No. STSE-CE2177B
SPECIFICATIONS FOR NICHIA BLUISH-GREEN LED
MODEL : NSPE590S
NICHIA CORPORATION
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Nichia STSE-CE2177B 1.SPECIFICATIONS (1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Soldering Temperature
Symbol IF IFP VR PD Topr Tstg Tsld
Absolute Maximum Rating 30 100 5 120 -30 ~ + 85 -40 ~ +100 265°C for 10sec.
(Ta=25°C) Unit mA mA V mW °C °C
IFP Conditions : Pulse Width < 10msec. and Duty < 1/10 = =
(2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Reverse Current IR Luminous Intensity Rank IE3 Iv
Condition IF=10[mA] VR= 5[V] IF=10[mA]
Min. 4200
Typ. 3.5 12000
(Ta=25°C) Max. Unit 4.0 V 50 µA mcd
! Luminous Intensity Measurement allowance is ± 10%.
Color Rank x y 0.03 0.44
(IF=10mA,Ta=25°C) Rank IE3 0.03 0.17 0.17 0.70 0.70 0.44
! Color Coordinates Measurement allowance is ± 0.012.
Average Value by Shipment Lot Item Symbol x Color Coordinates
(Average)
y Iv
(IF=10mA,Ta=25°C) Average Control ( x, y ) conforms to the ITE green color requirement. Iv > 10000mcd.
Luminous Intensity
(Average)
2.TYPICAL INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to figure’s page.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to figure’s page. Material as follows ; Resin(Mold) : Leadframe : Epoxy Resin Ag plating Copper Alloy
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Nichia STSE-CE2177B
4.PACKAGING
· The BG-LEDs are packed in cardboard boxes after packaging in anti-electrostatic bags. Please refer to figure’s page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity · In order to protect the BG-LEDs from mechanical shock, we pack them in cardboard boxes for transportation. · The BG-LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. · The boxes are not water resistant and therefore must be kept away from water and moisture. · When the BG-LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows lot number. The lot number is composed of the following characters; "#$$$$ - !% " - Year ( 2 for 2002, 3 for 2003 ) # - Month ( 1 for Jan., 9 for Sep., A for Oct., $$$$ - Nichia's Product Number !% - Ranking
B for Nov. )
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Nichia STSE-CE2177B
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item Resistance to Soldering Heat Solderability Thermal Shock Temperature Cycle Moisture Resistance Cyclic Terminal Strength (bending test) Terminal Strength (pull test) High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Standard Test Method JEITA ED-4701 300 302 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 400 401 JEITA ED-4701 400 401 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260 ± 5°C, 10sec. 3mm from the base of the epoxy bulb Tsld=235 ± 5°C, (using flux) 0°C ~ 100°C 15sec. 15sec. -40°C ~ 25°C ~ 100°C ~ 25°C 30min. 5min. 30min. 5min. 25°C ~ 65°C ~ -10°C 90%RH 24hrs./1cycle Load 5N (0.5kgf) 0° ~ 90° ~ 0° bend 2 times Load 10N (1kgf) 10 ± 1 sec. Ta=100°C Ta=60°C, RH=90% Ta=-40°C Ta=25°C, IF=30mA 60°C, RH=90%, IF=20mA Ta=-30°C, IF=20mA 5sec. Note 1 time 1 time over 95% 100 cycles 100 cycles 10 cycles No noticeable damage No noticeable damage 1000hrs. 1000hrs. 1000hrs. 1000hrs. 500hrs. 1000hrs. Number of Damaged 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100 0/100
(2) CRITERIA FOR JUDGING THE DAMAGE Item Symbol Test Conditions Forward Voltage VF IF=10mA U.S.L.*)$ 1.1 Reverse Current IR VR=5V U.S.L.*)$ 2.0 Luminous Intensity IV IF=10mA L.S.L.**)$ 0.7 *) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level Criteria for Judgement Min. Max.
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Nichia STSE-CE2177B
7.CAUTIONS
(1) Lead Forming · When forming leads, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. Do not use the base of the leadframe as a fulcrum during lead forming. · Lead forming should be done before soldering. · Do not apply any bending stress to the base of the lead. The stress to the base may damage the BG-LED’s characteristics or it may break the BG-LEDs. · When mounting the BG-LEDs onto a printed circuit board, the holes on the circuit board should be exactly aligned with the leads of the BG-LEDs. If the BG-LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the BG-LEDs. (2) Storage · The BG-LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Nichia and the storage life limits are 3 months. If the BG-LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. · Nichia BG-LED leadframes are comprised of a silver plated copper alloy. The silver surface may be affected by environments which contain corrosive gases and so on. Please avoid conditions which may cause the BG-LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the BG-LEDs be used as soon as possible. · Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. (3) Static Electricity · Static electricity or surge voltage damages the BG-LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the BG-LEDs. · All devices, equipment and machinery must be properly grounded. It is recommended that measures be taken against surge voltage to the equipment that mounts the BG-LEDs. · When inspecting the final products in which BG-LEDs were assembled, it is recommended to check whether the assembled BG-LEDs are damaged by static electricity or not. It is easy to find static-damaged BG-LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). · Damaged BG-LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the BG-LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA)
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Nichia STSE-CE2177B (4) Soldering Conditions · Nichia BG-LED leadframes are comprised of a silver plated copper alloy. This substance has a low thermal coefficient (easily conducts heat). Careful attention should be paid during soldering. · Solder the BG-LED no closer than 3mm from the base of the epoxy bulb. Soldering beyond the base of the tie bar is recommended. · Recommended soldering conditions
Pre-Heat Pre-Heat Time Solder Bath Temperature Dipping Time Dipping Position Dip Soldering 120°C Max. 60 seconds Max. 260°C Max. 10 seconds Max. No lower than 3 mm from the base of the epoxy bulb. Temperature Soldering Time Position Soldering 350°C Max. 3 seconds Max. No closer than 3 mm from the base of the epoxy bulb.
· Do not apply any stress to the lead particularly when heated. · The BG-LEDs must not be repositioned after soldering. · After soldering the BG-LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the BG-LEDs return to room temperature. · Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be caused from warping of the PC board or from the clinching and cutting of the leadframes. When it is absolutely necessary, the BG-LEDs may be mounted in this fashion but the User will assume responsibility for any problems. Direct soldering should only be done after testing has confirmed that no damage, such as wire bond failure or resin deterioration, will occur. Nichia’s BG-LEDs should not be soldered directly to double sided PC boards because the heat will deteriorate the epoxy resin. · When it is necessary to clamp the BG-LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the BG-LEDs. · Cut the BG-LED leadframes at room temperature. Cutting the leadframes at high temperatures may cause failure of the BG-LEDs. (5) Heat Generation · Thermal design of the end product is of paramount importance. Please consider the heat generation of the BG-LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of BG-LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. · The operating current should be decided after considering the ambient maximum temperature of BG-LEDs. (6) Cleaning · It is recommended that isopropyl alcohol be used as a solvent for cleaning the BG-LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the BG-LEDs because of worldwide regulations. · Do not clean the BG-LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the BG-LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the BG-LEDs will occur.
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Nichia STSE-CE2177B (7) Safety Guideline for Human Eyes · In 1993, the International Electric Committee (IEC) issued a standard concerning laser product safety (IEC 825-1). Since then, this standard has been applied for diffused light sources (BG-LEDs) as well as lasers. In 1998 IEC 60825-1 Edition 1.1 evaluated the magnitude of the light source. In 2001 IEC 60825-1 Amendment 2 converted the laser class into 7 classes for end products. Components are excluded from this system. Products which contain visible BG-LEDs are now classified as class 1. Products containing UV LEDs are class 1M. Products containing BG-LEDs can be classified as class 2 in cases where viewing angles are narrow, optical manipulation intensifies the light, and/or the energy emitted is high. For these systems it is recommended to avoid long term exposure. It is also recommended to follow the IEC regulations regarding safety and labeling of products. (8) Others · If the BG-LEDs are being used after being fixed into a case (container, box, etc...) the BG-LEDs must not be mounted so that the epoxy lens is pressed or glued onto a plastic (or metal) board. · Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had BG-LEDs incorporated into it. · These BG-LEDs are designed and manufactured for standard applications of traffic signals. It is recommended to consult with Nichia in advance if these BG-LEDs are used for other applications. · User shall not reverse engineer by disassembling or analysis of the BG-LEDs without having prior written consent from Nichia. When defective BG-LEDs are found, the User shall inform Nichia directly before disassembling or analysis. · The formal specifications must be exchanged and signed by both parties before large volume purchase begins. · The appearance and specifications of the product may be modified for improvement without notice.
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Nichia STSE-CE2177B
ICI Chromaticity Diagram
0.9 520 530 0.8 540 510 0.7 550 560 0.6 570 500 0.5 580 590 600 610 0.3 490 620 630
ITE (Green)
y
0.4 0.2 480 0.1 470 0 0 460 0.1 0.2
0.3
0.4
0.5
0.6
0.7
0.8
x
! Color Coordinates Measurement allowance is ± 0.012.
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! Forward Voltage vs. Forward Current
200 Forward Current IFP (mA) 100 50 20 10 5 Ta=25°C
! Forward Current vs. Relative Luminosity
5.0 Relative Luminosity (a.u.) 4.0 3.0 2.0 1.0 0 0 20 40 60 80 100 120 Forward Current IFP (mA) Ta=25°C
! Duty Ratio vs. Allowable Forward Current
Allowable Forward Current IFP (mA) 200 Ta=25°C 100 50 30 20 10 1
1 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Forward Voltage VF (V)
5 10 20 50 100 Duty Ratio (%)
! Ambient Temperature vs. Forward Voltage
5.0 4.6 4.2 3.8 3.4 3.0 2.6 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C)
! Ambient Temperature vs. Relative Luminosity
2.0 Relative Luminosity (a.u.) IFP=10mA 1.0
! Ambient Temperature vs. Allowable Forward Current
Allowable Forward Current IF (mA) 40 30 20 10 0
Forward Voltage VF (V)
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IFP=30mA IFP=10mA IFP=5mA
0.5
0.2 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C)
0
20 40 60 80 100 Ambient Temperature Ta (°C)
Nichia STSE-CE2177B
Model
NSPExxxx
NICHIA CORPORATION Title TYP.CHARACTERISTICS
No.
011130110011
! Forward Current vs. Chromaticity Coordinate (λD)
0.70 Ta=25°C 0.65
1mA(510nm)
! Spectrum
Relative Emission Intensity (a.u.)
1.2 1 0.8 0.6 0.4 0.2 0 350 400 450 500 550 600 650 Wavelength λ (nm) Ta=25°C IF=10mA
0.60
5mA(507nm) 10mA(505nm)
y
0.55 0.50 0.45 0
30mA(501nm)
0.05 0.10 0.15 0.20 0.25
x ! Forward Current vs. Dominant Wavelength !
Dominant Wavelength λD (nm)
! Ambient Temperature vs. Dominant Wavelength
Dominant Wavelength λD (nm)
! Directivity (NSPE590S)
1 0° Ta=25°C IF=10mA 10° 20° 30° 40° 50° 0.5 60° 70° 80° 0 90° 60° 30° Radiation Angle 0° 0.5 1 90°
513 509 505 501 497 1
Pulsating Current Direct Current
509 507 505 503 501
IFP=10mA
5 10 20 50 100 Forward Current IFP (mA)
499 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (°C)
! Applied Voltage Waveform
Pulsating Current (full-wave rectification)
v
Relative Luminosity (a.u.)
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517 Ta=25°C
511
Nichia STSE-CE2177B
t v
Model
t
NSPE590S
Direct Current
NICHIA CORPORATION Title TYP.CHARACTERISTICS
No.
011130110031
Cathode (2.5)
! 0.5 ± 0.05
Anode
1.5MAX.
1.1
φ5
5.3
Stopper
1 φ 5.6
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7.9 8.9 13.2 ± 0.5
0.3 0.3
(2)
29.7 ± 1
1
ITEM RESIN(MOLD) LEAD FRAME
MATERIALS Epoxy Resin Ag Plating Copper Alloy
Remark: Bare copper alloy is exposed at tie-bar portion after cutting. The lamps have sharp and hard points that may injure human eyes or fingers etc., so please pay enough care in the handling.
Nichia STSE-CE2177B
Model
NSPE590S
Unit mm 3/1 Scale Allow ±0.2
NICHIA CORPORATION
Title No.
OUTLINE DIMENSIONS
010903106051
Cardboard
Print
NICHIA
XXXX LED
Anti-electrostatic bag
TYPE LOT QTY NxPxxxxxx xxxxxx-!" pcs
NICHIA CORPORATION
491OKA,KAMINAKA,ANAN,TOKUSHIMA,JAPAN
The quantity is printed on this bag.
CAUTION TO ELECTROSTATIC DAMAGE
静電気に注意
Label
NICHIA
-11XXXX LED
Cardboard
TYPE LOT QTY
NxPxxxxxx xxxxxx-!" PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Nichia STSE-CE2177B
Cardboard box 360!135!215!4t
# One box contains 8 bags at maximum.
Model
NxPxxxxxx
NICHIA CORPORATION
Title No.
PACKING
031029201103
Cardboard
Print
Anti-electrostatic bag
NICHIA
XXXX LED
TYPE LOT QTY NxPxxxxxx xxxxxx-!" pcs
NICHIA CORPORATION
491OKA,KAMINAKA,ANAN,TOKUSHIMA,JAPAN
The quantity is printed on this bag.
CAUTION TO ELECTROSTATIC DAMAGE
静電気に注意
Cardboard box A
Label
NICHIA
XXXX LED
TYPE LOT QTY NxPxxxxxx xxxxxx-!" PCS
-12Cardboard Cardboard box B 360!135!215!4t
# The cardboard box B contains 2 cardboard box A at maximum.
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
# Put this label on the cardboard box B.
Nichia STSE-CE2177B
Model
NxPxxxxxx
NICHIA CORPORATION
Title No.
PACKING
031029201113
Cardboard Anti-electrostatic bag
Print
NICHIA
XXXX LED
TYPE LOT QTY NxPxxxxxx xxxxxx-!" pcs
NICHIA CORPORATION
491OKA,KAMINAKA,ANAN,TOKUSHIMA,JAPAN
The quantity is printed on this bag.
CAUTION TO ELECTROSTATIC DAMAGE
静電気に注意
Label
-13# One box contains 20 bags at maximum.
Cardboard
NICHIA
XXXX LED
TYPE LOT QTY NxPxxxxxx xxxxxx-!" PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Cardboard box 425!135!355!4t
Nichia STSE-CE2177B
Model
NxPxxxxxx
NICHIA CORPORATION
Title No.
PACKING
031029201123
Cardboard
Print
NICHIA
XXXX LED
Anti-electrostatic bag
TYPE LOT QTY NxPxxxxxx xxxxxx-!" pcs
NICHIA CORPORATION
The quantity is printed on this bag.
491OKA,KAMINAKA,ANAN,TOKUSHIMA,JAPAN
Cardboard box A
CAUTION TO ELECTROSTATIC DAMAGE
静電気に注意
Label
-14Cardboard Cardboard box B 425!135!355!4t
Model
NICHIA
XXXX LED
TYPE LOT QTY NxPxxxxxx xxxxxx-!" PCS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
# Put this label on the cardboard box B.
Nichia STSE-CE2177B
NxPxxxxxx
NICHIA CORPORATION
# The cardboard box B contains 4 cardboard box A at maximum.
Title No.
PACKING
031029201133