NESB007AT

No. STSE-CC5089A SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED MODEL : NESB007AT NICHIA CORPORATION -0- Nichia STSE-CC5089A 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Soldering Temperature Symbol IF IFP VR PD Topr Tstg Tsld Absolute Maximum Rating 15 50 5 60 -40 ~ + 85 -40 ~ +100 Reflow Soldering : 260°C Hand Soldering : 350°C (Ta=25°C) Unit mA mA mA mW °C °C for 10sec. for 3sec. IFP Conditions : Pulse Width < 10msec. and Duty < 1/10 = = (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Reverse Current IR Luminous Intensity Iv x Chromaticity Coordinate y Please refer to CIE 1931 chromaticity diagram. Condition IF=10[mA] VR= 5[V] IF=10[mA] IF=10[mA] IF=10[mA] Typ. (3.6) (150) 0.133 0.075 (Ta=25°C) Max. Unit 4.0 V 50 µA mcd (Ta=25°C) Max. Unit 300 mcd 213 mcd 150 mcd (3) Ranking Item Luminous Intensity Rank U Rank T Rank S Symbol Iv Iv Iv Condition IF=10[mA] IF=10[mA] IF=10[mA] Min. 213 150 104 Luminous Intensity Measurement allowance is ± 10%. Color Rank x y 0.11 0.04 (IF=10mA,Ta=25°C) Rank W 0.11 0.15 0.15 0.10 0.10 0.04 Color Coordinates Measurement allowance is ± 0.01. One delivery will include up to one color rank and three luminous intensity ranks of the products. The quantity-ratio of the ranks is decided by Nichia. -1- Nichia STSE-CC5089A 2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to figure’s page. 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to figure’s page. Material as follows ; Package : Encapsulating Resin : Electrodes : Heat-Resistant Polymer Epoxy Resin (with Diffused) Ag Plating Copper Alloy 4.PACKAGING · The LEDs are packed in cardboard boxes after taping. Please refer to figure’s page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity · In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. · The boxes are not water resistant and therefore must be kept away from water and moisture. · When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 4 for 2004, 5 for 2005 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number - Ranking by Color Coordinates - Ranking by Luminous Intensity B for Nov. ) -2- Nichia STSE-CC5089A 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Condition 1 Steady State Operating Life Condition 2 Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Vibration Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260°C, 10sec. (Pre treatment 30°C,70%,168hrs.) Tsld=215 ± 5°C, 3sec. (Lead Solder) 0°C ~ 100°C 15sec. 15sec. -40°C ~ 25°C ~ 100°C ~ 25°C 30min. 5min. 30min. 5min. 25°C ~ 65°C ~ -10°C 90%RH 24hrs./1cycle Ta=100°C Ta=60°C, RH=90% Ta=-40°C Ta=25°C, IF=10mA Ta=25°C, IF=15mA Ta=85°C, IF=4.2mA 60°C, RH=90%, IF=10mA Ta=-40°C, IF=10mA JEITA ED-4701 400 403 JEITA ED-4702 JEITA ED-4702 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3direction, 4cycles 3mm, 5 ± 1 sec. 5N, 10 ± 1 sec. Note 2 times Number of Damaged 0/50 1 time over 95% 20 cycles 100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 500 hrs. 1000 hrs. 500 hrs. 1000 hrs. 48min. 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 Substrate Bending Adhesion Strength 1 time 1 time 0/50 0/50 (2) CRITERIA FOR JUDGING DAMAGE Item Symbol Test Conditions Criteria for Judgement Min. Max. 1.1 2.0 Forward Voltage VF IF=10mA U.S.L.*) Reverse Current IR VR=5V U.S.L.*) Luminous Intensity IV IF=10mA L.S.L.**) 0.7 *) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level -3- Nichia STSE-CC5089A 7.CAUTIONS (1) Moisture Proof Package · When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. · The moisture proof package is made of an aluminum moisture proof bag with a zipper. A package of a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage · Storage Conditions Before opening the package : The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. · If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 ± 5°C · Nichia LED electrodes are silver plated copper alloy. The silver surface may be affected by environments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible. · Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Heat Generation · Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. · The operating current should be decided after considering the ambient maximum temperature of LEDs. -4- Nichia STSE-CC5089A (4) Soldering Conditions · The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. · Recommended soldering conditions Pre-heat Pre-heat time Peak temperature Soldering time Condition Reflow Soldering Lead Solder Lead-free Solder 180 ~ 200°C 120 ~ 150°C 120 sec. Max. 120 sec. Max. 240°C Max. 260°C Max. 10 sec. Max. 10 sec. Max. refer to refer to Temperature - profile 1. Temperature - profile 2. (N2 reflow is recommended.) Hand Soldering Temperature Soldering time 350°C Max. 3 sec. Max. (one time only) After reflow soldering rapid cooling should be avoided. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. 2.5 ~ 5°C / sec. Pre-heating 120 ~ 150°C 60sec.Max. Above 200°C 120sec.Max. 240°C Max. 10sec. Max. 1~ 5°C / sec. 1~ 5°C / sec. Pre-heating 180 ~ 200°C 60sec.Max. Above 220°C 120sec.Max. 260°C Max. 10sec. Max. 2.5 ~ 5°C / sec. [Recommended soldering pad design] Use the following conditions shown in the figure. 