54F 74F365 Hex Buffer Driver with TRI-STATE Outputs
January 1995
54F 74F365 Hex Buffer Driver with TRI-STATE Outputs
General Description
The ’F365 is a hex buffer and line driver designed to be employed as a memory and address driver clock driver and bus-oriented transmitter receiver
Features
Y Y Y
TRI-STATE buffer outputs Outputs sink 64 mA Bus-oriented
Commercial 74F365PC
Military
Package Number N16E
Package Description 16-Lead (0 300 Wide) Molded Dual-In-Line 16-Lead Ceramic Dual-In-Line 16-Lead (0 150 Wide) Molded Small Outline JEDEC 16-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C
54F365DM (Note 2) 74F365SC (Note 1) 54F365FM (Note 2) 54F365LM (Note 2)
Note 1 Devices also available in 13 reel Use suffix e SCX
J16A M16A W16A E20A
Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB
Logic Symbol
IEEE IEC
Connection Diagrams
Pin Assignment for DIP SOIC and Flatpak Pin Assignment for LCC
TL F 9522 – 1
TL F 9522 – 2
TL F 9522–4
TRI-STATE is a registered trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation
TL F 9522
RRD-B30M105 Printed in U S A
Unit Loading Fan Out
54F 74F Pin Names Description UL HIGH LOW 1 0 0 033 1 0 0 033 600 106 6 (80) Input IIH IIL Output IOH IOL 20 mA 20 mA 20 mA 20 mA
b 12 mA 64 mA (48 mA)
OE1 OE2 In On
Output Enable Input (Active LOW) Inputs Outputs Function Table Inputs
Output I L H X X O L H Z Z
L e LOW Voltage Level H e HIGH Voltage Level X e Immaterial Z e High Impedance
OE1 L L X H
OE2 L L H X
2
Absolute Maximum Ratings (Note 1)
If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias Plastic VCC Pin Potential to Ground Pin
b 65 C to a 150 b 55 C to a 125 b 55 C to a 175 b 55 C to a 150
Recommended Operating Conditions
Free Air Ambient Temperature Military Commercial Supply Voltage Military Commercial
b 55 C to a 125 C 0 C to a 70 C a 4 5V to a 5 5V a 4 5V to a 5 5V
C C C C
b 0 5V to a 7 0V b 0 5V to a 7 0V Input Voltage (Note 2) b 30 mA to a 5 0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0 5V to VCC Standard Output b 0 5V to a 5 5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA)
Note 1 Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired Functional operation under these conditions is not implied Note 2 Either voltage limit or current limit is sufficient to protect inputs
DC Electrical Characteristics
Symbol VIH VIL VCD VOH Parameter Min Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output HIGH Voltage 54F 10% VCC 54F 10% VCC 74F 10% VCC 74F 10% VCC 74F 5% VCC 54F 10% VCC 74F 10% VCC 24 20 24 20 27 0 55 0 55 20 100
b 20
54F 74F Typ Max
Units V 08
b1 2
VCC
Conditions Recognized as a HIGH Signal Recognized as a LOW Signal
20
V V Min
IIN e b18 mA IOH IOH IOH IOH IOH
e e e e e b 3 mA b 12 mA b 3 mA b 15 mA b 3 mA
V
Min
VOL IIH IBVI IIL IOZH IOZL IOS ICEX IZZ ICCH ICCL ICCZ
Output LOW Voltage Input HIGH Current Input HIGH Current Breakdown Test Input LOW Current
V mA mA mA mA mA mA mA mA mA mA mA
Min Max 00 Max Max Max Max Max 0 0V Max Max Max
IOL e 48 mA IOL e 64 mA VIN e 2 7V VIN e 7 0V VIN e 0 5V VOUT e 2 7V VOUT e 0 5V VOUT e 0V VOUT e VCC VOUT e 5 25V VO e HIGH VO e LOW VO e HIGH Z
Output Leakage Current Output Leakage Current Output Short-Circuit Current Output HIGH Leakage Current Bus Drainage Test Power Supply Current Power Supply Current Power Supply Current 25 44 35
b 100
50
b 50 b 225
250 500 35 62 48
3
AC Electrical Characteristics
74F Symbol Parameter Min tPLH tPHL tPZH tPZL tPHZ tPLZ Propagation Delay In to On Enable Time Disable Time 25 25 25 25 20 20 TA e a 25 C VCC e a 5 0V CL e 50 pF Typ 46 49 51 57 36 44 Max 65 70 95 90 65 65 54F TA VCC e Mil CL e 50 pF Min 20 20 20 20 15 15 Max 70 70 85 85 65 90 74F TA VCC e Com CL e 50 pF Min 20 20 25 25 20 20 Max 70 75 10 0 95 70 70 ns ns ns Units
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F Temperature Range Family 74F e Commercial 54F e Military Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline (SOIC) 365 S C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13 reels Temperature Range C e Commercial (0 C to a 70 C) M e Military (b55 C to a 125 C)
4
5
Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L) NS Package Number E20A
16-Lead Ceramic Dual-In-Line Package (D) NS Package Number J16A
6
Physical Dimensions inches (millimeters) (Continued)
16-Lead (0 150 Wide) Molded Small Outline Package JEDEC (S) NS Package Number M16A
16-Lead (0 300 Wide) Molded Dual-In-Line Package (P) NS Package Number N16E
7
54F 74F365 Hex Buffer Driver with TRI-STATE Outputs
Physical Dimensions inches (millimeters) (Continued)
16-Lead Ceramic Flatpak (F) NS Package Number W16A
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National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications
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