LF13332

LF11331/LF13331/LF11332/LF13332/LF11333/LF13333/LF11201/LF13201/LF11202/LF13202 Quad SPST JFET Analog Switches January 1995 LF11331/LF13331/LF11332/LF13332/LF11333/ LF13333/LF11201/LF13201/LF11202/LF13202 Quad SPST JFET Analog Switches General Description These devices are a monolithic combination of bipolar and JFET technology producing the industry’s first one chip quad JFET switch. A unique circuit technique is employed to maintain a constant resistance over the analog voltage range of ± 10V. The input is designed to operate from minimum TTL levels, and switch operation also ensures a break-before-make action. These devices operate from ± 15V supplies and swing a ± 10V analog signal. The JFET switches are designed for applications where a dc to medium frequency analog signal needs to be controlled. Features n Analog signals are not loaded n Constant “ON” resistance for signals up to ± 10V and 100 kHz n Pin compatible with CMOS switches with the advantage of blow out free handling n Small signal analog signals to 50 MHz n Break-before-make action: tOFF < tON n High open switch isolation at 1.0 MHz: −50 dB n Low leakage in “OFF” state: < 1.0 nA n TTL, DTL, RTL compatibility n Single disable pin opens all switches in package on LF11331, LF11332, LF11333 n LF11201 is pin compatible with DG201 Test Circuit and Schematic Diagram DS005667-2 FIGURE 1. Typical Circuit for One Switch DS005667-12 FIGURE 2. Schematic Diagram (Normally Open) © 1999 National Semiconductor Corporation DS005667 www.national.com Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. (Note 2) Supply Voltage (VCC−VEE) Reference Voltage Logic Input Voltage Analog Voltage Analog Current 36V VEE≤VR≤VCC VR−4.0V≤VIN≤VR+6.0V VEE≤VA≤VCC+6V; VA≤VEE+36V |IA| < 20 mA Power Dissipation (Note 3) Molded DIP (N Suffix) Cavity DIP (D Suffix) Operating Temperature Range LF11201, 2 and LF11331, 2, 3 LF13201, 2 and LF13331, 2, 3 Storage Temperature Soldering Information N and D Package (10 sec.) SO Package: Vapor Phase (60 sec.) Infrared (15 sec.) 500 mW 900 mW −55˚C to +125˚C 0˚C to +70˚C −65˚C to +150˚C 300˚C 215˚C 220˚C Electrical Characteristics (Note 4) LF11331/2/3 Symbol RON RON Match VA IS(ON) + ID(ON) IS(OFF) ID(OFF) VINH VINL IINH IINL tON tOFF tON−tOFF CS(OFF) CD(OFF) CS(ON) + CD(ON) ISO(OFF) CT SR IDIS IEE IR ICC “OFF” Isolation Crosstalk Analog Slew Rate Disable Current Negative Supply Current Reference Supply Current Positive Supply Current (Figure 4), (Note 5) (Figure 4), (Note 5) (Note 6) (Figure 5), (Note 7) All Switches “OFF,” VS = ± 10V All Switches “OFF,” VS = ± 10V All Switches “OFF,” VS = ± 10V TA = 25˚C TA = 25˚C TA = 25˚C TA = 25˚C TA = 25˚C TA = 25˚C TA = 25˚C −50 −65 50 0.4 0.6 3.0 4.2 2.0 2.8 4.5 6.3 1.0 1.5 5.0 7.5 4.0 6.0 6.0 9.0 −50 −65 50 0.6 0.9 4.3 6.0 2.7 3.8 7.0 9.8 1.5 2.3 7.0 10.5 5.0 7.5 9.0 13.5 dB dB V/µs mA mA mA mA mA mA mA mA Source Current in “OFF” Condition Drain Current in “OFF” Condition Logical “1” Input Voltage Logical “0” Input Voltage Logical “1” Input Current Logical “0” Input Current Delay Time “ON” Delay Time “OFF” Break-Before-Make Source Capacitance Drain Capacitance Active Source and Drain Capacitance VIN = 5V VIN = 0.8 VS = ± 10V, (Figure 3) VS = ± 10V, (Figure 3) VS = ± 10V, (Figure 3) Switch “OFF,” VS = ± 10V Switch “OFF,” VD = ± 10V Switch “ON,” VS = VD = 0V TA = 25˚C TA = 25˚C TA = 25˚C TA = 25˚C TA = 25˚C TA = 25˚C TA = 25˚C TA = 25˚C 500 90 80 4.0 3.0 5.0 3.6 Switch “OFF,” VS = +10V, VD = −10V Switch “OFF,” VS = +10V, VD = −10V 2.0 0.8 10 25 0.1 1 500 90 80 4.0 3.0 5.0 3.6 TA = 25˚C TA = 25˚C Parameter “ON” Resistance “ON” Resistance Matching Analog Range Leakage Current in “ON” Condition Switch “ON,” VS = VD = ± 10V TA = 25˚C VA = 0, ID = 1 mA Conditions TA = 25˚C TA = 25˚C LF11201/2 Min Typ 150 200 5 Max 200 300 20 5 100 5 100 5 100 2.0 0.8 40 100 0.1 1 LF13331/2/3 LF13201/2 Min Typ 150 200 10 Max 250 350 50 10 30 10 30 10 30 Ω Ω Ω V nA nA nA nA nA nA V V µA µA µA ns ns ns pF pF pF Units ± 10 ± 11 0.3 3 0.4 3 0.1 3 ± 10 ± 11 0.3 3 0.4 3 0.1 3 Note 1: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. Note 2: Refer to RETSF11201X, RETSF11331X, RETSF11332X and RETSF11333X for military specifications. Note 3: For operating at high temperature the molded DIP products must be derated based on a +100˚C maximum junction temperature and a thermal resistance of +150˚C/W, devices in the cavity DIP are based on a +150˚C maximum junction temperature and are derated at ± 100˚C/W. www.national.com 2 Electrical Characteristics (Note 4) (Continued) Note 4: Unless otherwise specified, VCC = +15V, VEE = −15V, VR = 0V, and limits apply for −55˚C≤TA≤+125˚C for the LF11331/2/3 and the LF11201/2, −25˚C≤TA≤+85˚C for the LF13331/2/3 and the LF13201/2. Note 5: These parameters are limited by the pin to pin capacitance of the package. Note 6: This is the analog signal slew rate above which the signal is distorted as a result of finite internal slew rates. Note 7: All switches in the device are turned “OFF” by saturating a transistor at the disable node as shown in Figure 5. The delay time will be approximately equal to the tON or tOFF plus the delay introduced by the external transistor. Note 8: This graph indicates the analog current at which 1% of the analog current is lost when the drain is positive with respect to the source. Note 9: θJA (Typical) Thermal Resistance Molded DIP (N) Cavity DIP (D) Small Outline (M) 85˚C/W 100˚C/W 105˚C/W Connection Diagrams (Top View for SO and Dual-In-Line Packages) (All Switches Shown are For Logical “0”) LF11332/LF13332 LF11331/LF13331 DS005667-1 DS005667-13 LF11333/LF13333 LF11201/LF13201 DS005667-14 DS005667-15 3 www.national.com Connection Diagrams “0”) (Continued) (Top View for SO and Dual-In-Line Packages) (All Switches Shown are For Logical LF11202/LF13202 DS005667-16 Order Number LF13201D, LF11201D, LF11201D/883, LF13202D, LF11202D, LF11202D/883, LF13331D, LF11331D, LF11331D/883, LF13332D, LF11332D, LF11332D/883, LF13333D, LF11333D or LH11333D/883 See NS Package Number D16C Order Number LF13201M, LF13202M, LF13331M, LF13332M or LF13333M See NS Package Number M16A Order Number LF13201N, LF13202N, LF13331N, LF13332N or LF13333N See NS Package Number N16A www.national.com 4 Test Circuit and Typical Performance Curves Switching Transients Delay Time, Rise Time, Settling Time, and DS005667-18 DS005667-17 DS005667-19 DS005667-20 DS005667-21 DS005667-22 5 www.national.com Additional Test Circuits DS005667-39 DS005667-40 FIGURE 3. tON, tOFF Test Circuit and Waveforms for a Normally Open Switch DS005667-41 FIGURE 4. “OFF” Isolation, Crosstalk, Small Signal Response Typical Performance Characteristics “ON” Resistance “ON” Resistance “ON” Resistance DS005667-23 DS005667-24 DS005667-25 www.national.com 6 Typical Performance Characteristics Break-Before-Make Action Switching Times (Continued) Crosstalk and “OFF” Isolation vs Frequency Using Test Circuit of Figure 5 DS005667-26 DS005667-27 DS005667-28 Supply Current Supply Current Supply Current DS005667-29 DS005667-30 DS005667-31 Switch Leakage Currents Switch Leakage Current Switch Capacitances DS005667-32 DS005667-33 DS005667-34 7 www.national.com Typical Performance Characteristics Slew Rate of Analog Voltage Above Which Signal Loading Occurs (Continued) Small Signal Response Maximum Accurate Analog Current vs Temperature DS005667-36 DS005667-35 DS005667-37 Logical “1” Input Bias Current DS005667-38 Application Hints GENERAL INFORMATION These devices are monolithic quad JFET analog switches with “ON” resistances which are essentially independent of analog voltage or analog current. The leakage currents are typically less than 1 nA at 25˚C in both the “OFF”and “ON” switch states and introduce negligible errors in most applications. Each switch is controlled by minimum TTL logic levels at its input and is designed to turn “OFF” faster than it will turn “ON.” This prevents two analog sources from being transiently connected together during switching. The switches were designed for applications which require break-before-make action, no analog current loss, medium speed switching times and moderate analog currents. Because these analog switches are JFET rather than CMOS, they do not require special handling. LOGIC INPUTS The logic input (IN), of each switch, is referenced to two forward diode drops (1.4V at 25˚C) from the reference supply (VR) which makes it compatible with DTL, RTL, and TTL logic families. For normal operation, the logic “0” voltage can range from 0.8V to −4.0V with respect to VR and the logic “1” voltage can range from 2.0V to 6.0V with respect to VR, provided VIN is not greater than (VCC−2.5V). If the input voltage is greater than (VCC−2.5V), the input current will increase. If the input voltage exceeds 6.0V or −4.0V with respect to VR, a resistor in series with the input should be used to limit the input current to less than 100µA. ANALOG VOLTAGE AND CURRENT Analog Voltage Each switch has a constant “ON” resistance (RON) for analog voltages from (VEE+5V) to (VCC−5V). For analog voltages greater than (VCC−5V), the switch will remain ON independent of the logic input voltage. For analog voltages less than (VEE+5V), the ON resistance of the switch will increase. Although the switch will not operate normally when the analog voltage is out of the previously mentioned range, the source voltage can go to either (VEE+36V) or (VCC+6V), whichever is more positive, and can go as negative as VEE without destruction. The drain (D) voltage can also go to either (VEE+36V) or (VCC+6V), whichever is more positive, and can go as negative as (VCC−36V) without destruction. Analog Current With the source (S) positive with respect to the drain (D), the RON is constant for low analog currents, but will increase at higher currents ( > 5 mA) when the FET enters the saturation region. However, if the drain is positive with respect to the source and a small analog current loss at high analog currents (Note 6) is tolerable, a low RON can be maintained for analog currents greater than 5 mA at 25˚C. www.national.com 8 Application Hints LEAKAGE CURRENTS (Continued) one of these conditions occurs, the supplies would zener an internal diode to an unlimited current; and result in a destroyed device. SWITCHING TRANSIENTS When a switch is turned OFF or ON, transients will appear at the load due to the internal transient voltage at the gate of the switch JFET being coupled to the drain and source by the junction capacitances of the JFET. The magnitude of these transients is dependent on the load. A lower value RL produces a lower transient voltage. A negative transient occurs during the delay time ON, while a positive transient occurs during the delay time OFF. These transients are relatively small when compared to faster switch families. DISABLE NODE This node can be used, as shown in Figure 5, to turn all the switches in the unit off independent of logic inputs. Normally, the node floats freely at an internal diode drop (≈0.7V) above VR. When the external transistor in Figure 5 is saturated, the node is pulled very close to VR and the unit is disabled. Typically, the current from the node will be less than 1 mA. This feature is not available on the LF11201 or LF11202 series. The drain and source leakage currents, in both the ON and the OFF states of each switch, are typically less than 1 nA at 25˚C and less than 100 nA at 125˚C. As shown in the typical curves, these leakage currents are Dependent on power supply voltages, analog voltage, analog current and the source to drain voltage. DELAY TIMES The delay time OFF (tOFF) is essentially independent of both the analog voltage and temperature. The delay time ON (tON) will decrease as either (VCC−VA) decreases or the temperature decreases. POWER SUPPLIES The voltage between the positive supply (VCC) and either the negative supply (VEE) or the reference supply (VR) can be as much as 36V. To accommodate variations in input logic reference voltages, VR can range from VEE to (VCC−4.5V). Care should be taken to ensure that the power supply leads for the device never become reversed in polarity or that the device is never inadvertently installed backwards in a test socket. If DS005667-6 FIGURE 5. Disable Function Typical Applications Sample and Hold with Reset DS005667-42 9 www.national.com Typical Applications (Continued) Programmable Inverting Non-Inverting Operational Amplifier DS005667-43 Programmable Gain Operational Amplifier DS005667-44 www.national.com 10 Typical Applications (Continued) Demultiplexer DS005667-45 Multiplexer/Mixer DS005667-46 11 www.national.com Typical Applications (Continued) 8-Channel Analog Commutator with 6-Channel Select Logic DS005667-47 Chopper Channel Amplifier DS005667-48 www.national.com 12 Typical Applications (Continued) Self-Zeroing Operational Amplifier DS005667-49 Programmable Integrator with Reset and Hold DS005667-50 13 www.national.com Typical Applications (Continued) Staircase Transfer Function Operational Amplifier DS005667-51 www.national.com 14 Typical Applications (Continued) DSB Modulator-Demodulator DS005667-11 15 www.national.com 16 Physical Dimensions inches (millimeters) unless otherwise noted Order Number LF11201D, LF11201D/883, LF13201D, LF11202D, LF11202D/883, LF13202D, LF11331D, LF11331D/883, LF13331D, LF11332D, LF11332D/883, LF13332D, LF11333D, LF11333D/883 or LF13333D NS Package Number D16C Order Number LF113201M, LF13202M, LF13331M, LF13332M or LF13333M NS Package Number M16A 17 www.national.com LF11331/LF13331/LF11332/LF13332/LF11333/LF13333/LF11201/LF13201/LF11202/LF13202 Quad SPST JFET Analog Switches Physical Dimensions inches (millimeters) unless otherwise noted (Continued) Order Number LF13201N, LF13202N, LF13331N, LF13332N or LF13333N NS Package Number N16A LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life support 1. Life support devices or systems are devices or sysdevice or system whose failure to perform can be reatems which, (a) are intended for surgical implant into sonably expected to cause the failure of the life support the body, or (b) support or sustain life, and whose faildevice or system, or to affect its safety or effectiveness. ure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 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