54F 74F189 64-Bit Random Access Memory with TRI-STATE Outputs
August 1995
54F 74F189 64-Bit Random Access Memory with TRI-STATE Outputs
General Description
The ’F189 is a high-speed 64-bit RAM organized as a 16word by 4-bit array Address inputs are buffered to minimize loading and are fully decoded on-chip The outputs are TRISTATE and are in the high impedance state whenever the Chip Select (CS) input is HIGH The outputs are active only in the Read mode and the output data is the complement of the stored data
Features
Y Y Y Y Y
TRI-STATE outputs for data bus applications Buffered inputs minimize loading Address decoding on-chip Diode clamped inputs minimize ringing Available in SOIC (300 mil only)
Commercial 74F189PC
Military
Package Number N16E
Package Description 16-Lead (0 300 Wide) Molded Dual-In-Line 16-Lead Ceramic Dual-In-Line 16-Lead (0 150 Wide) Molded Small Outline JEDEC 16-Lead (0 300 Wide) Molded Small Outline EIAJ 16-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C
54F189DL (Note 2) 74F189SC (Note 1) 74F189SJ (Note 1) 54F189FL (Note 2) 54F189LL (Note 2)
J16A M16A M16D W16A E20A
Note 1 Devices also available in 13 reel Use suffix e SCX and SJX Note 2 Military grade device with environmental and burn-in processing Use suffix e DLQB FLQB and LLQB
Logic Symbols
Connection Diagrams
Pin Assignment for DIP SOIC and Flatpak Pin Assignment for LCC
TL F 9493–1
IEEE IEC
TL F 9493 – 2
TL F 9493 – 3
TL F 9493–4
TRI-STATE is a registered trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation
TL F 9493
RRD-B30M105 Printed in U S A
Unit Loading Fan Out
54F 74F Pin Names Description UL HIGH LOW 10 10 10 10 10 10 10 10 150 40 (33 3) Input IIH IIL Output IOH IOL 20 mA b0 6 mA 20 mA b1 2 mA 20 mA b0 6 mA 20 mA b0 6 mA b 3 0 mA 24 mA (20 mA)
A0 – A3 CS WE D0 – D3 O 0 – O3
Address Inputs Chip Select Input (Active LOW) Write Enable Input (Active LOW) Data Inputs Inverted Data Outputs Function Table
Inputs CS L L H WE L H X
Operation Write Read Inhibit
Condition of Outputs High Impedance Complement of Stored Data High Impedance
H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial
Block Diagram
TL F 9493 – 5
2
Absolute Maximum Ratings (Note 1)
If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias Plastic VCC Pin Potential to Ground Pin
b 65 C to a 150 b 55 C to a 125 b 55 C to a 175 b 55 C to a 150
Recommended Operating Conditions
Free Air Ambient Temperature Military Commercial Supply Voltage Military Commercial
b 55 C to a 125 C 0 C to a 70 C a 4 5V to a 5 5V a 4 5V to a 5 5V
C C C C
b 0 5V to a 7 0V b 0 5V to a 7 0V Input Voltage (Note 2) b 30 mA to a 5 0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0 5V to VCC Standard Output b 0 5V to a 5 5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA)
Note 1 Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired Functional operation under these conditions is not implied Note 2 Either voltage limit or current limit is sufficient to protect inputs
DC Electrical Characteristics
Symbol VIH VIL VCD VOH Parameter Min Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output HIGH Voltage 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 74F 5% VCC 74F 5% VCC 54F 10% VCC 74F 10% VCC 54F 74F 54F 74F 54F 74F 74F 74F 4 75 3 75
b0 6 b1 2
54F 74F Typ Max
Units V 08
b1 2
VCC
Conditions Recognized as a HIGH Signal Recognized as a LOW Signal
20
V V Min
IIN e b18 mA IOH IOH IOH IOH IOH IOH
e e e e e e b 1 mA b 3 mA b 1 mA b 3 mA b 1 mA b 3 mA
25 24 25 24 27 27 05 05 20 0 50 100 70 250 50
V
Min
VOL IIH IBVI ICEX VID IOD IIL IOZH IOZL IOS IZZ ICCZ
Output LOW Voltage Input HIGH Current Input HIGH Current Breakdown Test Output HIGH Leakage Current Input Leakage Test Output Leakage Circuit Current Input LOW Current
V mA mA mA V mA mA mA mA mA mA mA
Min Max Max Max 00 00 Max Max Max Max 0 0V Max
IOL e 20 mA IOL e 24 mA VIN e 2 7V VIN e 7 0V VOUT e VCC IID e 1 9 mA All Other Pins Grounded VIOD e 150 mV All Other Pins Grounded VIN e 0 5V (except CS) VIN e 0 5V (CS) VOUT e 2 7V VOUT e 0 5V VOUT e 0V VOUT e 5 25V VO e HIGH Z
Output Leakage Current Output Leakage Current Output Short-Circuit Current Bus Drainage Test Power Supply Current 37 3
b 60
50
b 50 b 150
500 55
AC Electrical Characteristics
74F Symbol Parameter Min tPLH tPHL tPZH tPZL tPHZ tPLZ tPZH tPZL tPHZ tPLZ Access Time HIGH or LOW An to On Access Time HIGH or LOW CS to On Disable Time HIGH or LOW CS to On Write Recovery Time HIGH or LOW WE to On Disable Time HIGH or LOW WE to On 10 0 80 35 50 20 30 65 65 40 50 TA e a 25 C VCC e a 5 0V CL e 50 pF Typ 18 5 13 5 60 90 40 55 15 0 11 0 70 90 Max 26 0 19 0 85 13 0 60 80 28 0 15 5 10 0 13 0 54F TA VCC e Mil CL e 50 pF Min 90 80 35 50 20 25 65 65 35 50 Max 32 0 23 0 10 5 15 0 80 10 0 37 5 17 5 12 0 15 0 74F TA VCC e Com CL e 50 pF Min 10 0 80 35 50 20 30 65 65 40 50 Max 27 0 20 0 95 14 0 70 90 29 0 16 5 11 0 14 0 ns ns ns ns ns Units
AC Operating Requirements
74F Symbol Parameter TA e a 25 C VCC e a 5 0V Min ts(H) ts(L) th(H) th(L) ts(H) ts(L) th(H) th(L) ts(L) th(L) tw(L) Setup Time HIGH or LOW An to WE Hold Time HIGH or LOW An to WE Setup Time HIGH or LOW Dn to WE Hold Time HIGH or LOW Dn to WE Setup Time LOW CS to WE Hold Time LOW CS to WE WE Pulse Width LOW 0 0 20 20 10 0 10 0 0 0 0 60 60 Max 54F TA VCC e Mil Min 0 0 20 20 11 0 11 0 20 20 0 75 15 0 Max 74F TA VCC e Com Min 0 0 20 20 10 0 10 0 0 0 0 ns 60 60 ns Max Units
ns
ns
TA e b 55 C to a 125 C
4
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F Temperature Range Family 74F e Commercial 54F e Military Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Ceramic Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ 189 S C X Special Variations X e Devices shipped in 13 reels QB e Military grade with environmental and burn-in processing shipped in tubes Temperature Range C e Commercial (0 C to a 70 C) L e Military (b40 C to a 125 C)
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A
5
Physical Dimensions inches (millimeters) (Continued)
16-Lead Ceramic Dual-In-Line Package (D) NS Package Number J16A
16-Lead (0 150 Wide) Molded Small Outline Package JEDEC (S) NS Package Number M16A
6
Physical Dimensions inches (millimeters) (Continued)
16-Lead (0 300 Wide) Molded Dual-In-Line Package (P) NS Package Number N16E
16-Lead (0 300 Wide) Molded Small Outline Package EIAJ (SJ) NS Package Number M16D
7
54F 74F189 64-Bit Random Access Memory with TRI-STATE Outputs
Physical Dimensions inches (millimeters) (Continued)
16 Lead Ceramic Flatpak (F) NS Package Number W16A
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