NESR505DT

Nichia STS-DA1-0073 SPECIFICATIONS FOR NICHIA CHIP TYPE RED MODEL : NESR505DT LED NICHIA CORPORATION Nichia STS-DA1-0073 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Soldering Temperature IFP Conditions : Symbol IF IFP IR PD Topr Tstg Tsld Absolute Maximum Rating 40 160 85 100 -40 ~ +100 -40 ~ +100 Reflow Soldering : 260°C Hand Soldering : 350°C and Duty < 1/10 = (Ta=25°C) Unit mA mA mA mW °C °C for 10sec. for 3sec. Pulse Width < 10msec. = (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Luminous Intensity Iv x Chromaticity Coordinate y Please refer to CIE 1931 chromaticity diagram. Condition IF=20[mA] IF=20[mA] IF=20[mA] IF=20[mA] Typ. (2.1) (170) 0.704 0.295 (Ta=25°C) Max. Unit 2.5 V mcd - (3) Ranking Item Luminous Intensity Rank Q Rank P Rank O Symbol Iv Iv Iv Condition IF=20[mA] IF=20[mA] IF=20[mA] Min. 180 125 90 (Ta=25°C) Max. Unit 250 mcd 180 mcd 125 mcd Luminous Intensity Measurement allowance is ± 10% Color Rank x y 0.67 0.27 (IF=20mA,Ta=25°C) Rank R 0.67 0.73 0.73 0.33 0.33 0.27 Color Coordinates Measurement allowance is ± 0.01. Basically, a shipment shall consist of the LEDs of a combination of the above ranks. The percentage of each rank in the shipment shall be determined by Nichia. 2. INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to “CHARACTERISTICS” on the following pages. -1- Nichia STS-DA1-0073 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to “OUTLINE DIMENSIONS” on the following page. Package : Heat-Resistant Polymer Material as follows ; Encapsulating Resin : Silicone Resin (with Diffused) Electrodes : Ag Plating Copper Alloy 4.PACKAGING · The LEDs are packed in cardboard boxes after taping. Please refer to “TAPING DIMENSIONS” and “PACKING ”on the following pages. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity · In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. · The boxes are not water resistant and therefore must be kept away from water and moisture. · When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 7 for 2007, 8 for 2008 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number - Ranking by Color Coordinates - Ranking by Luminous Intensity B for Nov. ) -2- Nichia STS-DA1-0073 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260°C, 10sec. (Pre treatment 30°C,70%,168hrs.) Tsld=215 ± 5°C, 3sec. (using flux, Lead Solder) -40°C ~ 100°C 1min. (10sec.) 1min. (Pre treatment 30°C,70%,168hrs.) -40°C ~ 25°C ~ 100°C ~ 25°C 30min. 5min. 30min. 5min. 25°C ~ 65°C ~ -10°C 90%RH 24hrs./1cycle Ta=100°C Ta=60°C, Ta=-40°C Ta=25°C, IF=40mA Ta=85°C, IF=30mA 60°C, RH=90%, IF=20mA Ta=-40°C, IF=20mA JEITA ED-4701 500 501 JEITA ED-4701 400 403 Solvent : Isopropyl Alcohol Solvent Temperature : 20 ~ 25°C Dipping Time : 5 min. 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3directions, 4cycles 75cm R=1.5kΩ, C=100pF Test Voltage=2kV RH=90% Note 2 times Number of Damaged 0/22 1 time over 95% 100 cycles 0/22 0/100 Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Permanence of Marking 100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1 time 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/22 Vibration 48min. 0/10 Drop Electrostatic Discharge JEITA ED-4701 300 304 3 times 3 times Negative/Positive 0/10 0/22 (2) CRITERIA FOR JUDGING DAMAGE Item Forward Voltage Luminous Intensity Condition 1 Luminous Intensity Condition 2 Symbol VF IV IV Test Conditions IF=20mA IF=20mA IF=20mA Criteria for Judgement Min. Max. L.S.L.**) L.S.L.**) 0.7 0.5 U.S.L.