54F374FM

54F 74F374 Octal D-Type Flip-Flop with TRI-STATE Outputs May 1995 54F 74F374 Octal D-Type Flip-Flop with TRI-STATE Outputs General Description The ’F374 is a high-speed low-power octal D-type flip-flop featuring separate D-type inputs for each flip-flop and TRI-STATE outputs for bus-oriented applications A buffered Clock (CP) and Output Enable (OE) are common to all flip-flops Features Y Y Y Y Edge-triggered D-type inputs Buffered positive edge-triggered clock TRI-STATE outputs for bus-oriented applications Guaranteed 4000V minimum ESD protection Commercial 74F374PC Military Package Number N20A Package Description 20-Lead (0 300 Wide) Molded Dual-In-Line 20-Lead Ceramic Dual-In-Line 20-Lead (0 300 Wide) Molded Small Outline JEDEC 20-Lead (0 300 Wide) Molded Small Outline EIAJ 20-Lead Molded Shrink Small Outline EIAJ Type II 20-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C 54F374DM (QB) 74F374SC (Note 1) 74F374SJ (Note 1) 74F374MSA (Note 1) 54F374FM (QB) 54F374LM (QB) J20A M20B M20D MSA20 W20A E20A Note 1 Devices also available in 13 reel Use suffix e SCX SJX and MSAX Logic Symbols Connection Diagrams Pin Assignment for DIP SOIC SSOP and Flatpak Pin Assignment for LCC TL F 9524–1 IEEE IEC TL F 9524 – 3 TL F 9524 – 2 TL F 9524–4 TRI-STATE is a registered trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation TL F 9524 RRD-B30M75 Printed in U S A Unit Loading Fan Out Pin Names D0 – D7 CP OE O0 – O 7 54F 74F Description UL HIGH LOW Input IIH IIL Output IOH IOL Data Inputs 10 10 20 mA b0 6 mA Clock Pulse Input (Active Rising Edge) 10 10 20 mA b0 6 mA TRI-STATE Output Enable Input (Active LOW) 10 10 20 mA b0 6 mA TRI-STATE Outputs 150 40 (33 3) b3 mA 24 mA (20 mA) Functional Description The ’F374 consists of eight edge-triggered flip-flops with individual D-type inputs and TRI-STATE true outputs The buffered clock and buffered Output Enable are common to all flip-flops The eight flip-flops will store the state of their individual D inputs that meet the setup and hold time requirements on the LOW-to-HIGH Clock (CP) transition With the Output Enable (OE) LOW the contents of the eight flipflops are available at the outputs When the OE is HIGH the outputs go to the high impedance state Operation of the OE input does not affected the state of the flip-flops Truth Table Inputs Dn H L X CP L L X OE L L H Internal Register H L X Output On H L Z H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial Z e High Impedance L e LOW-to-HIGH Clock Transition Logic Diagram TL F 9524 – 5 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays 2 Absolute Maximum Ratings (Note 1) If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias Plastic VCC Pin Potential to Ground Pin b 65 C to a 150 C b 55 C to a 125 C b 55 C to a 175 C b 55 C to a 150 C ESD Last Passing Voltage (Min) 4000V Note 1 Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired Functional operation under these conditions is not implied Note 2 Either voltage limit or current limit is sufficient to protect inputs Recommended Operating Conditions Free Air Ambient Temperature Military Commercial Supply Voltage Military Commercial b 55 C to a 125 C 0 C to a 70 C a 4 5V to a 5 5V a 4 5V to a 5 5V b 0 5V to a 7 0V b 0 5V to a 7 0V Input Voltage (Note 2) b 30 mA to a 5 0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0 5V to VCC Standard Output b 0 5V to a 5 5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) DC Electrical Characteristics Symbol VIH VIL VCD VOH Parameter Min Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output HIGH Voltage 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 74F 5% VCC 74F 5% VCC 54F 10% VCC 74F 10% VCC 54F 74F 54F 74F 54F 74F 74F 74F 4 75 3 75 b0 6 54F 74F Typ Max Units V 08 b1 2 VCC Conditions Recognized as a HIGH Signal Recognized as a LOW Signal 20 V V Min IIN e b18 mA IOH IOH IOH IOH IOH IOH e e e e e e b 1 mA b 3 mA b 1 mA b 3 mA b 1 mA b 3 mA 25 24 25 24 27 27 05 05 20 0 50 100 70 250 50 V Min VOL IIH IBVI ICEX VID IOD IIL IOZH IOZL IOS IZZ ICCZ Output LOW Voltage Input HIGH Current Input HIGH Current Breakdown Test Output HIGH Leakage Current Input Leakage Test Output Leakage Circuit Current Input LOW Current V mA mA mA V mA mA mA mA mA mA mA Min Max Max Max 00 00 Max Max Max Max 0 0V Max IOL e 20 mA IOL e 24 mA VIN e 2 7V VIN e 7 0V VOUT e VCC IID e 1 9 mA All Other Pins Grounded VIOD e 150 mV All Other Pins Grounded VIN e 0 5V VOUT e 2 7V VOUT e 0 5V VOUT e 0V VOUT e 5 25V VO e HIGH Z Output Leakage Current Output Leakage Current Output Short-Circuit Current Bus Drainage Test Power Supply Current 55 b 60 50 b 50 b 150 500 86 3 AC Electrical Characteristics 74F Symbol Parameter Min fmax tPLH tPHL tPZH tPZL tPHZ tPLZ Maximum Clock Frequency Propagation Delay CP to On Output Enable Time Output Disable Time 100 40 40 20 20 20 15 TA e a 25 C VCC e a 5 0V CL e 50 pF Typ 140 65 65 90 58 53 43 85 85 11 5 75 70 55 Max 54F TA VCC e Mil CL e 50 pF Min 60 40 40 20 20 20 15 10 5 11 0 14 0 10 0 80 75 Max 74F TA VCC e Com CL e 50 pF Min 70 40 40 20 20 20 15 10 0 10 0 12 5 85 80 65 Max MHz ns Units ns AC Operating Requirements 74F Symbol Parameter TA e a 25 C VCC e a 5 0V Min ts(H) ts(L) th(H) th(L) tw(H) tw(L) Setup Time HIGH or LOW Dn to CP Hold Time HIGH or LOW Dn to CP CP Pulse Width HIGH or LOW 20 20 20 20 70 60 Max 54F TA VCC e Mil Min 25 20 20 25 70 60 Max 74F TA VCC e Com Min 20 20 20 20 70 60 ns Max Units ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F Temperature Range Family 74F e Commercial 54F e Military Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ MSA e Shrink Small Outline (EIAJ SSOP) 374 S C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13 reel Temperature Range C e Commercial (0 C to a 70 C) M e Military (b55 C to a 125 C) NOTE Not required for MSA package code 4 Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 20-Lead Ceramic Dual-In-Line Package (D) NS Package Number J20A 5 Physical Dimensions inches (millimeters) (Continued) 20-Lead (0 300 Wide) Molded Small Outline Package JEDEC (S) NS Package Number M20B 20-Lead (0 300 Wide) Molded Small Outline Package EIAJ (SJ) NS Package Number M20D 6 Physical Dimensions inches (millimeters) (Continued) 20-Lead (0 300 Wide) Molded Shrink Small Outline Package EIAJ Type II (MSA) NS Package Number MSA20 20-Lead (0 300 Wide) Molded Dual-In-Line Package (P) NS Package Number N20A 7 54F 74F374 Octal D-Type Flip-Flop with TRI-STATE Outputs Physical Dimensions inches (millimeters) (Continued) 20-Lead Ceramic Flatpak (F) NS Package Number W20A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user National Semiconductor Corporation 2900 Semiconductor Drive P O Box 58090 Santa Clara CA 95052-8090 Tel 1(800) 272-9959 TWX (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str 10 D-82256 F4urstenfeldbruck Germany Tel (81-41) 35-0 Telex 527649 Fax (81-41) 35-1 National Semiconductor Japan Ltd Sumitomo Chemical Engineering Center Bldg 7F 1-7-1 Nakase Mihama-Ku Chiba-City Ciba Prefecture 261 Tel (043) 299-2300 Fax (043) 299-2500 2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness National Semiconductor Hong Kong Ltd 13th Floor Straight Block Ocean Centre 5 Canton Rd Tsimshatsui Kowloon Hong Kong Tel (852) 2737-1600 Fax (852) 2736-9960 National Semiconductores Do Brazil Ltda Rue Deputado Lacorda Franco 120-3A Sao Paulo-SP Brazil 05418-000 Tel (55-11) 212-5066 Telex 391-1131931 NSBR BR Fax (55-11) 212-1181 National Semiconductor (Australia) Pty Ltd Building 16 Business Park Drive Monash Business Park Nottinghill Melbourne Victoria 3168 Australia Tel (3) 558-9999 Fax (3) 558-9998 National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications