHz f = 0.5 to 3.0 GHz f = 2.0/2.5 GHz f = 0.5 to 3.0 GHz Note 1 Note 1 Note 1 Note 1 MIN. − − − − − − − 23 23 16 14 14 − 15 15 − 15 15 +19.0 − − TYP. 0.40 0.40 0.40 0.46 0.48 0.54 27 27 27 19 17 17 20 20 20 20 20 20 +22.0 +22.0 +25.0 MAX. − 0.46 0.47 0.52 0.57 0.62 − − − − − − − − − − − − − − − Unit dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dB dBm dBm dBm Note 2 Note 2 Note 2 Note 2 1 dB Loss Compression Input Power Note 4 Pin (1 dB) f = 0.5 to 3.0 GHz Switch Control Current Switch Control Speed Icont tSW No RF input 50% CTL to 90/10% RF − − 0.2 50 20 500 μA ns Notes 1. DC blocking capacitors = 10 000 pF at f = 0.01 to 0.05 GHz 2. DC blocking capacitors = 1 000 pF at f = 0.05 to 0.5 GHz 3. Pin (0.1 dB) is measured the input power level when the insertion loss increases more 0.1 dB than that of linear range. 4. Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution This device is used it is necessary to use DC blocking capacitors. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 56 pF. 4 Data Sheet PG10747EJ01V0DS μPG2406TB EVALUATION CIRCUIT C2 C1 RF1 1 Vcont1 6 2 RFC 5 3 C1 Note Vcont2 RF2 C1 4 C2 Note C1 : 0.01 to 0.05 GHz 10 000 pF : 0.05 to 0.5 GHz : 0.5 to 3.0 GHz C2 : 1 000 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 1 000 pF 56 pF APPLICATION INFORMATION C1 Switch C1 C1 LESD • LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the antenna. • The value may be tailored to provide specific electrical responses. • The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for best performance. Data Sheet PG10747EJ01V0DS 5 μPG2406TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vcont1 RF1 C 1 C 2 C1 C2 C 1 RF2 USING THE NEC EVALUATION BOARD Symbol C1 Test Conditions f = 0.01 to 0.05 GHz f = 0.05 to 0.5 GHz f = 0.5 to 3.0 GHz C2 Values 10 000 pF 1 000 pF 56 pF 1 000 pF 6 Data Sheet PG10747EJ01V0DS IN Vc1 Vc2 C1 6pin SMM SPDT SW C2 C2 C1 G5L C1 OUT 2 OUT 1 RFC Vcont2 μPG2406TB TYPICAL CHARACTERISTICS (TA = +25°C, DC blocking capacitors = 56 pF, unless otherwise specified) RFC-RF1/RF2 INSERTION LOSS vs. FREQUENCY –0.1 0 –5 Insertion Loss Lins (dB) RFC-RF1/RF2 ISOLATION vs. FREQUENCY –0.2 Isolation ISL (dB) –10 –15 –20 –25 Vcont (H) = 1.8 V –0.3 Vcont (H) = 2.7 V –0.4 2.7 V –30 –35 –0.5 1.8 V –0.6 0.0 0.5 1.0 1.5 2.0 2.5 3.0 –40 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Frequency f (GHz) Frequency f (GHz) RFC-RF1/RF2 INPUT RETURN LOSS vs. FREQUENCY 0 Input Return Loss RLin (dB) RFC-RF1/RF2 OUTPUT RETURN LOSS vs. FREQUENCY 0 Output Return Loss RLout (dB) –5 –10 –15 Vcont (H) = 2.7 V –20 –25 1.8 V –30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 –5 –10 –15 –20 –25 1.8 V –30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Vcont (H) = 2.7 V Frequency f (GHz) Frequency f (GHz) RFC-RF1/RF2 INSERTION LOSS, Icont vs. SWITCH CONTROL VOLTAGE (H) –0.2 –0.3 Insertion Loss Lins (dB) RFC-RF1/RF2 ISOLATION vs. SWITCH CONTROL VOLTAGE (H) 0 –5 Isolation ISL (dB) 6 5 4 2.5 GHz 3 2 Icont 1 0 5.0 Switch Control Current Icont (μA) f = 1.0 GHz Lins –10 –15 –20 –25 –30 –35 –40 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 1.0 GHz f = 2.5 GHz –0.4 –0.5 –0.6 –0.7 –0.8 1.5 2.0 2.5 3.0 3.5 4.0 4.5 Switch Control Voltage (H) Vcont (H) (V) Switch Control Voltage (H) Vcont (H) (V) Remark The graphs indicate nominal characteristics. Data Sheet PG10747EJ01V0DS 7 μPG2406TB RFC-RF1/RF2 INPUT RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) 0 Output Return Loss RLout (dB) RFC-RF1/RF2 OUTPUT RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) 0 –5 –10 –15 –20 –25 –30 –35 –40 –45 –50 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 1.0 GHz f = 2.5 GHz –5 Input Return Loss RLin (dB) –10 –15 –20 –25 –30 –35 –40 –45 –50 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 1.0 GHz f = 2.5 GHz Switch Control Voltage (H) Vcont (H) (V) Switch Control Voltage (H) Vcont (H) (V) RFC-RF1/RF2 INSERTION LOSS, Icont vs. INPUT POWER 0 Vcont (H) = 2.7 V –0.5 Insertion Loss Lins (dB) RFC-RF1/RF2 INSERTION LOSS, Icont vs. INPUT POWER 6 Switch Control Current Icont (μA) 0 Vcont (H) = 2.7 V –0.5 Insertion Loss Lins (dB) 6 5 4 1.8 V 3 2 2.7 V 1 Icont 1.8 V 25 30 0 35 Switch Control Current Icont (μA) f = 1.0 GHz 5 4 f = 2.5 GHz Lins 1.8 V Lins –1.0 –1.5 –2.0 2.7 V –2.5 Icont –3.0 15 20 25 30 1.8 V –1.0 –1.5 –2.0 –2.5 –3.0 15 3 2 1 0 35 20 Input Power Pin (dBm) Input Power Pin (dBm) RFC-RF1/RF2 INPUT POWER vs. SWITCH CONTROL VOLTAGE (H) 32 f = 2.5 GHz 30 Input Power Pin (dBm) Input Power Pin (dBm) RFC-RF1/RF2 INPUT POWER vs. FREQUENCY 38 This data has changed the value 36 of the DC blocking capacitors according to the frequency. 34 Vcont (H) = 2.7 V 32 30 28 26 24 22 Pin (0.1 dB) 28 Pin (0.1 dB) 26 24 22 20 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 20 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Switch Control Voltage (H) Vcont (H) (V) Frequency f (GHz) Remark The graphs indicate nominal characteristics. 8 Data Sheet PG10747EJ01V0DS μPG2406TB MOUNTING PAD LAYOUT DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 0.4 0.8 0.65 0.65 Remark The mounting pad layout in this document is for reference only. 1.9 Data Sheet PG10747EJ01V0DS 9 μPG2406TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 1.25±0.1 2.0+0.15 –0.20 1.3 0.65 0.65 0.1 MIN. 0.9±0.1 0.7 10 Data Sheet PG10747EJ01V0DS 0 to 0.1 0.15+0.1 –0.05 0.2+0.1 –0.05 μPG2406TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260 For soldering Preheating temperature (package surface temperature) : 120°C or below Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10747EJ01V0DS 11 μPG2406TB Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A. • T he information in this document is current as of January, 2009. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. 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The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E 02. 11-1 12 Data Sheet PG10747EJ01V0DS μPG2406TB Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.