NJL6201R-1

NJL6201R-1 HIGH SPEED PIN PHOTO DIODE GENERAL DESCRIPTION The NJL6201R-1 is the high speed PIN photo-diode that attained the short tail performance and the fast monitor of optical storage devices. ACTIVE AREA 1.8 ±0.15 0.3 OUTLINE (typ.) Unit : mm Active area: 0.7X0.7mm 0.9 ±0.15 0.5 ±0.15 0.3 0.3 response (tr/tf) required of the laser diode power 1.8 ±0.15 1.16 ±0.15 1.0 FEATURES • Short tail performance • Fast rise-time/fall-time 5ns at1-99%, VR=2.5V,λ=780nm/650nm • High speed 300MHz at λ=780nm 300MHz at λ=650nm • Miniature, thin type 1.8mmX3.6mmX1.16mm 3.6 ±0.15 (2 1.0 × )R 0. 3 anode cathode APPLICATIONS • Front laser power monitor for CD-R/RW, DVD+/-R/RW/-RAM, recordable MD etc. ABSOLUTE MAXIMUM RATINGS (Ta=25°C) PARAMETER Reverse Voltage Operating Temperature Storage Temperature Reflow Soldering Temperature SYMBOL VR Topr Tstg Tsol RATINGS 35 -30 to +85 -40 to +100 260 UNIT V °C °C °C ELECTRO-OPTICAL CHARACTERISTICS (Ta=25°C) PARAMETER Dark Current Forward Voltage Capacitance Peak Wavelength Sensitivity Rise time/Fall time Cut off Frequency SYMBOL ID VF Ct λP S tr/tf fc TEST CONDITION VR=10V IF=1mA VR=2.5V, f=1MHz MIN — VR=2.5V, λ=780nm VR=2.5V, λ=650nm VR=2.5V, λ=780nm, 1-99% VR=2.5V, λ=650nm, 1-99% VR=2.5V, λ=780nm, RL=50Ω, -3dB VR=2.5V, λ=650nm, RL=50Ω, -3dB — — — — 0.38 0.32 — — — — TYP 0.1 — 8 800 0.47 0.37 5 5 300 300 MAX 2.0 1.0 — — — — — — — — UNIT nA V pF nm A/W A/W ns ns MHz MHz Ver.2005-01-20 -1- 0.95 0.95 NJL6201R-1 TYPICAL CHARACTERISTICS Light Current vs. Illuminance (Ta=25°C) 1.00E-02 100 90 Spectral Response (Ta=25°C) 1.00E-03 VR=2.5V, λ =650nm 80 70 Relative Sensitivity (%) 60 50 40 30 20 1.00E-04 Light Current IL(A) 1.00E-05 1.00E-06 1.00E-07 10 1.00E-08 0.01 0 0.1 1 Illuminance　(mW/cm ) 2 10 100 500 600 700 800 900 1000 1100 Wav elength λ(nm) Dark Current vs. Temperature 1.00E-08 Relative Sensitivity vs. Temperature 110% 108% 106% 104% VR=2.5V 1.00E-09 1.00E-10 Relative Sensitivity (%) Dark Current ID(A) 102% 100% 98% 96% VR=2.5V, λ =650nm 1.00E-11 1.00E-12 94% 92% 1.00E-13 -40 -20 0 20 40 60 80 100 90% -40 -20 0 20 40 60 80 100 Ambient Temperature Ta(℃) Ambient Temperature Ta( ℃) Rise Time vs. Reverse Voltage (Ta=25°C) 15 Fall Time vs. Reverse Voltage (Ta=25°C) 15 1-99%, λ=650nm, RL=50Ω 1-99%, λ=650nm, RL=50Ω 10 10 Rise Time 　tr (ns) Fall Time 　tr (ns) 5 5 0 0 1 2 3 4 5 0 0 1 2 3 4 5 Reverse Voltage　VR(V) Reverse Voltage　VR(V) -2- Ver.2005-01-20 NJL6201R-1 Relative Sensitivity vs. Frequency (Ta=25°C) 0 Capacitance vs. Reverse Voltage (Ta=25°C) 13 -1 12 11 Relative Sensitivity (dB) -2 Capasitance Cj (pF) VR=2.5V, λ =650nm, RL=50Ω 10 -3 9 -4 8 -5 7 -6 6 1 10 100 1000 0 1 2 3 4 5 Frequency f(MHz) Reverse Voltage VR(V) MEASURING CIRCUIT FOR RESPONSE TIME Oscilloscope Pulse Generator Input Laser NJL6201R-1 Output tr tf 50Ω 99% 1% Ver.2005-01-20 -3- NJL6201R-1 PRECAUTION FOR HANDLING 1. Soldering to actual circuit board Soldering condition - Heated condition of plastic package. Lower than 260 °C of maximum surface temperature Soldering Method 1) Reflow Method Recommended temperature profile of its method. Soldering to be done within twice under this condition. a : Temperature ramping rate b : Pre-heating temperature time c : Temperature ramping rate d : 220°C or higher time e : 230°C or higher time f : Peak temperature g : Temperature ramping rate : 1 to 4°C/s : 150 to 180°C : 60 to 120s : 1 to 4°C /s : Shorter than 60s : Shorter than 40s : Lower than 260°C : 1 to 6°C /s f 260°C 230°C 220°C 180°C 150°C e d The temperature indicates at the surface of mold package Room Temp. a b c g 2) Reflow Method (In case of infrared heating) - Temperature profile : Same to the above - Avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface temperature will be higher than lead itself. 3) The other method Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method ( VPS). If the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliability. It is necessary to solder in short time as soon as possible. 2. Cleaning Avoid washing of the device after soldering by reflow method. 3. Attention in handling 1) Treat not to touch the lens surface. 2) Avoid dust and any other foreign materials (paint, bonding material, etc.) on the lens surface. 4. Storage In order to prevent from degradation of this device in moisturing at reflow method, so that this device is contained in deaeration packaging. So that mount the device as short as possible after opening the envelope. -4- Ver.2005-01-20 NJL6201R-1 NJL6201R-1 Taping Specification 1. Taping Size 1) Carrier tape is used with Styrene type Carbonated Plastic. 2) Cover tape is used with electro statistically prevention treated Polyester type tape. 3) Product taping direction is to place the index mark against the pull out direction of the tape as in the drawing. Pull out direction of tape Unit:mm 4.0 2.0 φ1.5 1.75 0.3 5.5 4.2 2.4 4.0 1.5 Carrier tape 12.0 Cover tape 2. Taping Strength Pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15°, and the peeling-off strength is to be within the power of 20 to 70g. 3. Packaging 1) The taped products are to be rolled up on the taping reel as on the drawing. 2) Rolling up specification 2-1) Start Rolling : Carrier tape open space more than 20 Pieces. 2-2) End of Rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only. 3) Taping quantity : 2,000 Pieces 4) Seal off after putting each reels in a dampproof bag with silica gel (3 bags). φ13 13 Unit: mm Label Ver.2005-01-20 -5- φ180 φ60 NJL6201R-1 MEMO [CAUTION] The specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights. -6- Ver.2005-01-20