LM26CIM5-YPE

LM26NV SOT-23, ±3°C Accurate, Factory Preset Thermostat (LM26 without VTEMP output) August 5, 2008 LM26NV SOT-23, ±3°C Accurate, Factory Preset Thermostat (LM26 without VTEMP output) General Description The LM26NV is a precision, single digital-output, low-power thermostat comprised of an internal reference, DAC, temperature sensor and comparator. Utilizing factory programming, it can be manufactured with different trip points as well as different digital output functionality. The trip point (TOS) can be preset at the factory to any temperature in the range of −55°C to +110°C in 1°C increments. The LM26NV has one digital output (OS/OS/US/US) and one digital input (HYST). The digital output stage can be preset as either open-drain or push-pull. In addition, it can be factory programmed to be active HIGH or LOW. The digital output can be factory programmed to indicate an over temperature shutdown event (OS or OS) or an under temperature shutdown event (US or US). When preset as an overtemperature shutdown (OS), it will go LOW to indicate that the die temperature is over the internally preset TOS and go HIGH when the temperature goes below (TOS–THYST). Similarly, when preprogrammed as an undertemperature shutdown (US) it will go HIGH to indicate that the temperature is below TUS and go LOW when the temperature is above (TUS+THYST). The typical hysteresis, THYST, can be set to 2°C or 10°C and is controlled by the state of the HYST pin. Available parts are detailed in the ordering information. For other part options, contact a National Semiconductor Distributor or Sales Representative for information on minimum order qualification. The LM26NV is currently available in a 5lead SOT-23 package. ■ ■ ■ ■ ■ ■ Portable Battery Powered Systems Fan Control Industrial Process Control HVAC Systems Remote Temperature Sensing Electronic System Protection Features ■ Internal comparator with pin programmable 2°C or 10°C hysteresis ■ No external components required ■ Open Drain or push-pull digital output; supports CMOS ■ ■ ■ ■ logic levels Internal temperature sensor Internal voltage reference and DAC for trip-point setting Currently available in 5-pin SOT-23 plastic package Excellent power supply noise rejection Key Specifications ■ Power Supply Voltage ■ Power Supply Current ■ Hysteresis Temperature Temperature Range −55°C to +110°C +120°C 2.7V to 5.5V 40µA(max) 20µA(typ) 2°C or 10°C(typ) Temperature Trip Point Accuracy Applications ■ Microprocessor Thermal Management ■ Appliances LM26NV ±3°C (max) ±4°C (max) Connection Diagram 30075102 © 2008 National Semiconductor Corporation 300751 www.national.com LM26NV Pin Descriptions Pin Number 1 2 3 4 5 Pin Name HYST GND NC V+ OS OS US US Function Hysteresis control, digital input Ground, connected to the back side of the die through lead frame. Not Connected Inside Part Supply input Overtemperature Shutdown open-drain active low thermostat digital output Overtemperature Shutdown push-pull active high thermostat digital output Connection GND for 10°C or V+ for 2°C System GND Ground or No Connect 2.7V to 5.5V with a 0.1µF bypass capacitor. For PSRR information see Section Titled NOISE CONSIDERATIONS. Controller interrupt, system or power supply shutdown; pull-up resistor ≥ 10kΩ Controller interrupt, system or power supply shutdown Undertemperature Shutdown open-drain active System or power supply shutdown; pull-up resistor ≥ 10kΩ low thermostat digital output Undertemperature Shutdown push-pull active high thermostat digital output System or power supply shutdown Note: Pin 5 functionality and trip point setting are programmed during LM26NV manufacture. Ordering Information For more detailed information on the suffix meaning see the part number template at the end of the Electrical Characteristics Section. Contact National Semiconductor for other set points and output options. Order Number Bulk Rail LM26CIM5-YPE 3000 Units in Tape & Reel LM26CIM5X-YPE Top Mark YPE MA05B 115°C Active-Low, Open Drain, OS Output NS Package Number Trip Point Setting Output Function LM26CIM5-YPE Simplified Block Diagram and Connection Diagram 30075101 The LM26CIM5-YPE has a fixed trip point of 115°C. For other trip point and output function availability, please see ordering information or contact National Semiconductor. www.national.com 2 LM26NV Absolute Maximum Ratings (Note 1) Input Voltage Input Current at any pin (Note 2) Package Input Current(Note 2) Package Dissipation at TA = 25°C  (Note 3) Soldering Information SOT23 Package Vapor Phase (60 seconds) Infrared (15 seconds) 6.0V 5mA 20mA 500mW Storage Temperature ESD Susceptibility (Note 4) Human Body Model Machine Model −65°C to + 150°C 2500V 250V (Note 1) −55°C ≤ TA ≤ +125°C TMIN ≤ TA ≤ TMAX +2.7V to +5.5V +5.5V Operating Ratings Specified Temperature Range LM26NV Positive Supply Voltage (V+) Maximum VOUT 215°C 220°C LM26NV Electrical Characteristics The following specifications apply for V+ = 2.7VDC to 5.5VDC, and VTEMP load current = 0µA unless otherwise specified. Boldface limits apply for TA = TJ = TMIN to TMAX; all other limits TA = TJ = 25°C unless otherwise specified. Symbol Temperature Sensor Trip Point Accuracy (Includes VREF, DAC, -55°C ≤ TA ≤ +110°C Comparator Offset, and Temperature +120°C Sensitivity