54ABT543 Octal Registered Transceiver with TRI-STATE Outputs
November 2002
54ABT543 Octal Registered Transceiver with TRI-STATE ® Outputs
General Description
The ’ABT543 octal transceiver contains two sets of D-type latches for temporary storage of data flowing in either direction. Separate Latch Enable and Output Enable inputs are provided for each register to permit independent control of inputting and outputting in either direction of data flow. n A and B outputs have current sourcing capability of 24 mA and current sinking capability of 48 mA n Separate controls for data flow in each direction n Guaranteed latchup protection n High impedance glitch free bus loading during entire power up and power down cycle n Nondestructive hot insertion capability n Standard Military Drawing (SMD) 5962-9231401
Features
n Back-to-back registers for storage n Bidirectional data path
Ordering Code:
Military 54ABT543J-QML 54ABT543W-QML 54ABT543E-QML Package Number J24F W24C E28A 24-Lead Ceramic Dual-In-Line 24-Lead Cerpack 28-Lead Ceramic Leadless Chip Carrier, Type C Package Description
Connection Diagrams
Pin Assignment for DIP and Flatpak Pin Assignment for LCC
10021802 10021801
TRI-STATE ® is a registered trademark of National Semiconductor Corporation.
© 2002 National Semiconductor Corporation
DS100218
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54ABT543
Pin Descriptions
Pin Names OEAB , OEBA LEAB , LEBA CEAB , CEBA A0–A7 B0–B7 Description Output Enable Inputs Latch Enable Inputs Chip Enable Inputs Side A Inputs or TRI-STATE Outputs Side B Inputs or TRI-STATE Outputs
Functional Description
The ’ABT543 contains two sets of D-type latches, with separate input and output controls for each. For data flow from A to B, for example, the A to B Enable (CEAB ) input must be low in order to enter data from the A port or take data from the B port as indicated in the Data I/O Control Table. With CEAB low, a low signal on (LEAB ) input makes the A to B latches transparent; a subsequent low to high transition of the LEAB line puts the A latches in the storage mode and their outputs no longer change with the A inputs. With CEAB and OEAB both low, the B output buffers are active and reflect the data present on the output of the A latches. Control of data flow from B to A is similar, but using the CEBA , LEBA and OEBA . CEAB H X L X L LEAB X H L X X
Data I/O Control Table Inputs OEAB X X X H L Latched Latched Transparent — — Latch Status Output Buffers High Z — — High Z Driving
H = High Voltage Level L = Low Voltage Level X = Immaterial
Logic Diagram
10021803
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54ABT543
Absolute Maximum Ratings
(Note 1)
in LOW State (Max) DC Latchup Source Current Over Voltage Latchup (I/O)
twice the rated IOL (mA) −500 mA 10V
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias Ceramic VCC Pin Potential to Ground Pin Input Voltage (Note 2) Input Current (Note 2) Voltage Applied to Any Output in the Disable or Power-Off State in the HIGH State Current Applied to Output −0.5V to +5.5V −0.5V to VCC −0.5V to +7.0V −0.5V to +7.0V −30 mA to +5.0 mA −55˚C to +175˚C −65˚C to +150˚C −55˚C to +125˚C
Recommended Operating Conditions
Free Air Ambient Temperature Military Supply Voltage Military Minimum Input Edge Rate Data Input Enable Input Clock Input +4.5V to +5.5V (∆V/∆t) 50 mV/ns 20 mV/ns 100 mV/ns −55˚C to +125˚C
DC Electrical Characteristics
Symbol VIH VIL VCD VOH VOL VID IIH Parameter Min Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output HIGH Voltage Output LOW Voltage Input Leakage Test Input HIGH Current 54ABT 54ABT 54ABT 4.75 2.5 2.0 0.55 V V V Min Min 0.0 2.0 0.8 −1.2 ABT543 Typ Max V V V Min Recognized HIGH Signal Recognized LOW Signal IIN = −18 mA (Non I/O Pins) IOH = −3 mA, (An, Bn) IOH = −24 mA, (An, Bn) IOL = 48 mA, (An, Bn) IID = 1.9 µA, (Non-I/O Pins) All Other Pins Grounded 5 µA Max VIN = 2.7V (Non-I/O Pins) (Note 3) VIN = VCC (Non-I/O Pins) IBVI IBVIT IIL Input HIGH Current Breakdown Test Input HIGH Current Breakdown Test (I/O) Input LOW Current −5 µA Max VIN = 0.5V (Non-I/O Pins)(Note 3) VIN = 0.0V (Non-I/O Pins) IIH + IOZH IIL + IOZL IOS ICEX IZZ ICCLH ICCL ICCZ Output Leakage Current Output Leakage Current Output Short-Circuit Current Output HIGH Leakage Current Bus Drainage Test Power Supply Current Power Supply Current Power Supply Current −100 50 −50 −275 50 100 50 30 50 µA µA mA µA µA µA mA µA 0V–5.5V VOUT = 2.7V (An, Bn); OEAB or CEAB = 2V 0V–5.5V VOUT = 0.5V (An, Bn); OEAB or CEAB = 2V Max Max 0.0V Max Max Max VOUT = 0V (An, Bn) VOUT = VCC (An, Bn) VOUT = 5.5V (An, Bn); All Others GND All Outputs HIGH All Outputs LOW Outputs TRI-STATE All Others at VCC or GND 7 100 µA µA Max Max VIN = 7.0V (Non-I/O Pins) VIN = 5.5V (An, Bn) Units VCC Conditions
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54ABT543
DC Electrical Characteristics
Symbol ICCT ICCD Parameter
(Continued) ABT543 Min Typ Max 2.5 mA Max VI = VCC − 2.1V All Others at VCC or GND Outputs Open, CEAB 0.18 mA/MHz Max and OEAB = GND,CEBA = VCC, One Bit Toggling, 50% Duty Cycle, (Note 4) Units VCC Conditions
Additional ICC/Input Dynamic ICC (Note 3) No Load
Note 1: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 2: Either voltage limit or current limit is sufficient to protect inputs. Note 3: Guaranteed but not tested. Note 4: For 8-bit toggling. ICCD < 1.4 mA/MHz.
DC Electrical Characteristics
Conditions Symbol VOLP VOLV Parameter Quiet Output Maximum Dynamic VOL Quiet Output Minimum Dynamic VOL Min Max 1.1 -0.45 Units V V VCC 5.0 5.0 CL = 50 pF, RL = 500Ω TA = 25˚C (Note 5) TA = 25˚C(Note 5)
Note 5: Max number of outputs defined as (n). n − 1 data inputs are driven 0V to 3V. One output at LOW.
AC Electrical Characteristics
54ABT TA = −55˚C to +125˚C Symbol Parameter Min tPLH tPHL tPLH tPHL Propagation Delay An to Bn or Bn to An Propagation Delay LEAB to Bn, LEBA to An OEBA or OEAB to An or Bn tPZH tPZL Enable Time LEAB to Bn, LEBA to An OEBA or OEAB to An or Bn tPHZ tPLZ Disable Time CEBA or CEAB to An or Bn 1.3 1.8 2.0 1.5 6.4 7.4 7.2 7.0 Figure 6 ns Figure 6 1.6 1.6 6.6 6.4 ns Figure 4 1.6 1.6 VCC = 4.5V–5.5V CL = 50 pF Max 6.4 6.2 ns Figure 4 Units Fig. No.
ns
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54ABT543
AC Operating Requirements
54ABT TA = −55˚C to +125˚C Symbol Parameter VCC = 4.5V–5.5V CL = 50 pF Min tS(H) tS(L) tH(H) tH(L) tS(H) tS(L) tH(H) tH(L) tW(L) Setup Time, HIGH or LOW An or Bn to LEBA or LEAB Hold Time, HIGH or LOW An or Bn to LEBA or LEAB Setup Time, HIGH or LOW An or Bn to CEAB or CEBA Hold Time, HIGH or LOW An or Bn to CEAB or CEBA Pulse Width, LOW 3.5 3.0 2.0 2.0 3.3 2.5 2.0 2.0 3.5 ns Figure 5 ns Figure 7 ns Figure 7 ns Figure 7 Max ns Figure 7 Units Fig. No.
Capacitance
Symbol CIN CI/O(Note 6) Parameter Input Capacitance Output Capacitance Typ 5.0 11.0 Units pF pF Conditions: TA = 25˚C VCC = 0V (non I/O pins) VCC = 5.0V (An, Bn)
Note 6: CI/O is measured at frequency, f = 1 MHz, PER MIL-STD-883, METHOD 3012.
AC Loading
10021804
10021806
*Includes jig and probe capacitance
FIGURE 1. Standard AC Test Load
FIGURE 2. VM = 1.5V Input Pulse Requirements
Amplitude Rep. Rate 3V 1 MHz
tw 500 ns
tr 2.5 ns
tf 2.5 ns
FIGURE 3. Test Input Signal Requirements
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54ABT543
AC Loading
(Continued)
10021808
FIGURE 4. Propagation Delay Waveforms for Inverting and Non-Inverting Functions FIGURE 5. Propagation Delay, Pulse Width Waveforms
10021805
10021807
FIGURE 6. TRI-STATE Output HIGH and LOW Enable and Disable Times FIGURE 7. Setup Time, Hold Time and Recovery Time Waveforms
10021809
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54ABT543
Physical Dimensions
unless otherwise noted
inches (millimeters)
28-Lead Ceramic Leadless Chip Carrier (L) Order Number 54ABT543E-QML NS Package Number E28A
24-Lead Ceramic Dual-In-Line Package Order Number 54ABT543J-QML NS Package Number J24F
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54ABT543 Octal Registered Transceiver with TRI-STATE Outputs
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
24-Lead Ceramic Flatpak Package (F) Order Number 54ABT543W-QML NS Package Number W24C
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