IGBT MODULE MODULE
CIRCUIT
H-Bridge 200A 600V
OUTLINE DRAWING
PBMB200A6 PBMB200A6
8- fasten- tab No 110
Dimension(mm)
Approximate Weight : 650g
MAXMUM RATINGS (Tc=25°C) Item
Collector-Emitter Voltage Gate - Emitter Voltage Collector Current DC 1 ms
Symbol
VCES VGES IC ICP PC Tj Tstg VISO FTOR
PBMB200A6
600 +/ - 20 200 400 780 -40 to +150 -40 to +125 2500 3
Unit
V V A W °C °C V N•m
Collector Power Dissipation Junction Temperature Range Storage Temperature Range Isolation Voltage Terminal to Base AC, 1 min.) Module Base to Heatsink Mounting Torque Bus Bar to Main Terminals
ELECTRICAL CHARACTERISTICS (Tc=25°C) Characteristic
Collector-Emitter Cut-Off Current Gate-Emitter Leakage Current Collector-Emitter Saturation Voltage Gate-Emitter Threshold Voltage Input Capacitance Rise Time Turn-on Time Switching Time Fall Time Turn-off Time
Symbol
ICES IGES VCE(sat) VGE(th) Cies tr ton tf toff
Test Condition
VCE=600V,VGE=0V VGE=+/- 20V,VCE=0V IC=200A,VGE=15V VCE=5V,IC=200mA VCE=10V,VGE=0V,f=1MHz VCC= 300V RL= 3 ohm RG= 3.6 ohm VGE= +/- 15V
Min.
4.0 -
Typ.
2.1 20,000 0.15 0.25 0.2 0.45
Max.
2.0 1.0 2.6 8.0 0.3 0.4 0.35 0.7
Unit mA µA V V pF µs
FREE WHEELING DIODES RATINGS & CHARACTERISTICS (Tc=25°C) Item Symbol Rated Value
Forward Current DC 1 ms IF IFM 200 400
Unit A Typ.
1.9 0.15
Characteristic
Peak Forward Voltage Reverse Recovery Time
Symbol
VF trr
Test Condition
IF=200A,VGE=0V IF=200A,VGE=-10V,di/dt=200A/µs
Min.
-
Max.
2.4 0.25
Unit V µs Unit °C/W
THERMAL CHARACTERISTICS Characteristic
Thermal Impedance IGBT DIODE
Symbol
Rth(j-c)
Test Condition
Junction to Case
Min.
-
Typ.
-
Max.
0.16 0.38
PBMB200A6
Fig.1- Output Characteristics (Typical)
400
Fig.2- Collector to Emitter On Voltage vs. Gate to Emitter Voltage (Typical)
TC=25 ℃
16
TC=25 ℃ I C=80A 400A
V GE =20V
12V
Collector to Emitter Voltage V CE ( V)
15V 10V
14
200A
12 10 8 6 4 2 0
Collector Current I C ( A)
300
200
9V
100
8V 7V
0 0 2 4 6 8 10
0
4
8
12
16
20
Collector to Emitter Voltage V CE ( V)
Gate to Emitter Voltage V GE ( V)
Fig.3- Collector to Emitter On Voltage vs. Gate to Emitter Voltage (Typical)
16
Fig.4- Gate Charge vs. Collector to Emitter Voltage (Typical)
400 350 300 250 200 16
TC=125 ℃ I C=80A 400A
Collector to Emitter Voltage V CE ( V)
200A
12 10 8 6 4 2 0
Collector to Emitter Voltage V CE ( V)
14
RL=1.5 Ω TC=25 ℃
14
Gate to Emitter Voltage V GE (V)
12 10 8
VCE=300V
150 6
200V
100 50 0 0 150 300 450 600 750 900
100V
4 2 0
0
4
8
12
16
20
Gate to Emitter Voltage V GE ( V)
Total Gate Charge Qg ( nC)
Fig.5- Capacitance vs. Collector to Emitter Voltage (Typical)
100000 50000 20000
Fig.6- Collector Current vs. Switching Time (Typical)
1 0.9 0.8
Cies Coes Cres
VGE =0V f=1MHZ TC=25 ℃
VCC=300V R G=3.6 Ω VGE = ± 15V TC=25 ℃
Switching Time t ( μ s)
Capacitance C (pF)
10000 5000 2000 1000 500 200 100 0.2 0.5 1 2 5 10 20 50 100 200
0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 50 100 150
toff
ton tf
tr
200
Collector to Emitter Voltage V CE (V)
Collector Current IC ( A)
PBMB200A6
Fig.7- Series Gate Impedance vs. Switching Time (Typical)
5
Fig.8- Forward Characteristics of Free Wheeling Diode
(Typical)
400
2
V CC=300V I C=200A V G= ± 15V TC=25 ℃
TC=25 ℃
350
TC=125 ℃
toff ton tr
300
1
Forward Current I F ( A)
Switching Time t (μ s)
250 200 150 100 50 0
0.5
tf
0.2
0.1
0.05
1
10
100
0
1
2
3
4
Series Gate Impedance R G (Ω )
Forward Voltage V F ( V)
Fig.9- Reverse Recovery Characteristics (Typical)
500 1000
Fig.10- Reverse Bias Safe Operating Area (Typical)
500 200
Peak Reverse Recovery Current I RrM ( A) Reverse Recovery Time trr ( ns)
IF=200A TC=25 ℃ trr
R G=3.6 Ω V GE = ± 15V TC≦ 125 ℃
200
Collector Current I C ( A)
100 50 20 10 5 2 1 0.5 0.2
100
50
20
IRrM
10
5
0
200
400
600
800
1000
1200
0.1
0
200
400
600
800
-di/dt ( A/μ s)
Collector to Emitter Voltage V CE ( V)
Fig.11- Transient Thermal Impedance
5x10 -1
( ℃ /W)
FRD
2x10 -1 1x10 -1 5x10 -2
IGBT
Transient Thermal Impedance Rth
(J-C)
2x10 -2 1x10 -2 5x10 -3
TC=25 ℃
2x10 -3 1x10 -3 -5 10 10 -4 10 -3 10 -2 10 -1
1 Shot Pulse
1 10 1
Time t ( s)
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