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LM3102MH

LM3102MH

  • 厂商:

    NSC

  • 封装:

  • 描述:

    LM3102MH - SIMPLE SWITCHER® Synchronous 1MHz 2.5A Step-Down Voltage Regulator - National Semiconduct...

  • 数据手册
  • 价格&库存
LM3102MH 数据手册
LM3102 SIMPLE SWITCHER® Synchronous 1MHz 2.5A Step-Down Voltage Regulator September 2007 LM3102 SIMPLE SWITCHER® Synchronous 1MHz 2.5A Step-Down Voltage Regulator General Description The LM3102 Synchronously Rectified Buck Converter features all required functions to implement a highly efficient and cost effective buck regulator. It is capable of supplying 2.5A to loads with an output voltage as low as 0.8V. Dual N-Channel synchronous MOSFET switches allow a low component count, thus reducing complexity and minimizing board size. Different from most other COT regulators, the LM3102 does not rely on output capacitor ESR for stability, and is designed to work exceptionally well with ceramic and other very low ESR output capacitors. It requires no loop compensation, results in a fast load transient response and simple circuit implementation. The operating frequency remains nearly constant with line variations due to the inverse relationship between the input voltage and the on-time. The operating frequency can be externally programmed up to 1 MHz. Protection features include VCC under-voltage lock-out, output over-voltage protection, thermal shutdown, and gate drive under-voltage lock-out. The LM3102 is available in the thermally enhanced eTSSOP-20 package. Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Low component count and small solution size Stable with ceramic and other low ESR capacitors No loop compensation required High efficiency at a light load by DCM operation Pre-bias startup Ultra-fast transient response Programmable soft-start Programmable switching frequency up to 1 MHz Valley current limit Output over-voltage protection Precision internal reference for an adjustable output voltage down to 0.8V ■ Thermal shutdown Typical Applications ■ ■ ■ ■ ■ ■ ■ ■ 5VDC, 12VDC, 24VDC, 12VAC, and 24VAC systems Embedded Systems Industrial Control Automotive Telematics and Body Electronics Point of Load Regulators Storage Systems Broadband Infrastructure Direct Conversion from 2/3/4 Cell Lithium Batteries Systems Key Specifications ■ ■ ■ ■ Input voltage range 4.5V-42V 2.5A output current 0.8V, ±1.5% reference Integrated dual N-Channel main and synchronous MOSFETs ■ Thermally enhanced eTSSOP-20 package Typical Application 30021301 SIMPLE SWITCHER® is a registered trademark of National Semiconductor Corporation © 2007 National Semiconductor Corporation 300213 www.national.com LM3102 Connection Diagram 30021302 20-lead Plastic eTSSOP NS Package Number MXA20A Ordering Information Order Number LM3102MH LM3102MHX Package Type Exposed Pad TSSOP-20 NSC Package Drawing MXA0020 Supplied As 73 units per Anti-Static Tube 2500 Units on Tape and Reel www.national.com 2 LM3102 Pin Descriptions Pin 1,9,10,12,19,20 2, 3 Name N/C SW Description No Connection Switching Node Application Information These pins must be left unconnected. Internally connected to the source of the main MOSFET and the drain of the Synchronous MOSFET. Connect to the inductor. Supply pin to the device. Nominal input range is 4.5V to 42V. Connect a 33 nF capacitor from the SW pin to this pin. An internal diode charges the capacitor during the main MOSFET off-time. Ground for all internal circuitry other than the PGND pin. An 8 µA internal current source charges an external capacitor to provide the soft- start function. Must be connected to the AGND pin for normal operation. The GND and AGND pins are not internally connected. Internally connected to the regulation and over-voltage comparators. The regulation setting is 0.8V at this pin. Connect to feedback resistors. Connect a voltage higher than 1.26V to enable the regulator. An external resistor from the VIN pin to this pin sets the main MOSFET on-time. Nominally regulated to 6V. Connect a capacitor of not less than 680 nF between the VCC and AGND pins for stable operation. Synchronous MOSFET source connection. Tie to a ground plane. Thermal connection pad. Connect to the ground plane. 