NS6A083T

No. STSE-CC7101A SPECIFICATIONS FOR NICHIA CHIP TYPE AMBER LED MODEL : NS6A083T NICHIA CORPORATION -0- Nichia STSE-CC7101A 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Dice Temperature Symbol IF IFP IR PD Topr Tstg Tj Absolute Maximum Rating 350 600 85 1.54 -30 ~ + 85 -40 ~ +100 120 (Ta=25°C) Unit mA mA mA W °C °C °C IFP Conditions : Pulse Width < 10msec. and Duty < 1/10 = = (2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Luminous Flux φv x Chromaticity Coordinate y Please refer to CIE 1931 chromaticity diagram. Condition IF=300[mA] IF=300[mA] IF=300[mA] IF=300[mA] Typ. (3.8) (35) 0.55 0.44 (Ta=25°C) Max. Unit 4.4 V lm - (3) Ranking Item Forward Voltage Rank H Rank M Rank L Rank P13 Rank P12 Rank P11 Rank P10 Symbol VF Condition IF=300[mA] Min. 4.0 3.6 3.2 42.8 36.0 30.3 25.5 Luminous Flux φv IF=300[mA] (Ta=25°C) Max. Unit 4.4 V 4.0 3.6 51.0 42.8 lm 36.0 30.3 Forward Voltage Measurement allowance is ± 3%. Luminous Flux Measurement allowance is ± 10%. Color Rank x y 0.603 0.397 (IF=300mA,Ta=25°C) Rank L 0.532 0.522 0.589 0.467 0.460 0.393 Color Coordinates Measurement allowance is ± 0.01. 2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS Please refer to figure’s page. -1- Nichia STSE-CC7101A 3.OUTLINE DIMENSIONS AND MATERIALS Please refer to figure’s page. Material as follows ; Package Encapsulating Resin Electrodes : : : Heat-Resistant Polymer Silicone Resin (with Phosphor) Ag Plating Copper Alloy 4.PACKAGING · The LEDs are packed in cardboard boxes after taping. Please refer to figure’s page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity · In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. · The boxes are not water resistant and therefore must be kept away from water and moisture. · When the LEDs are transported, we recommend that you use the same packing method as Nichia. 5.LOT NUMBER The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 6 for 2006, 7 for 2007 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number - Ranking by Color Coordinates - Ranking by Luminous Flux - Ranking by Forward Voltage B for Nov. ) -2- Nichia STSE-CC7101A 6.RELIABILITY (1) TEST ITEMS AND RESULTS Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Vibration Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260°C, 10sec. (Pre treatment 30°C,70%,168hrs.) Tsld=215 ± 5°C, 3sec. (Lead Solder) 0°C ~ 100°C 15sec. 15sec. -40°C ~ 25°C ~ 100°C ~ 25°C 30min. 5min. 30min. 5min. 25°C ~ 65°C ~ -10°C 90%RH 24hrs./1cycle Ta=100°C Ta=60°C, RH=90% Ta=-40°C Ta=25°C, IF=350mA Tested with Nichia standard circuit board. Note 2 times Number of Damaged 0/22 1 time over 95% 20 cycles 100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 500 hrs. 1000 hrs. 48min. 0/22 0/50 0/50 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/22 0/22 Ta=85°C, IF=160mA Tested with Nichia standard circuit board. 60°C, RH=90%, IF=250mA Tested with Nichia standard circuit board. Ta=-30°C, IF=300mA Tested with Nichia standard circuit board. JEITA ED-4701 400 403 JEITA ED-4702 JEITA ED-4702 JEITA ED-4701 300 304 Substrate Bending Adhesion Strength Electrostatic Discharges 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3directions, 4cycles 3mm, 5 ± 1 sec. 5N, 10 ± 1 sec. 1 time 1 time 3 times Negative/Positive 0/22 0/22 0/22 R=1.5kΩ, C=100pF Test Voltage=2kV Thermal resistance of LED with Nichia standard circuit board : Rja ≒ 65°C/W Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm (2) CRITERIA FOR JUDGING DAMAGE Item Symbol Test Conditions Forward Voltage VF IF=300mA Initial Level Luminous Flux φv IF=300mA Initial Level 0.7 The test is performed after the board is cooled down to the room temperature. -3- Criteria for Judgement Min. Max. 1.1 Nichia STSE-CC7101A 7.CAUTIONS The LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current. Care should be taken after due consideration when using LEDs. (1) Moisture Proof Package · When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. · The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage · Storage Conditions Before opening the package : The LEDs should be kept at 30°C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30°C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in the moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. · If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following condition. Baking treatment : more than 24 hours at 65 ± 5°C · Nichia LED electrodes, leadframes and Die Heat sink are silver plated copper alloy. The silver surface may be affected by environments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration might lower solderability or might affect on optical characteristics. There is a possibility of accelerate corrosion if the LEDs are exposed to corrosive substances in high temperature. · Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. (3) Recommended circuit · In designing a circuit, the current through each LED must not exceed its absolute maximum rating. It is recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the worst case, some LED may be subjected to stresses in excess of the absolute maximum rating. (A) ... (B) ... -4- Nichia STSE-CC7101A (4) Soldering Conditions · The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. · Recommended soldering conditions Pre-heat Pre-heat time Peak temperature Soldering time Condition Reflow Soldering Lead Solder Lead-free Solder 180 ~ 200°C 120 ~ 150°C 120 sec. Max. 120 sec. Max. 240°C Max. 260°C Max. 10 sec. Max. 10 sec. Max. refer to refer to Temperature - profile 1. Temperature - profile 2. (N2 reflow is recommended.) Hand Soldering Temperature Soldering time 350°C Max. 3 sec. Max. (one time only) Although the recommended soldering conditions are specified in the above table, reflow or hand soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure. 2.5 ~ 5°C / sec. Pre-heating 120 ~ 150°C 60sec.Max. Above 200°C 120sec.Max. 240°C Max. 10sec. Max. 1 ~ 5°C / sec. 1 ~ 5°C / sec. Pre-heating 180 ~ 200°C 60sec.Max. Above 220°C 260°C Max. 10sec. Max. 2.5 ~ 5°C / sec. 120sec.Max. [Recommended soldering pad design] Thin line boxes：Solder resist opening Thick line boxes：Land pattern Make sure the die heat sink is electrically connected to the cathode(K). Use the following conditions shown in the figure. (9.5) Die Heat Sink 2.05 1.05 (4.3) K 1.1 4.5 8 A 3.9 (Unit : mm) · Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. · The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resin should be used. · Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a hot plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. · Reflow soldering should not be done more than two times. · Die Heat sink is to be soldered. If not, please use the heat conductive adhesive. · When soldering, do not put stress on the LEDs during heating. · After soldering, do not warp the circuit board. -5- Nichia STSE-CC7101A (5) Cleaning · It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. · Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. (6) Static Electricity · Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. · When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 6mA is recommended). · Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=3mA) (7) Heat Generation · Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. · Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS in this specifications. Please also take measures to remove heat from the area near the LED (heat sink) to improve the operational characteristics of the LED. · The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation between Tj and Ts. Tj=Ta + Rja W 1 Tj=Ts + Rjs W 2 Tj = Dice Temperature : °C, Ta = Ambient Temperature : °C, Ts = Solder Temperature (Cathode Side) : °C, Rja = Heat resistance from Dice to Ambient temperature : °C /W, Rjs = Heat resistance from Dice to Ts measuring point ≒ 10°C /W, W = Inputting Power (IF VF) : W -6- Nichia STSE-CC7101A (8) Others · NS6A083 complies with RoHS Directive. · The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. · Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. · The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia’s sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). · User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. · The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement without notice. -7- Nichia STSE-CC7101A ICI Chromaticity Diagram 0.9 520 530 0.8 540 510 0.7 550 560 0.6 570 500 0.5 580 590 0.4 y L 600 610 620 0.3 490 630 0.2 480 0.1 470 460 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 x Color Coordinates Measurement allowance is ± 0.01. -8- Forward Voltage vs. Forward Current Ta=25°C 300 100 50 Relative Luminous Flux (a.u.) 1000 Forward Current IFP (mA) Forward Current vs. Relative Luminous Flux 2.5 Ta=25°C 2.0 1.5 1.0 0.5 0 0 100 200 300 400 500 600 700 Forward Current IFP (mA) Allowable Forward Current IFP (mA) Duty Ratio vs. Allowable Forward Current 1000 Ta=25°C 600 350 200 10 2.5 3.0 3.5 4.0 4.5 5.0 Forward Voltage VF (V) 100 1 5 10 20 50 100 Duty Ratio (%) Ambient Temperature vs. Forward Voltage Relative Luminous Flux (a.u.) 5.0 Forward Voltage VF (V) IFP=300mA 4.5 4.0 3.5 3.0 2.5 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) Ambient Temperature vs. Relative Luminous Flux Allowable Forward Current IF (mA) 2.0 IFP=300mA 1.0 Ambient Temperature vs. Allowable Forward Current 500 400 350 270 Thermal resistance Rja=65°C/W 100 Typical measuring PWB Thermal resistance Rja=35°C/W -9- 0.5 160 0.2 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C) 0 0 20 40 60 80 100 Ambient Temperature Ta (°C) Nichia STSE-CC7101A Model NS6A083 NICHIA CORPORATION Title No. CHARACTERISTICS 070608766421 Forward Current vs. Chromaticity Coordinate Relative Emission Intensity (a.u.) Spectrum 1.2 1.0 0.8 0.6 0.4 0.2 0 450 550 650 750 Wavelength λ (nm) 850 Ta=25°C IFP=300mA 0.450 Ta=25°C 0.445 0.440 0.435 0.430 0.540 0.545 0.550 600mA 20mA 300mA y 0.555 0.560 x Ambient Temperature vs. Chromaticity Coordinate 0.450 Relative Illuminance (a.u.) Directivity 1.0 0° Ta=25°C IFP=300mA 10° 20° 30° 40° 50° 0.5 60° 70° 80° 0 90° 60° 30° Radiation Angle 0° 0.5 90° 1.0 IFP=300mA 0.445 -30°C 0°C 25°C 50°C 85°C y -10- 0.440 0.435 0.430 0.540 0.545 0.550 0.555 0.560 x Nichia STSE-CC7101A Model NS6A083 NICHIA CORPORATION Title No. CHARACTERISTICS 070608766431 4.3 3.2 Internal Circuit Cathode Die Heatsink 4.3 3.5 Protection device Cathode mark C 1.5 0.6 4.85 Anode Die Heatsink -11- 6.5 5 0.25 3.4 0.175 1.35 3.4 5 A K 1.6 Nichia STSE-CC7101A ITEM PACKAGE ENCAPSULATING RESIN ELECTRODES MATERIALS Heat-Resistant Polymer Silicone Resin (with Phosphor) Ag Plating Copper Alloy Model NS6x083 Unit mm 7/1 Scale Allow ±0.2 NS6x083 has a protection device built in as a protection circuit against static electricity. NICHIA CORPORATION Title No. OUTLINE DIMENSIONS 061026652612 Taping part φ 1.5+0.1 -0 4±0.1 2±0.05 Cathode mark 5.5±0.05 12+0.3 - 0.1 6.7±0.1 1.75±0.1 0.2±0.05 Reel part φ 180+0 -3 15.4±1 13+1 -0 φ2 1 ±0.8 φ 13 ±0.2 8±0.1 0.2 φ1.5 +0 - 1.55±0.1 Label XXXX LED TYPE NS6x083T LOT xxxxxxQTY pcs RoHS 5.2±0.1 Reel end of tape No LEDs LEDs mounting part No LEDs φ 60+1 -0 Pull direction Top cover tape Embossed carrier tape -12Reel Lead Min.160mm (No LEDs) Reel Lead Min.100mm (No LEDs) Reel Lead Min.400mm Nichia STSE-CC7101A 1,400pcs/Reel Model Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. NS6x083T Unit mm Scale Allow NICHIA CORPORATION Title No. TAPING DIMENSIONS 070524652622 Nichia STSE-CC7101A The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Reel Label Seal TYPE LOT QTY NICHIA XXXX LED NS6x083T xxxxxxPCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN RoHS Moisture absorbent material Moisture proof foil bag The box is partitioned with the cardboard. Label NICHIA Nichia LED XXXX LED TYPE RANK QTY NS6x083T PCS NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN RoHS Packing unit Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 1,400 MAX. Reel/box 5reel MAX. 10reel MAX. 20reel MAX. Quantity/box (pcs) 7,000 MAX. 14,000 MAX. 28,000 MAX. Dimensions (mm) 291 237 120 8t 259 247 243 5t 444 262 259 8t Model NS6x083T NICHIA CORPORATION Title No. PACKING 070524652632 -13-