LM2717

LM2717 Dual Step-Down DC/DC Converter March 4, 2008 LM2717 Dual Step-Down DC/DC Converter General Description The LM2717 is composed of two PWM DC/DC buck (stepdown) converters. The first converter is used to generate a fixed output voltage of 3.3V. The second converter is used to generate an adjustable output voltage. Both converters feature low RDSON (0.16Ω) internal switches for maximum efficiency. Operating frequency can be adjusted anywhere between 300kHz and 600kHz allowing the use of small external components. External soft-start pins for each enables the user to tailor the soft-start times to a specific application. Each converter may also be shut down independently with its own shutdown pin. The LM2717 is available in a low profile 24-lead TSSOP package ensuring a low profile overall solution. Features ■ Fixed 3.3V output buck converter with a 2.2A, 0.16Ω, internal switch ■ Adjustable buck converter with a 3.2A, 0.16Ω, internal ■ ■ ■ ■ ■ switch Operating input voltage range of 4V to 20V Input undervoltage protection 300kHz to 600kHz pin adjustable operating frequency Over temperature protection Small 24-Lead TSSOP package Applications ■ ■ ■ ■ TFT-LCD Displays Handheld Devices Portable Applications Laptop Computers Typical Application Circuit 20078501 © 2008 National Semiconductor Corporation 200785 www.national.com LM2717 Connection Diagram Top View 20078504 24-Lead TSSOP Ordering Information Order Number LM2717MT LM2717MTX LM2717MT LM2717MTX NOPB NOPB Spec Package Type TSSOP-24 TSSOP-24 TSSOP-24 TSSOP-24 NSC Package Drawing MTC24 MTC24 MTC24 MTC24 Supplied As 61 Units, Rail 2500 Units, Tape and Reel 61 Units, Rail 2500 Units, Tape and Reel www.national.com 2 LM2717 Pin Descriptions Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Name PGND PGND AGND FB1 VC1 VBG VC2 FB2 AGND AGND PGND PGND SW2 VIN VIN CB2 SHDN2 SS2 FSLCT SS1 SHDN1 CB1 VIN SW1 Function Power ground. PGND and AGND pins must be connected together directly at the part. Power ground. PGND and AGND pins must be connected together directly at the part. Analog ground. PGND and AGND pins must be connected together directly at the part. Fixed buck output voltage feedback input. Fixed buck compensation network connection. Connected to the output of the voltage error amplifier. Bandgap connection. Adjustable buck compensation network connection. Connected to the output of the voltage error amplifier. Adjustable buck output voltage feedback input. Analog ground. PGND and AGND pins must be connected together directly at the part. Analog ground. PGND and AGND pins must be connected together directly at the part. Power ground. PGND and AGND pins must be connected together directly at the part. Power ground. PGND and AGND pins must be connected together directly at the part. Adjustable buck power switch input. Switch connected between VIN pins and SW2 pin. Analog power input. VIN pins should be connected together directly at the part. Analog power input. VIN pins should be connected together directly at the part. Adjustable buck converter bootstrap capacitor connection. Shutdown pin for adjustable buck converter. Active low. Adjustable buck soft start pin. Switching frequency select input. Use a resistor to set the frequency anywhere between 300kHz and 600kHz. Fixed buck soft start pin. Shutdown pin for fixed buck converter. Active low. Fixed buck converter bootstrap capacitor connection. Analog power input. VIN pins should be connected together directly at the part. Fixed buck power switch input. Switch connected between VIN pins and SW1 pin. 3 www.national.com LM2717 Block Diagram 20078503 www.national.com 4 LM2717 Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. VIN SW1 Voltage SW2 Voltage FB1, FB2 Voltages CB1, CB2 Voltages VC1 Voltage VC2 Voltage SHDN1 Voltage SHDN2 Voltage SS1 Voltage SS2 Voltage −0.3V to 22V −0.3V to 22V −0.3V to 22V −0.3V to 7V −0.3V to VIN+7V (VIN=VSW) FSLCT Voltage Maximum Junction Temperature Power Dissipation(Note 2) Lead Temperature Vapor Phase (60 sec.) Infrared (15 sec.) ESD Susceptibility (Note 3) Human Body Model AGND to 5V 150°C Internally Limited 300°C 215°C 220°C 2kV Operating Conditions Operating Junction Temperature Range (Note 4) Storage Temperature Supply Voltage SW1 Voltage SW2 Voltage −40°C to +125°C −65°C to +150°C 4V to 20V 20V 20V 0.965V ≤ VC2 ≤ 1.565V −0.3V to 7.5V −0.3V to 7.5V −0.3V to 2.1V −0.3V to 2.1V 1.75V ≤ VC1 ≤ 2.25V Electrical Characteristics Specifications in standard type face are for TJ = 25°C and those with boldface type apply over the full Operating Temperature Range (TJ = −40°C to +125°C). VIN = 5V, IL = 0A, and FSW = 300kHz unless otherwise specified. Symbol IQ Parameter Conditions Min (Note 4) Typ (Note 5) 2.7 6 9 3.3 1.267 VIN = 8V (Note 7) VIN = 8V (Note 7) VIN = 20V 65 VIN = 20V 65 4 ΔI = 20µA ΔI = 20µA 1340 1360 134 