54F38LM

54F 74F38 Quad Two-Input NAND Buffer (Open Collector) December 1994 54F 74F38 Quad Two-Input NAND Buffer (Open Collector) General Description This device contains four independent gates each of which performs the logic NAND function The open-collector outputs require external pull-up resistors for proper logical operation Commercial 74F38PC Military Package Number N14E Package Description 14-Lead (0 300 Wide) Molded Dual-In-Line 14-Lead Ceramic Dual-In-Line 14-Lead (0 150 Wide) Molded Small Outline JEDEC 14-Lead (0 300 Wide) Molded Small Outline EIAJ 14-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C 54F38DM (Note 2) 74F38SC (Note 1) 74F38SJ (Note 1) 54F38FM (Note 2) 54F38LM (Note 2) J14A M14A M14D W14B E20A Note 1 Devices also available in 13 reel Use suffix e SCX and SJX Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB Logic Symbol IEEE IEC Connection Diagrams Pin Assignment for DIP SOIC and Flatpak Pin Assignment for LCC TL F 9465–3 TL F 9465 – 1 TL F 9465 – 2 TRI-STATE is a registered trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation TL F 9465 RRD-B30M75 Printed in U S A Unit Loading Fan Out 54F 74F Pin Names Description UL HIGH LOW OC 10 20 106 6 (80) Input IIH IIL Output IOH IOL 20 mA b1 2 mA OC 64 mA (48 mA) An Bn On OC e Open Collector Inputs Outputs Function Table Inputs A L L H H B L H L H Output O H H H L H e HIGH Voltage Level L e LOW Voltage Level 2 Absolute Maximum Ratings (Note 1) If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias Plastic VCC Pin Potential to Ground Pin b 65 C to a 150 b 55 C to a 125 b 55 C to a 175 b 55 C to a 150 Recommended Operating Conditions Free Air Ambient Temperature Military Commercial Supply Voltage Military Commercial b 55 C to a 125 C 0 C to a 70 C a 4 5V to a 5 5V a 4 5V to a 5 5V C C C C b 0 5V to a 7 0V b 0 5V to a 7 0V Input Voltage (Note 2) b 30 mA to a 5 0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0 5V to VCC Standard Output b 0 5V to a 5 5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) Note 1 Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired Functional operation under these conditions is not implied Note 2 Either voltage limit or current limit is sufficient to protect inputs DC Electrical Characteristics Symbol VIH VIL VCD VOL IIH IBVI VID IOD IIL IOHC ICCH ICCL Parameter Min Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output LOW Voltage Input HIGH Current Input HIGH Current Breakdown Test Input Leakage Test Output Leakage Circuit Current Input LOW Current Open Collector Output OFF Leakage Test Power Supply Current Power Supply Current 21 26 0 54F 10% VCC 74F 10% VCC 54F 74F 54F 74F 74F 74F 4 75 3 75 b1 2 54F 74F Typ Max Units V 08 b1 2 VCC Conditions Recognized as a HIGH Signal Recognized as a LOW Signal 20 V V V mA mA V mA mA mA mA mA Min Min Max Max 00 00 Max Min Max Max IIN e b18 mA IOL e 48 mA IOL e 64 mA VIN e 2 7V VIN e 7 0V IID e 1 9 mA All Other Pins Grounded VIOD e 150 mV All Other Pins Grounded VIN e 0 5V VOUT e VCC VO e HIGH VO e LOW 0 55 0 55 20 0 50 100 70 250 70 30 0 3 AC Electrical Characteristics 74F Symbol Parameter Min tPLH tPHL Propagation Delay An Bn to On 65 15 TA e a 25 C VCC e a 5 0V CL e 50 pF Typ 97 21 Max 12 5 50 54F TA VCC e Mil CL e 50 pF Min 65 10 Max 14 5 55 74F TA VCC e Com CL e 50 pF Min 65 15 Max 13 0 55 ns Units Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F Temperature Range Family 74F e Commercial 54F e Military Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ 38 S C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13 reels Temperature Range C e Commercial (0 C to a 70 C) M e Military (b55 C to a 125 C) 4 Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 5 Physical Dimensions inches (millimeters) (Continued) 14-Lead Ceramic Dual-In-Line Package (D) NS Package Number J14A 14-Lead (0 150 Wide) Molded Small Outline Package JEDEC (S) NS Package Number M14A 6 Physical Dimensions inches (millimeters) (Continued) 14-Lead (0 300 Wide) Molded Small Outline Package EIAJ (SJ) NS Package Number M14D 14-Lead (0 300 Wide) Molded Dual-In-Line Package (P) NS Package Number N14A 7 54F 74F38 Quad Two-Input NAND Buffer (Open Collector) Physical Dimensions inches (millimeters) (Continued) 14-Lead Ceramic Flatpak (F) NS Package Number W14B LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user National Semiconductor Corporation 2900 Semiconductor Drive P O Box 58090 Santa Clara CA 95052-8090 Tel 1(800) 272-9959 TWX (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str 10 D-82256 F4urstenfeldbruck Germany Tel (81-41) 35-0 Telex 527649 Fax (81-41) 35-1 National Semiconductor Japan Ltd Sumitomo Chemical Engineering Center Bldg 7F 1-7-1 Nakase Mihama-Ku Chiba-City Ciba Prefecture 261 Tel (043) 299-2300 Fax (043) 299-2500 2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness National Semiconductor Hong Kong Ltd 13th Floor Straight Block Ocean Centre 5 Canton Rd Tsimshatsui Kowloon Hong Kong Tel (852) 2737-1600 Fax (852) 2736-9960 National Semiconductores Do Brazil Ltda Rue Deputado Lacorda Franco 120-3A Sao Paulo-SP Brazil 05418-000 Tel (55-11) 212-5066 Telex 391-1131931 NSBR BR Fax (55-11) 212-1181 National Semiconductor (Australia) Pty Ltd Building 16 Business Park Drive Monash Business Park Nottinghill Melbourne Victoria 3168 Australia Tel (3) 558-9999 Fax (3) 558-9998 National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications