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54F823FM

54F823FM

  • 厂商:

    NSC

  • 封装:

  • 描述:

    54F823FM - 9-Bit D-Type Flip-Flop - National Semiconductor

  • 数据手册
  • 价格&库存
54F823FM 数据手册
54F 74F823 9-Bit D-Type Flip-Flop December 1994 54F 74F823 9-Bit D-Type Flip-Flop General Description The ’F823 is a 9-bit buffered register It features Clock Enable and Clear which are ideal for parity bus interfacing in high performance microprogramming systems The ’F823 is functionally and pin compatible with AMD’s Am29823 Features Y Y Y TRI-STATE outputs Clock Enable and Clear Direct replacement for AMD’s Am29823 Commercial 74F823SPC Military Package Number N24C Package Description 24-Lead (0 300 Wide) Molded Dual-In-Line 24-Lead (0 300 Wide) Ceramic Dual-In-Line 24-Lead (0 300 Wide) Molded Small Outline JEDEC 24-Lead Cerpack 24-Lead Ceramic Chip Carrier Type C 54F823SDM (Note 2) 74F823SC (Note 1) 54F823FM (Note 2) 54F823LM (Note 2) Note 1 Devices also available in 13 reel Use suffix e SCX J24F M24B W24C E28A Note 2 Military grade device with environmental and burn-in processing Use suffix e SDMQB FMQB and LMQB Logic Symbols Connection Diagrams Pin Assignment for DIP SOIC and Flatpak Pin Assignment for LCC TL F 9596–2 IEEE IEC TL F 9596 – 4 TL F 9596 – 3 TL F 9596–1 TRI-STATE is a registered trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation TL F 9596 RRD-B30M75 Printed in U S A Unit Loading Fan Out 54F 74F Pin Names Description UL HIGH LOW 10 10 10 10 10 10 10 20 10 10 150 40 (33 3) Input IIH IIL Output IOH IOL 20 mA b0 6 mA 20 mA b0 6 mA 20 mA b0 6 mA 20 mA b1 2 mA 20 mA b0 6 mA b 3 mA 24 mA (20 mA) D0 – D8 OE CLR CP EN O0 – O8 Data Inputs Output Enable Input Clear Clock Input Clock Enable TRI-STATE Outputs 2 Functional Description The ’F823 device consists of nine D-type edge-triggered flip-flops It has TRI-STATE true outputs and is organized in broadside pinning The buffered Clock (CP) and buffered Output Enable (OE) are common to all flip-flops The flipflops will store the state of their individual D inputs that meet the setup and hold times requirements on the LOW-to-HIGH CP transition With the OE LOW the contents of the flipflops are available at the outputs When the OE is HIGH the outputs go to the high impedance state Operation of the OE input does not affect the state of the flip-flops In addition to the Clock and Output Enable pins the ’F823 has Clear (CLR) and Clock Enable (EN) pins When the CLR is LOW and the OE is LOW the outputs are LOW When CLR is HIGH data can be entered into the flipflops When EN is LOW data on the inputs is transferred to the outputs on the LOW to HIGH clock transition When the EN is HIGH the outputs do not change state regardless of the data or clock inputs transitions This device is ideal for parity bus interfacing in high performance systems Function Table Inputs OE H H H L H L H H L L L L CLR H H H H L L H H H H H H EN L L H H X X L L L L L L CP H L X X X X L L L L H L D X X X X X X H H L H X X Internal Q NC NC NC NC H H H L H L NC NC Output O Z Z Z NC Z L Z Z L H NC NC Hold Hold Hold Hold Clear Clear Load Load Data Available Data Available No Change in Data No Change in Data Function L e LOW Voltage Level H e HIGH Voltage Level X e Immaterial Z e High Impedance L e LOW-to-HIGH Transition NC e No Change Logic Diagram TL F 9596 – 5 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays 3 Absolute Maximum Ratings (Note 1) If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias Plastic VCC Pin Potential to Ground Pin b 65 C to a 150 b 55 C to a 125 b 55 C to a 175 b 55 C to a 150 Note 1 Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired Functional operation under these conditions is not implied Note 2 Either voltage limit or current limit is sufficient to protect inputs C C C C Recommended Operating Conditions Free Air Ambient Temperature Military Commercial Supply Voltage Military Commercial b 55 C to a 125 C 0 C to a 70 C a 4 5V to a 5 5V a 4 5V to a 5 5V b 0 5V to a 7 0V b 0 5V to a 7 0V Input Voltage (Note 2) b 30 mA to a 5 0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0 5V to VCC Standard Output b 0 5V to a 5 5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) DC Electrical Characteristics Symbol VIH VIL VCD VOH Output HIGH Voltage Parameter