136 89 RF = 46.4k RF = 22.6k ISHDN1 ISHDN2 Fixed Buck Shutdown Pin Current 0V < VSHDN1 < 7.5V 200 475 −5 −5 93 300 600 400 775 5 5 20 nA V µmho µmho V/V V/V % kHz kHz µA µA µA 2.2 3.2 Max (Note 4) 6 12 27 Units mA mA µA V V A A Total Quiescent Current (both Not Switching switchers) Switching, switch open VSHDN = 0V Fixed Buck Feedback Voltage Adjustable Buck Feedback Voltage Fixed Buck Switch Current Limit Adjustable Buck Switch Current Limit Fixed Buck FB Pin Bias Current (Note 8) Adjustable Buck FB Pin Bias Current (Note 8) Input Voltage Range Fixed Buck Error Amp Transconductance Adjustable Buck Error Amp Transconductance Fixed Buck Error Amp Voltage Gain Adjustable Buck Error Amp Voltage Gain Maximum Duty Cycle Switching Frequency VFB1 VFB2 ICL1(Note 6) ICL2(Note 6) IB1 IB2 VIN gm1 gm2 AV1 AV2 DMAX FSW Adjustable Buck Shutdown Pin 0V < VSHDN2 < 7.5V Current 5 www.national.com LM2717 Symbol IL1 IL2 RDSON1 RDSON2 ThSHDN1 ThSHDN2 ISS1 ISS2 UVP θJA Parameter Fixed Buck Switch Leakage Current Adjustable Buck Switch Leakage Current Fixed Buck Switch RDSON (Note 9) Adjustable Buck Switch RDSON (Note 9) Fixed Buck SHDN Threshold Adjustable Buck SHDN Threshold Fixed Buck Soft Start Pin Current Adjustable Buck Soft Start Pin Current On Threshold Off Threshold Thermal Resistance (Note 10) Conditions VIN = 20V VIN = 20V Min (Note 4) Typ (Note 5) 0.01 0.01 160 160 Max (Note 4) 5 5 Units µA µA mΩ mΩ V V µA µA V °C/W Output High Output Low Output High Output Low 1.8 1.8 1.36 1.33 1.36 1.33 0.7 15 15 0.7 4 4 4 TSSOP, package only 9 9 3.8 3.6 115 3.3 Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended to be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics. Note 2: The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. See the Electrical Characteristics table for the thermal resistance. The maximum allowable power dissipation at any ambient temperature is calculated using: PD (MAX) = (TJ(MAX) − TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Note 3: The human body model is a 100 pF capacitor discharged through a 1.5kΩ resistor into each pin. Note 4: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100% tested or guaranteed through statistical analysis. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level (AOQL). Note 5: Typical numbers are at 25°C and represent the most likely norm. Note 6: Duty cycle affects current limit due to ramp generator. Note 7: Current limit at 0% duty cycle. See TYPICAL PERFORMANCE section for Switch Current Limit vs. VIN Note 8: Bias current flows into FB pin. Note 9: Includes the bond wires, RDSON from VIN pin(s) to SW pin. Note 10: Refer to National's packaging website for more detailed thermal information and mounting techniques for the TSSOP package. www.national.com 6 LM2717 Typical Performance Characteristics Shutdown IQ vs. Input Voltage Switching IQ vs. Input Voltage (FSW = 300kHz) 20078560 20078561 Switching Frequency vs. Input Voltage (FSW = 300kHz) Fixed Buck RDS(ON) vs. Input Voltage 20078563 20078562 Adjustable Buck RDS(ON) vs. Input Voltage Fixed Buck Efficiency vs. Load Current 20078564 20078565 7 www.national.com LM2717 Adjustable Buck Efficiency vs. Load Current (VOUT = 15V) Adjustable Buck Efficiency vs. Load Current (VOUT = 5V) 20078566 20078567 Fixed Buck Switch Current Limt vs. Input Voltage Adjustable Buck Switch Current Limt vs. Input Voltage (VOUT = 5V) 20078568 20078569 www.national.com 8 LM2717 Buck Operation PROTECTION (BOTH REGULATORS) The LM2717 has dedicated protection circuitry running during normal operation to protect the IC. The Thermal Shutdown circuitry turns off the power devices when the die temperature reaches excessive levels. The UVP comparator protects the power devices during supply power startup and shutdown to prevent operation at voltages less than the minimum input voltage. The OVP comparator is used to prevent the output voltage from rising at no loads allowing full PWM operation over all load conditions. The LM2717 also features a shutdown mode for each converter decreasing the supply current to approximately 10µA (both in shutdown mode). CONTINUOUS CONDUCTION MODE The LM2717 contains current-mode, PWM buck regulators. A buck regulator steps the input voltage down to a lower output voltage. In continuous conduction mode (when the inductor current never reaches zero at steady state), the buck regulator operates in two cycles. The power switch is connected between VIN and SW1 and SW2. In the first cycle of operation the transistor is closed and the diode is reverse biased. Energy is collected in the inductor and the load current is supplied by COUT and the rising current through the inductor. During the second cycle the transistor is open and the diode is forward biased due to the fact that the inductor current cannot instantaneously change direction. The energy stored