4, 5 6 VIN BST Input supply voltage Connection for bootstrap capacitor 7 8 11 AGND SS GND Analog Ground Soft-start Ground 13 FB Feedback 14 15 16 EN RON VCC Enable pin On-time Control Start-up regulator Output 17, 18 DAP PGND EP Power Ground Exposed Pad 3 www.national.com LM3102 Absolute Maximum Ratings (Note 1) If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. VIN, RON to AGND SW to AGND SW to AGND (Transient) VIN to SW BST to SW All Other Inputs to AGND -0.3V to 43.5V -0.3V to 43.5V -2V (< 100ns) -0.3V to 43.5V -0.3V to 7V -0.3V to 7V ESD Rating (Note 2) Human Body Model Storage Temperature Range Junction Temperature (TJ) ±2kV -65°C to +150°C 150°C (Note 1) 4.5V to 42V −40°C to +125°C 6.5°C/W Operating Ratings Supply Voltage Range (VIN) Junction Temperature Range (TJ) Thermal Resistance (θJC) (Note 3) Electrical Characteristics Specifications with standard type are for TJ = 25°C only; limits in boldface type apply over the full Operating Junction Temperature (TJ) range. Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 18V, VOUT = 3.3V. Symbol Start-Up Regulator, VCC VCC VIN - VCC IVCCL VCC-UVLO VCC-UVLO-HYS tVCC-UVLO-D IIN IIN-SD RDS-UP-ON RDS- DN-ON VG-UVLO Soft-start ISS Current Limit ICL ON/OFF Timer ton ton-MIN toff Enable Input VEN VEN-HYS VFB EN Pin input threshold Enable threshold hysteresis In-regulation feedback voltage VEN rising VEN falling VSS ≥ 0.8V TJ = −40°C to +125°C VSS ≥ 0.8V TJ = 0°C to +125°C VFB-OV IFB Feedback over-voltage threshold 0.784 0.788 0.888 0.920 5 1.13 1.18 90 0.8 0.816 0.812 0.945 V nA 1.23 V mV V ON timer pulse width VIN = 10V, RON = 100 kΩ VIN = 30V, RON = 100 kΩ ON timer minimum pulse width OFF timer pulse width 1.38 0.47 150 260 ns ns µs Syn. MOSFET current limit threshold 2.7 A SS pin source current VSS = 0.5V 6 8 10 µA VCC output voltage VIN - VCC dropout voltage VCC current limit (Note 4) VCC under-voltage lockout threshold (UVLO) VCC UVLO hysteresis VCC UVLO filter delay IIN operating current No switching, VFB = 1V IIN operating current, Device shutdown VEN = 0V Main MOSFET RDS(on) Syn. MOSFET RDS(on) Gate drive voltage UVLO VBST - VSW increasing CCC = 680nF, no load ICC = 2mA ICC = 20mA VCC = 0V VIN increasing VIN decreasing 40 3.6 5.0 6.0 50 350 65 3.75 130 3 0.7 25 0.18 0.11 3.3 1 40 0.375 0.225 4 3.9 7.2 200 570 mA V mV µs mA µA Ω Ω V V mV Parameter Conditions Min Typ Max Units Switching Characteristics Regulation and Over-Voltage Comparator www.national.com 4 LM3102 Symbol Thermal Shutdown TSD TSD-HYS Parameter Thermal shutdown temperature Thermal shutdown temperature hysteresis Conditions TJ rising TJ falling Min Typ 165 20 Max Units °C °C Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of the device is intended to be functional. For guaranteed specifications and test conditions, see the Electrical Characteristics. Note 2: The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. Note 3: θJC measurements are performed in general accordance with Mil-Std 883B, Method 1012.1 and utilizes the copper heat sink technique. Copper Heat Sink @ 60°C. Note 4: VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading. 5 www.national.com LM3102 Typical Performance Characteristics All curves are taken at VIN = 18V with the configuration in the typical application circuit for VOUT = 3.3V shown in this datasheet. TA = 25°C, unless otherwise specified. Quiescent Current, IIN vs VIN VCC vs ICC 30021303 30021304 VCC vs VIN ton vs VIN 30021305 30021306 Switching Frequency, fSW vs VIN VFB vs Temperature 30021307 30021308 www.national.com 6 LM3102 RDS(on) vs Temperature Efficiency vs Load Current (VOUT = 3.3V) 30021309 30021310 VOUT Regulation vs Load Current (VOUT = 3.3V) Efficiency vs Load Current (VOUT = 0.8V) 30021311 30021312 VOUT Regulation vs Load Current (VOUT = 0.8V) Power Up (VOUT = 3.3V, 2.5A Loaded) 30021339 30021313 7 www.national.com LM3102 Enable Transient (VOUT = 3.3V, 2.5A Loaded) Shutdown