54ABT646 Octal Transceivers and Registers with TRI-STATE Outputs
July 1998
54ABT646 Octal Transceivers and Registers with TRI-STATE ® Outputs
General Description
The ’ABT646 consists of bus transceiver circuits with TRI-STATE, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers. Data on the A or B bus will be clocked into the registers as the appropriate clock pin goes to a high logic level. Control OE and direction pins are provided to control the transceiver function. In the transceiver mode, data present at the high impedance port may be stored in either the A or the B register or in both. The select controls can multiplex stored and real-time (transparent mode) data. The direction control determines which bus will receive data when the enable control OE is Active LOW. In the isolation mode (control OE HIGH), A data may be stored in the B register and/or B data may be stored in the A register.
Features
n Independent registers for A and B buses n Multiplexed real-time and stored data n A and B output sink capability of 48 mA, source capability of 24 mA n Guaranteed multiple output switching specifications n Output switching specified for both 50 pF and 250 pF loads n Guaranteed simultaneous switching noise level and dynamic threshold performance n Guaranteed latchup protection n High impedance glitch free bus loading during entire power up and power down cycle n Nondestructive hot insertion capability n Standard Microcircuit Drawing (SMD) 5962-9457701
Ordering Code
Military 54ABT646J-QML 54ABT646W-QML 54ABT646E-QML Package Number J24A W24C E28A 24-Lead Cerpack 28-Lead Ceramic Leadless Chip Carrier, Type C Package Description 24-Lead Ceramic Dual-In-Line
TRI-STATE ® is a registered trademark of National Semiconductor Corporation.
© 1998 National Semiconductor Corporation
DS100209
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Connection Diagrams
Pin Assignment for DIP and Flatpak Pin Assignment for LCC
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DS100209-3
Pin Descriptions
Pin Names A0–A7 B0–B7 CPAB, CPBA SAB, SBA OE DIR Select Inputs Output Enable Input Direction Control Input Data Register A Inputs/ TRI-STATE Outputs Data Register B Inputs/ TRI-STATE Outputs Clock Pulse Inputs Description
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Connection Diagrams
(Continued) Storage from Bus to Register
Real Time Transfer A-Bus to B-Bus
DS100209-7 DS100209-5
FIGURE 3. Transfer from Register to Bus
FIGURE 1. Real Time Transfer B-Bus to A-Bus
DS100209-8 DS100209-6
FIGURE 4.
FIGURE 2. Inputs OE H H H L L L L L L L L DIR X X X H H H H L L L L CPAB H or L
N
Data I/O (Note 1) X X X L L H H X X X X X X X X X X X L L H H Output Input Input Output Input Input Isolation
Function
CPBA SAB SBA A0–A7 B0–B7 H or L X
N
Clock An Data into A Register Clock Bn Data into B Register An to Bn — Real Time (Transparent Mode) Clock An Data into A Register A Register to Bn (Stored Mode) Clock An Data into A Register and Output to Bn Bn to An — Real Time (Transparent Mode) Clock Bn Data into B Register B Register to An (Stored Mode) Clock Bn Data into B Register and Output to An
X X
N
X X X X X
N
H or L
N
X X X X
H or L
N
H = HIGH Voltage Level L = LOW Voltage Level X = Immaterial
N = LOW-to-HIGH Transition
Note 1: The data output functions may be enabled or disabled by various signals at the OE and DIR inputs. Data input functions are always enabled; i.e., data at the bus pins will be stored on every LOW-to-HIGH transition of the appropriate clock inputs.
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Logic Diagram
DS100209-9
Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.
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Absolute Maximum Ratings (Note 2)
If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias Ceramic VCC Pin Potential to Ground Pin Input Voltage (Note 3) Input Current (Note 3) Voltage Applied to Any Output in the Disable or Power-Off State in the HIGH State Current Applied to Output in LOW State (Max) DC Latchup Source Current −65˚C to +150˚C −55˚C to +125˚C −55˚C to +175˚C −0.5V to +7.0V −0.5V to +7.0V −30 mA to +5.0 mA
Over Voltage Latchup (I/O)
10V
Recommended Operating Conditions
Free Air Ambient Temperature Military Supply Voltage Military Minimum Input Edge Rate Data Input Enable Input Clock Input −55˚C to +125˚C +4.5V to +5.5V (∆V/∆t) 50 mV/ns 20 mV/ns 100 mV/ns
−0.5V to +5.5V −0.5V to VCC twice the rated IOL (mA) −500 mA
Note 2: Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Note 3: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
Symbol VIH VIL VCD VOH VOL VID IIH IBVI IBVIT IIL IIH + IOZH IIL + IOZL IOS ICEX IZZ ICCH ICCL ICCZ ICCT ICCD Parameter Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output HIGH Voltage Output LOW Voltage 54ABT 54ABT 54ABT 4.75 5 5 Input HIGH Current Breakdown Test Input HIGH Current Breakdown Test (I/O) Input LOW Current Output Leakage Current Output Leakage Current Output Short-Circuit Current Output HIGH Leakage Current Bus Drainage Test Power Supply Current Power Supply Current Power Supply Current Additional ICC/Input Dynamic ICC (Note 5) No Load −100 7 100 −5 −5 50 −50 −275 50 100 250 30 50 2.5 0.18 µA µA mA µA µA µA mA µA mA mA/MHz 0V–5.5V 0V–5.5V Max Max 0.0V Max Max Max Max Max µA µA µA Max Max Max 2.5 2.0 0.55 V V µA 2.0 0.8 −1.2 ABT646 Min Typ Max V V V V Min Min 0.0 Max Min Recognized HIGH Signal Recognized LOW Signal IIN = −18 mA (Non I/O Pins) IOH = −3 mA, (An, Bn) IOH = −24 mA, (An, Bn) IOL = 48 mA, (An, Bn) IID = 1.9 µA, (Non-I/O Pins) All Other Pins Grounded VIN = 2.7V (Non-I/O Pins) (Note 5) VIN = VCC (Non-I/O Pins) VIN = 7.0V (Non-I/O Pins) VIN = 5.5V (An, Bn) VIN = 0.5V (Non-I/O Pins) (Note 5) VIN = 0.0V (Non-I/O Pins) VOUT = 2.7V (An, Bn); OE = 2.0V VOUT = 0.5V (An, Bn); OE = 2.0V VOUT = 0V (An, Bn) VOUT = VCC (An, Bn) VOUT = 5.5V (An, Bn); All Others GND All Outputs HIGH All Outputs LOW Outputs TRI-STATE; All Others GND VI = VCC − 2.1V All Other Outputs at VCC or GND Outputs Open OE and DIR = GND, Non-I/O = GND or VCC (Note 4) One Bit toggling, 50% duty cycle Units VCC Conditions
Input Leakage Test Input HIGH Current
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DC Electrical Characteristics
Note 4: For 8-bit toggling, ICCD < 1.4 mA/MHz. Note 5: Guaranteed but not tested.
(Continued)
AC Electrical Characteristics
54ABT TA = −55˚C to +125˚C VCC = 4.5V–5.5V CL = 50 pF Min fmax tPLH tPHL tPLH tPHL tPLH tPHL tPZH tPZL tPHZ tPLZ tPZH tPZL tPHZ tPLZ Max Clock Frequency Propagation Delay Clock to Bus Propagation Delay Bus to Bus Propagation Delay SBA or SAB to An to Bn Enable Time OE to An or Bn Disable Time OE to An or Bn Enable Time DIR to An or Bn Disable Time DIR to An or Bn 125 2.2 1.7 1.5 1.5 1.5 1.5 1.0 1.9 1.5 1.5 1.0 2.2 1.5 1.5 8.8 8.8 7.9 7.9 8.1 8.9 7.3 8.8 9.3 9.3 7.7 9.5 8.7 9.2 ns ns ns ns ns ns Max MHz ns Fig. Units No.
Symbol
Parameter
Figure 8 Figure 8 Figure 8 Figure 10 Figure 10 Figure 10 Figure 10
AC Operating Requirements
54ABT TA = −55˚C to +125˚C VCC = 4.5V–5.5V CL = 50 pF Min tS(H) tS(L) tH(H) tH(L) tW(H) tW(L) Setup Time, HIGH or LOW Bus to Clock Hold Time, HIGH or LOW Bus to Clock Pulse Width, HIGH or LOW 4.0 ns 1.0 ns 3.5 Max ns Fig. Units No.
Symbol
Parameter
Figure 11 Figure 11 Figure 9
Capacitance
Symbol CIN CI/O (Note 6) Parameter Input Capacitance Output Capacitance Typ 5 11 Units pF pF Conditions TA = 25˚C VCC = 0V (non I/O pins) VCC = 5.0V (An, Bn)
Note 6: CI/O is measured at frequency, f = 1 MHz, per MIL-STD-883B, Method 3012.
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Capacitance
(Continued)
tPLH vs Temperature (TA) CL = 50 pF, 1 Output Switching Clock to Bus
tPHL vs Temperature (TA) CL = 50 pF, 1 Output Switching Clock to Bus
DS100209-18
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tPLH vs Load Capacitance 1 Output Switching, TA = 25˚C Clock to Bus
tPHL vs Load Capacitance 1 Output Switching, TA = 25˚C Clock to Bus
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DS100209-21
tPLH vs Load Capacitance 8 Outputs Switching, TA = 25˚C Clock to Bus
tPHL vs Load Capacitance 8 Outputs Switching, TA = 25˚C Clock to Bus
DS100209-22
DS100209-23
Dashed lines represent design characteristics; for specified guarantees, refer to AC Characteristics Tables.
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Capacitance
(Continued)
tPZL vs Temperature (TA) CL = 50 pF, 1 Output Switching OE to Bus
tPLZ vs Temperature (TA) CL = 50 pF, 1 Output Switching OE to Bus
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tPZH vs Temperature (TA) CL = 50 pF, 1 Output Switching
tPHZ vs Temperature (TA) CL = 50 pF, 1 Output Switching OE to Bus
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tPZH vs Temperature (TA) CL = 50 pF, 8 Outputs Switching OE to Bus
tPHZ vs Temperature (TA) CL = 50 pF, 8 Outputs Switching OE to Bus
DS100209-28
DS100209-29
Dashed lines represent design characteristics; for specified guarantees, refer to AC Characteristics Tables.
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Capacitance
(Continued)
tPZL vs Temperature (TA) CL = 50 pF, 8 Outputs Switching OE to Bus
tPLZ vs Temperature (TA) CL = 50 pF, 8 Outputs Switching OE to Bus
DS100209-30
DS100209-31
tPZL vs Load Capacitance 8 Outputs Switching, TA = 25˚C OE to Bus
tPZH vs Load Capacitance 8 Outputs Switching, TA = 25˚C OE to Bus
DS100209-32
DS100209-33
tPLH and tPHL vs Number Output Switching VCC = 5.0V, TA = 25˚C CL = 50 pF, Clock to Bus
DS100209-34
Dashed lines represent design characteristics; for specified guarantees, refer to AC Characteristics Tables.
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Capacitance
(Continued)
ICC vs Frequency, Average, TA = 25˚C, VCC = 5.5V All Outputs Unloaded/Unterminated; All Outputs Switching in phase @50% Duty Cycle
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tSET LOW vs Temperature (TA) CL = 50 pF, 1 Output Switching Bus to Clock
tSET HIGH vs Temperature (TA) CL = 50 pF, 1 Output Switching Bus to Clock
DS100209-36
DS100209-37
tHOLD LOW vs Temperature (TA) CL = 50 pF, 1 Output Switching Bus to Clock
tHOLD HIGH vs Temperature (TA) CL = 50 pF, 1 Output Switching Bus to Clock
DS100209-38
DS100209-39
Dashed lines represent design characteristics; for specified guarantees, refer to AC Characteristics Tables.
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AC Loading
DS100209-10
*Includes jig and probe capacitance
FIGURE 5. Standard AC Test Load
DS100209-11
FIGURE 9. Propagation Delay, Pulse Width Waveforms
DS100209-12
FIGURE 6. Test Input Signal Levels Input Pulse Requirements
DS100209-13
FIGURE 10. TRI-STATE Output HIGH and LOW Enable and Disable Times tf 2.5 ns
Amplitude 3.0V
Rep. Rate 1 MHz
tW 500 ns
tr 2.5 ns
FIGURE 7. Test Input Signal Requirements
DS100209-15 DS100209-14
FIGURE 8. Propagation Delay Waveforms for Inverting and Non-Inverting Functions
FIGURE 11. Setup Time, Hold Time and Recovery Time Waveforms
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Physical Dimensions
inches (millimeters) unless otherwise noted
28-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E28A
24-Lead Ceramic Dual-in-Line Package (D) NS Package Number J24A
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54ABT646 Octal Transceivers and Registers with TRI-STATE Outputs
Physical Dimensions
inches (millimeters) unless otherwise noted (Continued)
24-Lead Ceramic Flatpak Package (F) NS Package Number W24C
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