in the inductor is transferred to the load and output capacitor. The ratio of these two cycles determines the output voltage. The output voltage is defined approximately as: The RMS current reaches its maximum (IOUT/2) when VIN equals 2VOUT. This value should be calculated for both regulators and added to give a total RMS current rating. For an aluminum or ceramic capacitor, the voltage rating should be at least 25% higher than the maximum input voltage. If a tantalum capacitor is used, the voltage rating required is about twice the maximum input voltage. The tantalum capacitor should be surge current tested by the manufacturer to prevent being shorted by the inrush current. The minimum capacitor value should be 47µF for lower output load current applications and less dynamic (quickly changing) load conditions. For higher output current applications or dynamic load conditions a 68µF to 100µF low ESR capacitor is recommended. It is also recommended to put a small ceramic capacitor (0.1µF to 4.7µF) between the input pins and ground to reduce high frequency spikes. INDUCTOR SELECTION The most critical parameters for the inductor are the inductance, peak current and the DC resistance. The inductance is related to the peak-to-peak inductor ripple current, the input and the output voltages (for 300kHz operation): where D is the duty cycle of the switch, D and D′ will be required for design calculations. DESIGN PROCEDURE This section presents guidelines for selecting external components. SETTING THE OUTPUT VOLTAGE (ADJUSTABLE REGULATOR) The output voltage is set using the feedback pin and a resistor divider connected to the output as shown in Figure 1. The feedback pin voltage is 1.26V, so the ratio of the feedback resistors sets the output voltage according to the following equation: A higher value of ripple current reduces inductance, but increases the conductance loss, core loss, and current stress for the inductor and switch devices. It also requires a bigger output capacitor for the same output voltage ripple requirement. A reasonable value is setting the ripple current to be 30% of the DC output current. Since the ripple current increases with the input voltage, the maximum input voltage is always used to determine the inductance. The DC resistance of the inductor is a key parameter for the efficiency. Lower DC resistance is available with a bigger winding area. A good tradeoff between the efficiency and the core size is letting the inductor copper loss equal 2% of the output power. OUTPUT CAPACITOR The selection of COUT is driven by the maximum allowable output voltage ripple. The output ripple in the constant frequency, PWM mode is approximated by: INPUT CAPACITOR A low ESR aluminum, tantalum, or ceramic capacitor is needed betwen the input pin and power ground. This capacitor prevents large voltage transients from appearing at the input. The capacitor is selected based on the RMS current and voltage requirements. The RMS current is given by: The ESR term usually plays the dominant role in determining the voltage ripple. Low ESR ceramic, aluminum electrolytic, or tantalum capacitors (such as Taiyo Yuden MLCC, Nichicon PL series, Sanyo OS-CON, Sprague 593D, 594D, AVX TPS, and CDE polymer aluminum) is recommended. An electrolytic capacitor is not recommended for temperatures below −25°C since its ESR rises dramatically at cold temperature. Ceramic or tantalum capacitors have much better ESR specifications at cold temperature and is preferred for low temperature applications. BOOTSTRAP CAPACITOR A 4.7nF ceramic capacitor or larger is recommended for the bootstrap capacitor. For applications where the input voltage is less than twice the output voltage a larger capacitor is recommended, generally 0.1µF to 1µF to ensure plenty of gate drive for the internal switches and a consistently low RDS (ON). 9 www.national.com LM2717 SOFT-START CAPACITOR (BOTH REGULATORS) The LM2717 does not contain internal soft-start which allows for fast startup time but also causes high inrush current. Therefore for applications that need reduced inrush current the LM2717 has circuitry that is used to limit the inrush current on start-up of the DC/DC switching regulators. This inrush current limiting circuitry serves as a soft-start. The external SS pins are used to tailor the soft-start for a specific application. A current (ISS) charges the external soft-start capacitor, CSS. The soft-start time can be estimated as: TSS = CSS*0.6V/ISS When programming the softstart time simply use the equation given in the Soft-Start Capacitor section above. SHUTDOWN OPERATION (BOTH REGULATORS) The shutdown pins of the LM2717 are designed so that they may be controlled using 1.8V or higher logic signals. If the shutdown function is not to be used the pin may be left open. The maximum voltage to the shutdown pin should not exceed 7.5V. If the use of a higher voltage is desired due to system or other constraints it may be used, however a 100k or larger resistor is recommended between the applied voltage and the shutdown pin to protect the device. SCHOTTKY DIODE The breakdown voltage rating of D1 and D2 is preferred to be 25% higher than the maximum input voltage. The current rating for the diode should be equal to the maximum output current for best reliability in most applications. In cases where the input voltage is much greater than the output voltage the average diode current is lower. In this case it is possible to use a diode with a lower average current rating, approximately (1-D)*IOUT however the peak current rating should be higher than the maximum load current. LAYOUT CONSIDERATIONS The LM2717 uses two separate ground connections, PGND for the drivers and boost NMOS power device and AGND for the sensitive analog control circuitry. The AGND and PGND pins should be tied directly together at the package. The feedback and compensation networks should be connected directly to a dedicated analog ground plane and this ground plane must connect to the AGND pin. If no analog ground plane is available then the ground connections of the feedback and compensation networks must tie directly to the AGND pin. Connecting these networks to the PGND can inject noise into the system and effect performance. The input bypass capacitor CIN, as shown in Figure 1, must be placed close to the IC. This will reduce copper trace resistance which effects input voltage ripple of the IC. For additional input voltage filtering, a 0.1µF to 4.7µF bypass capacitors can be placed in parallel with CIN, close to the VIN pins to shunt any high frequency noise to ground. The output capacitors, COUT1 and COUT2, should also be placed close to the IC. Any copper trace connections for the COUTX capacitors can increase the series resistance, which directly effects output voltage ripple. The feedback network, resistors RFB1 and RFB2, should be kept close to the FB pin, and away from the inductor to minimize copper trace connections that can inject noise into the system. Trace connections made to the inductors and schottky diodes should be minimized to reduce power dissipation and increase overall efficiency. For more detail on switching power supply layout considerations see Application Note AN-1149: Layout Guidelines for Switching Power Supplies. Application Information Some Recommended Inductors (Others May Be Used) Manufacturer Coilcraft Coiltronics Pulse Sumida Inductor DO3316 and DO5022 series DRQ73 and CD1 series P0751 and P0762 series CDRH8D28 and CDRH8D43 series Some Recommended Input And Output Capacitors (Others May Be Used) Manufacturer Vishay Sprague Taiyo Yuden Cornell Dubilier Panasonic Capacitor 293D, 592D, and 595D series tantalum High capacitance MLCC ceramic ESRD seriec Polymer Aluminum Electrolytic SPV and AFK series V-chip series High capacitance MLCC ceramic EEJ-L series tantalum Contact Information www.vishay.com www.t-yuden.com www.cde.com www.panasonic.com Contact Information www.coilcraft.com www.cooperet.com www.pulseeng.com www.sumida.com www.national.com 10 LM2717 20078558 FIGURE 1. 15V, 3.3V Output Application 20078559 FIGURE 2. 5V, 3.3V Output Application 11 www.national.com LM2717 Physical Dimensions inches (millimeters) unless otherwise noted TSSOP-24 Pin Package (MTC) For Ordering, Refer to Ordering Information Table NS Package Number MTC24 www.national.com 12 LM2717 Notes 13 www.national.com LM2717 Dual Step-Down DC/DC Converter Notes For more National Semiconductor product information and proven design tools, visit the following Web sites at: Products Amplifiers Audio Clock Conditioners Data Converters Displays Ethernet Interface LVDS Power Management Switching Regulators LDOs LED Lighting PowerWise Serial Digital Interface (SDI) Temperature Sensors Wireless (PLL/VCO) www.national.com/amplifiers www.national.com/audio www.national.com/timing www.national.com/adc www.national.com/displays www.national.com/ethernet www.national.com/interface www.national.com/lvds www.national.com/power www.national.com/switchers www.national.com/ldo www.national.com/led www.national.com/powerwise www.national.com/sdi www.national.com/tempsensors www.national.com/wireless WEBENCH Analog University App Notes Distributors Green Compliance Packaging Design Support www.national.com/webench www.national.com/AU www.national.com/appnotes www.national.com/contacts www.national.com/quality/green www.national.com/packaging www.national.com/quality www.national.com/refdesigns www.national.com/feedback Quality and Reliability Reference Designs Feedback THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION (“NATIONAL”) PRODUCTS. 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