errors) Trip Point Hysteresis IS Supply Current HYST = GND HYST = V+ 11 2 16 20 40 1 0.4 ±3 ±4 °C (max) °C (max) °C °C µA (max) µA (max) µA (max) V (max) Parameter Conditions Typical (Note 6) LM26NV Limits (Note 7) Units (Limits) Digital Output and Input IOUT(“1”) VOUT(“0”) Logical “1” Output Leakage Current (Note 9) Logical “0” Output Voltage V+ = +5.0V IOUT = +1.2mA and 0.001 V+≥2.7V; IOUT = +3.2mA and V+≥4.5V; (Note 8) Logical “1” Push-Pull Output Voltage ISOURCE = 500µA, V+ ≥ 2.7V ISOURCE = 800µA, V + VOUT(“1”) 0.8 × V+ V+ − 1.5 0.8 × V+ 0.2 × V+ V (min) V (min) V (min) V (max) ≥4.5V VIH VIL HYST Input Logical ”1“ Threshold Voltage HYST Input Logical ”0“ Threshold Voltage 3 www.national.com LM26NV Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Note 2: When the input voltage (VI) at any pin exceeds the power supply (VI < GND or VI > V+), the current at that pin should be limited to 5mA. The 20mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5mA each. Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), θJA (junction to ambient thermal resistance) and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PD = (TJmax–TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, TJmax = 150°C. For this device the typical thermal resistance (θJA) of the different package types when board mounted follow: Package Type SOT23-5, MA05B θJA 250°C/W Note 4: The human body model is a 100pF capacitor discharge through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor discharged directly into each pin. Note 5: See the URL ”http://www.national.com/packaging/“ for other recommendations and methods of soldering surface mount devices. Note 6: Typicals are at TJ = TA = 25°C and represent most likely parametric norm. Note 7: Limits are guaranteed to National's AOQL (Average Outgoing Quality Level). Note 8: Care should be taken to include the effects of self heating when setting the maximum output load current. The power dissipation of the LM26NV would increase by 1.28mW when IOUT=3.2mA and VOUT=0.4V. With a thermal resistance of 250°C/W, this power dissipation would cause an increase in the die temperature of about 0.32°C due to self heating. Self heating is not included in the trip point accuracy specification. Note 9: The 1µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the current for every 15°C increase in temperature. For example, the 1nA typical current at 25°C would increase to 16nA at 85°C. www.national.com 4 LM26NV Part Number Template The series of characters labeled "xyz" in the part number LM26CIM5-xyz, describe the set point value and the function of the output. The character at "x" and "y" define the set point temperature (at which the digtal output will go active). The "z" character defines the type and function of the digital output. These place holders are defined in the following tables. The place holders xy describe the set point temperature as shown in the following table. x (10x) A B C D E F y (1x) Open-Drain/ PushPull 0 0 1 1 Temperature (°C) −5 −4 −3 −2 −1 −0 x (10x) H J K L N P R S T V X Y Z y (1x) H J K L N P R S T V - Temperature (°C) 0 1 2 3 4 5 6 7 8 9 10 11 12 The value of z describes the assignment/function of the output as shown in the following table: Active-Low/High 0 0 1 1 OS/US 0 1 0 1 Value of z E F G H Digital Output Function Active-Low, Open-Drain, OS output Active-Low, Open-Drain, US output Active-High, Push-Pull, OS output Active-High, Push-Pull, US output EXAMPLE: • The part number LM26CIM5-YPE has TOS = 115°C, and has an active-low open-drain overtemperature shutdown output. The "Y" represents the tens value "11", the "P" represents the ones value "5", and the "E" means that the output will be an active-low, open-drain, over-temperature output. Many active-high open-drain and active-low push-pull options are available, please contact National Semiconductor for more information. 5 www.national.com LM26NV Functional Description LM26NV OPTIONS The LM26NV can be factory programmed to have a trip point anywhere in the range of −55°C to +110°C. It is also available in any of four output options, as indicated by the last letter in the part number. 30075112 30075113 LM26CIM5 - _ _ E: The "E" indicates that the digital output is Active-Low Open-Drain and will trip as temperature is rising (OS) LM26CIM5 - _ _ F: The "F" indicates that the digita l output is Active-Low Open-Drain and will trip as temperature is falling (US) 30075114 30075115 LM26CIM5 - _ _G: The "G" indicates that the digital output is Active-High Push-Pull and will trip as temperature is rising (OS) LM26CIM5 - _ _H: The "H" indicates that the digital output is Active-High Push-Pull and will trip as temperature is falling (US) FIGURE 1. Output Pin Options Block Diagrams www.national.com 6 LM26NV Applications Hints NOISE CONSIDERATIONS The LM26NV has excellent power supply noise rejection. Listed below is a variety of signals used to test the LM26NV power supply rejection. False triggering of the output was not observed when these signals where coupled into the V+ pin of the LM26NV. • square wave 400kHz, 1Vp-p • square wave 2kHz, 200mVp-p • sine wave 100Hz to 1MHz, 200mVp-p Testing was done while maintaining the temperature of the LM26NV one degree centigrade way from the trip point with the output not activated. MOUNTING CONSIDERATIONS The LM26NV can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM26NV is sensing will be within about +0.06°C of the surface temperature to which the LM26NV's leads are attached to. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature measured would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity, the backside of the LM26NV die is directly attached to the GND pin (pin 2). The temperatures of the lands and traces to the other leads of the LM26NV will also affect the temperature that is being sensed. Alternatively, the LM26NV can be mounted inside a sealedend metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM26NV and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM26NV or its connections. The junction to ambient thermal resistance (θJA) is the parameter used to calculate the rise of a part's junction temperature due to its power dissipation. For the LM26NV the equation used to calculate the rise in the die junction temperature is as follows: (1) where TA is the ambient temperature, V+ is the power supply voltage, IQ is the quiescent current, VDO is the voltage on the digital output, and IDO is the load current on the digital output. The tables shown in Figure 2 summarize the thermal resistance for different conditions and the rise in die temperature of the LM26NV and a 10k pull-up resistor on an open-drain digital output with a 5.5V power supply. SOT23-5 no heat sink θJA (°C/W) Still Air Moving Air 250 TBD TJ−TA (°C) 0.11 TBD SOT23-5 small heat sink θJA (°C/W) TBD TBD TJ−TA (°C) TBD TBD FIGURE 2. Thermal resistance (θJA) and temperature rise due to self heating (TJ−TA) Typical Applications 30075103 FIGURE 3. Two Speed Fan Speed Control: The fan's control pin has an internal pull-up. The 10 kOhm pull-down sets a slow fan speed. When the output of the LM26NV goes low, the fan will speed up. 7 www.national.com LM26NV 30075120 FIGURE 4. Fan High Side Drive: The LM26NV switches the fan on when the measured temperature exceeds the trip temperatue. 30075121 FIGURE 5. Fan Low Side Drive: The LM26LV sinks causes the switch to sink the fan current when the measured temperature exceeds the trip temperature. 30075122 FIGURE 6. Audio Power Amplifier Thermal Protection: By thermally coupling the LM26NV to the audio power amplifier, the LM26NV safeguards the amplifier from overheating, turning on the fan when it temperature exceeds the trip temperature. www.national.com 8 LM26NV 30075123 FIGURE 7. Simple Thermostat: When the measured temperature is below the trip temperature of the LM26NV, the OS output will be high, causing the switch and relay to close. When the temperature exceeds the trip point, OS goes low and shuts off the relay and heater. 9 www.national.com LM26NV Physical Dimensions inches (millimeters) unless otherwise noted 5-Lead Molded SOT-23 Plastic Package, JEDEC Order Number LM26CIM5-_ _ E or LM26CIM5X-_ _ E; LM26CIM5-_ _ F or LM26CIM5X-_ _ F; LM26CIM5-_ _ G or LM26CIM5X-_ _ G; LM26CIM5-_ _ H or LM26CIM5X-_ _ H NS Package Number MA05B www.national.com 10 LM26NV Notes 11 www.national.com LM26NV SOT-23, ±3°C Accurate, Factory Preset Thermostat (LM26 without VTEMP output) Notes For more National Semiconductor product information and proven design tools, visit the following Web sites at: Products Amplifiers Audio Clock Conditioners Data Converters Displays Ethernet Interface LVDS Power Management Switching Regulators LDOs LED Lighting PowerWise Serial Digital Interface (SDI) Temperature Sensors Wireless (PLL/VCO) www.national.com/amplifiers www.national.com/audio www.national.com/timing www.national.com/adc www.national.com/displays www.national.com/ethernet www.national.com/interface www.national.com/lvds www.national.com/power www.national.com/switchers www.national.com/ldo www.national.com/led www.national.com/powerwise www.national.com/sdi www.national.com/tempsensors www.national.com/wireless WEBENCH Analog University App Notes Distributors Green Compliance Packaging Design Support www.national.com/webench www.national.com/AU www.national.com/appnotes www.national.com/contacts www.national.com/quality/green www.national.com/packaging www.national.com/quality www.national.com/refdesigns www.national.com/feedback Quality and Reliability Reference Designs Feedback THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION (“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS, IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS. EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness. National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other brand or product names may be trademarks or registered trademarks of their respective holders. Copyright© 2008 National Semiconductor Corporation For the most current product information visit us at www.national.com National Semiconductor Americas Technical Support Center Email: support@nsc.com Tel: 1-800-272-9959 www.national.com National Semiconductor Europe Technical Support Center Email: europe.support@nsc.com German Tel: +49 (0) 180 5010 771 English Tel: +44 (0) 870 850 4288 National Semiconductor Asia Pacific Technical Support Center Email: ap.support@nsc.com National Semiconductor Japan Technical Support Center Email: jpn.feedback@nsc.com