Min Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 74F 5% VCC 74F 5% VCC 54F 10% VCC 74F 10% VCC 54F 74F 54F 74F 54F 74F 74F 74F 4 75 3 75 b0 6 b1 2 54F 74F Typ Max Units V 08 b1 2 VCC Conditions Recognized as a HIGH Signal Recognized as a LOW Signal 20 V V Min IIN e b18 mA IOH IOH IOH IOH IOH IOH e e e e e e b 1 mA b 3 mA b 1 mA b 3 mA b 1 mA b 3 mA 25 24 25 24 27 27 05 05 20 0 50 100 70 250 50 V Min VOL IIH IBVI ICEX VID IOD IIL IOZH IOZL IOS IZZ ICCZ Output LOW Voltage Input HIGH Current Input HIGH Current Breakdown Test Output HIGH Leakage Current Input Leakage Test Output Leakage Circuit Current Input LOW Current V mA mA mA V mA mA mA mA mA mA mA mA Min Max Max Max 00 00 Max Max Max Max Max 0 0V Max IOL e 20 mA IOL e 24 mA VIN e 2 7V VIN e 7 0V VOUT e VCC IID e 1 9 mA All Other Pins Grounded VIOD e 150 mV All Other Pins Grounded VIN e 0 5V (OE CLR EN) VIN e 0 5V (CP) VOUT e 2 7V VOUT e 0 5V VOUT e 0V VOUT e 5 25V VO e HIGH Z Output Leakage Current Output Leakage Current Output Short-Circuit Current Buss Drainage Test Power Supply Current 75 b 60 50 b 50 b 150 500 100 4 AC Electrical Characteristics 74F Symbol Parameter Min fmax tPLH tPHL tPHL tPZH tPZL tPHZ tPLZ Maximum Clock Frequency Propagation Delay CP to On Propagation Delay CLR to On Output Enable Time OE to On Output Disable Time OE to On 100 20 20 40 20 20 15 15 TA e a 25 C VCC e a 5 0V CL e 50 pF Typ 160 56 52 71 58 55 29 27 95 95 12 0 10 5 10 5 70 70 Max 54F TA VCC e Mil CL e 50 pF Min 60 20 20 40 20 20 10 10 10 5 10 5 13 0 13 0 13 0 75 75 Max 74F TA VCC e Com CL e 50 pF Min 70 20 20 40 20 20 15 15 10 5 10 5 13 0 11 5 11 5 75 75 Max MHz ns ns Units ns AC Operating Requirements 74F Symbol Parameter TA e a 25 C VCC e a 5 0V Min ts(H) ts(L) th(H) th(L) ts(H) ts(L) th(H) th(L) tw(H) tw(L) tw(L) trec Setup Time HIGH or LOW Dn to CP Hold Time HIGH or LOW Dn to CP Setup Time HIGH or LOW EN to CP Hold Time HIGH or LOW EN to CP CP Pulse Width HIGH or LOW CLR Pulse Width LOW CLR Recovery Time 25 25 25 25 45 25 20 0 50 50 50 50 Max 54F TA VCC e Mil Min 40 40 25 25 50 30 30 10 60 60 50 50 Max 74F TA VCC e Com Min 30 30 25 25 50 30 20 0 60 60 50 50 ns ns ns Max Units ns ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F Temperature Range Family 74F e Commercial 54F e Military Device Type Package Code SP e Slim Plastic DIP SD e Slim Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline (SOIC) 823 S C X Special Variations QB e Military grade device with environmental and burn-in processing Temperature Range C e Commercial (0 C to a 70 C) M e Military (b55 C to a 125 C) 5 Physical Dimensions inches (millimeters) 28-Lead Ceramic Leadless Chip Carrier Type C (L) NS Package Number E28A 24-Lead (0 300 Wide) Ceramic Dual-In-Line Package (SD) NS Package Number J24F 6 Physical Dimensions inches (millimeters) (Continued) 24-Lead (0 300 Wide) Molded Small Outline Package JEDEC (S) NS Package Number M24B 24-Lead (0 300 Wide) Molded Dual-In-Line Package (SP) NS Package Number N24C 7 54F 74F823 9-Bit D-Type Flip-Flop Physical Dimensions inches (millimeters) (Continued) 24-Lead Ceramic Flatpak (F) NS Package Number W24C LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user National Semiconductor Corporation 2900 Semiconductor Drive P O Box 58090 Santa Clara CA 95052-8090 Tel 1(800) 272-9959 TWX (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str 10 D-82256 F4urstenfeldbruck Germany Tel (81-41) 35-0 Telex 527649 Fax (81-41) 35-1 National Semiconductor Japan Ltd Sumitomo Chemical Engineering Center Bldg 7F 1-7-1 Nakase Mihama-Ku Chiba-City Ciba Prefecture 261 Tel (043) 299-2300 Fax (043) 299-2500 2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness National Semiconductor Hong Kong Ltd 13th Floor Straight Block Ocean Centre 5 Canton Rd Tsimshatsui Kowloon Hong Kong Tel (852) 2737-1600 Fax (852) 2736-9960 National Semiconductores Do Brazil Ltda Rue Deputado Lacorda Franco 120-3A Sao Paulo-SP Brazil 05418-000 Tel (55-11) 212-5066 Telex 391-1131931 NSBR BR Fax (55-11) 212-1181 National Semiconductor (Australia) Pty Ltd Building 16 Business Park Drive Monash Business Park Nottinghill Melbourne Victoria 3168 Australia Tel (3) 558-9999 Fax (3) 558-9998 National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications
54F823FM 价格&库存

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