8.8 4 1 1 4 1.4 4 (Unit : mm) : Solder resist · Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. · Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. · Reflow soldering should not be done more than two times. · When soldering, do not put stress on the LEDs during heating. · After soldering, do not warp the circuit board. (5) Cleaning · It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. · Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. -5- Nichia STSE-CC5089A (6) Static Electricity · Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. · When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). · Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA) (7) Others · Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. · The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. · Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. · The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). · User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. · The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement without notice. -6- Nichia STSE-CC5089A ICI Chromaticity Diagram 0.9 520 0.8 530 510 540 550 560 0.7 0.6 570 500 0.5 580 590 y 0.4 600 610 620 630 0.3 490 0.2 480 0.1 470 460 0 0 0.1 W 0.2 0.3 0.4 0.5 0.6 0.7 0.8 x ! Color Coordinates Measurement allowance is ± 0.01. -7- Forward Voltage vs. Forward Current 100 Forward Current IFP (mA) 50 20 10 5 Relative Luminosity (a.u.) Ta=25°C Forward Current vs. Relative Luminosity 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 10 20 30 40 50 60 Forward Current IFP (mA) Ta=25°C Allowable Forward Current IFP (mA) Duty Ratio vs. Allowable Forward Current 100 Ta=25°C 50 20 15 10 1 5 10 20 50 100 Duty Ratio (%) 1 2.5 3.0 3.5 4.0 4.5 5.0 Forward Voltage VF (V) Ambient Temperature vs. Forward Voltage 5.0 4.6 4.2 3.8 3.4 3.0 2.6 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) Relative Luminosity (a.u.) Forward Voltage VF (V) IFP=10mA Ambient Temperature vs. Relative Luminosity 2.0 IFP=10mA 1.0 Allowable Forward Current IF (mA) Ambient Temperature vs. Allowable Forward Current 25 20 15 10 5 4 0 0 20 40 60 80 100 Ambient Temperature Ta (°C) -8- 0.5 0.2 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) Nichia STSE-CC5089A Model NESB007A NICHIA CORPORATION Title No. CHARACTERISTICS 050530540741 Forward Current vs. Chromaticity Coordinate (λD) Relative Emission Intensity (a.u.) Spectrum 1.2 1.0 0.8 0.6 0.4 0.2 0 350 400 450 500 550 600 650 Wavelength λ (nm) Ta=25°C IF=10mA 0.10 0.09 0.08 Ta=25°C 1mA(471.7nm) 5mA(471.0nm) 10mA(470.6nm) 50mA(469.3nm) y 0.07 0.06 0.05 0.11 0.12 0.13 0.14 0.15 0.16 x Forward Current vs. Dominant Wavelength Dominant Wavelength λ D (nm) Dominant Wavelength λ D (nm) Ambient Temperature vs. Dominant Wavelength 474 Relative Luminosity (a.u.) Directivity 1.0 0° Ta=25°C IFP=10mA 10° 20° 474 473 472 471 470 469 468 1 5 10 20 50 100 Forward Current IFP (mA) Ta=25°C 473 472 471 470 469 IFP=10mA 30° 40° 50° -9- 0.5 60° 70° 80° 468 -60 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) 0 90° 60° 30° Radiation Angle 0° 0.5 90° 1.0 Nichia STSE-CC5089A Model NESB007A NICHIA CORPORATION Title No. CHARACTERISTICS 050530540751 1.2 (0.9) (R 0.3) Anode A (0.8) 1.05 (1.7) 2 Cathode mark (C 0.3) Cathode (0.4) (0.6) -10- K (0.23) 1 (0.35) ITEM PACKAGE ENCAPSULATING RESIN ELECTRODES MATERIALS Heat-Resistant Polymer Epoxy Resin (with Diffused) Ag Plating Copper Alloy 1.3 Nichia STSE-CC5089A Model NxSB007x Unit mm 15/1 Scale Allow ±0.1 NICHIA CORPORATION Title No. OUTLINE DIMENSIONS 050530429372 1.75±0.1 Taping part φ 1.5+0.1 -0 4±0.1 2±0.05 0.25±0.05 Reel part φ 180+0 -3 11.4±1 9±0.3 3.5±0.05 Cathode mark 8+0.3 - 0.1 2.2±0.1 φ2 (2.75) φ 13 ±0.2 4±0.1 φ 1-+0.2 0 1.36±0.1 1.44±0.1 Label XXXX LED TYPE NxSx007xT LOT xxxxxxQTY pcs Reel End of tape No LEDs LEDs mounting part No LEDs φ 60+1 -0 1 ±0.8 -11Embossed carrier tape Reel Lead Min.40mm (No LEDs) Reel Lead Min.160mm (No LEDs is more than 40) Pull direction Top cover tape Reel Lead Min.400mm Nichia STSE-CC5089A 3,000pcs/Reel Model Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. NxSx007xT Unit mm Scale Allow NICHIA CORPORATION Title No. TAPING DIMENSIONS 050530316604 Nichia STSE-CC5089A The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Reel Label Seal NICHIA XXXX LED TYPE LOT QTY NxSx007xT xxxxxxPCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Moisture absorbent material Moisture proof foil bag The box is partitioned with the cardboard. Label NICHIA Nichia LED XXXX LED TYPE RANK QTY NxSx007xT PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Packing unit Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 3,000 MAX. Reel/box 7reel MAX. 15reel MAX. 30reel MAX. Quantity/box (pcs) 21,000 MAX. 45,000 MAX. 90,000 MAX. Dimensions (mm) 291 237 120 8t 259 247 243 5t 444 262 259 8t Model NxSx007xT NICHIA CORPORATION Title No. PACKING 050530540761 -12-