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ADC9708CCJ

ADC9708CCJ

  • 厂商:

    NSC

  • 封装:

  • 描述:

    ADC9708CCJ - 6-Channel 8-Bit uP Compatible A/D Converter - National Semiconductor

  • 数据手册
  • 价格&库存
ADC9708CCJ 数据手册
ADC9708 6-Channel 8-Bit mP Compatible A D Converter October 1991 ADC9708 6-Channel 8-Bit mP Compatible A D Converter General Description The ADC9708 is a single slope 8-bit 6-channel ADC subsystem that provides all of the necessary analog functions for a microprocessor-based data control system The device uses an external microprocessor system to provide the necessary addressing timing and counting functions and includes a 1-of-8 decoder 8-channel analog multiplexer sample and hold ramp integrator precision ramp reference and a comparator on a single monolithic chip Features Y Y Y Y Y Y Y Y Y MPU compatible Excellent linearity over full temperature range g 0 2% maximum Typical 300 ms conversion time per channel Wide dynamic range includes ground Auto-zero and full-scale correction capability Ratiometric conversion no precision reference required Single-supply operation TTL compatible Does not require access to data bus or address bus Connection Diagram All Packages Ordering Information Commercial (0 C s TA s 70 C) ADC9708CCN ADC9708CCJ Military (b55 C s TA s 125 C) ADC9708CMJ Package N16E J16A Package J16A TL H 10409 – 2 (Top View) Block Diagram TL H 10409 – 1 C1995 National Semiconductor Corporation TL H 10409 RRD-B30M115 Printed in U S A Absolute Maximum Ratings (Notes 1 2) Pin Temperature Ceramic DIP (Soldering 60 Sec ) Molded DIP (Soldering 10 Sec ) 300 C 260 C If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Supply Voltage (VCC) Comparator Output (Ramp Stop) Analog Input Range Digital Input Range Output Sink Current Storage Temperature Range Continuous Total Dissipation (Note 8) Ceramic DIP Package Molded DIP Package ESD Susceptibility (Note 9) 18V b 0 3V to a 18V b 0 3V to a 30V b 0 3V to a 30V 10 mA b 65 C to a 150 C 900 mW 1000 mW TBD Operating Ratings (Notes 1 2) Operating Temperature Range ADC9708CCN ADC9708CCJ 0 C to a 70 C b 55 C to a 125 C ADC9708CMJ 4 75V to 15V Supply Voltage (VCC) Reference Voltage (VREF) (Note 3) 2 8V to 5 25V 300 pF Ramp Capacitor (CH) 12 mA to 50 mA Reference Current (IR) Analog Input Range 0V to VREF Ramp Stop Output Current 1 6 mA Electrical Characteristics Over recommended operating conditions VCC e 5 0V b55 C s TA s a 125 C for ADC9708CMJ and 0 C s TA s a 70 C for ADC9708CCJ or ADC9708CCN unless otherwise specified Symbol EA ER VOSM tC tA IA tO tM VIH VIL IB IIL IIH IOS IOH VOL PSRR Parameter Conversion Accuracy Linearity Multiplexer Input Offset Voltage Conversion Time per Channel Acquisition Time Acquisition Current ADC9708CCN CCJ ADC9708CMJ Ramp Start Delay Time Multiplexer Address Time Digital Input HIGH Voltage Digital Input LOW Voltage Analog Input Current Input LOW Current Input HIGH Current Input Offset Current Comparator Logic ‘‘1’’ Output Leakage Current Comparator Logic ‘‘0’’ Output Voltage Power Supply Rejection Ratio Cross Talk between Any Two Channels VOH e 15V IOL e 1 6 mA (Note 6) (Note 7) A0 A1 A2 Ramp Start A0 A1 A2 Ramp Start Channel ON or OFF A0 A1 A2 Ramp Start e 0 4V A0 A1 A2 Ramp Start e 5 5V 10 b1 0 b5 Conditions Over Entire Temperature Range (Note 4) Applies to Any One Channel (Note 5) Channel ON TA e 25 C Channel ON Analog Input e 0V to VREF CH e 300 pF IREF e 50 mA CH e 1000 pF Typical (Note 10) g0 2 g 0 08 Limit (Note 11) g0 3 g0 2 Units (Limit) % (max) % (max) mV (max) mV (max) ms (max) ms (max) mA (min) mA (min) ns ms 20 20 296 20 40 70 350 40 150 115 100 10 20 08 b3 0 b 15 V (min) V mA (min) mA (min) mA (max) mA (max) mA (max) V (max) dB (min) dB (min) 10 30 10 04 40 60 2 Electrical Characteristics Over recommended operating conditions VCC e 5 0V b55 C s TA s a 125 C for ADC9708CMJ and 0 C s TA s a 70 C for ADC9708CCJ or ADC9708CCN unless otherwise specified (Continued) Symbol ICC CIN COUT Parameter Power Supply Current Input Capacitance Comparator Output Capacitance Conditions VCC e 5V to 15V I0 e 0 Typical (Note 10) 75 30 50 Limit (Note 11) 15 Units (Limit) mA (max) pF pF Note 1 Absolute Maximum Ratings indicate limits beyond which damage to the device may occur Operating Ratings indicate conditions for which the device is intended to be functional These ratings do not guarantee specific performance limits however For guaranteed specifications and test conditions see the Electrical Characteristics The guaranteed specifications apply only for the test conditions listed Some performance characteristics may degrade when the device is not operated under the listed test conditions Note 2 All voltages are measured with respect to GND unless otherwise specified Note 3 VREF should not exceed VCC b 2V Note 4 Conversion accuracy is defined as the deviations from a straight line drawn between the points defined by channel