UPG2409TB-E4-A

DATA SHEET GaAs INTEGRATED CIRCUIT μPG2409TB HIGH POWER SPDT SWITCH FOR WiMAX TM DESCRIPTION The μPG2409TB is a GaAs MMIC high power SPDT (Single Pole Double Throw) switch which were designed for WiMAX. This device can operate frequency from 0.5 to 3.8 GHz, having the low insertion loss and high isolation. This device is housed in a 6-pin super minimold package (SC-88/SOT-363 type). And this package is suitable for high-density surface mounting. FEATURES • Switch control voltage • Low insertion loss : Vcont (H) = 3.0 V TYP. : Vcont (L) = 0 V TYP. : Lins = 0.35 dB TYP. @ f = 1.0 GHz : Lins = 0.45 dB TYP. @ f = 2.5 GHz : Lins = 0.50 dB TYP. @ f = 3.0 GHz • High isolation : ISL = 32 dB TYP. @ f = 1.0 GHz : ISL = 26 dB TYP. @ f = 2.5 GHz : ISL = 23 dB TYP. @ f = 3.0 GHz • Handling power : Pin (1 dB) = +35.0 dBm TYP. @ f = 0.5 to 3.8 GHz • High-density surface mounting : 6-pin super minimold package (SC-88/SOT-363 type) (2.0 × 1.25 × 0.9 mm) APPLICATIONS • WiMAX and wireless LAN (IEEE802.11b/g/n) ORDERING INFORMATION Part Number Order Number Package 6-pin super minimold (SC-88/SOT-363 type) (Pb-Free) Marking G5T Supplying Form • Embossed tape 8 mm wide • Pin 4, 5, 6 face the perforation side of the tape • Qty 3 kpcs/reel μPG2409TB-E4 μPG2409TB-E4-A Remark To order evaluation samples, please contact your nearby sales office. Part number for sample order: μPG2409TB Caution Although this device is designed to be as robust as possible, ESD (Electrostatic Discharge) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions must be employed at all times. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. Document No. PG10772EJ01V0DS (1st edition) Date Published July 2009 NS Printed in Japan 2009 μPG2409TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) RF1 1 61 GND 52 RF2 43 (Top View) Vcont1 66 RFC 55 Vcont2 44 (Bottom View) 1 Pin No. 1 2 3 4 Pin Name RF1 GND RF2 Vcont2 RFC Vcont1 G5T On Path RFC-RF1 RFC-RF2 Parameter Vcont = 3 V Vcont = 5 V Parameter 2 2 3 3 5 6 SW TRUTH TABLE Vcont1 High Low Vcont2 Low High ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified) Symbol Vcont Pin Pin PD TA Tstg Ratings +6.0 Note Unit V dBm Switch Control Voltage Input Power +35 +37 150 −45 to +85 −55 to +150 Power Dissipation (average) Operating Ambient Temperature Storage Temperature mW °C °C Note ⎪Vcont1 − Vcont2⎪ ≤ 6.0 V RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified) Symbol f Vcont (H) Vcont (L) MIN. 0.5 2.7 −0.2 −0.1 TYP. − 3.0 0 0 MAX. 3.8 5.3 0.2 0.1 Unit GHz V V V Operating Frequency Switch Control Voltage (H) Switch Control Voltage (L) Control Voltage Difference ΔVcont (H), ΔVcont (L)Note Note ΔVcont (H) = Vcont1 (H) − Vcont2 (H) ΔVcont (L) = Vcont1 (L) − Vcont2 (L) 2 Data Sheet PG10772EJ01V0DS μPG2409TB ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, ZO = 50 Ω, DC blocking capacitors = 8 pF, unless otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Insertion Loss 3 Insertion Loss 4 Insertion Loss 5 Isolation 1 Isolation 2 Isolation 3 Isolation 4 Isolation 5 Return Loss 0.1 dB Loss Compression Input Power Note 2 Symbol Lins1 Lins2 Lins3 Lins4 Lins5 ISL1 ISL2 ISL3 ISL4 ISL5 RL Pin (0.1 dB) Test Conditions f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz f = 3.0 to 3.8 GHz f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 2.5 to 3.0 GHz f = 3.0 to 3.8 GHz f = 0.5 to 3.8 GHz f = 2.5 GHz Note 1 Note 1 Note 1 MIN. − − − − − 29 25 23 20 16 15 − TYP. 0.35 0.40 0.45 0.50 0.60 32 28 26 23 19 20 +33.5 MAX. 0.60 0.65 0.70 0.75 0.85 − − − − − − − Unit dB dB dB dB dB dB dB dB dB dB dB dBm Note 1 Note 1 1 dB Loss Compression Input Power 1 Note 3 Pin (1 dB) 1 f = 0.5 to 3.8 GHz Vcont = 3 V Pin (1 dB) 2 f = 0.5 to 3.8 GHz Vcont = 5 V 2f0 3f0 IIP3 Icont tSW Note 1 − +35 − dBm 1 dB Loss Compression Input Power 2 Note 3 Note 1 − +37 − dBm 2nd Harmonics 3rd Harmonics Input 3rd Order Intercept Point Switch Control Current Switch Control Speed f = 2.5 GHz, Pin = +26 dBm f = 2.5 GHz, Pin = +26 dBm f = 2.5 GHz No RF input 50% CTL to 90/10% RF − − − − − 75 80 +60 0.1 100 − − − 10 250 dBc dBc dBm μA ns Notes 1. DC blocking capacitors = 56 pF at f = 0.5 to 2.0 GHz 2. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of the linear range. 3. Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of the linear range. Caution It is necessary to use DC blocking capacitors with this device. Data Sheet PG10772EJ01V0DS 3 μPG2409TB EVALUATION CIRCUIT C1 RF1 1 6 1 000pF Vcont1 2 5 C1 Note RFC 3 RF2 C1 4 Vcont2 1 000pF Note C1 : 0.5 to 2.0 GHz : 2.0 to 3.8 GHz 56 pF 8 pF The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. APPLICATION INFORMATION C1 Switch C1 C1 LESD • C1 are DC blocking capacitors external to the device. The value may be tailored to provide specific electrical responses. • The RF ground connections should be kept as short as possible and connected to directly to a good RF ground for best performance. • LESD provides a means to increase the ESD protection on a specific RF port, typically the port attached to the antenna. 4 Data Sheet PG10772EJ01V0DS μPG2409TB TYPICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 2.7 to 5.3 V, Vcont (L) = −0.2 to 0.2V, unless otherwise specified) RFC-RF1/RF2 INSERTION LOSS vs. FREQUENCY 0.0 –0.2 0 –10 RFC-RF1/RF2 ISOLATION vs. FREQUENCY Insertion Loss Lins (dB) –0.4 –0.6 –0.8 –1.0 –1.2 –1.4 –1.6 –1.8 –2.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 DC blocking capacitors = 56 pF Isolation ISL (dB) DC blocking capacitors = 56 pF –20 –30 –40 –50 –60 0.0 8 pF 8 pF 1.0 2.0 3.0 4.0 5.0 6.0 Frequency f (GHz) Frequency f (GHz) RFC RETURN LOSS vs. FREQUENCY 0 –5 RF1/RF2 RETURN LOSS vs. FREQUENCY 0 –5 DC blocking capacitors = 56 pF Return Loss RL (dB) –15 8 pF –20 –25 –30 –35 –40 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Return Loss RL (dB) –10 DC blocking capacitors = 56 pF –10 –15 8 pF –20 –25 –30 –35 –40 0.0 1.0 2.0 3.0 4.0 5.0 6.0 Frequency f (GHz) Frequency f (GHz) RFC-RF1/RF2 INSERTION LOSS, Icont vs. SWITCH CONTROL VOLTAGE (H) –0.4 f = 2.5 GHz Lins –0.6 3.8 GHz 1.0 0 –5 RFC-RF1/RF2 ISOLATION vs. SWITCH CONTROL VOLTAGE (H) Insertion Loss Lins (dB) –0.5 0.8 Switch Control Current Icont (μA) Isolation ISL (dB) –10 –15 –20 –25 –30 –35 –40 2.0 2.5 3.0 3.5 4.0 4.5 5.0 2.5 GHz f = 3.8 GHz 0.6 –0.7 0.4 –0.8 Icont (No RF input) –0.9 2.0 2.5 3.0 3.5 4.0 4.5 0.2 0.0 5.0 Switch Control Voltage (H) Vcont (H) (V) Switch Control Voltage (H) Vcont (H) (V) Remark The graphs indicate nominal characteristics. Data Sheet PG10772EJ01V0DS 5 μPG2409TB RFC RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) 0 –5 –10 0 –5 –10 RF1/RF2 RETURN LOSS vs. SWITCH CONTROL VOLTAGE (H) Return Loss RL (dB) Return Loss RL (dB) –15 –20 –25 –30 –35 –40 –45 –50 2.0 2.5 3.0 f = 3.8 GHz –15 –20 –25 –30 –35 –40 –45 f = 3.8 GHz 2.5 GHz 2.5 GHz 3.5 4.0 4.5 5.0 –50 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Switch Control Voltage (H) Vcont (H) (V) Switch Control Voltage (H) Vcont (H) (V) –0.2 f = 2.5 GHz Lins 5.0 V –0.6 Vcont (H) = 2.7 V –0.8 3.0 V 20 0.1 dB Loss Compression Input Power Pin (0.1 dB) (dBm) RFC-RF1/RF2 INSERTION LOSS, Icont vs. INPUT POWER Switch Control Current Icont (μA) 18 16 14 12 10 8 6 –1.0 Icont –1.2 15 20 25 30 35 3.0 V 2.7 V 4 2 0 40 RFC-RF1/RF2 Pin (0.1 dB) vs. SWITCH CONTROL VOLTAGE (H) 38 f = 2.5 GHz 36 34 32 30 28 26 2.0 Insertion Loss Lins (dB) –0.4 5.0 V 2.5 3.0 3.5 4.0 4.5 5.0 Input Power Pin (dBm) Switch Control Voltage (H) Vcont (H) (V) –30 Vcont (H) = 3.0 V –40 Vcont (L) = 0 V DC blocking –50 capacitors = 8 pF f = 2.5 GHz –60 –70 2f0 –80 –90 –100 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 Input Power Pin (dBm) Output Power Pout (dBm) 3rd Order Intermoduration Distortion IM3 (dBm) RFC-RF1/RF2 2f0, 3f0 vs. INPUT POWER RFC-RF1/RF2 OUTPUT POWER, IM3 vs. INPUT POWER 80 60 40 Pout 20 0 –20 –40 –60 –80 0 10 20 IM3 Vcont (H) = 3.0 V Vcont (L) = 0 V DC blocking capacitors = 8 pF f = 2.5 GHz 40 50 60 70 80 2nd Harmonics 2f0 (dBc) 3rd Harmonics 3f0 (dBc) 3f0 30 Input Power Pin (1 Tone) (dBm) Remark The graphs indicate nominal characteristics. 6 Data Sheet PG10772EJ01V0DS μPG2409TB MOUNTING PAD LAYOUT DIMENSIONS 6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm) 0.4 0.8 0.65 0.65 Remark The mounting pad layout in this document is for reference only. When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design. 1.9 Data Sheet PG10772EJ01V0DS 7 μPG2409TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (SC-88/SOT-363 type) (UNIT: mm) 2.1±0.1 1.25±0.1 2.0+0.15 –0.20 1.3 0.65 0.65 0.1 MIN. 0.9±0.1 0.7 8 Data Sheet PG10772EJ01V0DS 0 to 0.1 0.15+0.1 –0.05 0.2+0.1 –0.05 μPG2409TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260 For soldering Preheating temperature (package surface temperature) : 120°C or below Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10772EJ01V0DS 9 μPG2409TB WiMAX is a trademark or a registered trademark of the WiMAX Forum. • T he information in this document is current as of July, 2009. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document. • NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others. • Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. 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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application. (Note) (1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its majority-owned subsidiaries. (2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as defined above). M8E0904E 10 Data Sheet PG10772EJ01V0DS μPG2409TB Caution GaAs Products This product uses gallium arsenide (GaAs). GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. • Follow related laws and ordinances when disposing of the product. If there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. Commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. Exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. • Do not burn, destroy, cut, crush, or chemically dissolve the product. • Do not lick the product or in any way allow it to enter the mouth.