54F541LM

54F 74F540  54F 74F541 Octal Buffer Line Driver with TRI-STATE Outputs May 1995 54F 74F540  54F 74F541 Octal Buffer Line Driver with TRI-STATE Outputs General Description The ’F540 and ’F541 are similar in function to the ’F240 and ’F244 respectively except that the inputs and outputs are on opposite sides of the package (see Connection Diagrams) This pinout arrangement makes these devices especially useful as output ports for microprocessors allowing ease of layout and greater PC board density Features Y Y TRI-STATE outputs drive bus lines Inputs and outputs opposite side of package allowing easier interface to microprocessors Commercial 74F540PC Military Package Number N20A Package Description 20-Lead (0 300 Wide) Molded Dual-In-Line 20-Lead Ceramic Dual-In-Line 20-Lead (0 300 Wide) Molded Small Outline JEDEC 20-Lead (0 300 Wide) Molded Small Outline EIAJ 20-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C 20-Lead (0 300 Wide) Molded Dual-In-Line 20-Lead Ceramic Dual-In-Line 20-Lead (0 300 Wide) Molded Small Outline JEDEC 20-Lead (0 300 Wide) Molded Small Outline EIAJ 20-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C 54F540DM (Note 2) 74F540SC (Note 1) 74F540SJ (Note 1) 54F540FM (Note 2) 54F540LM (Note 2) 74F541PC 54F541DM (Note 2) 74F541SC (Note 1) 74F541SJ (Note 1) 54F541FM (Note 2) 54F541LM (Note 2) J20A M20B M20D W20A E20A N20A J20A M20B M20D W20A E20A Note 1 Devices also available in 13 reel Use suffix e SCX and SJX Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB Connection Diagrams Pin Assignment for DIP SOIC and Flatpak ’F540 Pin Assignment for LCC TL F 9553 – 2 TL F 9553 – 1 TRI-STATE is a registered trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation TL F 9553 RRD-B30M75 Printed in U S A Connection Diagrams (Continued) ’F541 TL F 9553 – 5 TL F 9553–4 Unit Loading Fan Out 54F 74F Pin Names Description UL HIGH LOW 10 10 10 10 600 106 6 (80) Input IIH IIL Output IOH IOL 20 mA b0 6 mA 20 mA b0 6 mA b 12 mA 64 mA (48 mA) OE1 OE2 In On On TRI-STATE Output Enable Input (Active LOW) Inputs Outputs Truth Table Inputs OE1 L H X L OE2 L X H L I H X X L Outputs ’F540 L Z Z H ’F541 H Z Z L H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial Z e High Impedance Logic Diagrams IEEE IEC ’F540 IEEE IEC ’F541 TL F 9553–3 TL F 9553 – 6 2 Absolute Maximum Ratings (Note 1) If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias Plastic VCC Pin Potential to Ground Pin b 65 C to a 150 b 55 C to a 125 b 55 C to a 175 b 55 C to a 150 Recommended Operating Conditions Free Air Ambient Temperature Military Commercial Supply Voltage Military Commercial b 55 C to a 125 C 0 C to a 70 C a 4 5V to a 5 5V a 4 5V to a 5 5V C C C C b 0 5V to a 7 0V b 0 5V to a 7 0V Input Voltage (Note 2) b 30 mA to a 5 0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0 5V to VCC Standard Output b 0 5V to a 5 5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) Note 1 Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired Functional operation under these conditions is not implied Note 2 Either voltage limit or current limit is sufficient to protect inputs DC Electrical Characteristics Symbol VIH VIL VCD VOH Parameter Min Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output HIGH Voltage 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 74F 5% VCC 54F 10% VCC 74F 10% VCC 54F 74F 54F 74F 54F 74F 74F 74F 4 75 3 75 b0 6 54F 74F Typ Max Units V 08 b1 2 VCC Conditions Recognized as a HIGH Signal Recognized as a LOW Signal 20 V V Min IIN e b18 mA IOH IOH IOH IOH IOH e e e e e b 3 mA b 12 mA b 3 mA b 15 mA b 3 mA 24 20 24 20 27 0 55 0 55 20 0 50 100 70 250 50 V Min VOL IIH IBVI ICEX VID IOD IIL IOZH IOZL IOS IZZ Output LOW Voltage Input HIGH Current Input HIGH Current Breakdown Test Output HIGH Leakage Current Input Leakage Test Output Leakage Circuit Current Input LOW Current V mA mA mA V mA mA mA mA mA mA Min Max Max Max 00 00 Max Max Max Max 0 0V IOL e 48 mA IOL e 64 mA VIN e 2 7V VIN e 7 0V VOUT e VCC IID e 1 9 mA All Other Pins Grounded VIOD e 150 mV All Other Pins Grounded VIN e 0 5V VOUT e 2 7V VOUT e 0 5V VOUT e 0V VOUT e 5 25V Output Leakage Current Output Leakage Current Output Short-Circuit Current Bus Drainage Test b 100 50 b 50 b 225 500 3 DC Electrical Characteristics Symbol ICCH ICCL ICCZ ICCH ICCL ICCZ Parameter (Continued) 54F 74F Min Typ 11 53 31 26 55 31 Max 20 75 45 35 75 55 mA mA mA mA mA mA Max Max Max Max Max Max VO e HIGH VO e LOW VO e HIGH Z VO e HIGH VO e LOW VO e HIGH Z Units VCC Conditions Power Supply Current (’F540) Power Supply Current (’F540) Power Supply Current (’F540) Power Supply Current (’F541) Power Supply Current (’F541) Power Supply Current (’F541) AC Electrical Characteristics 74F Symbol Parameter Min tPLH tPHL tPZH tPZL tPHZ tPLZ tPLH tPHL tPZH tPZL tPHZ tPLZ Propagation Delay Data to Output (’F540) Output Enable Time (’F540) Output Disable Time (’F540) Propagation Delay Data to Output (’F541) Output Enable Time (’F541) Output Disable Time (’F541) 15 10 25 35 15 10 15 15 30 35 15 15 TA e a 25 C VCC e a 5 0V CL e 50 pF Typ 30 20 49 58 34 25 33 27 58 61 34 29 Max 50 40 80 10 0 60 55 55 55 80 85 60 55 54F TA VCC e Mil CL e 50 pF Min 10 10 25 35 15 10 Max 60 45 90 11 0 70 75 74F TA VCC e Com CL e 50 pF Min 10 10 25 35 15 10 15 15 25 30 15 15 Max 55 40 85 10 5 65 60 60 60 95 95 65 60 ns ns Units ns ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F Temperature Range Family 74F e Commercial 54F e Military Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ 540 541 S C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13 reel Temperature Range C e Commercial (0 C to a 70 C) M e Military (b55 C to a 125 C) 4 Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 5 Physical Dimensions inches (millimeters) (Continued) 20-Lead Ceramic Dual-In-Lead Package (D) NS Package Number J20A 20-Lead (0 300 Wide) Molded Small Outline Package JEDEC (S) NS Package Number M20B 6 Physical Dimensions inches (millimeters) (Continued) 20-Lead (0 300 Wide) Molded Small Outline Package EIAJ (SJ) NS Package Number M20D 20-Lead (0 300 Wide) Molded Dual-In-Line Package (P) NS Package Number N20A 7 54F 74F540  54F 74F541 Octal Buffer Line Driver with TRI-STATE Outputs Physical Dimensions inches (millimeters) (Continued) 20-Lead Ceramic Flatpak (F) NS Package Number W20A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user National Semiconductor Corporation 2900 Semiconductor Drive P O Box 58090 Santa Clara CA 95052-8090 Tel 1(800) 272-9959 TWX (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str 10 D-82256 F4urstenfeldbruck Germany Tel (81-41) 35-0 Telex 527649 Fax (81-41) 35-1 National Semiconductor Japan Ltd Sumitomo Chemical Engineering Center Bldg 7F 1-7-1 Nakase Mihama-Ku Chiba-City Ciba Prefecture 261 Tel (043) 299-2300 Fax (043) 299-2500 2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness National Semiconductor Hong Kong Ltd 13th Floor Straight Block Ocean Centre 5 Canton Rd Tsimshatsui Kowloon Hong Kong Tel (852) 2737-1600 Fax (852) 2736-9960 National Semiconductores Do Brazil Ltda Rue Deputado Lacorda Franco 120-3A Sao Paulo-SP Brazil 05418-000 Tel (55-11) 212-5066 Telex 391-1131931 NSBR BR Fax (55-11) 212-1181 National Semiconductor (Australia) Pty Ltd Building 16 Business Park Drive Monash Business Park Nottinghill Melbourne Victoria 3168 Australia Tel (3) 558-9999 Fax (3) 558-9998 National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications