74F245PC

54F 74F245 Octal Bidirectional Transceiver with TRI-STATE Outputs June 1995 54F 74F245 Octal Bidirectional Transceiver with TRI-STATE Outputs General Description The ’F245 contains eight non-inverting bidirectional buffers with TRI-STATE outputs and is intended for bus-oriented applications Current sinking capability is 24 mA (20 mA Mil) at the A ports and 64 mA (48 mA Mil) at the B ports The Transmit Receive (T R) input determines the direction of data flow through the bidirectional transceiver Transmit (active HIGH) enables data from A ports to B ports Receive (active LOW) enables data from B ports to A ports The Output Enable input when HIGH disables both A and B ports by placing them in a High Z condition Features Y Y Y Y Y Non-inverting buffers Bidirectional data path A outputs sink 24 mA (20 mA Mil) B outputs sink 64 mA (48 mA Mil) Guaranteed 4000V minimum ESD protection Commercial 74F245PC Military Package Number N20A Package Description 20-Lead (0 300 Wide) Molded Dual-In-Line 20-Lead Ceramic Dual-In-Line 20-Lead (0 300 Wide) Molded Small Outline JEDEC 20-Lead (0 300 Wide) Molded Small Outline EIAJ 20-Lead Molded Shrink Small Outline EIAJ Type II 20-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C 54F245DM (Note 2) 74F245SC (Note 1) 74F245SJ (Note 1) 74F245MSA (Note 1) 54F245FM (Note 2) 54F245LM (Note 2) J20A M20B M20D MSA20 W20A E20A Note 1 Devices also available in 13 reel Use suffix e SCX SJX and MSAX Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB Logic Symbols IEEE IEC TL F 9503 – 3 TL F 9503 – 4 TRI-STATE is a registered trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation TL F 9503 RRD-B30M75 Printed in U S A Connection Diagrams Pin Assignment for DIP SOIC SSOP and Flatpak Pin Assignment for LCC TL F 9503–1 TL F 9503 – 2 Unit Loading Fan Out 54F 74F Pin Names Description UL HIGH LOW 10 20 10 20 3 5 1 083 150 40(38 3) 3 5 1 083 600 106 6(80) Input IIH IIL Output IOH IOL 20 mA b1 2 mA 20 mA b1 2 mA 70 mA b0 65 mA b 3 mA 24 mA (20 mA) 70 mA b0 65 mA b 12 mA 64 mA (48 mA) OE TR A 0 – A7 B 0 – B7 Output Enable Input (Active LOW) Transmit Receive Input Side A Inputs or TRI-STATE Outputs Side B Inputs or TRI-STATE Outputs Truth Table Inputs OE L L H H e HIGH Voltage Level L e LOW Voltage Level X e Immaterial Output TR L H X Bus B Data to Bus A Bus A Data to Bus B High Z State 2 Absolute Maximum Ratings (Note 1) If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias Plastic VCC Pin Potential to Ground Pin Input Voltage (Note 2) Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) Standard Output TRI-STATE Output b 65 C to a 150 C b 55 C to a 125 C b 55 C to a 175 C b 55 C to a 150 C b 0 5V to a 7 0V b 0 5V to a 7 0V b 30 mA to a 5 0 mA Current Applied to Output in LOW State (Max) ESD Last Passing Voltage (Min) twice the rated IOL (mA) 4000V Note 1 Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired Functional operation under these conditions is not implied Note 2 Either voltage limit or current limit is sufficient to protect inputs Recommended Operating Conditions Free Air Ambient Temperature Military Commercial Supply Voltage Military Commercial b 55 C to a 125 C 0 C to a 70 C a 4 5V to a 5 5V a 4 5V to a 5 5V b 0 5V to VCC b 0 5V to a 5 5V DC Electrical Characteristics Symbol VIH VIL VCD VOH Parameter Min Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output HIGH Voltage 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 74F 5% VCC 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 54F 74F 24 20 24 20 27 05 0 55 05 0 55 20 0 50 100 70 10 05 250 50 4 75 3 75 b1 2 54F 74F Typ Max Units V 08 b1 2 VCC Conditions Recognized as a HIGH Signal Recognized as a LOW Signal 20 V V Min IIN e b18 mA IOH IOH IOH IOH IOH IOL IOL IOL IOL e e e e e e e e e b 3 mA (An) b 12 mA (Bn) b 3 mA (An) b 15 mA (Bn) b 3 mA (An) V