Transient (VOUT = 3.3V, 2.5A Loaded) 30021314 30021315 Continuous Mode Operation (VOUT = 3.3V, 2.5A Loaded) Discontinuous Mode Operation (VOUT = 3.3V, 0.025A Loaded) 30021316 30021317 DCM to CCM Transition (VOUT = 3.3V, 0.15A - 2.5A Load) Load Transient (VOUT = 3.3V, 0.25A - 2.5A Load, Current slew-rate: 2.5A/µs) 30021318 30021319 www.national.com 8 LM3102 Simplified Functional Block Diagram 30021320 9 www.national.com LM3102 Functional Description The LM3102 Step Down Switching Regulator features all required functions to implement a cost effective, efficient buck power converter capable of supplying 2.5A to a load. It contains Dual N-Channel main and synchronous MOSFETs. The Constant ON-Time (COT) regulation scheme requires no loop compensation, results in fast load transient response and simple circuit implementation. The regulator can function properly even with an all ceramic output capacitor network, and does not rely on the output capacitor’s ESR for stability. The operating frequency remains constant with line variations due to the inverse relationship between the input voltage and the on-time. The valley current limit detection circuit, with the limit set internally at 2.7A, inhibits the main MOSFET until the inductor current level subsides. The LM3102 can be applied in numerous applications and can operate efficiently for inputs as high as 42V. Protection features include output over-voltage protection, thermal shutdown, VCC under-voltage lock-out, gate drive under-voltage lock-out. The LM3102 is available in the thermally enhanced eTSSOP-20 package. VOUT = 0.8V x (RFB1 + RFB2)/RFB2 (3) Startup Regulator (VCC) A startup regulator is integrated within the LM3102. The input pin VIN can be connected directly to a line voltage up to 42V. The VCC output regulates at 6V, and is current limited to 65 mA. Upon power up, the regulator sources current into an external capacitor CVCC, which is connected to the VCC pin. For stability, CVCC must be at least 680 nF. When the voltage on the VCC pin is higher than the under-voltage lock-out (UVLO) threshold of 3.75V, the main MOSFET is enabled and the SS pin is released to allow the soft-start capacitor CSS to charge. The minimum input voltage is determined by the dropout voltage of the regulator and the VCC UVLO falling threshold (≊3.7V). If VIN is less than ≊4.0V, the regulator shuts off and VCC goes to zero. Regulation Comparator The feedback voltage at the FB pin is compared to a 0.8V internal reference. In normal operation (the output voltage is regulated), an on-time period is initiated when the voltage at the FB pin falls below 0.8V. The main MOSFET stays on for the on-time, causing the output voltage and consequently the voltage of the FB pin to rise above 0.8V. After the on-time period, the main MOSFET stays off until the voltage of the FB pin falls below 0.8V again. Bias current at the FB pin is nominally 5 nA. COT Control Circuit Overview COT control is based on a comparator and a one-shot ontimer, with the output voltage feedback (feeding to the FB pin) compared with an internal reference of 0.8V. If the voltage of the FB pin is below the reference, the main MOSFET is turned on for a fixed on-time determined by a programming resistor RON and the input voltage VIN, upon which the on-time varies inversely. Following the on-time, the main MOSFET remains off for a minimum of 260 ns. Then, if the voltage of the FB pin is below the reference, the main MOSFET is turned on again for another on-time period. The switching will continue to achieve regulation. The regulator will operate in the discontinuous conduction mode (DCM) at a light load, and the continuous conduction mode (CCM) with a heavy load. In the DCM, the current through the inductor starts at zero and ramps up to a peak during the on-time, and then ramps back to zero before the end of the off-time. It remains zero and the load current is supplied entirely by the output capacitor. The next on-time period starts when the voltage at the FB pin falls below the internal reference. The operating