address 000 (0 scale) and channel address 111 (full scale) for all channels Note 5 Linearity is defined as the deviation from a straight line drawn between the 0 and full scale points for each channel Note 6 Power supply rejection ratio is defined as the conversion error contributed by power supply voltage variations while resolving mid scale on any channel Note 7 Cross Talk between channels e 20 log DVCH D VI Note 8 Caution should be taken not to exceed absolute maximum power rating when the device is operating in a severe fault condition (ex when any inputs or outputs exceed the power supply) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature) iJA (package junction to ambient thermal resistance) and TA (ambient temperature) The maximum allowable power dissipation at any temperature is PDmax e (TJmax b TA) iJA or the number given in the Absolute Maximum Ratings whichever is lower For this device TJmax e 150 C and the typical thermal resistance (iJA) for board mounting follow ADC9708CCN 62 C W ADC9708CCJ ADC9708CMJ 58 C W Note 9 Human body model 100 pF discharged through a 1 5 kX resistor Timing Diagram Test Circuits TL H 10409 – 7 FIGURE 1 Equivalent Timing Waveform for Test Circuits and Applications Note 10 Typicals are at a 25 C and represent most likely parametric norm Note 11 Tested limits are guaranteed to National’s AOQL (Average Outgoing Quality Level) Input Timing tA l 400 ms VREF e IR e TL H 10409 – 8  2 kX 3 3 kX a 3 3 kX J 5V e31 5b31 e 19 mA 100 kX tR l max e full scale ramp time e 0 01 c 10b6 c 3 1 e 1 6 ms 19 c 10b6 Note For evaluation purposes the ramp start timing generation can be implemented with an LM555 timer (astable operation) or MPU evaluation kit and a time interval meter for ramp time measurement The TIM meter will measure the time between to 0 to 1 transition of the ramp start and the 1 to 0 transition of the ramp stop The ramp stop is open collector and must have an external pull-up resistor to VCC FIGURE 2 Slow Speed Evaluation Circuit for Ratiometric Operation 3 Test Circuits (Continued) ed is selected via address terminals A0 – A2 The analog input voltage level is transferred to the external ramp capacitor connected to pin 4 when the input to the ramp start terminal (pin 3) is at a logic 0 (See Figure 1 ) The time to charge the capacitor is the acquisition time which is a function of the output impedance of an amplifier internal to the A D converter and the value of the capacitor After charging the external capacitor the ramp start terminal is switched to a logic 1 which introduces a high impedance between the analog input voltage and the external capacitor The capacitor begins to discharge at a controlled rate The controlled rate of discharge (ramp) is established by the external reference voltage the external reference resistor the value of the external capacitor and the internal leakage of the A D converter Connected to the capacitor terminal is a comparator internal to the A D converter with its output going to the ramp stop terminal (pin 7) The comparator output is a logic one when the capacitor is charged and switches to a logic 0 when the capacitor is in a discharged state The ramp time is from the time when ramp start goes HIGH (logic ‘‘1’’) to when ramp stop goes LOW (logic ‘‘0’’) The microprocessor must be programmed to determine this conversion time The ideal (no undesirable internal source impedances leakage paths errors on levels where comparator switches or delay time) conversion time is calculated as follows CH Ramp Time e V1 IR Where V1 e Analog Input Voltage Being Measured CH e External Ramp Capacitor VCC b VREF IR e RREF Where VCC e Power Supply Voltage VREF e Reference Voltage RREF e Reference Resistor In actual use the errors due to a nonideal A D converter can be minimized by using a microprocessor to make the calculations (See Figures 5 through 8 ) Channel Selection Input Address Line A2 0 0 0 0 1 1 1 1 A1 0 0 1 1 0 0 1 1 A0 0 1 0 1 0 1 0 1 Selected Analog Input Ground I1 I2 I3 I4 I5 I6 VREF TL H 10409–9 FIGURE 3 Linearity Acquisition Time Conversion Time Test Circuit TL H 10409–10 FIGURE 4 Static Measurements Functional Description This Analog to Digital Converter is a single-slope 8-bit 6-channel A D converter that provides all of the necessary analog functions for a microprocessor-based data control system The device uses the processor system to provide the necessary addressing timing and counting functions and includes a 1-of-8 decoder 8-channel analog multiplexer sample and hold precision current reference ramp integrator and comparator on a single monolithic chip Applications that require auto-zero or auto-calibration (See Figures 5–8 ) can use selection of address 000 and 111 for input address lines A0–A2 in conjunction with the arithmetic capability of a microprocessor to provide ground and scaling factors Address 0 0 0 internally connects the input of the ramp generator to ground and may be used for zero offset correction in subsequent conversions Address 1 1 1 internally connects the input of the ramp generator to the voltage reference VREF and may be used for scale factor correction in subsequent conversions For the following refer to the Functional Block Diagram Six separate external analog voltage inputs may come into terminals I1 – I6 and the specific analog input to be convert- 4 Functional Description (Continued) Auto-Zero and Full-Scale Features No Zero Offset No Full-Scale Error Count (n) e VIN c 256 VREF TL H 10409 – 3 NF S NZ i i 256 TL H 10409 – 4 0 (N) has both full-scale and zero errors FIGURE 5 Ideal Transfer Function FIGURE 6 Transfer Function with Zero and Full-Scale Error N e N b NZ N has Full-Scale Error TL H 10409 – 5 N e (N b NZ) c 256 (NF S b NZ) TL H 10409 – 6 FIGURE 7 Transfer Functions with Zero-Correction Added FIGURE 8 Transfer Function with both Zero and Full-Scale Correction Added 9 2V s VREF s (VCC b 2V) 10 Address lines A0 A1 A2 must be stable throughout the sampling interval tA 11 Pin 6 (RREF) should be bypassed to ground via a 0 02 mF capacitor Microprocessor Considerations Several alternatives exist from a hardware software standpoint in microprocessor based systems using the ADC9708 1 The ramp time measurement may be implemented in software using a register increment followed by a branch back depending on the status of the ramp stop 2 Alternately the ramp stop may be tied into the interrupt structure in systems containing a programmable binary timer This scheme has the following advantages a The CPU is not committed during the ramp time interval b It requires only 5 bits of an I O port for control signals Typical Applications Application Suggestions and Formulas 1 The capacitor node impedance is approximately 30 mX and should have no parallel resistance for proper operation 2 tR when VIN e 0V will be finite (i e the comparator will always toggle for VIN t 0V) 3 The ramp stop output is open collector and an external pull-up resistor is required 4 All digital inputs and outputs are TTL compatible 5 For proper operation timing commences on the 0 to 1 transition of ramp start and terminates on the 1 to 0 transition of ramp stop CH c VREF (See Figure 1 ) IA b IR CH C c VIN tR l max e H c VREF 7 tR (ramp time) e IR IR (See Figure 1 ) VCC b VREF 8 IR e RREF 6 tA t 5 Typical Applications (Continued) 3 The auto-zero auto-full-scale (See Figures 5–8 ) should use double precision rounded (as opposed to truncated) arithmatic Several points are worth noting a The subtractions are single op code instructions b The full scale correction uses a multiply by 256 and can be accomplished by a shift left 8 bits (usually one instruction) or placing (N b NZ) in the MSB register and setting the LSB register to zero for the double precision divide c The divisor (NF S b NZ) of the MSB register will always be zero These schemes have the following advantages a No access to the data bus or address bus is required by the A D system b 5 I O bits completely support the A D system c Since auto full scale auto zero are implemented in software and long term drift (aging) effects are eliminated d Software overhead is minimal (typically 30 bytes) e Where ratiometric operation is permissible the 4 external components may be g 5% tolerance including the power supply Note DVI e (Applied Force) and can be Linearized (if necessary) in Software TL H 10409 – 11 FIGURE 9 Ratiometric Strain Gage Sensore Controller TL H 10409 – 12 Applications Beverage Brewers Dispensers Chemical Solution Control Automatic Liquid Mixing Control Ramp Current e IR e VCC VI e a R RX X a RB J R R1 1 a R2 J R J 1 3 VCC a CH R Ramp Time e VI  I J R e RX X a RB J 1 a R2 R1 J C R J H3 FIGURE 10 6 Physical Dimensions inches (millimeters) Dual-In-Line Package (J) Order Number ADC9708CCJ or ADC9708CMJ NS Package Number J16A 7 ADC9708 6-Channel 8-Bit mP Compatible A D Converter Physical Dimensions inches (millimeters) (Continued) 16 Lead Dual-In-Line Package (N) Order Number ADC9708CCN NS Package Number N16E LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user National Semiconductor Corporation 1111 West Bardin Road Arlington TX 76017 Tel 1(800) 272-9959 Fax 1(800) 737-7018 2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness National Semiconductor Europe Fax (a49) 0-180-530 85 86 Email cnjwge tevm2 nsc com Deutsch Tel (a49) 0-180-530 85 85 English Tel (a49) 0-180-532 78 32 Fran ais Tel (a49) 0-180-532 93 58 Italiano Tel (a49) 0-180-534 16 80 National Semiconductor Hong Kong Ltd 13th Floor Straight Block Ocean Centre 5 Canton Rd Tsimshatsui Kowloon Hong Kong Tel (852) 2737-1600 Fax (852) 2736-9960 National Semiconductor Japan Ltd Tel 81-043-299-2309 Fax 81-043-299-2408 National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications
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