*) 1.1 *) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level These test items are judged by the criteria of Luminous Intensity Condition 2. -3- Nichia STS-DA1-0073 7.CAUTIONS (1) Moisture Proof Package · When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. · The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage · Storage Conditions Before opening the package : The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. · If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 ± 5°C · This product has silver plated metal parts that are inside and/or outside the package body. The silver plating becomes tarnished when being exposed to an environment which contains corrosive gases. Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics. Please do not expose the LEDs to corrosive atmosphere during storage. · After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere. The above should be taken into consideration when designing. · Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. -4- Nichia STS-DA1-0073 (3) Heat Generation · Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. · The operating current should be decided after considering the ambient maximum temperature of LEDs. -5- Nichia STS-DA1-0073 (4) Soldering Conditions · The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. · Recommended soldering conditions Reflow Soldering Lead Solder Pre-heat Pre-heat time Peak temperature Soldering time Condition 10 sec. Max. refer to Temperature - profile 1. 10 sec. Max. refer to Temperature - profile 2. (N2 reflow is recommended.) 120 ~ 150°C 120 sec. Max. 240°C Max. Lead-free Solder 180 ~ 200°C 120 sec. Max. 260°C Max. Temperature Soldering time 350°C Max. 3 sec. Max. (one time only) Hand Soldering Although the recommended soldering conditions are specified in the above table, reflow or hand soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. 2.5 ~ 5°C / sec. Pre-heating 120 ~ 150°C 60sec.Max. Above 200°C 120sec.Max. 1~ 5°C / sec. 240°C Max. 10sec. Max. 1~ 5°C / sec. Pre-heating 180 ~ 200°C 60sec.Max. Above 220°C 120sec.Max. 260°C Max. 10sec. Max. 2.5 ~ 5°C / sec. [Recommended soldering pad design] 8.8 4.0 2.9 2.9 4.0 Use the following conditions shown in the figure. 2.0 4.0 (0.25) (1.5) : Solder resist (Unit : mm) · Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. · Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. · Reflow soldering should not be done more than two times. · When soldering, do not put stress on the LEDs during heating. · After soldering, do not warp the circuit board. -6- Nichia STS-DA1-0073 (5) Cleaning · It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. · Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. (6) Static Electricity · Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. (7) Others · NESR505D complies with RoHS Directive. · The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. · Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. · The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). · User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. · The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement without notice. -7- Nichia STS-DA1-0073 ICI Chromaticity Diagram 0.9 520 530 0.8 510 0.7 540 550 560 0.6 570 500 0.5 580 590 y 0.4 600 610 620 630 0.3 490 R 0.2 480 0.1 0 0 470 460 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 x Color Coordinates Measurement allowance is ± 0.01. -8- Forward Voltage vs. Forward Current Forward Current IFP (mA) Relative Luminosity (a.u.) 300 160 100 50 20 10 5 Ta=25°C Forward Current vs. Relative Luminosity Allowable Forward Current IFP (mA) 10 Ta=25°C 8 6 4 2 0 0 40 80 120 160 200 Forward Current IFP (mA) Duty Ratio vs. Allowable Forward Current 300 200 160 100 Ta=25°C 40 20 10 1 5 10 20 50 100 Duty Ratio (%) 1 1.2 1.6 2.0 2.4 2.8 3.2 3.6 Forward Voltage VF (V) Ambient Temperature vs. Forward Voltage 2.6 Relative Luminosity (a.u.) Forward Voltage VF (V) IFP=20mA 2.4 2.2 2.0 1.8 1.6 -60 -30 0 30 60 90 120 Ambient Temperature Ta (°C) Ambient Temperature vs. Relative Luminosity 2.0 IFP=20mA 1.0 Allowable Forward Current IF (mA) Ambient Temperature vs. Allowable Forward Current 50 40 30 20 12 10 0 0 20 40 60 80 100 120 Ambient Temperature Ta (°C) -9- 0.5 0.2 -60 -30 0 30 60 90 120 Ambient Temperature Ta (°C) Nichia STS-DA1-0073 Model NESR505D NICHIA CORPORATION Title No. CHARACTERISTICS 071001700661 Ambient Temperature vs. Chromaticity Coordinate (λD) Relative Emission Intensity (a.u.) Spectrum 1.2 1.0 0.8 0.6 0.4 0.2 0 450 500 550 600 650 700 750 Wavelength λ (nm) Wavelength Ta=25°C IF=20mA 0.32 IFP=20mA 0.31 0.30 -40°C(624nm) 0°C(627nm) 25°C(628nm) 50°C(629nm) 100°C(630nm) y 0.29 0.28 0.27 0.68 0.69 0.70 0.71 0.72 0.73 x Ambient Temperature vs. Dominant Wavelength Dominant Wavelength λ D (nm) Dominant Wavelength λ D (nm) Forward Current vs. Dominant Wavelength 634 Relative Luminosity (a.u.) Directivity 1.0 0° Ta=25°C IFP=20mA X-X Y-Y 0.5 10° 20° 30° 40° 50° X Y X Y 634 632 630 628 626 624 622 -60 -30 0 30 60 90 120 Ambient Temperature Ta (°C) IFP=20mA 632 630 628 626 624 622 1 Ta=25°C -10- 60° 70° 80° 5 10 20 50 100 200 Forward Current IFP (mA) 0 90° 60° 30° Radiation Angle 0° 0.5 90° 1.0 Nichia STS-DA1-0073 Model NESR505D NICHIA CORPORATION Title No. CHARACTERISTICS 071219706511 4.2 Internal Circuit Protection device A ITEM PACKAGE ENCAPSULATING RESIN ELECTRODES MATERIALS Heat-Resistant Polymer Silicone Resin (with Diffused) Ag Plating Copper Alloy (0.7) (1) 3 Cathode mark (0.5) 4.5 (4) K NESR505D has a protection device built in as a protection circuit against static electricity. (2.2) 0.63 1.25 2.65 1.8 2.5 3 1 -11- Cathode 1.4 (1.5) 4.3 1.4 Anode Model NESR505D Unit mm 10/1 Scale Allow ±0.2 Nichia STS-DA1-0073 NICHIA CORPORATION Title No. OUTLINE DIMENSIONS 071001700681 Taping part φ 1.5+0.1 -0 8±0.1 2±0.1 4±0.1 1.75±0.1 0.3±0.05 Reel part φ 330±0.2 17.5±1 13.5±0.5 Cathode mark 5.5±0.05 12+0.2 - 0.1 4.75±0.1 φ2 1 ±0.8 φ 0 27 φ 13 ±0.2 φ 1.5+0.2 -0 3.25±0.1 3.35±0.1 Label XXXX LED Reel end of tape No LEDs TYPE NxSx505xT LOT XXXXXXQTY pcs RoHS LEDs mounting part No LEDs φ 80±1 Pull direction Top cover tape -12Reel Lead Min.160mm (No LEDs) Reel Lead Min.100mm (No LEDs) Reel Lead Min.400mm Embossed carrier tape Nichia STS-DA1-0073 2,500pcs/Reel Model Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. NxSx505xT Unit mm Scale Allow NICHIA CORPORATION Title No. TAPING DIMENSIONS 071214705921 Nichia STS-DA1-0073 The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Moisture proof foil bag Reel Label NICHIA Seal XXXX LED TYPE LOT QTY NxSx505xT xxxxxxPCS RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Moisture absorbent material The box is partitioned with the cardboard. Label NICHIA Nichia LED XXXX LED TYPE RANK QTY NxSx505xT PCS RoHS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN Packing unit Moisture proof foil bag Cardboard box Cardboard box S Reel/bag 1reel Quantity/bag (pcs) 2,500 MAX. Reel/box 5reel MAX. Quantity/box (pcs) 12,500 MAX. Dimensions (mm) 391 379 149 8t Model NxSx505xT NICHIA CORPORATION Title No. PACKING 071214705931 -13-