frequency in the DCM is lower and varies larger with the load current as compared with the CCM. Conversion efficiency is maintained since conduction loss and switching loss are reduced with the reduction in the load and the switching frequency respectively. The operating frequency in the DCM can be calculated approximately as follows: Zero Coil Current Detect The current of the synchronous MOSFET is monitored by a zero coil current detection circuit which inhibits the synchronous MOSFET when its current reaches zero until the next on-time. This circuit enables the DCM operation, which improves the efficiency at a light load. Over-Voltage Comparator The voltage at the FB pin is compared to a 0.92V internal reference. If it rises above 0.92V, the on-time is immediately terminated. This condition is known as over-voltage protection (OVP). It can occur if the input voltage or the output load changes suddenly. Once the OVP is activated, the main MOSFET remains off until the voltage at the FB pin falls below 0.92V. The synchronous MOSFET will stay on to discharge the inductor until the inductor current reduces to zero, and then switch off. ON-Time Timer, Shutdown The on-time of the LM3102 main MOSFET is determined by the resistor RON and the input voltage VIN. It is calculated as follows: (1) In the continuous conduction mode (CCM), the current flows through the inductor in the entire switching cycle, and never reaches zero during the off-time. The operating frequency remains relatively constant with load and line variations. The CCM operating frequency can be calculated approximately as follows: (4) The inverse relationship of ton and VIN gives a nearly constant frequency as VIN is varied. RON should be selected such that the on-time at maximum VIN is greater than 150 ns. The ontimer has a limiter to ensure a minimum of 150 ns for ton. This limits the maximum operating frequency, which is governed by the following equation: (2) The output voltage is set by two external resistors RFB1 and RFB2. The regulated output voltage is www.national.com 10 LM3102 (5) The LM3102 can be remotely shutdown by pulling the voltage of the EN pin below 1V. In this shutdown mode, the SS pin is internally grounded, the on-timer is disabled, and bias currents are reduced. Releasing the EN pin allows normal operation to resume because the EN pin is internally pulled up. 30021325 FIGURE 1. Shutdown Implementation the main MOSFET is turned off, the inductor current flows through the load, the PGND pin and the internal synchronous MOSFET. If this current exceeds 2.7A, the current limit comparator toggles, and as a result disabling the start of the next on-time period. The next switching cycle starts when the recirculating current falls back below 2.7A (and the voltage at the FB pin is below 0.8V). The inductor current is monitored during the on-time of the synchronous MOSFET. As long as the inductor current exceeds 2.7A, the main MOSFET will remain inhibited to achieve current limit. The operating frequency is lower during current limit due to a longer off-time. Figure 2 illustrates an inductor current waveform. On average, the output current IOUT is the same as the inductor current IL, which is the average of the rippled inductor current. In case of current limit (the current limit portion of Figure 2), the next on-time will not initiate until that the current drops below 2.7A (assume the voltage at the FB pin is lower than 0.8V). During each on-time the current ramps up an amount equal to: Current Limit Current limit detection is carried out during the off-time by monitoring the re-circulating current through the synchronous MOSFET. Referring to the Functional Block Diagram, when (6) During current limit, the LM3102 operates in a constant current mode with an average output current IOUT(CL) equal to 2.7A + ILR / 2. 30021326 FIGURE 2. Inductor Current - Current Limit Operation 11 www.national.com LM3102 N-Channel MOSFET and Driver The LM3102 integrates an N-Channel main MOSFET and an associated floating high voltage main MOSFET gate driver. The gate drive circuit works in conjunction with an external bootstrap capacitor CBST and an internal high voltage diode. CBST connecting between the BST and SW pins powers the main MOSFET gate driver during the main MOSFET on-time. During each off-time, the voltage of the SW pin falls to approximately -1V, and CBST charges from VCC through the internal diode. The minimum off-time of 260 ns provides enough time for charging CBST in each cycle. 2.5A output current is possible by increasing the PCB ground plane area, or reducing the input voltage or operating frequency. Soft-Start The soft-start feature allows the converter to gradually reach a steady state operating point, thereby reducing startup stresses and current surges. Upon turn-on, after VCC reaches the under-voltage threshold, an 8 µA internal current source charges up an external capacitor CSS connecting to the SS pin. The ramping voltage at the SS pin (and the non-inverting input of the regulation comparator as well) ramps up the output voltage VOUT in a controlled manner. An internal switch grounds the SS pin if any of the following three cases happens: (i) VCC is below the under-voltage lockout threshold; (ii) a thermal shutdown occurs; or (iii) the EN pin is grounded. Alternatively, the output voltage can be shut off by connecting the SS pin to ground using an external switch. Releasing the switch allows the SS pin to ramp up and the output voltage to return to normal. The shutdown configuration is shown in Figure 3. 30021340 FIGURE 4. Thermal Derating Curve 30021327 FIGURE 3. Alternate Shutdown Implementation Thermal Protection The junction temperature of the LM3102 should not exceed the maximum limit. Thermal protection is implemented by an internal Thermal Shutdown circuit, which activates (typically) at 165°C to make the controller enter a low power reset state by disabling the main MOSFET, disabling the on-timer, and grounding the SS pin. Thermal protection helps prevent catastrophic failures from accidental device overheating. When the junction temperature falls back below 145°C (typical hysteresis = 20°C), the SS pin is released and normal operation resumes. Thermal Derating The LM3102 is capable of supplying 2.5A below an ambient temperature of 100°C. Under worst case operation, with either input voltage up to 42V, operating frequency up to 1 MHz, or voltage of the RON pin below the absolute maximum of 7V, the LM3102 can deliver a minimum of 1.9A output current without thermal shutdown with a PCB ground plane copper area of 40cm2, 2 oz/Cu. Figure 4 shows a thermal derating curve for the minimum output current without thermal shutdown against ambient temperature up to 125°C. Obtaining www.national.com 12 LM3102 Applications Information EXTERNAL COMPONENTS The following guidelines can be used to select external components. RFB1 and RFB2 : These resistors should be chosen from standard values in the range of 1.0 kΩ to 10 kΩ, satisfying the following ratio: RFB1/RFB2 = (VOUT/0.8V) - 1 (7) Beware that the higher peak of ILR should not be larger than the saturation current of the inductor and current limits of the main and synchronous MOSFETs. Also, the lower peak of ILR must be positive if CCM operation is required. For VOUT = 0.8V, the FB pin can be connected to the output directly with a pre-load resistor drawing more than 20 µA. It is because the converter operation needs a minimum inductor current ripple to maintain good regulation when no load is connected. RON: Equation (2) can be used to select RON if a desired operating frequency is selected. But the minimum value of RON is determined by the minimum on-time. It can be calculated as follows: 30021331 (8) If RON calculated from (2) is smaller than the minimum value determined in (8), a lower frequency should be selected to recalculate RON by (2). Alternatively, VIN(MAX) can also be limited in order to keep the frequency unchanged. The relationship of VIN(MAX) and RON is shown in Figure 5. On the other hand, the minimum off-time of 260 ns can limit the maximum duty ratio. Larger RON should be selected in any application requiring large duty ratio. FIGURE 6. Inductor selection for VOUT = 3.3V 30021332 FIGURE 7. Inductor selection for VOUT = 0.8V Figure 6 and Figure 7 show curves on inductor selection for various VOUT and RON. For small RON, according to (8), VIN is limited. Some curves are therefore limited as shown in the figures. CVCC: The capacitor on the VCC output provides not only noise filtering and stability, but also prevents false triggering of the VCC UVLO at the main MOSFET on/off transitions. CVCC should be no smaller than 680 nF for stability, and should be a good quality, low ESR, ceramic capacitor. COUT and COUT3: COUT should generally be no smaller than 10 µF. Experimentation is usually necessary to determine the minimum value for COUT, as the nature of the load may require a larger value. A load which creates significant transients requires a larger COUT than a fixed load. COUT3 is a small value ceramic capacitor located close to the LM3102 to further suppress high frequency noise at VOUT. A 100 nF capacitor is recommended. 30021329 FIGURE 5. Maximum VIN for selected RON L: The main parameter affected by the inductor is the amplitude of inductor current ripple (ILR). Once ILR is selected, L can be determined by: (9) where VIN is the maximum input voltage and fSW is determined from (2). If the output current IOUT is determined, by assuming that IOUT = IL, the higher and lower peak of ILR can be determined. 13 www.national.com LM3102 CIN and CIN3: The function of CIN is to supply most of the main MOSFET current during the on-time, and limit the voltage ripple at the VIN pin, assuming that the voltage source connecting to the VIN pin has finite output impedance. If the voltage source’s dynamic impedance is high (effectively a current source), CIN supplies the average input current, but not the ripple current. At the maximum load current, when the main MOSFET turns on, the current to the VIN pin suddenly increases from zero to the lower peak of the inductor’s ripple current and ramps up to the higher peak value. It then drops to zero at turn-off. The average current during the on-time is the load current. For a worst case calculation, CIN must be capable of supplying this average load current during the maximum on-time. CIN is calculated from: (10) where IOUT is the load current, ton is the maximum on-time, and ΔVIN is the allowable ripple voltage at VIN. CIN3’s purpose is to help avoid transients and ringing due to long lead inductance at the VIN pin. A low ESR 0.1 µF ceramic chip capacitor located close to the LM3102 is recommended. CBST: A 33 nF high quality ceramic capacitor with low ESR is recommended for CBST since it supplies a surge current to charge the main MOSFET gate driver at turn-on. Low ESR also helps ensure a complete recharge during each off-time. CSS: The capacitor at the SS pin determines the soft-start time, i.e. the time for the reference voltage at the regulation comparator and the output voltage to reach their final value. The time is determined from the following equation: (11) CFB: If the output voltage is higher than 1.6V, CFB is needed in the Discontinuous Conduction Mode to reduce the output ripple. The recommended value for CFB is 10 nF. PC BOARD LAYOUT The LM3102 regulation, over-voltage, and current limit comparators are very fast so they will respond to short duration noise pulses. Layout is therefore critical for optimum performance. It must be as neat and compact as possible, and all external components must be as close to their associated pins of the LM3102 as possible. Refer to the functional block diagram, the loop formed by CIN, the main and synchronous MOSFET internal to the LM3102, and the PGND pin should be as small as possible. The connection from the PGND pin to CIN should be as short and direct as possible. Vias should be added to connect the ground of CIN to a ground plane, located as close to the capacitor as possible. The bootstrap capacitor CBST should be connected as close to the SW and BST pins as possible, and the connecting traces should be thick. The feedback resistors and capacitor RFB1, RFB2, and CFB should be close to the FB pin. A long trace running from VOUT to RFB1 is generally acceptable since this is a low impedance node. Ground R FB2 directly to the AGND pin (pin 7). The output capacitor COUT should be connected close to the load and tied directly to the ground plane. The inductor L should be connected close to the SW pin with as short a trace as possible to reduce the potential for EMI (electromagnetic interference) generation. If it is expected that the internal dissipation of the LM3102 will produce excessive junction temperature during normal operation, making good use of the PC board’s ground plane can help considerably to dissipate heat. The exposed pad on the bottom of the LM3102 IC package can be soldered to the ground plane, which should extend out from beneath the LM3102 to help dissipate heat. The exposed pad is internally connected to the LM3102 IC substrate. Additionally the use of thick traces, where possible, can help conduct heat away from the LM3102. Using numerous vias to connect the die attached pad to the ground plane is a good practice. Judicious positioning of the PC board within the end product, along with the use of any available air flow (forced or natural convection) can help reduce the junction temperature. 30021335 Typical Application Schematic for VOUT = 3.3V www.national.com 14 LM3102 30021336 Typical Application Schematic for VOUT = 0.8V 15 www.national.com LM3102 Physical Dimensions inches (millimeters) unless otherwise noted 20-Lead Plastic eTSSOP Package NS Package Number MXA20A www.national.com 16 LM3102 Notes 17 www.national.com LM3102 SIMPLE SWITCHER® Synchronous 1MHz 2.5A Step-Down Voltage Regulator Notes THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION (“NATIONAL”) PRODUCTS. NATIONAL MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE ACCURACY OR COMPLETENESS OF THE CONTENTS OF THIS PUBLICATION AND RESERVES THE RIGHT TO MAKE CHANGES TO SPECIFICATIONS AND PRODUCT DESCRIPTIONS AT ANY TIME WITHOUT NOTICE. NO LICENSE, WHETHER EXPRESS, IMPLIED, ARISING BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. TESTING AND OTHER QUALITY CONTROLS ARE USED TO THE EXTENT NATIONAL DEEMS NECESSARY TO SUPPORT NATIONAL’S PRODUCT WARRANTY. EXCEPT WHERE MANDATED BY GOVERNMENT REQUIREMENTS, TESTING OF ALL PARAMETERS OF EACH PRODUCT IS NOT NECESSARILY PERFORMED. NATIONAL ASSUMES NO LIABILITY FOR APPLICATIONS ASSISTANCE OR BUYER PRODUCT DESIGN. BUYERS ARE RESPONSIBLE FOR THEIR PRODUCTS AND APPLICATIONS USING NATIONAL COMPONENTS. PRIOR TO USING OR DISTRIBUTING ANY PRODUCTS THAT INCLUDE NATIONAL COMPONENTS, BUYERS SHOULD PROVIDE ADEQUATE DESIGN, TESTING AND OPERATING SAFEGUARDS. EXCEPT AS PROVIDED IN NATIONAL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, NATIONAL ASSUMES NO LIABILITY WHATSOEVER, AND NATIONAL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO THE SALE AND/OR USE OF NATIONAL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: Life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness. National Semiconductor and the National Semiconductor logo are registered trademarks of National Semiconductor Corporation. All other brand or product names may be trademarks or registered trademarks of their respective holders. Copyright© 2007 National Semiconductor Corporation For the most current product information visit us at www.national.com National Semiconductor Americas Customer Support Center Email: new.feedback@nsc.com Tel: 1-800-272-9959 National Semiconductor Europe Customer Support Center Fax: +49 (0) 180-530-85-86 Email: europe.support@nsc.com Deutsch Tel: +49 (0) 69 9508 6208 English Tel: +49 (0) 870 24 0 2171 Français Tel: +33 (0) 1 41 91 8790 National Semiconductor Asia Pacific Customer Support Center Email: ap.support@nsc.com National Semiconductor Japan Customer Support Center Fax: 81-3-5639-7507 Email: jpn.feedback@nsc.com Tel: 81-3-5639-7560 www.national.com
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