Min VOL Output LOW Voltage V Min 20 mA (An) 48 mA (Bn) 24 mA (An) 64 mA (Bn) IIH IBVI IBVIT ICEX VID IOD IIL IIH a IOZH IIL a IOZL Input HIGH Current mA mA mA mA V mA mA mA mA Max Max Max Max 00 00 Max Max Max VIN e 2 7V VIN e 7 0V (OE T R) VIN e 5 5 V (An Bn) VOUT e VCC (An Bn) IID e 1 9 mA All Other Pins Grounded VIOD e 150 mV All Other Pins Grounded VIN e 0 5V (T R OE) VOUT e 2 7V (An Bn) VOUT e 0 5V (An Bn) Input HIGH Current 54F Breakdown Test 74F Input HIGH Current 54F Breakdown (I O) 74F Output HIGH Leakage Current Input Leakage Test Output Leakage Circuit Current Input LOW Current Output Leakage Current Output Leakage Current 54F 74F 74F 74F 70 b 650 3 DC Electrical Characteristics Symbol IOS IZZ ICCH ICCL ICCZ Parameter (Continued) 54F 74F Min Typ Max b 150 b 225 Units VCC Conditions VOUT e 0V (An) VOUT e 0V (Bn) VOUT e 5 25V(An Bn) VO e HIGH VO e LOW VO e HIGH Z Output Short-Circuit Current Bus Drainage Test Power Supply Current Power Supply Current Power Supply Current b 60 b 100 mA mA mA mA mA Max 0 0V Max Max Max 500 70 95 85 90 120 110 AC Electrical Characteristics 74F Symbol Parameter Min tPLH tPHL tPZH tPZL tPHZ tPLZ Propagation Delay An to Bn or Bn to An Output Enable Time Output Disable Time 25 25 30 35 20 20 TA e a 25 C VCC e a 5 0V CL e 50 pF Typ 42 42 53 60 50 50 Max 60 60 70 80 65 65 54F TA VCC e Mil CL e 50 pF Min 20 20 25 30 20 20 Max 75 75 90 10 0 90 10 0 74F TA VCC e Com CL e 50 pF Min 20 20 25 30 20 20 Max 70 70 80 90 75 75 ns Units ns Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F Temperature Range Family 74F e Commercial 54F e Military Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC MSA e Shrink Small Outline Package (EIAJ SSOP) SJ e Small Outline Package SOIC EIAJ 245 S C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13 reel Temperature Range C e Commercial (0 C to a 70 C) M e Military (b55 C to a 125 C) NOTE NOT REQUIRED FOR MSA PACKAGE CODE 4 Physical Dimensions inches (millimeters) 20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A 20-Lead Ceramic Dual-In-Line Package (D) NS Package Number J20A 5 Physical Dimensions inches (millimeters) (Continued) 20-Lead (0 300 Wide) Molded Small Outline Package JEDEC (S) NS Package Number M20B 20-Lead (0 300 Wide) Molded Small Outline Package EIAJ (SJ) NS Package Number M20D 6 Physical Dimensions inches (millimeters) (Continued) 20-Lead Molded Shrink Small Outline Package EIAJ Type II (MSA) NS Package Number MSA20 20-Lead Molded (0 300 Wide) Dual-In-Line Package (P) NS Package Number N20A 7 54F 74F245 Octal Bidirectional Transceiver with TRI-STATE Outputs Physical Dimensions inches (millimeters) (Continued) 20-Lead Ceramic Flatpak (F) NS Package Number W20A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user National Semiconductor Corporation 2900 Semiconductor Drive P O Box 58090 Santa Clara CA 95052-8090 Tel 1(800) 272-9959 TWX (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str 10 D-82256 F4urstenfeldbruck Germany Tel (81-41) 35-0 Telex 527649 Fax (81-41) 35-1 National Semiconductor Japan Ltd Sumitomo Chemical Engineering Center Bldg 7F 1-7-1 Nakase Mihama-Ku Chiba-City Ciba Prefecture 261 Tel (043) 299-2300 Fax (043) 299-2500 2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness National Semiconductor Hong Kong Ltd 13th Floor Straight Block Ocean Centre 5 Canton Rd Tsimshatsui Kowloon Hong Kong Tel (852) 2737-1600 Fax (852) 2736-9960 National Semiconductores Do Brazil Ltda Rue Deputado Lacorda Franco 120-3A Sao Paulo-SP Brazil 05418-000 Tel (55-11) 212-5066 Telex 391-1131931 NSBR BR Fax (55-11) 212-1181 National Semiconductor (Australia) Pty Ltd Building 16 Business Park Drive Monash Business Park Nottinghill Melbourne Victoria 3168 Australia Tel (3) 558-9999 Fax (3) 558-9998 National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications