74F174SC

54F 74F174 Hex D Flip-Flop with Master Reset November 1994 54F 74F174 Hex D Flip-Flop with Master Reset General Description The ’F174 is a high-speed hex D flip-flop The device is used primarily as a 6-bit edge-triggered storage register The information on the D inputs is transferred to storage during the LOW-to-HIGH clock transition The device has a Master Reset to simultaneously clear all flip-flops Features Y Y Y Y Edge-triggered D-type inputs Buffered positive edge-triggered clock Asynchronous common reset Guaranteed 4000V minimum ESD protection Commercial 74F174PC Military Package Number N16E Package Description 16-Lead (0 300 Wide) Molded Dual-In-Line 16-Lead Ceramic Dual-In-Line 16-Lead (0 150 Wide) Molded Small Outline JEDEC 16-Lead (0 300 Wide) Molded Small Outline EIAJ 16-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C 54F174DM (Note 2) 74F174SC (Note 1) 74F174SJ (Note 1) 54F174FM (Note 2) 54F174LM (Note 2) J16A M16A M16D W16A E20A Note 1 Devices also available in 13 reel Use Suffix e SCX and SJX Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB Logic Symbols Connection Diagrams Pin Assignment for DIP SOIC and Flatpak Pin Assignment for LCC TL F 9489–3 TL F 9489 – 1 TL F 9489 – 2 IEEE IEC TL F 9489–5 TRI-STATE is a registered trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation TL F 9489 RRD-B30M75 Printed in U S A Unit Loading Fan Out 54F 74F Pin Names Description UL HIGH LOW 10 10 10 10 10 10 50 33 3 Input IIH IIL Output IOH IOL 20 mA b0 6 mA 20 mA b0 6 mA 20 mA b0 6 mA b 1 mA 20 mA D0 – D5 CP MR Q0 – Q5 Data Inputs Clock Pulse Input (Active Rising Edge) Master Reset Input (Active LOW) Outputs Functional Description The ’F174 consists of six edge-triggered D flip-flops with individual D inputs and Q outputs The Clock (CP) and Master Reset (MR) are common to all flip-flops Each D input’s state is transferred to the corresponding flip-flop’s output following the LOW-to-HIGH Clock (CP) transition A LOW input to the Master Reset (MR) will force all outputs LOW independent of Clock or Data inputs The ’F174 is useful for applications where the true output only is required and the Clock and Master Reset are common to all storage elements Truth Table Inputs MR L H H CP X L L Dn X H L Outputs Qn L H L H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial L e LOW-to-HIGH Clock Transition Logic Diagram TL F 9489 – 4 Please note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays 2 Absolute Maximum Ratings (Note 1) If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias Plastic VCC Pin Potential to Ground Pin b 65 C to a 150 b 55 C to a 125 b 55 C to a 175 b 55 C to a 150 Recommended Operating Conditions Free Air Ambient Temperature Military Commercial Supply Voltage Military Commercial b 55 C to a 125 C 0 C to a 70 C a 4 5V to a 5 5V a 4 5V to a 5 5V C C C C b 0 5V to a 7 0V b 0 5V to a 7 0V Input Voltage (Note 2) b 30 mA to a 5 0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0 5V to VCC Standard Output b 0 5V to a 5 5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) ESD Last Passing Voltage (Min) 4000V Note 1 Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired Functional operation under these conditions is not implied Note 2 Either voltage limit or current limit is sufficient to protect inputs DC Electrical Characteristics Symbol VIH VIL VCD VOH Parameter Min Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output HIGH Voltage Output LOW Voltage Input HIGH Current Input HIGH Current Breakdown Test Output HIGH Leakage Current Input Leakage Test Output Leakage Circuit Current Input LOW Current Output Short-Circuit Current Power Supply Current Power Supply Current b 60 54F 74F Typ Max Units V 08 b1 2 VCC Conditions Recognized as a HIGH Signal Recognized as a LOW Signal 20 V V V Min Min IIN e b18 mA IOH e b1 mA IOH e b1 mA IOH e b1 mA IOL e 20 mA IOL e 20 mA VIN e 2 7V VIN e 7 0V VOUT e VCC IID e 1 9 mA All Other Pins Grounded VIOD e 150 mV All Other Pins Grounded VIN e 0 5V VOUT e 0V CP e L Dn e MR e HIGH VO e LOW 54F 10% VCC 74F 10% VCC 74F 5% VCC 54F 10% VCC 74F 10% VCC 54F 74F 54F 74F 54F 74F 74F 74F 25 25 27 05 05 20 0 50 100 70 250 50 4 75 3 75 b0 6 b 150 VOL IIH IBVI ICEX VID IOD IIL IOS ICCH ICCL V mA mA mA V mA mA mA mA mA Min Max Max Max 00 00 Max Max Max Max 30 30 45 45 3 AC Electrical Characteristics 74F Symbol Parameter Min fmax tPLH tPHL tPHL Maximum Clock Frequency Propagation Delay CP to Qn Propagation Delay MR to Qn 80 35 40 50 55 70 10 0 80 10 0 14 0 TA e a 25 C VCC e a 5 0V CL e 50 pF Typ Max 54F TA VCC e Mil CL e 50 pF Min 70 30 40 50 10 0 12 0 16 0 Max 74F TA VCC e Com CL e 50 pF Min 80 35 40 50 90 11 0 15 0 Max MHz ns ns Units AC Operating Requirements 74F Symbol Parameter TA e a 25 C VCC e a 5 0V Min ts(H) ts(L) th(H) th(L) tw(H) tw(L) tw(L) trec Setup Time HIGH or LOW Dn to CP Hold Time HIGH or LOW Dn to CP CP Pulse Width HIGH or LOW MR Pulse Width LOW Recovery Time MR to CP 48 40 0 0 40 60 50 50 Max 54F TA VCC e Mil Min 50 50 20 20 50 75 65 60 Max 74F TA VCC e Com Min 48 40 0 0 40 60 50 50 ns ns Max Units ns 4 Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F Temperature Range Family 74F e Commercial 54F e Military Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SS e Small Outline SOIC EIAJ 174 S C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13 reel Temperature Range C e Commercial (0 C to a 70 C) M e Military (b55 C to a 125 C) Physical Dimensions inches (millimeters) 20-Terminal Ceramic Leadless Chip Carrier (L) NS Package Number E20A 5 Physical Dimensions inches (millimeters) (Continued) 16-Lead Ceramic Dual-In-Line Package (D) NS Package Number J16A 16-Lead (0 150 Wide) Molded Small Outline Package JEDEC (S) NS Package Number M16A 6 Physical Dimensions inches (millimeters) (Continued) 16-Lead (0 300 Wide) Molded Small Outline Package EIAJ (SJ) NS Package Number M16D 16-Lead (0 300 Wide) Molded Dual-In-Line Package (P) NS Package Number N16E 7 54F 74F174 Hex D Flip-Flop with Master Reset Physical Dimensions inches (millimeters) (Continued) 16 Lead Ceramic Flatpak (F) NS Package Number W16A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user National Semiconductor Corporation 2900 Semiconductor Drive P O Box 58090 Santa Clara CA 95052-8090 Tel 1(800) 272-9959 TWX (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str 10 D-82256 F4urstenfeldbruck Germany Tel (81-41) 35-0 Telex 527649 Fax (81-41) 35-1 National Semiconductor Japan Ltd Sumitomo Chemical Engineering Center Bldg 7F 1-7-1 Nakase Mihama-Ku Chiba-City Ciba Prefecture 261 Tel (043) 299-2300 Fax (043) 299-2500 2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness National Semiconductor Hong Kong Ltd 13th Floor Straight Block Ocean Centre 5 Canton Rd Tsimshatsui Kowloon Hong Kong Tel (852) 2737-1600 Fax (852) 2736-9960 National Semiconductores Do Brazil Ltda Rue Deputado Lacorda Franco 120-3A Sao Paulo-SP Brazil 05418-000 Tel (55-11) 212-5066 Telex 391-1131931 NSBR BR Fax (55-11) 212-1181 National Semiconductor (Australia) Pty Ltd Building 16 Business Park Drive Monash Business Park Nottinghill Melbourne Victoria 3168 Australia Tel (3) 558-9999 Fax (3) 558-9998 National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications