IGBT MODULE Chopper MODULE Chopper
CIRCUIT
50A 1200V
OUTLINE DRAWING
PCHMB50B12 PCHMB50B12
2- fasten- tab No 110
Dimension(mm)
Approximate Weight : 220g
MAXMUM RATINGS (Tc=25°C) Item
Collector-Emitter Voltage Gate - Emitter Voltage Collector Current DC 1 ms
Symbol
VCES VGES IC ICP PC Tj Tstg VISO FTOR
PCHMB50B12
1200 +/ - 20 50 100 250 -40 to +150 -40 to +125 2500 2
Unit
V V A W °C °C V N•m
Collector Power Dissipation Junction Temperature Range Storage Temperature Range Isolation Voltage Terminal to Base AC, 1 min.) Module Base to Heatsink Mounting Torque Bus Bar to Main Terminals
ELECTRICAL CHARACTERISTICS (Tc=25°C) Characteristic
Collector-Emitter Cut-Off Current Gate-Emitter Leakage Current Collector-Emitter Saturation Voltage Gate-Emitter Threshold Voltage Input Capacitance Rise Time Turn-on Time Switching Time Fall Time Turn-off Time
Symbol
ICES IGES VCE(sat) VGE(th) Cies tr ton tf toff
Test Condition
VCE=1200V,VGE=0V VGE=+/- 20V,VCE=0V IC=50A,VGE=15V VCE=5V,IC=50mA VCE=10V,VGE=0V,f=1MHz VCC= 600V RL= 12 ohm RG= 20 ohm VGE= +/- 15V
Min.
4.0 -
Typ.
1.9 4200 0.25 0.40 0.25 0.80
Max.
1.0 1.0 2.4 8.0 0.45 0.70 0.35 1.10
Unit mA µA V V pF µs
FREE WHEELING DIODES RATINGS & CHARACTERISTICS (Tc=25°C) Item Symbol Rated Value
Forward Current DC 1 ms IF IFM 50 100
Unit A Typ.
1.9 0.2
Characteristic
Peak Forward Voltage Reverse Recovery Time
Symbol
VF trr
Test Condition
IF=50A,VGE=0V IF=50A,VGE=-10V,di/dt=100A/µs
Min.
-
Max.
2.4 0.3
Unit V µs Unit °C/W
THERMAL CHARACTERISTICS Characteristic
Thermal Impedance IGBT DIODE
Symbol
Rth(j-c)
Test Condition
Junction to Case
Min.
-
Typ.
-
Max.
0.43 0.7
PCHMB50B12
Fig.1- Output Characteristics (Typical)
100
Fig.2- Collector to Emitter On Voltage vs. Gate to Emitter Voltage (Typical)
TC=25 ℃
16
TC=25 ℃ I C=25A 100A
VGE =20V 15V
12V
10V
Collector to Emitter Voltage V CE ( V)
14 12 10 8 6 4 2 0
50A
Collector Current I C ( A)
75
9V
50
8V
25
7V
0 0 2 4 6 8 10
0
4
8
12
16
20
Collector to Emitter Voltage V CE ( V)
Gate to Emitter Voltage V GE ( V)
Fig.3- Collector to Emitter On Voltage vs. Gate to Emitter Voltage (Typical)
16
Fig.4- Gate Charge vs. Collector to Emitter Voltage (Typical)
800 700 600 500 400 16
TC=125 ℃ IC=25A 100A
Collector to Emitter Voltage V CE ( V)
Collector to Emitter Voltage V CE ( V)
14
RL=12Ω TC=25℃
14
Gate to Emitter Voltage V GE ( V)
50A
12 10 8 6 4 2 0
12 10 8
VCE =600V
300 6
400V
200 100 0 0 50 100 150 200 250 300 350
200V
4 2 0
0
4
8
12
16
20
Gate to Emitter Voltage V GE ( V)
Total Gate Charge Qg ( nC)
Fig.5- Capacitance vs. Collector to Emitter Voltage (Typical)
20000 10000 5000 1.4
Fig.6- Collector Current vs. Switching Time (Typical)
VCC=600V R G=20Ω VGE=±15V TC=25℃
Cies
VGE=0V f=1MHZ TC=25℃
1.2 1 0.8 0.6 0.4 0.2 0
tOFF
2000 1000 500 200 100 50 20
Coes
Switching Time t (μs)
Capacitance C (pF)
tf
Cres
tON tr
0.1
0.2
0.5
1
2
5
10
20
50
100
200
0
10
20
30
40
50
Collector to Emitter Voltage
VCE
(V)
Collector Current IC (A)
PCHMB50B12
Fig.8- Forward Characteristics of Free Wheeling Diode
Fig.7- Series Gate Impedance vs. Switching Time (Typical)
10 5
(Typical)
100 90
VCC=600V IC=50A VGE=±15V TC=25℃
TC=25℃
TC=125℃
toff ton tr
80
Switching Time t (μs)
2 1 0.5
Forward Current I F (A)
300
70 60 50 40 30 20
tf
0.2 0.1 0.05
10
5
10
20
50
100
200
0
0
1
2
3
4
Series Gate Impedance RG (Ω)
Forward Voltage VF (V)
Fig.9- Reverse Recovery Characteristics (Typical)
500 500
Fig.10- Reverse Bias Safe Operating Area (Typical)
R G=20Ω VGE=±15V TC≦125℃
Peak Reverse Recovery Current I RrM ( A) Reverse Recovery Time trr ( ns)
IF=50A TC=25 ℃ trr
200 100
200 100 50
Collector Current I C (A)
IRrM
50 20 10 5 2 1 0.5
20 10 5
2 1 0
0.2 50 100 150 200 250 300 0.1 0 400 800 1200 1600
-di/dt ( A/μ s)
Collector to Emitter Voltage V CE (V)
fig11-Tansient Thermal Impedance
5
Tansient Thermal Impedance Rth (J-C) (゚C/W)
2 1 5x10 2x10 10
-1
FRD IGBT
-1 -1 -2
5x10 2x10 10
-2 -2 -3
Tc=25℃ 1 Shot
-5
5x10 2x10
-3
10
10
-4
10
-3
10
-2
10
-1
1
10
1
Time t (s)
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